CN114939509A - Automatic gluing device and method for semiconductor silicon wafer - Google Patents
Automatic gluing device and method for semiconductor silicon wafer Download PDFInfo
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- CN114939509A CN114939509A CN202210703793.8A CN202210703793A CN114939509A CN 114939509 A CN114939509 A CN 114939509A CN 202210703793 A CN202210703793 A CN 202210703793A CN 114939509 A CN114939509 A CN 114939509A
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- connecting pipe
- lifting
- tray
- silicon wafer
- glue
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 80
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 79
- 239000010703 silicon Substances 0.000 title claims abstract description 79
- 238000004026 adhesive bonding Methods 0.000 title claims abstract description 64
- 239000004065 semiconductor Substances 0.000 title claims abstract description 24
- 238000000034 method Methods 0.000 title claims abstract description 14
- 230000007246 mechanism Effects 0.000 claims abstract description 109
- 239000003292 glue Substances 0.000 claims abstract description 50
- 239000007921 spray Substances 0.000 claims abstract description 21
- 230000007480 spreading Effects 0.000 claims abstract description 10
- 238000003892 spreading Methods 0.000 claims abstract description 10
- 238000007790 scraping Methods 0.000 claims abstract description 9
- 238000005507 spraying Methods 0.000 claims abstract description 9
- 235000012431 wafers Nutrition 0.000 claims description 65
- 230000005540 biological transmission Effects 0.000 claims description 31
- 238000013016 damping Methods 0.000 claims description 16
- 238000007789 sealing Methods 0.000 claims description 14
- 238000000576 coating method Methods 0.000 claims description 10
- 230000009467 reduction Effects 0.000 claims description 10
- 239000011248 coating agent Substances 0.000 claims description 8
- 230000033001 locomotion Effects 0.000 claims description 8
- 238000001179 sorption measurement Methods 0.000 claims description 5
- 238000012544 monitoring process Methods 0.000 claims description 3
- 230000008569 process Effects 0.000 abstract description 6
- 230000003014 reinforcing effect Effects 0.000 description 6
- 238000010073 coating (rubber) Methods 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 241000252254 Catostomidae Species 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
- B05C5/027—Coating heads with several outlets, e.g. aligned transversally to the moving direction of a web to be coated
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/02—Apparatus for spreading or distributing liquids or other fluent materials already applied to a surface ; Controlling means therefor; Control of the thickness of a coating by spreading or distributing liquids or other fluent materials already applied to the coated surface
- B05C11/023—Apparatus for spreading or distributing liquids or other fluent materials already applied to a surface
- B05C11/028—Apparatus for spreading or distributing liquids or other fluent materials already applied to a surface with a body having a large flat spreading or distributing surface
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
- B05C11/1039—Recovery of excess liquid or other fluent material; Controlling means therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C13/00—Means for manipulating or holding work, e.g. for separate articles
- B05C13/02—Means for manipulating or holding work, e.g. for separate articles for particular articles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention discloses an automatic gluing device and method for a semiconductor silicon wafer in the field of silicon wafer gluing, and the automatic gluing device comprises a gluing mechanism, a mounting rack, a lifting sliding table, a tray for containing the silicon wafer and a sucker for adsorbing the tray; the gluing mechanism and the lifting sliding table are connected to the mounting frame in a sliding manner; the sucker is arranged on the lifting sliding table; the lifting driving mechanism drives the lifting sliding table and the gluing mechanism to slide; the tray is provided with a first positioning conical surface of the positioning gluing mechanism and a second positioning conical surface of the positioning sucker; the glue spreading mechanism comprises a lifting frame, a rotating motor and an inverted T-shaped connecting pipe; the bottom of the connecting pipe is provided with a plurality of spray heads for gluing and scraping plates for scraping glue; the rotating motor drives the connecting pipe to rotate around the axis; according to the invention, the scraper scrapes the glue to uniformly coat the glue on the silicon wafer, and the spraying is positioned through the first positioning conical surface and the second positioning conical surface, so that the spraying process is more accurate, and the spraying efficiency is improved.
Description
Technical Field
The invention belongs to the technical field of silicon wafer gluing, and particularly relates to an automatic gluing and whirl-coating device and method for a silicon wafer.
