CN108406458B - Monocrystalline silicon piece production system and production process thereof - Google Patents

Monocrystalline silicon piece production system and production process thereof Download PDF

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Publication number
CN108406458B
CN108406458B CN201810161593.8A CN201810161593A CN108406458B CN 108406458 B CN108406458 B CN 108406458B CN 201810161593 A CN201810161593 A CN 201810161593A CN 108406458 B CN108406458 B CN 108406458B
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China
Prior art keywords
monocrystalline silicon
rod
motor
shaft
grinding
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CN201810161593.8A
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Chinese (zh)
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CN108406458A (en
Inventor
王全文
杨蛟
李鹭
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Sichuan yajixin Electronic Technology Co., Ltd
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Chengdu Qingyang Electronic Material Co ltd
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Publication of CN108406458A publication Critical patent/CN108406458A/en
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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B5/00Machines or devices designed for grinding surfaces of revolution on work, including those which also grind adjacent plane surfaces; Accessories therefor
    • B24B5/02Machines or devices designed for grinding surfaces of revolution on work, including those which also grind adjacent plane surfaces; Accessories therefor involving centres or chucks for holding work
    • B24B5/04Machines or devices designed for grinding surfaces of revolution on work, including those which also grind adjacent plane surfaces; Accessories therefor involving centres or chucks for holding work for grinding cylindrical surfaces externally
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B08CLEANING
    • B08BCLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04Cleaning involving contact with liquid
    • B08B3/044Cleaning involving contact with liquid using agitated containers in which the liquid and articles or material are placed
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B08CLEANING
    • B08BCLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04Cleaning involving contact with liquid
    • B08B3/10Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity, by vibration
    • B08B3/12Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity, by vibration by sonic or ultrasonic vibrations
    • B08B3/123Cleaning travelling work, e.g. webs, articles on a conveyor
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00Lapping machines or devices; Accessories
    • B24B37/04Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/08Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for double side lapping
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00Lapping machines or devices; Accessories
    • B24B37/34Accessories
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B47/00Drives or gearings; Equipment therefor
    • B24B47/02Drives or gearings; Equipment therefor for performing a reciprocating movement of carriages or work- tables
    • B24B47/06Drives or gearings; Equipment therefor for performing a reciprocating movement of carriages or work- tables by liquid or gas pressure only
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B47/00Drives or gearings; Equipment therefor
    • B24B47/10Drives or gearings; Equipment therefor for rotating or reciprocating working-spindles carrying grinding wheels or workpieces
    • B24B47/12Drives or gearings; Equipment therefor for rotating or reciprocating working-spindles carrying grinding wheels or workpieces by mechanical gearing or electric power
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B47/00Drives or gearings; Equipment therefor
    • B24B47/20Drives or gearings; Equipment therefor relating to feed movement
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B24B57/02Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B9/00Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
    • B24B9/02Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
    • B24B9/06Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/007Use, recovery or regeneration of abrasive mediums
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/04Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
    • B28D5/045Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades

Abstract

The invention discloses a monocrystalline silicon piece production system, which comprises a tumbling mill, a slicing device, a chamfering device, a grinding machine and a cleaning tank, wherein the tumbling mill is arranged on the top of the slicing device; it also discloses a production process of the monocrystalline silicon piece. The invention has the beneficial effects that: the silicon single crystal rod roll grinding machine has the advantages of high roll grinding precision, capability of quickly realizing the tool of the silicon single crystal rod, capability of roll grinding the silicon single crystal rod with different lengths, capability of cutting the silicon single crystal rod into a plurality of silicon single crystal wafers at one time, automatic centering, improvement of chamfering efficiency, high automation degree, capability of grinding the plurality of silicon single crystal wafers at one time, high grinding efficiency and high cleaning efficiency.

Description

Monocrystalline silicon piece production system and production process thereof
Technical Field
The invention relates to the technical field of monocrystalline silicon wafer production, in particular to a monocrystalline silicon wafer production system and a production process thereof.
Background
Single crystal silicon, an important semiconductor material, has good electrical properties and thermal stability, and has been discovered and utilized as a substitute for other semiconductor materials soon. The silicon material has better high temperature resistance and radiation resistance, and is particularly suitable for manufacturing high-power devices, so that the silicon material is the most applied semiconductor material, and most silicon materials of integrated circuit semiconductor devices are manufactured. In the method for manufacturing a silicon single crystal having good properties, the Czochralski method for growing a silicon single crystal has relatively simple equipment and process, and is easy to realize automatic control. After being pulled out from a single crystal furnace, the silicon rod of the straight-pull single crystal needs to be subjected to a series of working procedures, wherein the working procedures comprise mechanical processing such as cutting, squaring, fillet grinding and plane grinding at the early stage; in the middle period, the monocrystalline silicon rod is required to be subjected to the processes of barreling, slicing, cleaning, chamfering, grinding, re-cleaning and the like; and in the later stage, the silicon wafer is subjected to the procedures of texturing, diffusion, crystallization, sintering and the like to be manufactured into a semiconductor device or a solar cell for photovoltaic power generation.
The purpose of the tumbling mill is to grind a monocrystalline silicon rod with an irregular cross section into a monocrystalline silicon rod with a circular cross section by using a grinding wheel, the conventional tumbling mill mode is carried out on a machine tool, namely, a three-jaw chuck is firstly used for clamping one end of the monocrystalline silicon rod, then a conical hole is drilled on the other end surface of the monocrystalline silicon rod, and then a conical head at the tail part of the machine tool is inserted into the conical hole, so that the tool for the monocrystalline silicon rod is realized, the three-jaw chuck is rotated to drive the monocrystalline silicon rod to rotate, and meanwhile, a worker leans against the outer surface of the monocrystalline silicon rod by using the grinding wheel to grind the monocrystalline silicon rod into a cylindrical. However, the tumbling mode has the defect of more loading processes, which reduces the production efficiency, and in addition, in the tumbling process, workers are required to move along the axis of the single crystal silicon rod by using a grinding wheel to tumble the whole single crystal silicon rod, which increases the labor intensity of the workers and further reduces the tumbling efficiency.
