CN115889081B - Silicon carbide wafer wax pasting device and method thereof - Google Patents
Silicon carbide wafer wax pasting device and method thereof Download PDFInfo
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- CN115889081B CN115889081B CN202211517328.1A CN202211517328A CN115889081B CN 115889081 B CN115889081 B CN 115889081B CN 202211517328 A CN202211517328 A CN 202211517328A CN 115889081 B CN115889081 B CN 115889081B
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Abstract
The invention relates to the technical field of semiconductor wafer waxing, in particular to a silicon carbide wafer waxing device and a method thereof. Including quick-witted case and triaxial mobile mechanism, still include: the spraying mechanism is arranged in the chassis and is fixedly connected with the triaxial moving mechanism; the rotating mechanism is arranged below the spraying mechanism and connected with the silicon carbide wafer, and comprises a bearing disc which is coaxially arranged below the silicon carbide wafer; the limiting assembly is connected with the rotating mechanism and comprises a plurality of linkage mechanisms and a plurality of limiting mechanisms, the plurality of linkage mechanisms are arranged at the lower end of the supporting disc, the plurality of linkage mechanisms are arranged in a uniform array along the circumferential direction of the supporting disc, the plurality of limiting mechanisms are arranged in pairs, and each linkage mechanism is connected with one group of limiting mechanisms.
Description
Technical Field
The invention relates to the technical field of semiconductor wafer waxing, in particular to a silicon carbide wafer waxing device and a method thereof.
Background
At present, in the field of upstream wax-sticking processing of silicon carbide wafers, a traditional wax-sticking device needs to be subjected to multiple steps of heating, waxing, sticking, tabletting, waxing and the like, and is low in efficiency. Although there are also high-efficiency automatic chip mounting devices on the market, the device is expensive, and manual wax mounting cannot be avoided by engineers in experiments due to the small number of chips in the early development stage or in the stage of testing product performance by downstream manufacturers.
However, when the wafer is manually cured, in view of the thickness of the wax layer and the difference of the skillfulness of the bonding of workers, the air around the wafer is easy to cause waxing bubbles, and if the air cannot be timely discharged in the process of compacting the wafer, the air bubbles remain in the middle of the wax layer. Therefore, the traditional manual wax pasting mode is not beneficial to the wafer wax pasting yield, not only reduces the working efficiency, but also increases the enterprise cost.
Therefore, it is necessary to design a full silicon carbide wafer waxing device, the device can imitate a pancake machine, evenly smears bonding wax on the upper end of a silicon carbide wafer by referring to the working principle of the device, so that scalding of operators at high temperature of a ceramic disc during manual waxing is avoided, the working efficiency is improved, and the labor intensity of the operators is reduced.
Disclosure of Invention
Accordingly, there is a need for a silicon carbide wafer wax-sticking device and a method thereof, which address the problems of the prior art.
In order to solve the problems in the prior art, the invention adopts the following technical scheme:
the utility model provides a carborundum wafer pastes wax device, includes quick-witted case and triaxial mobile mechanism, still includes:
the spraying mechanism is arranged in the chassis and is fixedly connected with the triaxial moving mechanism;
the rotating mechanism is arranged below the spraying mechanism and connected with the silicon carbide wafer, and comprises a bearing disc which is coaxially arranged below the silicon carbide wafer;
the limiting assembly is connected with the rotating mechanism and comprises a plurality of linkage mechanisms and a plurality of limiting mechanisms, the plurality of linkage mechanisms are arranged at the lower end of the supporting disc, the plurality of linkage mechanisms are arranged in a uniform array along the circumferential direction of the supporting disc, the plurality of limiting mechanisms are arranged in pairs, and each linkage mechanism is connected with one group of limiting mechanisms.
Further, the spraying mechanism comprises a spray pipe, a connecting frame, a fixed short pin, a scraping plate and two fixing nuts, wherein the spray pipe is fixedly connected with the lower end of the triaxial moving mechanism, the connecting frame is in a horizontal state and is fixedly connected with the spray pipe, the fixed short pin is in a vertical state and is connected with the connecting frame, the two fixing nuts are respectively arranged at the upper end and the lower end of the connecting frame, meanwhile, the two fixing nuts are fixedly connected with the fixed short pin in a screwing mode, and the middle of the scraping plate is fixedly connected with the lower end of the fixed short pin.
Further, rotary mechanism still includes power gyro wheel, power motor, first motor frame and a plurality of supporting leg, and a plurality of supporting legs are vertical state along bearing disc circumferencial direction uniform array, and a plurality of supporting legs and bearing disc fixed connection, first motor frame and bearing disc fixed connection, power motor are vertical state setting, power motor and first motor frame fixed connection, and power motor's output upwards stretches out and passes first motor frame and bearing disc in proper order, and power gyro wheel fixed cover is established on power motor's output.