Background
With the production and technical development of the semiconductor industry, the automation requirement of production equipment is higher and higher. The gluing treatment of the silicon wafer is an essential link in the semiconductor industry. In the past, the gluing of the silicon wafer is mostly finished manually by manpower, the working efficiency is low, and the final glue film thickness and the uniformity degree are difficult to ensure. In recent years, with continuous research of technicians, automatic glue spreading machines are widely applied to the semiconductor industry, and at present, the equipment technological processes generally adopted by the glue spreading treatment of silicon wafers in the semiconductor industry include manual wafer placing baskets, automatic wafer feeding to a feeding station, silicon wafer conveying to a glue spreading station for spreading glue, silicon wafer conveying to a drying station for drying, silicon wafer conveying to a discharging station and the like.
The existing device has poor continuity when gluing the silicon chip, needs manual participation, has low efficiency, and easily causes uneven smearing of the silicon chip by mechanical operation when gluing.
Disclosure of Invention
The invention aims to provide an automatic gluing device and method for a semiconductor silicon wafer, which can be used for automatically gluing the silicon wafer and ensuring the uniformity and continuity of gluing.
In order to achieve the purpose, the technical scheme adopted by the invention is as follows:
in a first aspect, the invention provides an automatic gluing device for a semiconductor silicon wafer, which comprises a gluing mechanism, a mounting frame, a lifting sliding table, a tray for containing the silicon wafer and a sucker for adsorbing the tray; the gluing mechanism and the lifting sliding table are connected to the mounting frame in a sliding manner; the sucker is arranged on the lifting sliding table; the glue spreading mechanism is arranged above the sucker; the lifting driving mechanism drives the lifting sliding table and the gluing mechanism to slide;
the glue spreading mechanism comprises a lifting frame, a rotating motor and an inverted T-shaped connecting pipe; the lifting frame is connected to the mounting frame in a sliding manner; the top of the connecting pipe is rotatably connected with the lifting frame; the bottom of the connecting pipe is provided with a plurality of spray heads for gluing and scraping plates for scraping glue; guide wheels for positioning are arranged at two end parts of the connecting pipe; the rotating motor drives the connecting pipe to rotate around the axis;
the tray is provided with a first positioning conical surface and a second positioning conical surface; the first positioning conical surface is matched with the sucker to position the relative position of the tray and the sucker; the second positioning conical surface is matched with the guide wheel to position the relative position of the tray and the connecting pipe; the tray bottom is equipped with the absorption hole that adsorbs the silicon chip, the absorption hole with the sucking disc corresponds the setting.
Preferably, the bottom of the tray is provided with a pouring groove; the backflow groove is arranged around the silicon wafer.
Preferably, the connecting pipe comprises a first section of vertically arranged connecting pipe and a second section of horizontally arranged connecting pipe; the center of the second section of connecting pipe is connected with the first section of connecting pipe; the guide wheel, the spray head and the scraper are arranged on the second section of connecting pipe;
the first section of connecting pipe is rotatably connected to the lifting frame; the lifting frame is provided with a shell; one end of the shell is communicated with the fixed pipe; the first section of connecting pipe is provided with a connector, and the other end of the shell is inserted into the connector; a first sealing ring is arranged between the connector and the shell; the shell is rotatably connected with the first section of connecting pipe through a sealing bearing; the shell is in threaded connection with an end cover used for positioning the sealing bearing; and a second sealing ring is arranged between the end cover and the first section of connecting pipe.
Preferably, the second section of connecting pipe is arranged along the radial direction of the silicon wafer in the gluing process; the two guide wheels are arranged at two ends of the second section of connecting pipe; the guide wheel is arranged to be conical; the outer wall of the guide wheel is matched with the second positioning conical surface.
Preferably, the mounting frame comprises a mounting seat, a first supporting plate and a second supporting plate which are parallel to each other; the first supporting plate and the second supporting plate are respectively arranged on two sides of the mounting seat; the second supporting plate is arranged on the mounting seat through an upright post; the first supporting plate is provided with a sliding rail for the lifting sliding table to slide; and a sliding groove for the lifting frame to slide is arranged on the second supporting plate.
Preferably, a conveying mechanism for conveying the silicon wafer is arranged between the first supporting plate and the second supporting plate; the conveying mechanism comprises two conveying chains which are arranged in parallel and a conveying motor for driving the conveying chains; two ends of the tray are respectively arranged on the two conveying chains; and the tray is provided with a through hole for the sucker to adsorb the silicon wafer.