In the slicing procedure, a columnar silicon single crystal rod is cut into a plurality of thin silicon wafers, most manufacturers adopt a wire cutting machine for slicing, but the wire cutting machine can only cut one silicon wafer by one silicon wafer, so that the defect of discontinuous cutting exists, and the slicing efficiency is greatly reduced. In addition, after each slice is cut, the steel wire loss is large, the heating amount is large, the service life is short, and the strain of the wire cutting machine is further increased. Therefore, the existing linear cutting machine for cutting the silicon rod is not popularized and used.
The purpose of the middle chamfering is to grind the outer edge of the monocrystalline silicon wafer by using a grinding wheel, i.e., to remove burrs produced during slicing. The existing chamfering method is that a monocrystalline silicon wafer is firstly placed on the top surface of a vacuum chuck, the vacuum chuck is vacuumized, the monocrystalline silicon wafer is adsorbed on the top of the vacuum chuck, so that the monocrystalline silicon wafer is fixed, then workers polish along the outer edge of the monocrystalline silicon wafer by using a grinding wheel to remove burrs, and finally chamfering of the monocrystalline silicon wafer is achieved. However, the method needs to manually hold the grinding wheel for grinding, and has the defects of high labor intensity and low chamfering efficiency. In addition, the vacuum chuck is frequently operated during feeding and discharging at each time, so that the labor intensity of workers is further increased, and the chamfering efficiency is reduced.
In the middle-stage grinding process, the upper surface of the monocrystalline silicon wafer is usually ground by using a grinding disc, and the other surface is ground by turning 180 degrees after grinding, which undoubtedly increases the labor intensity of workers, and has the defect of discontinuous grinding, thereby reducing the grinding efficiency. In addition, the monocrystalline silicon wafer and the grinding disc are subjected to dry friction, the surface of the grinding disc is easy to generate heat and damage, and the monocrystalline silicon wafer can be burnt by heat.
Disclosure of Invention
The invention aims to overcome the defects of the prior art and provides a monocrystalline silicon piece production system and a production process thereof, wherein the tooling is high in tumbling precision and capable of quickly realizing monocrystalline silicon rods, can tumble monocrystalline silicon rods with different lengths, can cut a monocrystalline silicon rod into a plurality of monocrystalline silicon pieces at one time, is automatically centered, improves chamfering efficiency, is high in automation degree, can grind the monocrystalline silicon pieces at one time, and is high in grinding efficiency and cleaning efficiency.
The purpose of the invention is realized by the following technical scheme: a monocrystalline silicon piece production system comprises a tumbling mill, a slicing device, a chamfering device, a grinding machine and a cleaning tank;
the tumbling mill comprises a mill body, a transverse hydraulic sliding table and a longitudinal hydraulic sliding table, wherein the transverse hydraulic sliding table and the longitudinal hydraulic sliding table are arranged at the top of the mill body, a power mechanism and a horizontal oil cylinder are respectively arranged on the top surface of the transverse hydraulic sliding table and positioned at the left end part and the right end part of the transverse hydraulic sliding table, the output end of the power mechanism is connected with a rotating shaft, a shaft sleeve is rotatably arranged at the end part of a piston rod of the horizontal oil cylinder, a conical head is arranged on the left end surface of the shaft sleeve, a sleeve is sleeved on the conical head, the sleeve and the rotating shaft are coaxially;
the slicing device comprises a case, an oil cylinder I arranged at the top of the case, and an unwinding mechanism and a winding mechanism which are arranged in the case, wherein a left roller and a right roller which are arranged in the front and at the back are rotatably arranged in the case, a steel wire is wound between the left roller and the right roller, the head end of the steel wire is fixed on the unwinding mechanism, the tail end of the steel wire is fixed on the winding mechanism, a piston rod of the oil cylinder I extends into the case, a guide rail is fixedly arranged at the tail end of the piston rod, a dovetail groove is formed in the guide rail, a sliding block is slidably arranged in the dovetail groove, a burette which is arranged in the front and at the back is also arranged in the case, the burette is positioned between the left roller and the right roller;
the chamfering device comprises a machine shell, a positioning plate is arranged in the machine shell, the positioning plate is arranged on a rear plate of the machine shell, the microswitch is arranged on a left side plate of the machine shell, a through groove is formed in the left side plate, a grinding wheel B is rotatably installed in the through groove and located on the front side of the microswitch, the air cylinder is arranged on the front plate which penetrates through the machine shell from front to back, a connecting plate is arranged on a piston rod of the air cylinder, a driving belt wheel and a driven belt wheel are rotatably installed at the bottom of the connecting plate through a rotating shaft, a belt is installed between the driving belt wheel and the driven belt wheel, a motor E is fixedly installed at the top of the connecting plate, an output shaft of the motor E is connected with the rotating shaft of the driving belt wheel, a vacuum sucker is arranged on the rotating shaft of the driven belt wheel and located above the connecting plate, the vacuum sucker is coaxially arranged with the rotating shaft of the;
the grinding machine comprises a portal frame and a bearing seat arranged below the portal frame, an oil cylinder II is fixedly arranged at the top of a cross beam of the portal frame, a rotary table is rotatably arranged at the action end of a piston rod of the oil cylinder II, an annular groove is formed in the outer edge of the rotary table, an upper grinding disc is arranged below the rotary table, a connecting piece is fixedly arranged between the upper grinding disc and the rotary table, a plurality of pipelines are arranged between the upper grinding disc and the annular groove, one end of each pipeline is communicated with the annular groove, the other end of each pipeline is communicated with the lower surface of the upper grinding disc, a through hole is formed in the middle of the upper grinding disc; a main shaft is installed in the bearing seat, a connecting shaft is fixedly arranged at the top of the main shaft and is positioned right below the through hole, a plurality of grooves matched with the fixing blocks are formed in the cylindrical surface of the connecting shaft and around the circumferential direction of the connecting shaft, an outer cylinder body positioned below the connecting shaft is rotatably installed on the main shaft, a lower grinding disc and a driven gear C are installed on the outer cylinder body, the lower grinding disc is positioned above the driven gear C, and a driven gear D positioned below the outer cylinder body is also installed on the main shaft; the grinding machine also comprises a motor C and a motor D, wherein a driving gear C is mounted on an output shaft of the motor C and is meshed with a driven gear C, a driving gear D is mounted on an output shaft of the motor D, and the driving gear D is meshed with the driven gear D;
the cleaning tank comprises a tank body, wherein an ultrasonic generator is arranged on the inner wall of the tank body, flanges are arranged on the front wall and the rear wall of the tank body, main brackets are arranged above the two flanges, a transmission shaft is rotatably arranged on the front side and the rear side of the tank body, a cam is arranged on the transmission shaft, a guide sleeve and a motor F are arranged on the front side and the rear side of the tank body, the output end of the motor F is connected with the transmission shaft, the guide sleeve is positioned between the transmission shaft and the flanges, a guide rod capable of moving up and down is slidably arranged in the guide sleeve, a roller is rotatably arranged at the bottom of the guide rod and is placed on the cam, and the; the main bracket is fixedly provided with connecting rods, the connecting rods extend into the groove body, and a frame positioned in the groove body is arranged between the connecting rods;
the production system further comprises a controller and a vacuumizing device, the vacuumizing device is connected with the vacuum chuck, and the controller is connected with the motor, the oil cylinder, the micro switch, the vacuumizing device, the air cylinder, the transverse hydraulic sliding table and the longitudinal hydraulic sliding table.