Further, rotary mechanism still includes power belt, rotatory ring, a plurality of first spacing gasket, a plurality of sucking disc and a plurality of first spacing short pin, rotatory ring coaxial setting is in the upper end of bearing disc, rotatory ring's inner circle still shaping has spacing flange, a plurality of first spacing short pin equidistant distribution is in rotatory ring's inner circle, a plurality of first spacing gasket coaxial setting is in the lower part of a plurality of first spacing short pins, a plurality of first spacing short pins rotate with the bearing disc through a plurality of first spacing gasket and are connected, simultaneously, a plurality of first spacing short pins still pass through spacing flange and rotatory ring sliding connection, power belt's one end links to each other with the power gyro wheel, the other end links to each other with rotatory ring, a plurality of sucking discs are fixed along rotatory ring circumferencial direction equidistant fixed setting.
Further, the limiting assembly further comprises a driving motor, a linkage fluted disc, a driving gear and a second motor frame, the second motor frame is fixedly arranged at the lower end of the supporting disc, the driving motor is arranged in a vertical state, the output end of the driving motor extends upwards and penetrates through the second motor frame, the driving gear is coaxially and fixedly sleeved with the output end of the driving motor, the linkage fluted disc and the supporting disc are coaxially arranged, the linkage fluted disc is meshed with the driving gear, and the linkage fluted disc is connected with the linkage mechanism.
Further, the limiting assembly further comprises a limiting top block and a fixed pin shaft, a plurality of limiting sliding grooves are uniformly arranged on the linkage fluted disc along the circumferential direction, the fixed pin shaft penetrates through the axis of the linkage fluted disc and is fixedly connected with the supporting disc, the fixed pin shaft is rotationally connected with the linkage fluted disc, the limiting top block is arranged on one side, close to the supporting disc, of the linkage fluted disc, and the limiting top block is connected with the fixed pin shaft through a bearing.
Further, the link gear includes second limit short pin, linkage stock, connect the short slab, fixed stop and two limit stop, second limit short pin and limit chute sliding connection, the one end that the linkage stock is close to the linkage fluted disc and second limit short pin fixed connection, two limit stop fixed lower extreme that sets up the bearing disc, the linkage stock sets up between two limit stop to two limit stop and linkage stock sliding connection, fixed stop is vertical state setting, fixed stop and linkage stock keep away from the one end fixed connection of linkage fluted disc, connect the short slab setting in fixed stop's upper end, connect short slab and fixed stop fixed connection.
Further, stop gear includes the long round pin of buffering, connect the bent plate, spacing gyro wheel, two buffer springs, two damping springs, two small-size damping bars and two second spacing gaskets, the long round pin of buffering is pegged graft with the short board of connection slip, two buffer springs cover simultaneously establishes in the outside of the long round pin of buffering, connect the bent plate setting and be close to the one end of carborundum wafer at the short board of connection, connect bent plate and the long round pin fixed connection of buffering, wherein, the buffer spring that is close to carborundum wafer, its one end offsets with connecting the bent plate, the other end offsets with the short board of connection, keep away from the damping spring of carborundum wafer, its one end offsets with the short board of connection, its other end offsets with the round pin cap of the long round pin of buffering, spacing gyro wheel sets up in the one side that is close to carborundum wafer of connecting the bent plate, spacing gyro wheel and carborundum wafer roll connection, two second spacing gaskets are symmetrical state fixed settings in the both sides of spacing gyro wheel, two small-size damping bars respectively with connect the bent plate fixed connection, its output and spacing gyro wheel pass through the second spacing gasket link to each other, simultaneously, spacing still rotates with two small-size damping bars to be connected with the damping bars, its one end offsets with the small damping bars, the damping bars is connected with the second damping bars.