Preferably, a photoelectric switch for monitoring the tray is arranged on the conveying mechanism; a positioning cylinder is arranged on the mounting seat; the positioning cylinder drives the limiting block to lift, and the limiting block blocks the tray on the conveying chain from moving.
Preferably, the lifting driving mechanism drives the lifting sliding table to slide through the first conveying mechanism; the lifting driving mechanism drives the gluing mechanism to slide through the second conveying mechanism; the lifting driving mechanism comprises a lifting motor, a reduction gearbox and a gear box; the lifting motor is connected with an input shaft of the reduction gearbox; the output shaft of the reduction gearbox is in gear transmission with the input shaft of the gear box; the transmission ratio of the gear box is 1; the first transmission mechanism is connected with the input shaft of the gear box; the second transmission mechanism is connected with the output shaft of the gear box; and a 180-degree phase difference is arranged between the first transmission mechanism and the second transmission mechanism.
Preferably, the first transmission mechanism comprises a first connecting rod A, a second connecting rod A and a third connecting rod A which are connected in turn; the input shaft of the gear box drives the first connecting rod A to do circular motion; and the third connecting rod A is fixed on the lifting sliding table.
Preferably, the second transmission mechanism comprises a first connecting rod B, a second connecting rod B and a third connecting rod B which are connected in a rotating manner in sequence; the output shaft of the gear box drives the first connecting rod B to do circular motion; the third connecting rod B is arranged on the lifting frame through a damping mechanism; and a phase difference of 180 degrees is arranged between the first connecting rod A and the first connecting rod B.
Preferably, the damping mechanism comprises a connecting block, a damping plate and a spring; the connecting block is fixedly connected to the lifting frame; the connecting block and the lifting frame are respectively arranged on the front side and the back side of the second support frame; a guide pillar is arranged above the connecting block; the spring is sleeved on the guide post; a stop block is arranged at the end part of the guide post; the damping plate is connected to the guide pillar in a sliding mode and limited between the stop block and the connecting block; the spring is arranged between the damping plate and the connecting block.
The invention provides a second aspect of an automatic gluing method for a semiconductor silicon wafer, which comprises the following steps:
the lifting driving mechanism simultaneously drives the lifting sliding table and the gluing mechanism to slide, the lifting sliding table is lifted until the sucker is attached to the silicon wafer, and the gluing mechanism is lowered to enable the plug to be inserted into the socket;
the sucking disc is used for sucking and fixing the silicon wafer;
the rotating motor drives the connecting pipe to rotate around the plug, the spray nozzle sprays glue on the silicon wafer, the scraper scrapes the glue to enable the glue to be uniformly coated on the silicon wafer, and the spray nozzle stops spraying the glue after the connecting pipe rotates for a whole circle;
after the connecting pipe rotates for a set number of turns, the rotating speed of the rotating motor is increased, and the glue scraped by the scraper is thrown out of the silicon wafer;
the rotating motor stops rotating, and the sucking disc loosens the silicon wafer; and the lifting driving mechanism simultaneously drives the lifting sliding table and the gluing mechanism to slide to an initial state.
Compared with the prior art, the invention has the following beneficial effects:
in the invention; the first positioning conical surface is matched with the sucker to position the relative position of the tray and the sucker; the second positioning conical surface is matched with the guide wheel to determine the relative position of the tray and the connecting pipe, so that the spraying is positioned, and the spraying process is more accurate; the rotating motor drives the connecting pipe to rotate around the plug, the spray nozzle sprays glue on the silicon wafer, and the scraper scrapes the glue to uniformly coat the glue on the silicon wafer; and the plurality of spray heads spray glue on the silicon wafer simultaneously, so that the spraying efficiency is improved.
The first transmission mechanism is connected with the input shaft of the gear box; the first transmission mechanism is connected with the output shaft of the gear box; be equipped with 180 degrees phase differences between first drive mechanism and the second drive mechanism, mechanical mechanism realizes that lift actuating mechanism drives lift slip table and rubber coating mechanism simultaneously and slides, compares with cylinder individual drive, has avoided because of the security failure that the indiscriminate sign indicating number of procedure appears, has simple structure, safe and reliable and easy maintenance's advantage.