The power mechanism comprises a motor B and a reduction gearbox, and the output end of the motor B is connected with the input end of the reduction gearbox.
The rotating shaft is connected to the output end of the reduction gearbox.
The slicing device further comprises a mortar pump, and a mortar outlet of the mortar pump is connected with a dropper.
Unwinding mechanism and winding mechanism all are located the right side of right roller.
And an auxiliary bracket is fixedly arranged between the two main brackets.
Four fixing blocks are uniformly distributed on the edge of the through hole.
The process for producing the monocrystalline silicon wafer by the system comprises the following steps:
s1, barreling: the left end face of the to-be-barreled silicon single crystal rod is abutted against the end face of the rotating shaft, and then the piston rod of the horizontal oil cylinder is controlled to extend leftwards to enable the sleeve to abut against the right end face of the silicon single crystal rod, so that the silicon single crystal rod is quickly assembled without clamping by a three-jaw chuck and drilling a conical hole at the tail part of the silicon single crystal rod, and the assembly efficiency is greatly improved; after the silicon single crystal rod is assembled, the longitudinal hydraulic sliding table is controlled to extend out to enable the grinding wheel A to contact the outer surface of the silicon single crystal rod, then the motor A and the motor B are controlled to be started, the motor A drives the grinding wheel A to rotate at a high speed, the torque of the motor B is reduced by the reduction gearbox and then is transmitted to the rotating shaft, the rotating shaft drives the silicon single crystal rod to rotate around the axis of the rotating shaft, meanwhile, the transverse hydraulic sliding table is controlled to reciprocate left and right, the silicon single crystal rod is barreled by the grinding wheel A, and the cylindrical;
s2, slicing: before slicing, firstly adhering a resin strip to the bottom of a sliding block, adhering a cylindrical monocrystalline silicon rod subjected to barreling to the bottom of the resin strip, and then adhering an adhesive tape to the bottom of the cylindrical monocrystalline silicon rod to realize the tool for the cylindrical monocrystalline silicon rod; then controlling the winding mechanism to start, unwinding the steel wire on the unwinding mechanism, and gradually winding the steel wire by the winding mechanism to enable the steel wire between the left roller and the right roller to move horizontally; then starting a mortar pump, pumping the mortar into the dropper by the mortar pump, dropping the mortar from the mortar outlet hole of the dropper, and dropping the mortar on the steel wire; then a piston rod of the oil cylinder I is controlled to extend downwards, the cylindrical monocrystalline silicon rod makes a downward feeding motion, the steel wire with the mortar dropped thereon makes a main motion, the steel wire with the mortar dropped thereon firstly cuts into the adhesive tape which plays a role of a lead, then the steel wire cuts into the cylindrical monocrystalline silicon rod and finally cuts into the resin strip, so that slicing of the cylindrical monocrystalline silicon rod is realized, and a plurality of steel wires are wound between the left and right rollers, so that a plurality of monocrystalline silicon slices are cut at one time;
s3, chamfering: firstly, enabling a grinding wheel B to rotate at a high speed, flatly placing a cut monocrystalline silicon piece on the top of a vacuum chuck, then enabling the monocrystalline silicon piece to lean against a positioning plate to realize preliminary positioning, and finally enabling the monocrystalline silicon piece to lean against a microswitch, wherein the microswitch is pressed down to send an electric signal to a controller, the controller controls a vacuumizing device to start, the vacuumizing device vacuumizes the vacuum chuck, the vacuum chuck sucks the monocrystalline silicon piece, and the automatic centering of the monocrystalline silicon piece is realized, namely the monocrystalline silicon piece is coaxial with the vacuum chuck; after the microswitch is pressed down, the controller also controls the motor E to start, and simultaneously controls the piston rod of the air cylinder to retract, the motor E drives the driving belt wheel to rotate, the driving belt wheel drives the driven belt wheel to rotate through a belt, the driven belt wheel drives the vacuum chuck to do rotary motion, so that the monocrystalline silicon wafer is driven to do rotary motion, the air cylinder drives the monocrystalline silicon wafer to move towards the direction of the grinding wheel B, and in the retraction process of the piston rod, the monocrystalline silicon wafer is slowly tangent to the grinding wheel B, so that the quick chamfering of the monocrystalline silicon wafer is realized;
s4, grinding: placing a plurality of chamfered monocrystalline silicon wafers on the upper surface of a lower grinding disc, then controlling a piston rod of an oil cylinder II to extend downwards, driving an upper grinding disc to move downwards by the piston rod, inserting a fixed block into a groove from top to bottom, controlling the oil cylinder II to close when the lower surface of the upper grinding disc contacts the surface of the monocrystalline silicon wafer, then controlling a motor C to rotate forwards, driving the driving gear C to rotate by the motor C, driving a driven gear C to rotate, driving an outer cylinder to rotate by the driven gear C, driving the lower grinding disc to rotate forwards by the outer cylinder, controlling a motor D to rotate backwards, driving the driving gear D to rotate by the motor D, driving a driven gear D to rotate a connecting shaft on a main shaft to rotate backwards, driving the upper grinding disc to rotate backwards around the axis of the piston rod of the oil cylinder II by the matching of the fixed groove and the fixed block, and in the rotating, the mortar in the annular groove drops on the monocrystalline silicon wafer along the pipeline, so that the monocrystalline silicon wafer is ground by the mortar;
s5, cleaning: firstly, vertically placing the ground monocrystalline silicon wafer into a cleaning basket, then placing the cleaning basket on a frame, namely, the frame supports the cleaning basket, then starting an ultrasonic generator, and simultaneously controlling two motors F to rotate, wherein the motors F drive a transmission shaft to rotate at uniform speed, the transmission shaft drives a cam to rotate, the cam drives a roller to do reciprocating up-and-down motion, and further drives a guide rod to do reciprocating up-and-down motion, the guide rod enables a main support to do reciprocating up-and-down motion, and further drives the frame to do reciprocating up-and-down motion, so that the monocrystalline silicon wafer in the cleaning basket does reciprocating up-and-down motion in water, and in the process of moving the monocrystalline silicon wafer in water, impurities and scraps attached to the surface of the monocrystalline silicon wafer rapidly drop to the bottom of a tank body, and the cleaning.
