CN221455545U

CN221455545U - Multi-carrier-disc chip mounter

Info

Publication number: CN221455545U
Application number: CN202323278357.XU
Authority: CN
Inventors: 何广强; 董建斌; 刘建伟; 谭永麟
Original assignee: Zhonghuan Leading Semiconductor Technology Co ltd; Tianjin Zhonghuan Advanced Material Technology Co Ltd
Current assignee: Zhonghuan Leading Semiconductor Technology Co ltd; Tianjin Zhonghuan Advanced Material Technology Co Ltd
Priority date: 2023-12-01
Filing date: 2023-12-01
Publication date: 2024-08-02
Anticipated expiration: 2033-12-01

Abstract

The utility model provides a multi-carrier-disc chip mounter which comprises a supporting carrier, a wax dripping device and a ceramic disc, wherein a plurality of carrier discs are arranged on the upper part of the supporting carrier and used for adsorbing silicon chips, the carrier discs can rotate around respective axes at the same time, the wax dripping device is arranged on the outer side of the supporting carrier and used for dripping wax to the silicon chips, the ceramic disc is arranged above the carrier discs, and the carrier discs can move up and down to paste the silicon chips on the ceramic disc. The polishing wax coating device has the advantages that polishing wax can be coated on a plurality of silicon wafers at the same time, uniformity of wax films of different silicon wafers is guaranteed, the silicon wafers are directly attached to the ceramic disc without reversing by using a mechanical arm, uniformity of the wax films is improved, risk of scratches of the silicon wafers is reduced, and production efficiency is improved.

Description

Multi-carrier-disc chip mounter

Technical Field

The utility model belongs to the technical field of monocrystalline silicon wafer polishing production, and particularly relates to a multi-carrier-disc chip mounter.

Background

In the polishing process of the monocrystalline silicon wafer, a chip mounter is required to be used for coating polishing wax on the monocrystalline silicon wafer, then a mechanical arm is used for reversing the silicon wafer, and the silicon wafer is stuck on a ceramic disc for polishing. In the process of reversing the silicon wafer, the wax film of the silicon wafer is uneven, and the mechanical arm is extremely easy to scratch the silicon wafer. In the prior art, the chip mounter can only coat polishing wax on a single silicon chip, so that uniformity of wax films of different silicon chips is inconsistent easily, and production efficiency is low.

Disclosure of utility model

In order to solve the technical problems, the utility model provides the multi-carrier disc chip mounter, which effectively solves the problems that the existing chip mounter has lower production efficiency, different silicon wafers have inconsistent wax film uniformity and are easy to scratch by a mechanical arm, and overcomes the defects in the prior art.

The technical scheme adopted by the utility model is as follows: a multi-carrier chip mounter, comprising:

The upper part of the support carrier is provided with a plurality of carrier plates for adsorbing silicon wafers, and the carrier plates can rotate around respective axes at the same time;

The wax dripping device is arranged at the outer side of the supporting carrier and is used for dripping wax to the silicon wafer;

The ceramic disc is arranged above the carrying disc, and the carrying disc can move up and down to attach the silicon wafer to the ceramic disc.

Further, the plurality of carrier plates are uniformly distributed along the circumferential direction of the support carrier.

Further, the wax dropping device is provided with a plurality of wax dropping devices, and the wax dropping devices are arranged along the circumferential direction of the supporting carrier platform relative to the plurality of carrier plates.

Further, the bottom of the carrying disc is provided with a rotating shaft, and the rotating shaft penetrates through the supporting carrying platform.

Further, a first driving device is arranged below the supporting carrier and used for driving the rotating shaft to rotate simultaneously.

Further, a driving gear is arranged on the first driving device, driven gears are arranged on the rotating shafts, and the driving gears are externally meshed with the driven gears.

Further, a second driving device is arranged at one end of the rotating shaft, which is far away from the carrying disc, and can drive the rotating shaft to move up and down.

Further, a connecting piece is arranged at one end, close to the rotating shaft, of the second driving device, a bearing is arranged on the connecting piece, and the bearing is connected with the end part of the rotating shaft.

Further, baffles are arranged in the circumferential direction of the carrier disc, and the baffles are arranged on the supporting carrier.