Drawings
FIG. 1 is a right side view of an automatic glue spreading apparatus for a semiconductor silicon wafer according to the present invention;
FIG. 2 is a left side view of an automatic glue spreading apparatus for a semiconductor silicon wafer according to the present invention;
FIG. 3 is a structural view of a second transmission mechanism in the present invention;
FIG. 4 is an enlarged view of a portion of FIG. 3 of the present invention;
FIG. 5 is a structural view of a first transmission mechanism in the present invention;
FIG. 6 is a structural view of a gluing mechanism according to the present invention;
FIG. 7 is a connection relationship diagram of the first section of the connecting pipe and the lifting frame in the invention;
FIG. 8 is a structural view of a tray and a silicon wafer in the present invention;
fig. 9 is a structural view of the conveyance mechanism in the present invention.
In the figure: 1 mounting seat, 2 supporting parts, 3 lifting motors, 4 reduction boxes, 5 gear boxes, 51 gear box input shafts, 52 gear box output shafts, 6 first transmission mechanisms, 61 first connecting rods A, 62 second connecting rods A, 63 third connecting rods C, 7 lifting sliding tables, 8 reinforcing plates, 81 positioning cylinders, 82 limiting blocks, 9 suckers, 10 trays, 101 first conical surfaces, 102 second conical surfaces, 103 adsorption holes, 104 diversion grooves, 11 silicon chips, 12 glue coating mechanisms, 121 lifting frames, 121a shell, 121B sealing bearings, 121C second sealing rings, 121d end covers, 122 fixing pipes, 123 rotating motors, 124 first gears, 125 second gears, 126 first section connecting pipes, 126a connecting heads, 126B first sealing rings, 127 second section connecting pipes, 128 spray heads, 129 scraping plates, 1210 guide wheels, 13 upright columns, 14 second supporting plates, 141 sliding grooves, 15 second transmission mechanisms, 151 first connecting rods B, and, 152 second connecting rod B, 153 third connecting rod B, 16 damping mechanism, 161 damping plate, 162 stop block, 163 guide pillar, 164 spring, 17 connecting block, 18 conveying mechanism, 181 photoelectric switch, 182 conveying chain, 183 conveying motor and 19 first supporting plate.
Detailed Description
The invention is further described below with reference to the accompanying drawings. The following examples are only for illustrating the technical solutions of the present invention more clearly, and the protection scope of the present invention is not limited thereby.
It should be noted that in the description of the present invention, the terms "front", "rear", "left", "right", "upper", "lower", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of describing the present invention but do not require that the present invention must be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. As used in the description of the present invention, the terms "front," "back," "left," "right," "up," "down" and "in" refer to directions in the drawings, and the terms "inner" and "outer" refer to directions toward and away from, respectively, the geometric center of a particular component.
Example one
As shown in fig. 1 to 9, an automatic gluing device for a semiconductor silicon wafer comprises a gluing mechanism 12, a mounting frame, a lifting sliding table 7, a tray for placing a silicon wafer 11 and a suction cup 9 for adsorbing the tray; the gluing mechanism 12 and the lifting sliding table 7 are connected to the mounting frame in a sliding manner; the sucker 9 is arranged on the lifting sliding table 7; the glue coating mechanism 12 is arranged above the sucking disc 9;
the mounting rack comprises a mounting seat 1, a first supporting plate 19 and a second supporting plate 14 which are parallel to each other; supporting parts 2 are arranged at four corners of the mounting base 1; the first supporting plate 19 and the second supporting plate 14 are respectively arranged at two sides of the mounting seat 1; the second support plate 14 is mounted on the mounting base 1 through upright posts 13, the two upright posts 13 are vertically arranged on the mounting base 1, and the second support plate 14 is arranged between the two upright posts 13 through angle steel; the second supporting plate 14 is provided with two sliding chutes 141 for the lifting frame to slide, and the two sliding chutes 141 are vertically arranged; a sliding rail for sliding the lifting sliding table 7 is arranged on the first supporting plate 19; a reinforcing plate 8 is arranged at the top of the mounting seat 1; the reinforcing plate 8 is arranged between the first supporting plate 19 and the second supporting plate 14, and a through hole for the lifting sliding table 7 and the sucker 9 to pass through is formed in the reinforcing plate 8.