The invention has the following advantages: the invention has high tumbling precision, can rapidly realize the tool of the monocrystalline silicon rod, can tumble and grind the monocrystalline silicon rods with different lengths, can cut the monocrystalline silicon rod into a plurality of monocrystalline silicon wafers at one time, has automatic centering, improves the chamfering efficiency, has high automation degree, can grind a plurality of monocrystalline silicon wafers at one time, and has high grinding efficiency and high cleaning efficiency.
Drawings
FIG. 1 is a front view of a tumbling mill;
FIG. 2 is a top view of the tumbling mill;
FIG. 3 is a schematic structural view of a slicing apparatus;
FIG. 4 is a cross-sectional view A-A of FIG. 3;
FIG. 5 is a view from the direction B of FIG. 3;
FIG. 6 is a schematic structural view of the chamfering apparatus;
FIG. 7 is a view taken along line C of FIG. 6;
FIG. 8 is a schematic view of the structure of the grinding machine;
FIG. 9 is a cross-sectional view D-D of FIG. 8;
FIG. 10 is a top view of the connecting shaft;
FIG. 11 is a front view of the cleaning tank;
FIG. 12 is a top view of the cleaning tank;
fig. 13 is a cross-sectional view E-E of fig. 12.
Detailed Description
The invention will be further described with reference to the accompanying drawings, without limiting the scope of the invention to the following:
as shown in fig. 1 to 13, a single crystal silicon wafer production system comprises a tumbling mill, a slicing device, a chamfering device, a grinding mill and a cleaning tank;
as shown in fig. 1-2, the tumbling mill includes fuselage 1, sets up in horizontal hydraulic pressure slip table 2 and vertical hydraulic pressure slip table 3 at 1 top of fuselage, the tip is provided with power unit and horizontal cylinder 4 respectively on the top surface of horizontal hydraulic pressure slip table 2 and about being located it, and power unit's output is connected with pivot 5, and the rotatory axle sleeve 6 of installing in tip of horizontal cylinder 4's piston rod, is provided with cone 7 on the left end face of axle sleeve 6, and the cover has sleeve 8 on the cone 7, and sleeve 8 and the coaxial setting of pivot 5, the top fixed mounting of vertical hydraulic pressure slip table 3 has motor A9, installs the emery wheel A10 that sets up around on the output shaft of motor A9.
As shown in fig. 3 to 5, the slicing apparatus includes a cabinet 14, an oil cylinder I15 disposed at the top of the cabinet 14, an unwinding mechanism 16 and a winding mechanism 17 disposed in the cabinet 14, the unwinding mechanism 16 and the winding mechanism 17 are both disposed at the right side of the right roller 19, a left roller 18 and a right roller 19 which are arranged in front and back are rotatably arranged in the case 14, a steel wire 20 is wound between the left roller 18 and the right roller 19, the head end of the steel wire 20 is fixed on the unreeling mechanism 16, the tail end of the steel wire 20 is fixed on the reeling mechanism 17, a piston rod of the oil cylinder I15 extends into the case 14, a guide rail 21 is fixedly arranged at the tail end of the piston rod, a dovetail groove is formed in the guide rail 21, a slide block 22 is slidably arranged in the dovetail groove, a dropper 23 arranged in the front and back is also arranged in the case 14, the dropper 23 is positioned between the left roller 18 and the right roller 19, the dropper 23 is arranged above the steel wire 20, and a plurality of slurry outlet holes are formed at the bottom of the dropper 23 along the length direction of the dropper; the slicing device also comprises a mortar pump, and a mortar outlet of the mortar pump is connected with the dropper 23.
As shown in fig. 6 to 7, the chamfering device includes a housing 26, a positioning plate 27, a micro switch 28 and a cylinder 29 are disposed in the housing 26, the positioning plate 27 is disposed on a rear plate of the housing 26, the micro switch 28 is disposed on a left side plate of the housing 26, a through groove is formed on the left side plate, a grinding wheel B30 is rotatably mounted in the through groove, a grinding wheel B30 is located on a front side of the micro switch 28, the cylinder 29 penetrates through the front plate of the housing 26 from front to back, a connecting plate 31 is disposed on a piston rod of the cylinder 29, a driving pulley 32 and a driven pulley 33 are rotatably mounted at the bottom of the connecting plate 31 via a rotating shaft, a belt 34 is mounted between the driving pulley 32 and the driven pulley 33, a motor E35 is fixedly mounted at the top of the connecting plate 31, an output shaft of the motor E35 is connected with the rotating shaft of the driving pulley 32, the vacuum cup 36 is coaxially disposed with the rotation shaft of the driven pulley 33, and the center of the vacuum cup 36 is spaced from the positioning plate 27 by a distance equal to the distance between the center of the vacuum cup 36 and the microswitch 28.