A method of using a silicon carbide wafer waxing device, comprising a silicon carbide wafer waxing device as described above, further comprising the steps of:
s1: before the device operates, an operator firstly places a silicon carbide wafer to be processed at the upper ends of a plurality of suckers, the plurality of suckers adsorb the silicon carbide wafer, then the operator starts a machine, a driving motor starts, and finally a plurality of limiting rollers clamp the outer edge of the silicon carbide wafer, in the process, a buffer spring can provide the wide capacity in the horizontal direction for the silicon carbide wafer, and damage to the silicon carbide wafer due to overlarge clamping force when a plurality of connecting bent plates move is avoided. Simultaneously, the bonding wax flows into the spray pipe through the tail end of the triaxial moving mechanism;
s2: when the device operates, the bonding wax is sprayed out of the spray pipe and then drops on the surface of the silicon carbide wafer, the bonding wax is in a liquid viscous state along with the temperature rise of the silicon carbide wafer, then the silicon carbide wafer is driven by the rotating mechanism to perform autorotation movement, and in the autorotation process, the scraper plates uniformly spread the liquid viscous bonding wax on the surface of the silicon carbide wafer;
s3: in the silicon carbide wafer rotation process, the silicon carbide wafer passes through sucking disc and rotatory ring fixed connection, and when power motor was operated, power gyro wheel rotated, and rotatory ring and power gyro wheel pass through power belt transmission and are connected, and finally power motor can drive rotatory ring rotation, and two damping springs can provide the vertical epaxial wide tolerance for the silicon carbide wafer, avoid the silicon carbide wafer to take place the drunkenness and lose balance in the rotation in-process. The two small damping rods can absorb elastic deformation force of the two damping springs, namely when the silicon carbide wafer jumps, the two damping springs can filter the vibration of the silicon carbide wafer, but the damping springs can reciprocate, and the two small damping rods are used for restraining the jump of the two damping springs (the same as the working principle of an automobile damper).
Compared with the prior art, the invention has the following beneficial effects:
the method comprises the following steps: the device can evenly drip the coating wax at the center of the silicon carbide wafer, then after the device is started, the coating wax can be evenly coated at the upper end of the silicon carbide wafer, the coating process does not need manual interference, the labor intensity of operators is reduced, meanwhile, the operators can be prevented from being burnt by the high temperature of the ceramic disc, and the potential safety hazard in operation is reduced.
And two,: when the device is operated, the coating wax is smeared from the center of the silicon carbide wafer, the whole process is gradually spread and smeared from inside to outside, and the process can prevent the coating wax from forming bubbles on the surface of the silicon carbide wafer, thereby improving the quality of finished products. The process has simple and efficient steps, and is beneficial to improving the yield and the working efficiency of the device.
Drawings
FIG. 1 is a schematic perspective view of the present invention;
FIG. 2 is a front view of the invention in a perspective configuration with the chassis removed;
FIG. 3 is a bottom view of the present invention with the chassis removed;
FIG. 4 is a side view of the present invention in a perspective configuration with the chassis removed;
FIG. 5 is an enlarged schematic view of the structure shown at A in FIG. 4;
FIG. 6 is a bottom view of the rotation mechanism and spacing assembly of the present invention;
FIG. 7 is a top view of the rotation mechanism and spacing assembly of the present invention;
FIG. 8 is an enlarged schematic view of the structure at B in FIG. 7;
FIG. 9 is a schematic perspective view of a linkage mechanism according to the present invention;
fig. 10 is an enlarged schematic view of the structure at C in fig. 9.
The reference numerals in the figures are:
1. a chassis; 2. a triaxial moving mechanism; 3. a spraying mechanism; 4. a spray pipe; 5. a connecting frame; 6. fixing the short pin; 7. a fixing nut; 8. a scraper; 9. a rotation mechanism; 10. a suction cup; 11. rotating the circular ring; 12. a limit flange; 13. a first limit short pin; 14. a first limit gasket; 15. a power belt; 16. a power roller; 17. a power motor; 18. a first motor frame; 19. a support disc; 20. support legs; 21. a limit component; 22. a linkage fluted disc; 23. limiting sliding grooves; 24. a limiting top block; 25. a fixed pin shaft; 26. a linkage mechanism; 27. a second limit short pin; 28. a linkage long rod; 29. a limit stop; 30. a fixed baffle; 31. connecting short plates; 32. a limiting mechanism; 33. a buffer spring; 34. a buffer long pin; 35. connecting a curved plate; 36. a damping spring; 37. a small damping rod; 38. a second limit gasket; 39. limiting idler wheels; 40. a driving motor; 41. a second motor frame; 42. and a drive gear.
Detailed Description
The invention will be further described in detail with reference to the drawings and the detailed description below, in order to further understand the features and technical means of the invention and the specific objects and functions achieved.
