CN214980116U

CN214980116U - Polishing equipment for sapphire wafer

Info

Publication number: CN214980116U
Application number: CN202120861324.XU
Authority: CN
Inventors: 王慧芳; 林传宝
Original assignee: Jiaozuo Huahan Photoelectric Co ltd
Current assignee: Jiaozuo Huahan Photoelectric Co ltd
Priority date: 2021-04-25
Filing date: 2021-04-25
Publication date: 2021-12-03
Anticipated expiration: 2031-04-25

Abstract

The utility model provides a polishing equipment for sapphire wafer relates to sapphire polishing equipment technical field, and this a polishing equipment for sapphire wafer includes the workstation, the automatic unloading mechanism of going up that is used for sapphire wafer polishing mechanism and is used for sapphire wafer to go up and down is installed at the top of workstation, the automatic unloading mechanism of going up has two, two go up unloading mechanism and the circumferencial direction evenly distributed that goes up the unloading mechanism and go up and down polishing mechanism along the rolling disc in the automation, the axis of rotation that extends to the workstation is all installed to the bottom of the automatic unloading mechanism of going up and down polishing mechanism, the sheave is installed to the bottom of axis of rotation, driving motor is installed to the bottom of workstation, install the initiative driver plate on driving motor's the output shaft. Thereby make the device can accomplish the automatic material loading, polishing and the unloading of going up unloading mechanism automatically, improved the polishing efficiency of device, needn't repeatedly open equipment when going up unloading simultaneously and stop.

Description

Polishing equipment for sapphire wafer

Technical Field

The utility model relates to a sapphire polishing equipment technical field specifically is a polishing equipment for sapphire wafer.

Background

Need polish it during sapphire wafer production, traditional polishing equipment is bulky, and the operation is complicated, inconvenient transportation, extravagant usage space, and inconvenient adjusting polishing equipment has increased the operation degree of difficulty simultaneously.

The chinese patent that is CN205520877U in the bulletin number of authorizing discloses a polishing equipment for sapphire wafer, including first base and second base, first base and second base upside are equipped with the telescopic link, the telescopic link inboard is equipped with the motor, the motor inboard is equipped with the pivot, the pivot middle part is equipped with the connecting pipe, the symmetry is equipped with the stopper on the connecting pipe, the pivot inboard is equipped with the rotary rod, the rotary rod inboard is equipped with rotatory piece, rotatory piece inboard is equipped with the hose, hose surface symmetry is equipped with the brush.

However, the above technical solution has the following defect that the apparatus needs to be manually loaded and unloaded when polishing the sapphire wafer, so that the apparatus needs to be continuously started and stopped when polishing, thereby reducing the service life of the apparatus, affecting the polishing efficiency of the sapphire wafer, and being not beneficial to polishing a large number of sapphire wafers.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a polishing equipment for sapphire wafer aims at solving the device among the prior art and need constantly start and stop when polishing, from the life for having reduced the device to influence the polishing efficiency of sapphire wafer, be unfavorable for carrying on the problem of big polishing of sapphire wafer in batches.

In order to achieve the above purpose, the utility model adopts the following technical scheme: the polishing device for the sapphire wafer comprises a workbench and a rotating disc arranged at the top end of the workbench, the top of the rotating disc is provided with a fixed groove, the top of the workbench is provided with a lifting polishing mechanism for polishing the sapphire wafer and an automatic feeding and discharging mechanism for feeding and discharging the sapphire wafer, the two automatic feeding and discharging mechanisms and the two lifting polishing mechanisms are uniformly distributed along the circumferential direction of the rotating disc, the bottoms of the automatic feeding and discharging mechanism and the lifting polishing mechanism are both provided with rotating shafts extending to the workbench, a grooved pulley is arranged at the bottom of the rotating shaft, a radial groove is arranged at the bottom of the grooved pulley, a driving motor is arranged at the bottom of the workbench, an output shaft of the driving motor is provided with an active driving plate, and the bottom of the active driving plate is provided with a driving lever for driving the grooved wheel to rotate.

In order to make the utility model discloses have the effect that can drive the burnishing machine and carry out reciprocal lift, the utility model discloses a further technical scheme does, the workstation is close to lift polishing mechanism's bottom one end fixedly connected with fixed plate, the transmission shaft is installed to the one end that the fixed plate is close to the initiative driver plate.

The utility model discloses a further technical scheme does, the driving medium is all installed with the bottom middle part of initiative driver plate to the transmission shaft, the driving medium is a pair of intermeshing's bevel gear, the one end that the transmission shaft is close to lift polishing mechanism runs through the fixed plate and installs the cam.

The utility model discloses a further technical scheme does, the lift spacing groove has been seted up at the middle part of backup pad, the lift axle that extends to the workstation bottom is installed to the bottom of lift spacing groove, the bottom of lift axle and the outer wall contact of cam.

The utility model discloses a further technical scheme does, the lift connecting plate that is used for driving the burnishing machine and goes up and down and slides along the single degree of freedom of lift spacing groove is installed at the top of lift axle, the one end of lift connecting plate stretch out the lift spacing groove and with the outer wall fixed connection of burnishing machine.