As shown in fig. 8 to 10, the grinding machine includes a gantry 37 and a bearing block 38 disposed below the gantry 37, an oil cylinder II39 is fixedly mounted at the top of a cross beam of the gantry 37, a rotary table 40 is rotatably mounted at an action end of a piston rod of the oil cylinder II39, an annular groove 41 is disposed on an outer edge of the rotary table 40, an upper grinding disc 42 is disposed below the rotary table 40, a connecting member 43 is fixedly disposed between the upper grinding disc 42 and the rotary table 40, a plurality of pipelines 44 are disposed between the upper grinding disc 42 and the annular groove 41, one end of each pipeline 44 is communicated with the annular groove 41, the other end of each pipeline is communicated with the lower surface of the upper grinding disc 42, a through hole 45 is formed in the middle of the upper grinding disc 42, and a; a main shaft 47 is installed in the bearing seat 38, a connecting shaft 48 is fixedly arranged at the top of the main shaft 47, the connecting shaft 48 is located right below the through hole 45, a plurality of grooves 49 matched with the fixing blocks 46 are formed in the cylindrical surface of the connecting shaft 48 and around the circumferential direction of the connecting shaft, an outer cylinder 50 located below the connecting shaft 48 is rotatably installed on the main shaft 47, a lower grinding disc 51 and a driven gear C52 are installed on the outer cylinder 50, the lower grinding disc 51 is located above the driven gear C52, and a driven gear D53 located below the outer cylinder 50 is also installed on the main shaft 47; the grinder also comprises a motor C54 and a motor D55, wherein a driving gear C56 is mounted on an output shaft of the motor C54, the driving gear C56 is meshed with a driven gear C52, a driving gear D57 is mounted on an output shaft of the motor D55, and the driving gear D57 is meshed with a driven gear D53.
As shown in fig. 11 to 13, the cleaning tank includes a tank body 58, an ultrasonic generator is disposed on an inner wall of the tank body 58, flanges 59 are disposed on front and rear walls of the tank body 58, main brackets 60 are disposed above the two flanges 59, an auxiliary bracket is fixedly disposed between the two main brackets 60, transmission shafts 61 are rotatably mounted on front and rear sides of the tank body 58, cams 62 are mounted on the transmission shafts 61, guide sleeves 63 and motors F64 are disposed on front and rear sides of the tank body 58, an output end of the motor F64 is connected with the transmission shafts 61, the guide sleeves 63 are disposed between the transmission shafts 61 and the flanges 59, guide rods 65 capable of moving up and down are slidably mounted in the guide sleeves 63, rollers 66 are rotatably mounted at bottoms of the guide rods 65, the rollers 66 are disposed on the cams 62, and tops of the guide rods 65 penetrate through the flanges 59 and are; the main bracket 60 is fixedly provided with connecting rods 67, the connecting rods 67 extend into the groove body 58, and a frame 68 positioned in the groove body 58 is arranged between the connecting rods 67.
The production system further comprises a controller and a vacuumizing device, wherein the vacuumizing device is connected with the vacuum sucker 36, and the controller is connected with the motor, the oil cylinder, the microswitch 28, the vacuumizing device, the air cylinder 29, the transverse hydraulic sliding table 2 and the longitudinal hydraulic sliding table 3.
The power mechanism comprises a motor B11 and a reduction gearbox 12, the output end of the motor B11 is connected with the input end of the reduction gearbox 12, and the rotating shaft 5 is connected to the output end of the reduction gearbox 12. Four fixing blocks 46 are uniformly distributed on the edge of the through hole 45.
The process for producing the monocrystalline silicon wafer by the system comprises the following steps:
s1, barreling: the left end face of a to-be-barreled silicon single crystal rod 13 is abutted against the end face of the rotating shaft 5, and then the piston rod of the horizontal oil cylinder 4 is controlled to extend leftwards to enable the sleeve 8 to abut against the right end face of the silicon single crystal rod 13, so that the silicon single crystal rod is quickly assembled without clamping by a three-jaw chuck and drilling a conical hole at the tail part of the silicon single crystal rod, and the assembling efficiency is greatly improved; after the silicon single crystal rod is assembled, the longitudinal hydraulic sliding table 3 is controlled to extend out to enable the grinding wheel A10 to contact the outer surface of the silicon single crystal rod 13, then the motor A9 and the motor B11 are controlled to be started, the motor A9 drives the grinding wheel A10 to do high-speed rotary motion, the torque of the motor B11 is transmitted to the rotating shaft 5 after being reduced in speed by the reduction box 12, the rotating shaft 5 drives the silicon single crystal rod 13 to do rotary motion around the axis of the rotating shaft, meanwhile, the transverse hydraulic sliding table 2 is controlled to do left-right reciprocating motion, the silicon single crystal rod is barreled by the grinding wheel A10, and the cylindrical silicon single crystal rod is obtained after barreling for a period of time, so that the silicon single crystal rod;
s2, slicing: before slicing, firstly adhering a resin strip 24 to the bottom of a slide block 22, adhering a cylindrical monocrystalline silicon rod subjected to barreling to the bottom of the resin strip 24, and then adhering an adhesive tape 25 to the bottom of the cylindrical monocrystalline silicon rod to realize the tool for the cylindrical monocrystalline silicon rod; then, the winding mechanism 17 is controlled to start, the unwinding mechanism 16 unwinds the steel wire thereon, and simultaneously, the winding mechanism 17 gradually winds the steel wire 20 to enable the steel wire 20 positioned between the left roller 18 and the right roller 19 to move horizontally; then, starting a mortar pump, pumping the mortar into the dropper 23 by the mortar pump, dropping the mortar from the mortar outlet hole of the dropper 23, and dropping the mortar on the steel wire 20; then the piston rod of the oil cylinder I15 is controlled to extend downwards, the cylindrical single