Referring to fig. 1 to 10, a silicon carbide wafer wax-sticking device includes a chassis 1 and a triaxial moving mechanism 2, and further includes:
the spraying mechanism 3 is arranged in the case 1 and is fixedly connected with the triaxial moving mechanism 2;
the rotating mechanism 9 is arranged below the spraying mechanism 3 and is connected with the silicon carbide wafer, and the rotating mechanism 9 comprises a bearing disc 19, and the bearing disc 19 is coaxially arranged below the silicon carbide wafer;
the limiting assembly 21 is connected with the rotating mechanism 9, the limiting assembly 21 comprises a plurality of linkage mechanisms 26 and a plurality of limiting mechanisms 32, the plurality of linkage mechanisms 26 are arranged at the lower end of the bearing disc 19, the plurality of linkage mechanisms 26 are uniformly arranged in an array along the circumferential direction of the bearing disc 19, the plurality of limiting mechanisms 32 are arranged in pairs, and each linkage mechanism 26 is connected with one group of limiting mechanisms 32.
The spraying mechanism 3 comprises a spray pipe 4, a connecting frame 5, a fixed short pin 6, a scraping plate 8 and two fixing nuts 7, wherein the spray pipe 4 is fixedly connected with the lower end of the triaxial moving mechanism 2, the connecting frame 5 is horizontally fixedly connected with the spray pipe 4, the fixed short pin 6 is vertically connected with the connecting frame 5, the two fixing nuts 7 are respectively arranged at the upper end and the lower end of the connecting frame 5, meanwhile, the two fixing nuts 7 are fixedly connected with the fixed short pin 6 in a rotating mode, and the middle of the scraping plate 8 is fixedly connected with the lower end of the fixed short pin 6. When the device is operated, the bonding wax is sprayed out of the spray pipe 4 and then drops on the surface of the silicon carbide wafer, the bonding wax is in a liquid viscous state along with the temperature rise of the silicon carbide wafer, then the silicon carbide wafer is driven by the rotating mechanism 9 to perform autorotation motion, and in the autorotation process, the scraper 8 uniformly spreads the liquid viscous bonding wax on the surface of the silicon carbide wafer.
The rotating mechanism 9 further comprises a power roller 16, a power motor 17, a first motor frame 18 and a plurality of supporting legs 20, wherein the supporting legs 20 are in a vertical state and uniformly arrayed along the circumferential direction of the bearing disc 19, the supporting legs 20 are fixedly connected with the bearing disc 19, the first motor frame 18 is fixedly connected with the bearing disc 19, the power motor 17 is arranged in a vertical state, the power motor 17 is fixedly connected with the first motor frame 18, the output end of the power motor 17 extends upwards and sequentially penetrates through the first motor frame 18 and the bearing disc 19, and the power roller 16 is fixedly sleeved on the output end of the power motor 17. When the device operates, the supporting legs 20 play a role in bearing, the power motor 17 operates, the power roller 16 is fixedly connected with the power motor 17, and then the operation of the power motor 17 drives the power roller 16 to rotate.
The rotating mechanism 9 further comprises a power belt 15, a rotating circular ring 11, a plurality of first limiting gaskets 14, a plurality of suckers 10 and a plurality of first limiting short pins 13, wherein the rotating circular ring 11 is coaxially arranged at the upper end of the supporting circular ring 19, the inner ring of the rotating circular ring 11 is further provided with limiting flanges 12, the plurality of first limiting short pins 13 are uniformly distributed at the inner ring of the rotating circular ring 11 at equal intervals, the plurality of first limiting gaskets 14 are coaxially arranged at the lower parts of the plurality of first limiting short pins 13, the plurality of first limiting short pins 13 are rotatably connected with the supporting circular ring 19 through the plurality of first limiting gaskets 14, meanwhile, the plurality of first limiting short pins 13 are further connected with the rotating circular ring 11 in a sliding mode through the limiting flanges 12, one end of the power belt 15 is connected with power rollers 16, the other end of the power belt is connected with the rotating circular ring 11, and the plurality of suckers 10 are fixedly arranged along the circumferential direction of the rotating circular ring 11 at equal intervals. When the device operates, along with the operation of the power motor 17, the power belt 15 rotates, the rotary ring 11 is connected with the power belt 15, the rotation of the power belt 15 can drive the rotary ring 11 to rotate, the first limiting short pins 13 are in sliding connection with the rotary ring 11, the first limiting short pins 13 provide limiting for the rotation of the rotary ring 11, the rotary ring 11 is prevented from moving in the rotation process, the silicon carbide wafer is fixedly connected with the rotary ring 11 through the sucking discs 10, and the rotation of the rotary ring 11 can drive the silicon carbide wafer to rotate.