A conveying mechanism 18 for conveying the silicon wafer is arranged between the first supporting plate 19 and the second supporting plate 14; the conveying mechanism 18 is arranged above the reinforcing plate 8; the conveying mechanism 18 comprises two conveying chains 182 which are arranged in parallel and a conveying motor 183 for driving the conveying chains; the two ends of the tray 10 are respectively arranged on the two conveying chains 182; the silicon chip 11 is arranged on the tray 10, and the bottom of the tray 10 is provided with a pouring groove 104; the reflow groove 104 is arranged around the silicon wafer 11; two groups of photoelectric switches 181 of the monitoring tray 10 are arranged on the conveying mechanism 18; the two groups of photoelectric switches 181 are arranged on the front side and the rear side of the gluing station; a positioning cylinder 81 is arranged on the reinforcing plate 8 of the mounting seat 1; the positioning air cylinder 81 drives the limiting block 82 to lift, and the limiting block 82 blocks the tray 10 on the conveying chain from moving.
The glue coating mechanism 12 comprises a lifting frame 121, a rotating motor 123 and a connecting pipe; the lifting frame 121 is slidably connected to the sliding groove 141; the connecting pipe comprises a first section of connecting pipe 126 and a second section of connecting pipe 127 which are connected in sequence to form an inverted T shape; when gluing, the axis of the first section of connecting pipe 126 coincides with the center of the circle of the silicon wafer 11, and the second section of connecting pipe 127 is arranged along the radial direction of the silicon wafer 11; the first segment connecting pipe 126 is rotatably connected to the lifting frame 121.
The lifting frame 121 is provided with a shell 121 a; one end of the shell 121a is communicated with a fixed pipe 122, and the fixed pipe is externally connected with a glue supply device; a connector 126a is arranged on the first section of connecting pipe 126, the other end of the shell 121a is inserted into the connector 126a, and the connector 126a is in a conical shape; a conical surface matched with the connector 126a is arranged in the shell 121a, so that the rotation center of the connecting pipe is positioned; a first sealing ring 126b is arranged between the connector 126a and the shell 121 a; the housing 121a is rotatably connected with the first section connecting pipe 126 through a sealing bearing 121 b; the housing 121a is in threaded connection with an end cover 121c for positioning the sealing bearing 121 b; a second sealing ring 121d is arranged between the end cover 121c and the first section of connecting pipe 126; a first gear 124 is arranged on the rotating motor 123; a second gear 125 is arranged on the first section of connecting pipe 126; the first gear 124 is meshed with the second gear 125; the rotary motor 123 drives the connection pipe to rotate around the axis.
The middle part of the second section connecting pipe 127 is provided with a plurality of spray heads 128 for gluing and scraping plates 129 for scraping glue; the bottom of the scraper 129 is a set distance away from the silicon wafer 11, so that the scraper 129 is prevented from scraping off all glue on the silicon wafer 11, and the silicon wafer 11 is prevented from being damaged by the scraper 129; guide wheels 1210 are arranged at two ends of the second section of connecting pipe 127, and the guide wheels 1210 are in a conical shape.
The tray 10 is provided with a first positioning conical surface 101 and a second positioning conical surface 102; the second positioning conical surface 102 is matched with the conical surface of the guide wheel 1210, and the relative positions of the tray 10 and the second section of connecting pipe 127 are positioned, so that the second section of connecting pipe 127 is ensured to be arranged along the radial direction of the silicon chip 11, the relative heights from the spray head 128 and the scraper 129 to the silicon chip 11 can be ensured, and a positioning effect can be realized, so that the gluing quality is improved; the bottom of the tray 10 is provided with an adsorption hole 103 for adsorbing a silicon wafer 11; the first positioning conical surface 101 is matched with the sucker 9, positions the relative position of the tray 10 and the sucker 9, and ensures that the adsorption hole 103 is arranged corresponding to the sucker 9.