crystal silicon rod makes a downward feeding motion, the steel wire 20 with the mortar is made a main motion, the steel wire 20 with the mortar is firstly cut into the adhesive tape 25, the adhesive tape 25 plays a role of a lead, then the steel wire is cut into the cylindrical single crystal silicon rod and finally cut into the resin strip 24, so that the slicing of the cylindrical single crystal silicon rod is realized, and a plurality of steel wires are wound between the left roller and the right roller, so that the cutting of a plurality of single crystal silicon slices at one time is realized, and compared with the slicing of a traditional wire cutting machine, the cutting efficiency is greatly improved; in addition, the mortar not only has the function of reducing the surface temperature of the steel wire, but also has the function of cutting the cylindrical single crystal silicon rod, thereby effectively preventing the abrasion of the steel wire and prolonging the service life of the steel wire; in addition, the monocrystalline silicon slices cut into slices are attached to the resin strips 24 and cannot fall off, so that the product is well protected; when the monocrystalline silicon wafer is to be taken out, the slide block 22 only needs to slide out of the guide rail 21, and then the monocrystalline silicon wafer is taken out of the case 14, so that the working operation is convenient;
s3, chamfering: firstly, making a grinding wheel B30 rotate at a high speed, flatly placing the cut monocrystalline silicon piece 69 on the top of a vacuum chuck 36, then making the monocrystalline silicon piece 69 lean against a positioning plate 27 to realize primary positioning, and finally making the monocrystalline silicon piece 69 lean against a microswitch 28, wherein the microswitch 28 is pressed down to send an electric signal to a controller, the controller controls a vacuumizing device to start, the vacuumizing device vacuumizes the vacuum chuck 36, the vacuum chuck 36 sucks the monocrystalline silicon piece 69, and the automatic centering of the monocrystalline silicon piece is realized, namely the monocrystalline silicon piece 69 is coaxial with the vacuum chuck 36; after the microswitch 28 is pressed down, the controller also controls the motor E35 to be started, and simultaneously controls the piston rod of the air cylinder 29 to retract, the motor E35 drives the driving belt wheel 32 to rotate, the driving belt wheel 32 drives the driven belt wheel 33 to rotate through the belt 34, the driven belt wheel 33 drives the vacuum chuck 36 to do rotary motion, so that the monocrystalline silicon wafer 69 is driven to do rotary motion, the air cylinder 29 drives the monocrystalline silicon wafer 69 to move towards the grinding wheel B30, in the retraction process of the piston rod, the monocrystalline silicon wafer is slowly tangent to the grinding wheel B30, so that the quick chamfering of the monocrystalline silicon wafer is realized, the grinding wheel is not required to be manually held for grinding, the labor intensity of workers is greatly reduced, the chamfering efficiency is improved, the microswitch 28 controls the opening and closing of the vacuum pumping device, frequent operation is not required;
s4, grinding: firstly, placing a plurality of chamfered monocrystalline silicon wafers on the upper surface of a lower grinding disc 51, then controlling a piston rod of an oil cylinder II39 to extend downwards, driving the upper grinding disc 42 to move downwards by the piston rod, inserting a fixed block 46 into a groove 49 from top to bottom, closing a control oil cylinder II39 when the lower surface of the upper grinding disc 42 contacts the surface of the monocrystalline silicon wafer, then controlling a motor C54 to rotate forwards, driving a driving gear C56 to rotate by the motor C54, driving a driven gear C56 to rotate a driven gear C52, driving an outer cylinder 50 to rotate by the driven gear C52, driving the lower grinding disc 51 to rotate forwards by the outer cylinder 50, controlling a motor D55 to rotate backwards at the same time, driving a driving gear D57 to rotate by the motor D55, driving a driven gear D53 to rotate by the driving gear D57, driving a connecting shaft 48 on a main shaft 47 to rotate backwards by the driven gear D53, driving the upper grinding disc 42 to rotate backwards around the axis of the, in the rotating process, the mortar in the annular groove 41 drops onto the monocrystalline silicon wafer along the pipeline 44, so that the monocrystalline silicon wafer is ground by the mortar, and the mortar can not only reduce the surface temperature of the grinding disc, but also improve the grinding precision; after a period of grinding, the upper grinding disc 42 finishes grinding the upper surface of the monocrystalline silicon piece, and the lower grinding disc 51 finishes grinding the lower surface of the monocrystalline silicon piece, so that the grinding efficiency is greatly improved, and meanwhile, a plurality of monocrystalline silicon pieces can be ground at one time, so that the grinding efficiency is greatly improved;
s5, cleaning: firstly, vertically placing the ground monocrystalline silicon wafer into a cleaning basket, then placing the cleaning basket on a frame 68, namely the frame 68 supports the cleaning basket, then starting an ultrasonic generator, and simultaneously controlling two motors F64 to rotate, wherein the motor F64 drives a transmission shaft 61 to rotate at a uniform speed, the transmission shaft 61 drives a cam 62 to rotate, the cam 62 drives a roller 66 to do reciprocating up-and-down motion, and further drives a guide rod 65 to do reciprocating up-and-down motion, the guide rod 65 enables a main bracket 60 to do reciprocating up-and-down motion, and further drives the frame 68 to do reciprocating up-and-down motion, so that the monocrystalline silicon wafer in the cleaning basket does reciprocating up-and-down motion in water, impurities and scraps attached to the surface of the monocrystalline silicon wafer rapidly drop to the bottom in the moving process of the monocrystalline silicon wafer in water, the cleaning of the monocrystalline silicon wafer is accelerated, compared with the traditional cleaning method adopting an ultrasonic generator, the cleaning efficiency of the monocrystalline silicon, has the characteristic of high cleaning efficiency.