The limiting assembly 21 further comprises a driving motor 40, a linkage fluted disc 22, a driving gear 42 and a second motor frame 41, the second motor frame 41 is fixedly arranged at the lower end of the bearing disc 19, the driving motor 40 is arranged in a vertical state, the output end of the driving motor 40 extends upwards and penetrates through the second motor frame 41, the driving gear 42 is coaxially and fixedly sleeved with the output end of the driving motor 40, the linkage fluted disc 22 is coaxially arranged with the bearing disc 19, the linkage fluted disc 22 is meshed with the driving gear 42, and the linkage fluted disc 22 is further connected with the linkage mechanism 26. When the device operates, the driving motor 40 is started, the driving gear 42 is fixedly connected with the output end of the driving motor 40, the driving motor 40 operates to drive the driving gear 42 to rotate, the linkage fluted disc 22 is meshed with the driving gear 42, and then the rotation of the driving gear 42 drives the linkage fluted disc 22 to rotate.
The limiting assembly 21 further comprises a limiting top block 24 and a fixed pin shaft 25, the linkage fluted disc 22 is uniformly provided with a plurality of limiting sliding grooves 23 along the circumferential direction, the fixed pin shaft 25 penetrates through the axis of the linkage fluted disc 22 and is fixedly connected with the supporting disc 19, the fixed pin shaft 25 is rotationally connected with the linkage fluted disc 22, the limiting top block 24 is arranged on one side, close to the supporting disc 19, of the linkage fluted disc 22, and the limiting top block 24 is connected with the fixed pin shaft 25 through a bearing. When the device operates, the fixed pin shaft 25 ensures that the linkage fluted disc 22 cannot be separated from the lower end of the supporting disc 19 in the rotating process, the linkage mechanism 26 is connected with the linkage fluted disc 22, the rotation of the linkage fluted disc 22 can drive the linkage mechanism 26 to move towards the circle center of the linkage fluted disc 22, and the limiting jacking block 24 can limit the displacement path of the linkage mechanism 26 so as to prevent the linkage mechanism 26 from being blocked in the moving process.
The linkage mechanism 26 comprises a second limit short pin 27, a linkage long rod 28, a connecting short plate 31, a fixed baffle 30 and two limit stop blocks 29, wherein the second limit short pin 27 is in sliding connection with the limit chute 23, one end of the linkage long rod 28, which is close to the linkage fluted disc 22, is fixedly connected with the second limit short pin 27, the lower ends of the support disc 19 are fixedly arranged on the two limit stop blocks 29, the linkage long rod 28 is arranged between the two limit stop blocks 29, the two limit stop blocks 29 are in sliding connection with the linkage long rod 28, the fixed baffle 30 is arranged in a vertical state, the fixed baffle 30 is fixedly connected with one end, which is far away from the linkage fluted disc 22, of the linkage long rod 28, the connecting short plate 31 is arranged at the upper end of the fixed baffle 30, and the connecting short plate 31 is fixedly connected with the fixed baffle 30. When the device is operated, along with the rotation of the linkage fluted disc 22, the second limiting short pin 27 is connected with the limiting chute 23 in a sliding manner, when the second limiting short pin 27 moves to the tail end of the limiting chute 23, the second limiting short pin 27 is driven to move by the rotation of the linkage fluted disc 22, the second limiting short pin 27 is fixedly connected with the linkage long rod 28, the movement of the second limiting short pin 27 can drive the linkage long rod 28 to move, the linkage long rod 28 is connected with the fixed baffle 30, the movement of the linkage long rod 28 can drive the fixed baffle 30 to move, the fixed baffle 30 is connected with the connecting short plate 31, and the movement of the fixed baffle 30 can drive the connecting short plate 31 to move.