Further, a sliding table is arranged at the bottom of the wax dripping device and can drive the wax dripping device to be close to or far away from the supporting carrier.

The utility model has the advantages and positive effects that: by adopting the technical scheme, the polishing wax can be coated on a plurality of silicon wafers at the same time, so that uniformity of wax films of different silicon wafers is guaranteed, the silicon wafers are directly attached to the ceramic disc without reversing by using the mechanical arm, uniformity of the wax films is improved, risk of scratches of the silicon wafers is reduced, and production efficiency is improved.

Drawings

Fig. 1 is a schematic diagram of an overall structure of a multi-tray chip mounter according to an embodiment of the present utility model.

Fig. 2 is a top view of a support carrier of a multi-tray chip mounter according to an embodiment of the present utility model.

In the figure:

1. Support carrier 2, carrier plate 3 and silicon wafer

4. Wax dropping device 5, ceramic disc 6 and mechanical arm

7. A rotation shaft 8, a first driving device 9, and a driving gear

10. Driven gear 11, second driving device 12, and connecting member

13. Bearing 14, baffle 15 and sliding table

Detailed Description

The embodiment of the utility model provides a multi-tray chip mounter, and the embodiment of the utility model is described below with reference to the accompanying drawings.

In the description of the embodiments of the present utility model, it should be understood that the orientation or positional relationship indicated by the terms "top", "bottom", etc. are based on the orientation or positional relationship shown in the drawings, are merely for convenience of description and to simplify the description, and are not indicative or implying that the apparatus or element in question must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the present utility model. In the description of the present utility model, it should be noted that, unless explicitly stated and limited otherwise, the terms "disposed," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art in a specific case.

As shown in fig. 1 and 2, the multi-carrier-disc chip mounter according to the embodiment of the present utility model includes a supporting carrier 1, a wax dripping device 4 and a ceramic disc 5, where a plurality of carrier discs 2 are disposed on the upper portion of the supporting carrier 1 for adsorbing silicon wafers 3, and the structure of the carrier discs 2 is the same as that of the carrier disc of the existing wax applicator for vacuumizing and adsorbing the silicon wafers 3, and the specific structure is not described here. The plurality of carrying discs 2 can rotate around the respective axes simultaneously, and meanwhile, the plurality of silicon wafers 3 are subjected to wax throwing, the rotation speed is kept consistent, and the uniformity of the wax film thickness of the plurality of silicon wafers 3 is kept consistent. The outside at support carrier 1 is equipped with and drips wax device 4 for to the 3 wax of silicon chip, the structure is the same with the current wax device 4 of chip mounter, and specific structure is here not repeated. A ceramic disc 5 is arranged above the carrying disc 2, and the ceramic disc 5 is fixed by a mechanical arm 6. The carrying disc 2 can move up and down, the wax dripping device 4 drips polishing wax on the silicon wafer 3, the plurality of carrying discs 2 rotate simultaneously to throw wax, a wax film is formed on the upper surface of the silicon wafer 3, the plurality of carrying discs 2 ascend simultaneously, the plurality of silicon wafers 3 are directly attached to the ceramic disc 5, and the silicon wafer 3 does not need to be reversed.

The shapes of the carrier plate 2 and the support stage 1 are not limited, and are preferably circular. The number of carrier plates 2 is not limited and is uniformly distributed along the circumferential direction of the support stage 1.

The plurality of wax dropping devices 4 are arranged, and the positions of the opposite carrier plates 2 are arranged along the circumferential direction of the supporting carrier table 1, namely one carrier plate 2 corresponds to one wax dropping device 4, so that the wax can be dropped on a plurality of silicon wafers 3 at the same time.

Specifically, the bottom of the carrying disc 2 is provided with rotating shafts 7, and a plurality of rotating shafts 7 penetrate through the supporting carrying platform 1 to be vertically arranged and in clearance fit with the supporting carrying platform 1.

Specifically, a first driving device 8 is disposed in the center of the lower portion of the support carrier 1, and is used for driving the multiple rotation shafts 7 to rotate simultaneously. The specific form of the first driving device 8 is not limited, and may be a motor, and the motor drives the plurality of rotating shafts 7 to rotate simultaneously, so that the plurality of carrier plates 2 rotate simultaneously to throw wax.