The utility model discloses a further technical scheme does, the reset spring who is used for driving the lift connecting plate and resets is installed at the outer wall top of lift axle.

In order to make the utility model discloses have the effect of unloading in the automation, the utility model discloses a further technical scheme does, unloading mechanism includes the connection pad in the automation, the top edge of connection pad evenly installs the three automatic vacuum chuck that is used for the sapphire wafer to go up and down, the bottom mid-mounting of connection pad has the automatic telescopic link that is used for automatic vacuum chuck to go up and down.

The utility model has the advantages that:

after the device polishes the sapphire wafer, driving motor drives the initiative driver plate pivoted and drives the cam through driving medium and transmission shaft simultaneously and rotates, the cam passes through the lift axle with burnishing machine jack-up, the initiative driver plate drives three sheave rotation through driving lever one side this moment, the rolling disc rotates simultaneously, the sapphire wafer after will polishing is transported to automatic vacuum chuck's below by the burnishing machine, then unloading is carried out to one of them automatic unloading mechanism of going up, another automatic unloading mechanism of going up carries out the material loading, thereby make the device can accomplish the automatic material loading of unloading mechanism of going up, polishing and unloading automatically, the polishing efficiency of device has been improved, needn't repeatedly open and stop equipment when going up unloading simultaneously, the service life of equipment has been improved.

Drawings

Fig. 1 is a schematic front view of a polishing apparatus for a sapphire wafer.

Fig. 2 is a schematic diagram of a rear view configuration of a polishing apparatus for a sapphire wafer.

Fig. 3 is a schematic structural view of a polishing apparatus driving mechanism for a sapphire wafer.

In the figure: 1. a work table; 2. rotating the disc; 3. fixing grooves; 4. an automatic loading and unloading mechanism; 401. automatically telescoping the rod; 402. a connecting disc; 403. an automatic vacuum chuck; 5. a lifting polishing mechanism; 501. a support plate; 502. a lifting limiting groove; 503. lifting the connecting plate; 504. a lifting shaft; 505. a return spring; 506. polishing the machine; 6. a drive motor; 7. an active drive plate; 8. a grooved wheel; 9. a radial slot; 10. a deflector rod; 11. a transmission member; 12. a drive shaft; 13. a cam; 14. a fixing plate; 15. and rotating the shaft.

Detailed Description

The following description will further describe embodiments of the present invention with reference to the accompanying drawings.

As shown in fig. 1-3, a polishing apparatus for sapphire wafers, including a worktable 1 and a rotating disc 2 installed on the top of the worktable 1, a fixed slot 3 is opened on the top of the rotating disc 2, a lifting polishing mechanism 5 for polishing sapphire wafers and an automatic feeding and discharging mechanism 4 for feeding and discharging sapphire wafers are installed on the top of the worktable 1, there are two automatic feeding and discharging mechanisms 4, the two automatic feeding and discharging mechanisms 4 and the lifting polishing mechanism 5 are uniformly distributed along the circumferential direction of the rotating disc 2, rotating shaft sheaves 15 extending to the worktable 1 are installed on the bottoms of the automatic feeding and discharging mechanisms 4 and the lifting polishing mechanism 5, shift levers 8 are installed on the bottoms of the rotating shafts 15, radial slots 9 are opened on the bottoms of the sheaves 8, a driving motor 6 is installed on the bottom of the worktable 1, a driving dial 7 is installed on an output shaft of the driving motor 6, and a driving lever 10 for shifting the sheaves 8 to rotate is installed on the bottom of the driving dial 7.

In the embodiment, the driving motor 6 drives the driving dial 7 to rotate, the driving dial is driven by the transmission member 11 and drives the cam 13 to rotate by the transmission shaft 12, and the polishing machine 506 is driven by the cam 13 to go up and down, when the polishing machine goes up, the driving dial 7 drives the rotating disc 2 to rotate and the two automatic loading and unloading mechanisms 4 to rotate in sequence by the deflector rod 10 and the grooved pulley 8, the rotating disc 2 rotates the polished sapphire wafer to the position below one of the automatic loading and unloading mechanisms 4 and rotates the sapphire wafer to be polished below the other automatic loading and unloading mechanism 4 to the position below the polishing machine 506, at the moment, the two automatic loading and unloading mechanisms 4 go down, at the same time, one automatic loading and unloading mechanism 4 sucks up the polished sapphire wafer, the other automatic loading and unloading mechanism 4 places the sapphire wafer to be processed on the fixed groove on the polishing machine 2, thereby make the device can accomplish automatic feeding, polishing and the unloading of going up unloading mechanism automatically, improved the polishing efficiency of device, needn't repeatedly open equipment when going up unloading simultaneously and stop, improved the life of equipment.

Specifically, a fixing plate 14 is fixedly connected to one end of the bottom of the working table 1 close to the lifting polishing mechanism 5, and a transmission shaft 12 is installed at one end of the fixing plate 14 close to the driving dial 7.