Claims (8)

1. A single crystal silicon wafer production system is characterized in that: the device comprises a tumbling mill, a slicing device, a chamfering device, a grinding mill and a cleaning tank;
the tumbling mill comprises a machine body (1), a transverse hydraulic sliding table (2) and a longitudinal hydraulic sliding table (3), wherein the transverse hydraulic sliding table (2) and the longitudinal hydraulic sliding table (3) are arranged at the top of the machine body (1), a power mechanism and a horizontal oil cylinder (4) are respectively arranged on the top surface of the transverse hydraulic sliding table (2) and positioned at the left end part and the right end part of the transverse hydraulic sliding table, the output end of the power mechanism is connected with a rotating shaft (5), a shaft sleeve (6) is rotatably arranged at the end part of a piston rod of the horizontal oil cylinder (4), a conical head (7) is arranged on the left end surface of the shaft sleeve (6), a sleeve (8) is sleeved on the conical head (7), the sleeve (8) and the rotating shaft (5) are coaxially arranged, a motor;
the slicing device comprises a case (14), an oil cylinder I (15) arranged at the top of the case (14), an unwinding mechanism (16) and a winding mechanism (17) arranged in the case (14), a left roller (18) and a right roller (19) which are arranged in the case (14) in a front-back manner, a steel wire (20) is wound between the left roller (18) and the right roller (19), the head end of the steel wire (20) is fixed on the unwinding mechanism (16), the tail end of the steel wire (20) is fixed on the winding mechanism (17), a piston rod of the oil cylinder I (15) extends into the case (14), a guide rail (21) is fixedly arranged at the tail end of the piston rod, a dovetail-shaped groove is formed in the guide rail (21), a sliding block (22) is arranged in the dovetail-shaped groove in a sliding manner, a dropper (23) arranged in the case (14) in a front-back manner is further arranged, and the dropper (23, the dropper (23) is arranged above the steel wire (20), and a plurality of slurry outlet holes are formed in the bottom of the dropper (23) along the length direction of the dropper;
the chamfering device comprises a machine shell (26), a positioning plate (27), a microswitch (28) and a cylinder (29) are arranged in the machine shell (26), the positioning plate (27) is arranged on a rear plate of the machine shell (26), the microswitch (28) is arranged on a left side plate of the machine shell (26), a through groove is formed in the left side plate, a grinding wheel B (30) is installed in the through groove in a rotating mode, the grinding wheel B (30) is located on the front side of the microswitch (28), the cylinder (29) is arranged by penetrating through the front plate of the machine shell (26) from front to back, a connecting plate (31) is arranged on a piston rod of the cylinder (29), a driving belt wheel (32) and a driven belt wheel (33) are installed at the bottom of the connecting plate (31) in a rotating mode through a rotating shaft, a belt (34) is installed between the driving belt wheel (32) and the driven belt wheel (33), a motor E (35) is fixedly installed at the, a vacuum sucker (36) is arranged on a rotating shaft of the driven belt wheel (33), the vacuum sucker (36) is positioned above the connecting plate (31), the vacuum sucker (36) and the rotating shaft of the driven belt wheel (33) are coaxially arranged, and the distance between the center of the vacuum sucker (36) and the positioning plate (27) is equal to the distance between the center of the vacuum sucker (36) and the microswitch (28);
the grinding machine comprises a portal frame (37) and a bearing seat (38) arranged below the portal frame (37), wherein an oil cylinder II (39) is fixedly arranged at the top of a cross beam of the portal frame (37), a rotary table (40) is rotatably arranged at the action end of a piston rod of the oil cylinder II (39), an annular groove (41) is formed in the outer edge of the rotary table (40), an upper grinding disc (42) is arranged below the rotary table (40), a connecting piece (43) is fixedly arranged between the upper grinding disc (42) and the rotary table (40), a plurality of pipelines (44) are arranged between the upper grinding disc (42) and the annular groove (41), one end of each pipeline (44) is communicated with the annular groove (41), the other end of each pipeline is communicated with the lower surface of the upper grinding disc (42), a through hole (45) is formed in the middle of the upper grinding disc (42), and a plurality of; a main shaft (47) is installed in the bearing seat (38), a connecting shaft (48) is fixedly arranged at the top of the main shaft (47), the connecting shaft (48) is located right below the through hole (45), a plurality of grooves (49) matched with the fixing blocks (46) are formed in the cylindrical surface of the connecting shaft (48) and arranged in the circumferential direction of the cylindrical surface, an outer cylinder body (50) located below the connecting shaft (48) is rotatably installed on the main shaft (47), a lower grinding disc (51) and a driven gear C (52) are installed on the outer cylinder body (50), the lower grinding disc (51) is located above the driven gear C (52), and a driven gear D (53) located below the outer cylinder body (50) is further installed on the main shaft (47); the grinder also comprises a motor C (54) and a motor D (55), wherein a driving gear C (56) is installed on an output shaft of the motor C (54), the driving gear C (56) is meshed with a driven gear C (52), a driving gear D (57) is installed on an output shaft of the motor D (55), and the driving gear D (57) is meshed with a driven gear D (53);
the cleaning tank comprises a tank body (58), an ultrasonic generator is arranged on the inner wall of the tank body (58), flanges (59) are arranged on the front wall and the rear wall of the tank body (58), main brackets (60) are arranged above the two flanges (59), the front side and the rear side of the groove body (58) are respectively rotatably provided with a transmission shaft (61), the transmission shaft (61) is provided with a cam (62), the front side and the rear side of the groove body (58) are respectively provided with a guide sleeve (63) and a motor F (64), the output end of the motor F (64) is connected with the transmission shaft (61), the guide sleeve (63) is positioned between the transmission shaft (61) and a flange (59), a guide rod (65) capable of moving up and down is slidably arranged in the guide sleeve (63), the bottom of the guide rod (65) is rotatably provided with a roller (66), the roller (66) is placed on the cam (62), and the top of the guide rod (65) penetrates through the flange (59) and is fixed on the main support; a connecting rod (67) is fixedly arranged on the main bracket (60), the connecting rod (67) extends into the groove body (58), and a frame (68) positioned in the groove body (58) is arranged between the connecting rods (67);
the production system further comprises a controller and a vacuumizing device, the vacuumizing device is connected with the vacuum sucker (36), and the controller is connected with the motor, the oil cylinder, the micro switch (28), the vacuumizing device, the air cylinder (29), the transverse hydraulic sliding table (2) and the longitudinal hydraulic sliding table (3).
2. A single-crystal silicon wafer production system according to claim 1, wherein: the power mechanism comprises a motor B (11) and a reduction gearbox (12), and the output end of the motor B (11) is connected with the input end of the reduction gearbox (12).
3. A single-crystal silicon wafer production system according to claim 1, wherein: the rotating shaft (5) is connected to the output end of the reduction gearbox (12).
4. A single-crystal silicon wafer production system according to claim 1, wherein: the slicing device further comprises a mortar pump, and a mortar outlet of the mortar pump is connected with a dropper (23).
5. A single-crystal silicon wafer production system according to claim 1, wherein: and the unwinding mechanism (16) and the winding mechanism (17) are both positioned on the right side of the right roller (19).
6. A single-crystal silicon wafer production system according to claim 1, wherein: an auxiliary bracket is fixedly arranged between the main brackets (60) above the two flanges (59).
7. A single-crystal silicon wafer production system according to claim 1, wherein: four fixing blocks (46) are uniformly distributed on the edge of the through hole (45).