Specifically, the output end of the first driving device 8 is provided with a driving gear 9, the rotating shaft 7 is provided with a driven gear 10, and the driving gear 9 is externally meshed with the driven gear 10. The driving gear 9 and the plurality of driven gears 10 are disposed on the same plane. The driven gears 10 are uniformly distributed along the circumferential direction of the driving gear 9. The first driving device 8 drives the driving gear 9 to rotate, and the driving gear 9 drives the driven gears 10 to simultaneously rotate, so that the rotating shafts 7 and the carrying disc 2 are driven to simultaneously rotate, and the silicon wafers 3 simultaneously throw wax.

Specifically, the end of the rotating shaft 7 far away from the carrier plate 2 is provided with a second driving device 11, which can drive the rotating shaft 7 to move up and down. The specific form of the second driving device 11 is not limited, and may be a hydraulic cylinder, an air cylinder or an electric telescopic rod, and the rotation shaft 7 is driven to move up and down by telescopic reciprocating motion of the second driving device 11, so that the carrier plate 2 is driven to move up and down.

Specifically, the second driving device 11 is provided with a connecting member 12 at one end near the rotation shaft 7, and the specific shape of the connecting member 12 is not limited. A groove is arranged on one side of the connecting piece 12, which is close to the rotating shaft 7, a bearing 13 is arranged in the groove, and the bearing 13 is connected with the end part of the rotating shaft 7. When the rotation shaft 7 rotates, the second driving device 11 is not driven to rotate. The second driving device 11 drives the rotation shaft 7 to move up and down, and simultaneously, the driven gear 10 is separated from the driving gear 9.

Preferably, the carrier plate 2 is provided with baffles 14 in the circumferential direction. When the plurality of carrier plates 2 are used for throwing wax at the same time, the polishing wax is easy to throw onto other silicon wafers 3, so that a baffle plate 14 is arranged along the circumferential direction of each carrier plate 2, and the baffle plate 14 is arranged on the supporting carrier table 1. The baffle 14 is cylindrically sleeved outside each carrier plate 2. The height of the baffle 14 is not easily too high, and the height of the carrier plate 2 needs to be higher than the top of the baffle 14 when the silicon wafer 3 is attached to the ceramic plate 5.

Preferably, in order not to influence the upward movement of the carrier plate 2, a sliding table 15 is arranged at the bottom of the wax dripping device 4, and the sliding table 15 can drive the wax dripping device 4 to be close to or far away from the supporting carrier table 1. When the silicon wafer 3 is required to be dripped with wax, the sliding table 15 drives the wax dripping device 4 to be close to the supporting carrier 1, and when the carrier plate 2 drives the silicon wafer 3 to move upwards, the sliding table 15 drives the wax dripping device 4 to be far away from the supporting carrier 1, so that interference is avoided. The sliding table 15 may be a pneumatic sliding table 15 or an electric sliding table 15, which is in the prior art, and the specific structure is not described here.

Examples: a multi-carrier-disc chip mounter comprises a supporting carrier 1, a wax dripping device 4 and a ceramic disc 5. Four carrier plates 2 are arranged on the upper portion of the support carrier table 1, are uniformly distributed along the circumferential direction of the support carrier table 1, the support carrier table 1 and the carrier plates 2 are circular, and the carrier plates 2 are used for adsorbing silicon wafers 3. Four wax dropping devices 4 are provided in the circumferential direction of the support stage 1 at positions opposite to the carrier plate 2. The bottom of the carrying disc 2 is provided with rotating shafts 7, and a plurality of rotating shafts 7 penetrate through the supporting carrying platform 1 to be vertically arranged. A first driving device 8, in particular a motor, is arranged in the center of the lower part of the support carrier 1. A driving gear 9 is fixedly arranged on the output shaft of the motor. A driven gear 10 is fixedly mounted on the rotating shaft 7. The driving gear 9 and the four driven gears 10 are positioned on the same plane, and the driven gears 10 are uniformly distributed along the circumferential direction of the driving gear 9 and are externally meshed with the driving gear 9. The end of the rotating shaft 7 remote from the carrier plate 2 is provided with a second driving device 11, in particular a hydraulic cylinder. The movable end of the hydraulic cylinder is fixed with a connecting piece 12, one side of the connecting piece 12, which is close to the rotating shaft 7, is provided with a groove, and a bearing 13 is arranged in the groove. The bearing 13 is connected to the end of the rotation shaft 7. The circumference of the carrier plate 2 is provided with a cylindrical baffle plate 14, and the baffle plate 14 is fixedly arranged on the supporting carrier table 1. The bottom of the wax dropping device 4 is provided with a sliding table 15, in particular an electric sliding table 15. A circular ceramic disc 5 is arranged above the carrying disc 2, and the ceramic disc 5 is arranged on a mechanical arm 6.