The limiting mechanism 32 comprises a long buffer pin 34, a connecting bent plate 35, a limiting roller 39, two buffer springs 33, two damping springs 36, two small damping rods 37 and two second limiting gaskets 38, wherein the long buffer pin 34 is in sliding connection with the short connecting plate 31, the two buffer springs 33 are sleeved outside the long buffer pin 34, the connecting bent plate 35 is arranged at one end, close to a silicon carbide wafer, of the short connecting plate 31, the connecting bent plate 35 is fixedly connected with the long buffer pin 34, one end of the buffer spring 33, close to the silicon carbide wafer, abuts against the connecting bent plate 35, the other end abuts against the short connecting plate 31, the damping springs 33, far away from the silicon carbide wafer, abut against the short connecting plate 31, the other end abuts against the pin caps of the long buffer pins 34, the limiting roller 39 is arranged at one side, close to the silicon carbide wafer, of the limiting roller 39 is in rolling connection with the silicon carbide wafer, the two second limiting gaskets 38 are symmetrically fixedly arranged at two sides of the limiting roller 39, the two small damping rods 37 are fixedly connected with the connecting bent plate 35, the output ends of the limiting roller 35 abut against the small damping springs 37, the two small damping rods are in rolling connection with the limiting roller 39, and the other ends of the limiting roller 37 are in a symmetrical state, and the two small damping rods are in rolling connection with the small damping rods 37. When the device is operated, the movement of the connecting short plate 31 can drive the buffer long pin 34 to move, the buffer long pin 34 is connected with the connecting bent plate 35, the movement of the buffer long pin 34 can drive the connecting bent plate 35 to move, the limit roller 39 is connected with the connecting bent plate 35 through the small damping rods 37 at the two sides of the limit roller 39, namely, the movement of the connecting bent plate 35 can drive the limit roller 39 to be tightly attached to the silicon carbide wafer, in the process, the buffer spring 33 can provide the wide capacity in the horizontal direction for the silicon carbide wafer, and the damage to the silicon carbide wafer caused by overlarge clamping force when a plurality of connecting bent plates 35 move is avoided. The two damping springs 36 can provide a vertical tolerance for the silicon carbide wafer to avoid the silicon carbide wafer from moving and losing balance in the rotation process, and the two small damping rods 37 can absorb the elastic deformation force of the two damping springs 36, namely, when the silicon carbide wafer jumps, although the two damping springs 36 can filter the vibration of the silicon carbide wafer, the damping springs 36 can have reciprocating motion, and the two small damping rods 37 are used for restraining the jump of the two damping springs 36 (the same as the working principle of an automobile damper).
A method of using a silicon carbide wafer waxing device, comprising a silicon carbide wafer waxing device as described above, further comprising the steps of:
s1: before the device operates, an operator firstly places a silicon carbide wafer to be processed at the upper ends of the plurality of suckers 10, the plurality of suckers 10 adsorb the silicon carbide wafer, then the operator starts a machine, the driving motor 40 starts, and finally the plurality of limiting rollers 39 clamp the outer edge of the silicon carbide wafer, in the process, the buffer spring 33 can provide the wide capacity in the horizontal direction for the silicon carbide wafer, and damage to the silicon carbide wafer due to overlarge clamping force when the plurality of connecting bent plates 35 move is avoided. At the same time, the bonding wax flows into the spray pipe 4 through the tail end of the triaxial moving mechanism 2;
s2: when the device operates, bonding wax is sprayed out of the spray pipe 4 and then drops on the surface of the silicon carbide wafer, the bonding wax is in a liquid viscous state along with the temperature rise of the silicon carbide wafer, then the silicon carbide wafer is driven by the rotating mechanism 9 to perform autorotation movement, and in the autorotation process, the scraper 8 uniformly spreads the liquid viscous bonding wax on the surface of the silicon carbide wafer;
s3: in the silicon carbide wafer rotation process, the silicon carbide wafer is fixedly connected with the rotary ring 11 through the sucker 10, when the power motor 17 runs, the power roller 16 rotates, the rotary ring 11 is in transmission connection with the power roller 16 through the power belt 15, the power motor 17 finally drives the rotary ring 11 to rotate, and the two damping springs 36 can provide the vertical wide capacity for the silicon carbide wafer, so that the silicon carbide wafer is prevented from moving and losing balance in the rotation process. While the two small damping rods 37 can absorb the elastic deformation force of the two damping springs 36, that is, when the silicon carbide wafer is jumped, although the two damping springs 36 can filter the vibration of the silicon carbide wafer, the damping springs 36 can reciprocate, and the two small damping rods 37 serve to restrain the jump of the two damping springs 36 (the same working principle as the automobile damper).
When the device is operated, the bonding wax is sprayed out of the spray pipe 4 and then drops on the surface of the silicon carbide wafer, the bonding wax is in a liquid viscous state along with the temperature rise of the silicon carbide wafer, then the silicon carbide wafer is driven by the rotating mechanism 9 to perform autorotation motion, and in the autorotation process, the scraper 8 uniformly spreads the liquid viscous bonding wax on the surface of the silicon carbide wafer.
The specific process is as follows: the supporting legs 20 play a role in supporting, the power motor 17 runs, the power roller 16 is fixedly connected with the power motor 17, and then the running of the power motor 17 drives the power roller 16 to rotate. The power belt 15 is connected with the power roller 16, the power roller 16 rotates to drive the power belt 15 to rotate, the rotary circular ring 11 is connected with the power belt 15, the power belt 15 rotates to drive the rotary circular ring 11 to rotate, the first limiting short pins 13 are in sliding connection with the rotary circular ring 11, the first limiting short pins 13 provide limiting for the rotation of the rotary circular ring 11, the rotary circular ring 11 is prevented from moving in the rotation process, and the silicon carbide wafer is fixedly connected with the rotary circular ring 11 through the sucking discs 10, namely, the rotation of the rotary circular ring 11 drives the silicon carbide wafer to rotate.