The lifting driving mechanism drives the lifting sliding table 7 to slide through the first conveying mechanism 6; the lifting driving mechanism drives the gluing mechanism 12 to slide through the second conveying mechanism 15; the lifting driving mechanism comprises a lifting motor 3, a reduction gearbox 4 and a gear box 5; the lifting motor 3 is a servo motor; the lifting motor 3 is connected with an input shaft of the reduction gearbox 4; the output shaft of the reduction gearbox 4 and the input shaft of the gear box 5 are in gear transmission; the transmission ratio of the gear box 5 is 1, so that the first transmission mechanism 6 and the second transmission mechanism 15 can move synchronously; the first transmission mechanism 6 is connected with the gearbox input shaft 51; the second transmission 6 is connected to the gearbox output shaft 52.
The first transmission mechanism 6 comprises a first connecting rod A61, a second connecting rod A62 and a third connecting rod A63 which are sequentially connected in a rotating way; the gear box input shaft 51 drives the first connecting rod A61 to do circular motion; the third connecting rod a63 is fixed on the lifting sliding table 7.
The second transmission mechanism 15 comprises a first connecting rod B151, a second connecting rod B152 and a third connecting rod B153 which are connected in sequence in a rotating manner; the gearbox output shaft 52 drives the first connecting rod B151 to do circular motion; the third connecting rod B153 is arranged on the lifting frame 121 through a damping mechanism 16; be equipped with 180 degrees phase differences between first link A61 and the first link B151, guarantee lift slip table 7 and rubber coating mechanism 12 motion opposite direction, guarantee lift slip table 7 and rubber coating mechanism 12 simultaneous movement and telemechanical opposite direction through mechanical structure, safe and reliable more, convenient maintenance is adjusted simultaneously.
The damper mechanism 16 includes a damper plate 161 and a spring 164; the connecting block 17 is fixedly connected with the lifting frame 121; the connecting block 17 and the lifting frame 121 are respectively arranged on the front side and the back side of the second support frame 14; a guide post 163 is arranged above the connecting block 17; the spring 164 is sleeved on the guide post 163; the end of the guide post 163 is provided with a stop block 162; the damping plate 161 is slidably connected to the guide post 163 and is limited between the stopper 162 and the connecting block 17; the spring 164 is disposed between the damping plate 161 and the connecting block 17, and can damp the rotation motor 123 through a damping mechanism, and provide a pressing force for the cooperation of the plug 1210 and the socket 93, so as to prevent the plug 1210 and the socket 93 from being separated during the gluing process.
Example two
An automatic glue coating method for a semiconductor silicon wafer, the glue coating method provided by the embodiment can be applied to the glue coating device in the first embodiment, and comprises the following steps:
the transmission mechanism 18 transmits the tray 10 and the silicon wafer 11 to the gluing station, the photoelectric switch 181 in front of the gluing station detects the next tray 10, and after the photoelectric switch 181 in back of the gluing station does not detect the previous tray 10, the positioning cylinder 81 drives the limiting block 82 to ascend, and the limiting block 82 blocks the tray 10 from staying on the gluing station;
the lifting driving mechanism simultaneously drives the lifting sliding table 7 and the gluing mechanism 12 to slide, the lifting sliding table 7 rises until the sucker 9 is attached to the first positioning conical surface 101 of the tray 10, and the gluing mechanism 12 descends to enable the guide wheel 1210 to be attached to the second positioning conical surface 102 of the tray 10; determining the relative positions of the sucker 9, the gluing mechanism 12 and the tray 10 through the first positioning conical surface 101 and the second positioning conical surface 102; the suction cup 9 sucks and fixes the silicon wafer 11 through the suction hole 103.
The rotating motor 123 drives the connecting pipe to rotate around the axis, the rotating speed of the connecting pipe is 12r/min, the spray head 128 sprays glue on the silicon chip 11, the scraper 129 scrapes the glue to enable the glue to be uniformly coated on the silicon chip 11, and after the connecting pipe rotates for a whole circle, the spray head 128 stops spraying the glue;
after the connecting pipe rotates for a set number of turns, the rotating speed of the rotating motor 123 is increased, so that the rotating speed of the connecting pipe is increased to 2000 r/min; the glue scraped by the scraper 129 is thrown out of the silicon wafer 11, and the glue slides to the diversion trench 104 along the inner wall of the tray 10, so that the collection of the glue is realized;
the rotating motor 123 stops rotating, and the suction disc 9 loosens the silicon wafer 11; the lifting driving mechanism simultaneously drives the lifting sliding table 7 and the gluing mechanism 12 to slide to an initial state, and the processes are repeated to glue the silicon wafers in sequence.