8. The process for producing a single crystal silicon wafer according to any one of claims 1 to 7, wherein: it comprises the following steps:
s1, barreling: the left end face of a to-be-barreled silicon single crystal rod (13) is abutted against the end face of the rotating shaft (5), and then a piston rod of the horizontal oil cylinder (4) is controlled to extend leftwards to enable the sleeve (8) to abut against the right end face of the silicon single crystal rod (13), so that the silicon single crystal rod is quickly assembled, a three-jaw chuck is not required to be used for clamping, a conical hole is not required to be drilled at the tail part of the silicon single crystal rod, and the assembling efficiency is greatly improved; after the silicon single crystal rod is assembled, the longitudinal hydraulic sliding table (3) is controlled to stretch out to enable the grinding wheel A (10) to contact the outer surface of the silicon single crystal rod (13), then the motor A (9) and the motor B (11) are controlled to be started, the motor A (9) drives the grinding wheel A (10) to do high-speed rotary motion, the torque of the motor B (11) is reduced by the reduction gearbox (12) and then transmitted to the rotating shaft (5), the rotating shaft (5) drives the silicon single crystal rod (13) to do rotary motion around the axis of the silicon single crystal rod, meanwhile, the transverse hydraulic sliding table (2) is controlled to do left-right reciprocating motion, the grinding wheel A (10) grinds the silicon single crystal rod;
s2, slicing: before slicing, firstly adhering a resin strip (24) to the bottom of a sliding block (22), adhering a cylindrical monocrystalline silicon rod subjected to barreling to the bottom of the resin strip (24), and then adhering an adhesive tape (25) to the bottom of the cylindrical monocrystalline silicon rod to realize the tool for the cylindrical monocrystalline silicon rod; then controlling the winding mechanism (17) to start, unwinding the steel wire on the unwinding mechanism (16), and gradually winding the steel wire (20) by the winding mechanism (17) to enable the steel wire (20) between the left roller (18) and the right roller (19) to horizontally move; then, a mortar pump is started, the mortar pump pumps the mortar into the dropper (23), the mortar drops from a mortar outlet hole of the dropper (23), and the mortar drops on the steel wire (20); then a piston rod of the oil cylinder I (15) is controlled to extend downwards, the cylindrical single crystal silicon rod makes a downward feeding motion, the steel wire (20) with the mortar is made a main motion, the steel wire (20) with the mortar is firstly cut into the adhesive tape (25), the adhesive tape (25) plays a role of a lead, then the steel wire is cut into the cylindrical single crystal silicon rod and finally cut into the resin strip (24), and therefore slicing of the cylindrical single crystal silicon rod is achieved, and due to the fact that a plurality of steel wires are wound between the left roller and the right roller, a plurality of single crystal silicon slices are cut at one time;
s3, chamfering: firstly, making a grinding wheel B (30) rotate at a high speed, flatly placing a cut monocrystalline silicon piece (69) on the top of a vacuum chuck (36), then leaning the monocrystalline silicon piece (69) against a positioning plate (27) to realize primary positioning, and finally leaning the monocrystalline silicon piece (69) against a microswitch (28), wherein the microswitch (28) is pressed down to send an electric signal to a controller, the controller controls a vacuumizing device to start, the vacuumizing device vacuumizes the vacuum chuck (36), the vacuum chuck (36) sucks the monocrystalline silicon piece (69), so that the automatic centering of the monocrystalline silicon piece is realized, namely the monocrystalline silicon piece (69) and the vacuum chuck (36) are coaxial; after the microswitch (28) is pressed down, the controller also controls a motor E (35) to start, and simultaneously controls a piston rod of the air cylinder (29) to retract, the motor E (35) drives a driving belt wheel (32) to rotate, the driving belt wheel (32) drives a driven belt wheel (33) to rotate through a belt (34), the driven belt wheel (33) drives a vacuum chuck (36) to do rotary motion, so that a monocrystalline silicon piece (69) is driven to do rotary motion, the air cylinder (29) drives the monocrystalline silicon piece (69) to move towards the grinding wheel B (30), and in the retraction process of the piston rod, the monocrystalline silicon piece is slowly tangent to the grinding wheel B (30), so that the quick chamfering of the monocrystalline silicon piece is realized;
s4, grinding: firstly, placing a plurality of chamfered monocrystalline silicon wafers on the upper surface of a lower grinding disc (51), then controlling a piston rod of an oil cylinder II (39) to extend downwards, driving an upper grinding disc (42) to move downwards by the piston rod, inserting a fixed block (46) into a groove (49) from top to bottom, closing the oil cylinder II (39) when the lower surface of the upper grinding disc (42) contacts the surface of the monocrystalline silicon wafer, then controlling a motor C (54) to rotate forwards, driving a driving gear C (56) by the motor C (54), driving a driven gear C (52) by the driving gear C (56), driving an outer cylinder (50) by the driven gear C (52), driving the lower grinding disc (51) by the outer cylinder (50) to rotate forwards, controlling a motor D (55) to rotate backwards, driving a D (57) by the motor D (55), driving a driven gear D (53) by the driving gear D (57), the driven gear D (53) drives a connecting shaft (48) on the main shaft (47) to rotate reversely, the connecting shaft (48) drives the upper grinding disc (42) to rotate reversely around the axis of the piston rod of the oil cylinder II (39) through the matching of the fixed groove (49) and the fixed block (46), and in the rotating process, mortar in the annular groove (41) drops onto the monocrystalline silicon wafer along the pipeline (44), so that the monocrystalline silicon wafer is ground by the mortar;
s5, cleaning: firstly, vertically placing the ground monocrystalline silicon wafer in a cleaning basket, then placing the cleaning basket on a frame (68), namely, the frame (68) supports the cleaning basket, then the ultrasonic generator is started, two motors F (64) are controlled to rotate simultaneously, the motors F (64) drive the transmission shafts (61) to rotate at the same speed, the transmission shafts (61) drive the cams (62) to rotate, the cams (62) drive the rollers (66) to do reciprocating up-and-down motion, the guide rods (65) are further driven to do reciprocating up-and-down motion, the guide rods (65) enable the main support (60) to do reciprocating up-and-down motion, and the frame (68) is further driven to do reciprocating up-and-down motion, thereby leading the monocrystalline silicon piece in the cleaning basket to do reciprocating up-and-down motion in water, leading the monocrystalline silicon piece to be in the motion process in the water, impurities and scraps attached to the surface of the monocrystalline silicon wafer rapidly drop to the bottom of the tank body, so that the cleaning of the monocrystalline silicon wafer is accelerated.
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