The using method comprises the following steps: a plurality of silicon wafers 3 are placed on a carrier plate 2, and the carrier plate 2 adsorbs the silicon wafers 3. The sliding table 15 moves the wax dropping device 4 to approach the supporting carrier 1, and drops the polishing wax on the silicon wafer 3. After the wax is dropped, the sliding table 15 drives the wax dropping device 4 to be far away from the supporting carrier 1. The first driving device 8 drives the driving gear 9 to rotate, and drives the plurality of rotating shafts 7 to rotate simultaneously by meshing with the driven gear 10, so that the plurality of carrier plates 2 can throw wax simultaneously. In the process of throwing the wax, the baffle 14 shields the thrown polishing wax. After the wax is thrown, the first driving device 8 stops rotating. The movable end of the second driving device 11 moves upwards to drive the transmission shaft and the carrier plate 2 to move upwards, and the driven gear 10 is separated from the driving gear 9. The carrier plate 2 moves upwards to attach the silicon wafer 3 to the ceramic plate 5 above. The robot arm 6 moves the ceramic disk 5 to perform the next polishing process.

The utility model has the advantages and positive effects that:

1. The polishing wax can be coated on a plurality of silicon wafers at the same time, so that the uniformity of wax films of different silicon wafers is ensured to be consistent;

2. The mechanical arm is not required to be used for reversing, and the carrying disc is directly moved upwards to attach the silicon wafer to the ceramic disc above, so that the uniformity of the wax film is improved, and the risk of scratching the silicon wafer is reduced;

3. the baffle is arranged, so that polishing wax is prevented from being thrown onto other silicon wafers;

4. The production efficiency is improved, the structure is simple, and the operation is convenient.

The foregoing describes the embodiments of the present utility model in detail, but the description is only a preferred embodiment of the present utility model and should not be construed as limiting the scope of the utility model. All equivalent changes and modifications within the scope of the present utility model are intended to be covered by the present utility model.

Claims

1. A multi-carrier chip mounter, comprising:

2. The multi-carrier chip mounter according to claim 1, wherein: the plurality of carrier plates are uniformly distributed along the circumferential direction of the supporting carrier platform.

3. The multi-carrier chip mounter according to claim 2, wherein: the wax dropping device is provided with a plurality of wax dropping devices, and the wax dropping devices are arranged along the circumferential direction of the supporting carrier platform relative to the carrier plates.

4. A multi-carrier chip mounter according to any of claims 1-3, wherein: the bottom of the carrying disc is provided with a rotating shaft, and the rotating shaft penetrates through the supporting carrying platform.

5. The multi-carrier chip mounter according to claim 4, wherein: and a first driving device is arranged below the supporting carrier and used for driving the rotating shaft to rotate simultaneously.

6. The multi-carrier chip mounter according to claim 5, wherein: the first driving device is provided with a driving gear, the rotating shafts are provided with driven gears, and the driving gear is externally meshed with the driven gears.

7. A multi-carrier chip mounter according to claim 5 or 6, wherein: and a second driving device is arranged at one end of the rotating shaft, which is far away from the carrying disc, and can drive the rotating shaft to move up and down.

8. The multi-carrier chip mounter according to claim 7, wherein: the second driving device is provided with a connecting piece near one end of the rotating shaft, the connecting piece is provided with a bearing, and the bearing is connected with the end part of the rotating shaft.

9. A multi-carrier chip mounter according to any of claims 1-3, 5-6 and 8, wherein: the circumference of the carrier disc is provided with baffles, and the baffles are arranged on the supporting carrier platform.

10. The multi-carrier chip mounter according to claim 9, wherein: the bottom of the wax dropping device is provided with a sliding table which can drive the wax dropping device to be close to or far away from the supporting carrier.