The above description is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, several modifications and variations can be made without departing from the technical principle of the present invention, and these modifications and variations should also be regarded as the protection scope of the present invention.
Claims (10)
1. An automatic gluing device for a semiconductor silicon wafer is characterized by comprising a gluing mechanism (12), a mounting frame, a lifting sliding table (7), a tray for containing a silicon wafer (11) and a sucking disc (9) for adsorbing the tray (10); the glue coating mechanism (12) and the lifting sliding table (7) are connected to the mounting frame in a sliding manner; the sucker (9) is arranged on the lifting sliding table (7); the glue coating mechanism (12) is arranged above the sucking disc (9); the lifting driving mechanism drives the lifting sliding table (7) and the gluing mechanism (12) to slide;
the glue spreading mechanism (12) comprises a lifting frame (121), a rotating motor (123) and an inverted T-shaped connecting pipe; the lifting frame (121) is connected to the mounting frame in a sliding mode; the top of the connecting pipe is rotationally connected with the lifting frame (121); the bottom of the connecting pipe is provided with a plurality of spray heads (128) for gluing and scrapers (129) for scraping off glue; guide wheels (1210) for positioning are arranged at two ends of the connecting pipe; the rotating motor (123) drives the connecting pipe to rotate around the axis;
the tray (10) is provided with a first positioning conical surface (101) and a second positioning conical surface (102); the first positioning conical surface (101) is matched with the sucker (9) to position the relative position of the tray (10) and the sucker (9); the second positioning conical surface (102) is matched with the guide wheel (1210) to position the relative position of the tray (10) and the connecting pipe; the bottom of the tray (10) is provided with an adsorption hole (103) for adsorbing a silicon wafer, and the adsorption hole (103) and the sucker (9) are correspondingly arranged.
2. The automatic gluing device for the semiconductor silicon wafer as claimed in claim 1, wherein the connecting pipes comprise a first connecting pipe (126) arranged vertically and a second connecting pipe (127) arranged horizontally; the center of the second section of connecting pipe (127) is connected with the first section of connecting pipe (126); the guide wheel (1210), the spray head (128) and the scraper (129) are arranged on the second section of connecting pipe (127);
the first section of connecting pipe (126) is rotatably connected to the lifting frame (121); the lifting frame (121) is provided with a shell (121 a); one end of the shell (121a) is communicated with the fixed pipe (122); a connector (126a) is arranged on the first section of connecting pipe (126), and the connector (126a) is inserted into the other end of the shell (121 a); a first sealing ring (126b) is arranged between the connector (126a) and the shell (121 a); the shell (121a) is rotationally connected with the first section of connecting pipe (126) through a sealed bearing (121 b); the shell (121a) is in threaded connection with an end cover (121d) used for positioning a sealing bearing; and a second sealing ring (121c) is arranged between the end cover (121d) and the first section of connecting pipe (126).
3. An automatic gluing device for semiconductor silicon wafers as claimed in claim 1, wherein the mounting frame comprises a mounting base (1), a first support plate (19) and a second support plate (14) which are parallel to each other; the first supporting plate (19) and the second supporting plate (14) are respectively arranged on two sides of the mounting base (1); a sliding rail for the lifting sliding table (7) to slide is arranged on the first supporting plate (19); the second supporting plate (14) is provided with a sliding chute (141) for the lifting frame (121) to slide.
4. An automatic gluing device for semiconductor silicon wafers as claimed in claim 3, wherein a conveying mechanism (18) for conveying the silicon wafers is arranged between the first supporting plate (19) and the second supporting plate (14); the conveying mechanism (18) comprises two conveying chains (182) arranged in parallel and a conveying motor (183) for driving the conveying chains; two ends of the tray (10) are respectively arranged on the two conveying chains (182); the silicon chip (11) is arranged on the tray (10); the tray (10) is provided with a through hole for the sucker (9) to adsorb the silicon chip (11).
5. The automatic gluing device of the semiconductor silicon wafer as claimed in claim 4, wherein the conveying mechanism (18) is provided with a photoelectric switch (181) for monitoring the tray; a positioning cylinder (81) is arranged on the mounting seat (1); the positioning air cylinder (81) drives the limiting block (82) to lift, and the limiting block (82) blocks the tray (10) on the conveying chain (182) from moving.