Specifically, the transmission parts 11 are respectively installed at the middle parts of the transmission shaft 12 and the bottom end of the driving dial 7, the transmission parts 11 are a pair of mutually meshed bevel gears, and one end of the transmission shaft 12 close to the lifting polishing mechanism 5 penetrates through the fixing plate 14 and is provided with a cam 13.

Further, the lifting polishing mechanism 5 comprises a supporting plate 501 and a polishing machine 506, a lifting limiting groove 502 is formed in the middle of the supporting plate 501, a lifting shaft 504 extending to the bottom of the workbench 1 is installed at the bottom of the lifting limiting groove 502, and the bottom end of the lifting shaft 504 is in contact with the outer wall of the cam 13 and can drive the polishing machine 506 to intermittently ascend.

Preferably, the top of the lifting shaft 504 is provided with a lifting connecting plate 503 for driving the polishing machine 506 to lift and slide along the lifting limiting groove 502 with a single degree of freedom, and one end of the lifting connecting plate 503 extends out of the lifting limiting groove 502 and is fixedly connected with the outer wall of the polishing machine 506, so that the lifting of the polishing machine 506 can be limited.

Further, a return spring 505 for driving the lifting connecting plate 503 to reset is installed at the top of the outer wall of the lifting shaft 504, and can drive the polishing machine 506 to automatically reset.

Specifically, the automatic loading and unloading mechanism 4 comprises a connecting disc 402, three automatic vacuum chucks 403 used for loading and unloading sapphire wafers are uniformly installed at the top edge of the connecting disc 402, and an automatic telescopic rod 401 used for lifting the automatic vacuum chucks 403 is installed in the middle of the bottom end of the connecting disc 402.

In the description of the present invention, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

It is obvious to a person skilled in the art that the invention is not restricted to details of the above-described exemplary embodiments, but that it can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.

Claims

1. The utility model provides a polishing equipment for sapphire wafer, includes workstation (1) and installs rolling disc (2) on workstation (1) top, fixed slot (3) have been seted up at the top of rolling disc (2), characterized by, the automatic unloading mechanism (4) of going up and down that is used for sapphire wafer polishing (5) and is used for sapphire wafer to go up and down are installed at the top of workstation (1), automatic unloading mechanism (4) have two, two automatic unloading mechanism (4) and lifting polishing mechanism (5) evenly distributed along the circumferencial direction of rolling disc (2), the axis of rotation (15) that extend to workstation (1) are all installed to the bottom of automatic unloading mechanism (4) and lifting polishing mechanism (5), sheave (8) are installed to the bottom of axis of rotation (15), radial groove (9) have been seted up to the bottom of sheave (8), the automatic shifting mechanism is characterized in that a driving motor (6) is installed at the bottom of the workbench (1), an active driving plate (7) is installed on an output shaft of the driving motor (6), and a shifting lever (10) used for shifting the grooved pulley (8) to rotate is installed at the bottom of the active driving plate (7).

2. The polishing device for the sapphire wafer as set forth in claim 1, wherein a fixed plate (14) is fixedly connected to one end of the table (1) near the bottom of the lifting polishing mechanism (5), and a transmission shaft (12) is mounted on one end of the fixed plate (14) near the driving dial (7).

3. The polishing apparatus for sapphire wafer as set forth in claim 2, wherein a driving member (11) is installed at the middle of the bottom end of each of the driving shaft (12) and the driving dial (7), the driving members (11) are a pair of bevel gears engaged with each other, and one end of the driving shaft (12) near the lifting polishing mechanism (5) penetrates the fixed plate (14) and is installed with the cam (13).

4. The polishing apparatus for a sapphire wafer according to any one of claims 1 to 3, wherein the lifting polishing mechanism (5) comprises a support plate (501) and a polishing machine (506), a lifting limiting groove (502) is formed in the middle of the support plate (501), a lifting shaft (504) extending to the bottom of the worktable (1) is mounted at the bottom of the lifting limiting groove (502), and the bottom end of the lifting shaft (504) is in contact with the outer wall of the cam (13).

5. The polishing apparatus for the sapphire wafer as set forth in claim 4, wherein a lifting connection plate (503) for driving the polishing machine (506) to lift and descend and to slide and ascend along the lifting limit groove (502) with a single degree of freedom is mounted on the top of the lifting shaft (504), and one end of the lifting connection plate (503) extends out of the lifting limit groove (502) and is fixedly connected with the outer wall of the polishing machine (506).

6. The polishing apparatus for sapphire wafer as set forth in claim 5, wherein a return spring (505) for returning the lifting link plate (503) is installed on the top of the outer wall of the lifting shaft (504).

7. The polishing device for the sapphire wafer as set forth in any one of claims 1 to 3, wherein the automatic loading and unloading mechanism (4) comprises a connecting disc (402), three automatic vacuum chucks (403) for loading and unloading the sapphire wafer are uniformly installed at the top edge of the connecting disc (402), and an automatic telescopic rod (401) for lifting the automatic vacuum chucks (403) is installed in the middle of the bottom end of the connecting disc (402).