Meanwhile, the driving motor 40 is started, the driving gear 42 is fixedly connected with the output end of the driving motor 40, the driving motor 40 operates to drive the driving gear 42 to rotate, the linkage fluted disc 22 is meshed with the driving gear 42, and then the rotation of the driving gear 42 drives the linkage fluted disc 22 to rotate. The fixed pin shaft 25 ensures that the linkage fluted disc 22 cannot be separated from the lower end of the bearing disc 19 in the rotation process, the linkage mechanism 26 is connected with the linkage fluted disc 22, the rotation of the linkage fluted disc 22 can drive the linkage mechanism 26 to move towards the circle center of the linkage fluted disc 22, and the limiting jacking block 24 can limit the displacement path of the linkage mechanism 26 so as to prevent the linkage mechanism 26 from dying in the movement process. The working process of the linkage mechanism 26 is as follows: along with the rotation of the linkage fluted disc 22, the second spacing short pin 27 is connected with the spacing spout 23 in a sliding way, when the second spacing short pin 27 moves to the end of the spacing spout 23, the rotation of the linkage fluted disc 22 can drive the second spacing short pin 27 to move, the second spacing short pin 27 is fixedly connected with the linkage long rod 28, then the movement of the second spacing short pin 27 can drive the linkage long rod 28 to move, the linkage long rod 28 is connected with the fixed baffle 30, the movement of the linkage long rod 28 can drive the fixed baffle 30 to move, the fixed baffle 30 is connected with the connecting short plate 31, and then the movement of the fixed baffle 30 can drive the connecting short plate 31 to move. The movement of the connecting short plate 31 can drive the long buffer pin 34 to move, the long buffer pin 34 is connected with the connecting curved plate 35, the movement of the long buffer pin 34 can drive the connecting curved plate 35 to move, the limit roller 39 is connected with the connecting curved plate 35 through the small damping rods 37 on two sides of the limit roller 39, namely, the movement of the connecting curved plate 35 can drive the limit roller 39 to be tightly attached to the silicon carbide wafer, in the process, the buffer spring 33 can provide the wide capacity in the horizontal direction for the silicon carbide wafer, and damage to the silicon carbide wafer due to overlarge clamping force when a plurality of connecting curved plates 35 move is avoided. The two damping springs 36 can provide the vertical tolerance for the silicon carbide wafer, so as to prevent the silicon carbide wafer from moving and losing balance in the rotation process. While the two small damping rods 37 can absorb the elastic deformation force of the two damping springs 36, that is, when the silicon carbide wafer is jumped, although the two damping springs 36 can filter the vibration of the silicon carbide wafer, the damping springs 36 can reciprocate, and the two small damping rods 37 serve to restrain the jump of the two damping springs 36 (the same working principle as the automobile damper).
The foregoing examples merely illustrate one or more embodiments of the invention, which are described in greater detail and are not to be construed as limiting the scope of the invention. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the invention, which are all within the scope of the invention. Accordingly, the scope of protection of the present invention is to be determined by the appended claims.