6. The automatic gluing device for the semiconductor silicon wafers as claimed in claim 3, wherein the lifting driving mechanism drives the lifting sliding table (7) to slide through the first conveying mechanism (6); the lifting driving mechanism drives the gluing mechanism (12) to slide through a second conveying mechanism (15); the lifting driving mechanism comprises a lifting motor (3), a reduction box (4) and a gear box (5); the lifting motor (3) is connected with an input shaft of the reduction gearbox (4); the output shaft of the reduction gearbox (4) is in gear transmission with the input shaft of the gear box (5); the transmission ratio of the gear box (5) is 1; the first transmission mechanism (6) is connected with the gear box input shaft (51); the second transmission mechanism (15) is connected with the gearbox output shaft (52); and a 180-degree phase difference is arranged between the first transmission mechanism (6) and the second transmission mechanism (15).
7. The automatic gluing device of the semiconductor silicon wafer as claimed in claim 6, wherein the first transmission mechanism (6) comprises a first connecting rod A (61), a second connecting rod A (62) and a third connecting rod A (63) which are connected in turn in a rotating manner; the gear box input shaft (51) drives the first connecting rod A (61) to do circular motion; and the third connecting rod A (63) is fixed on the lifting sliding table (7).
8. The automatic gluing device of the semiconductor silicon wafer as claimed in claim 7, wherein the second transmission mechanism (15) comprises a first connecting rod B (151), a second connecting rod B (152) and a third connecting rod B (153) which are connected in turn in a rotating manner; the gear box output shaft (52) drives the first connecting rod B (151) to do circular motion; the third connecting rod B (153) is arranged on the lifting frame (121) through a damping mechanism (16); and a phase difference of 180 degrees is arranged between the first connecting rod A (61) and the first connecting rod B (151).
9. The automatic gluing device for the semiconductor silicon wafer according to claim 8, wherein the damping mechanism (16) comprises a damping plate (161) and a spring (164); the connecting block (17) is fixedly connected to the lifting frame (121); the connecting block (17) and the lifting frame (121) are respectively arranged on the front side and the back side of the second supporting frame (14); a guide post (163) is arranged above the connecting block (17); the spring (164) is sleeved on the guide post (163); a stop block (162) is arranged at the end part of the guide post (163); the damping plate (161) is connected with the guide post (163) in a sliding manner and limited between the stop block (162) and the connecting block (17); the spring (164) is arranged between the damping plate (161) and the connecting block (17).
10. An automatic gluing method for a semiconductor silicon wafer is characterized by comprising the following steps:
the lifting driving mechanism simultaneously drives the lifting sliding table (7) and the gluing mechanism (12) to slide; the lifting sliding table (7) rises until the sucker (9) is attached to the first positioning conical surface (101) of the tray (10), and the relative position of the tray (10) and the connecting pipe is positioned; the glue coating mechanism (12) descends to enable the guide wheel (1210) to be attached to the second positioning conical surface (102) of the tray (10), and the relative position of the tray (10) and the connecting pipe is positioned;
the sucking disc (9) is used for sucking and fixing the silicon wafer (11) through the sucking holes (103);
the rotating motor (123) drives the connecting pipe to rotate around the plug (1210), the spray head (128) sprays glue on the silicon wafer, the scraper blade (129) scrapes the glue to enable the glue to be uniformly coated on the silicon wafer, and after the connecting pipe rotates for a whole circle, the spray head (128) stops spraying the glue;
after the connecting pipe rotates for a set number of turns, the rotating speed of the rotating motor (123) is increased, and the glue scraped by the scraper (129) is thrown out of the silicon chip (11);
the rotating motor (123) stops rotating, and the silicon wafer (11) is loosened by the sucking disc (9); the lifting driving mechanism drives the lifting sliding table (7) and the gluing mechanism (12) to slide to an initial state at the same time.
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| CN202210703793.8A CN114939509B (en) | 2022-06-21 | 2022-06-21 | Automatic gluing device and method for semiconductor silicon wafer |
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| CN202210703793.8A CN114939509B (en) | 2022-06-21 | 2022-06-21 | Automatic gluing device and method for semiconductor silicon wafer |
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| CN114939509B (en) | 2024-02-20 |
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