Claims (2)
1. The utility model provides a carborundum wafer pastes wax device, includes quick-witted case (1) and triaxial mobile mechanism (2), its characterized in that still includes:
the spraying mechanism (3) is arranged in the chassis (1) and is fixedly connected with the triaxial moving mechanism (2);
the rotating mechanism (9) is arranged below the spraying mechanism (3) and is connected with the silicon carbide wafer, the rotating mechanism (9) comprises a bearing disc (19), and the bearing disc (19) is coaxially arranged below the silicon carbide wafer;
the limiting assembly (21) is connected with the rotating mechanism (9), the limiting assembly (21) comprises a plurality of linkage mechanisms (26) and a plurality of limiting mechanisms (32), the plurality of linkage mechanisms (26) are arranged at the lower end of the bearing disc (19), the plurality of linkage mechanisms (26) are uniformly arranged in an array along the circumferential direction of the bearing disc (19), the plurality of limiting mechanisms (32) are arranged in pairs, and each linkage mechanism (26) is connected with one group of limiting mechanisms (32);
the spraying mechanism (3) comprises a spray pipe (4), a connecting frame (5), a fixed short pin (6), a scraping plate (8) and two fixing nuts (7), wherein the spray pipe (4) is fixedly connected with the lower end of the triaxial moving mechanism (2), the connecting frame (5) is in a horizontal state and is fixedly connected with the spray pipe (4), the fixed short pin (6) is in a vertical state and is connected with the connecting frame (5), the two fixing nuts (7) are respectively arranged at the upper end and the lower end of the connecting frame (5), meanwhile, the two fixing nuts (7) are fixedly connected with the fixed short pin (6) in a screwing mode, and the middle part of the scraping plate (8) is fixedly connected with the lower end of the fixed short pin (6);
the rotating mechanism (9) further comprises a power roller (16), a power motor (17), a first motor frame (18) and a plurality of supporting legs (20), wherein the supporting legs (20) are uniformly arrayed along the circumferential direction of the bearing disc (19) in a vertical state, the supporting legs (20) are fixedly connected with the bearing disc (19), the first motor frame (18) is fixedly connected with the bearing disc (19), the power motor (17) is arranged in a vertical state, the power motor (17) is fixedly connected with the first motor frame (18), the output end of the power motor (17) extends upwards and sequentially penetrates through the first motor frame (18) and the bearing disc (19), and the power roller (16) is fixedly sleeved on the output end of the power motor (17);
the rotating mechanism (9) further comprises a power belt (15), a rotating circular ring (11), a plurality of first limiting gaskets (14), a plurality of suckers (10) and a plurality of first limiting short pins (13), wherein the rotating circular ring (11) is coaxially arranged at the upper end of the supporting circular ring (19), a limiting flange (12) is formed on the inner ring of the rotating circular ring (11), the plurality of first limiting short pins (13) are uniformly distributed on the inner ring of the rotating circular ring (11) at intervals, the plurality of first limiting gaskets (14) are coaxially arranged at the lower parts of the plurality of first limiting short pins (13), the plurality of first limiting short pins (13) are rotationally connected with the supporting circular ring (19) through the plurality of first limiting gaskets (14), meanwhile, one end of the power belt (15) is connected with the power roller (16) through the limiting flange (12), the other end of the power belt is connected with the rotating circular ring (11), and the plurality of first limiting short pins (10) are fixedly arranged at equal intervals along the circumferential direction of the rotating circular ring (11);
the limiting assembly (21) further comprises a driving motor (40), a linkage fluted disc (22), a driving gear (42) and a second motor frame (41), the second motor frame (41) is fixedly arranged at the lower end of the bearing disc (19), the driving motor (40) is arranged in a vertical state, the output end of the driving motor (40) extends upwards and penetrates through the second motor frame (41), the driving gear (42) is fixedly sleeved with the output end of the driving motor (40) coaxially, the linkage fluted disc (22) is coaxially arranged with the bearing disc (19), the linkage fluted disc (22) is meshed with the driving gear (42), and the linkage fluted disc (22) is further connected with the linkage mechanism (26);
the limiting assembly (21) further comprises a limiting top block (24) and a fixed pin shaft (25), a plurality of limiting sliding grooves (23) are uniformly arranged on the linkage fluted disc (22) along the circumferential direction, the fixed pin shaft (25) penetrates through the axis of the linkage fluted disc (22) and is fixedly connected with the supporting disc (19), the fixed pin shaft (25) is rotationally connected with the linkage fluted disc (22), the limiting top block (24) is arranged on one side, close to the supporting disc (19), of the linkage fluted disc (22), and the limiting top block (24) is connected with the fixed pin shaft (25) through a bearing;
the linkage mechanism (26) comprises a second limit short pin (27), a linkage long rod (28), a connecting short plate (31), a fixed baffle (30) and two limit stops (29), the second limit short pin (27) is in sliding connection with the limit chute (23), one end of the linkage long rod (28) close to the linkage fluted disc (22) is fixedly connected with the second limit short pin (27), the two limit stops (29) are fixedly arranged at the lower end of the bearing disc (19), the linkage long rod (28) is arranged between the two limit stops (29), the two limit stops (29) are in sliding connection with the linkage long rod (28), the fixed baffle (30) is arranged in a vertical state, the fixed baffle (30) is fixedly connected with one end of the linkage long rod (28) far away from the linkage fluted disc (22), the connecting short plate (31) is arranged at the upper end of the fixed baffle (30), and the connecting short plate (31) is fixedly connected with the fixed baffle (30);
the limiting mechanism (32) comprises a long buffer pin (34), a connecting bent plate (35), a limiting roller (39), two buffer springs (33), two damping springs (36), two small damping rods (37) and two second limiting gaskets (38), wherein the long buffer pin (34) is in sliding connection with the short buffer plate (31), the two buffer springs (33) are sleeved outside the long buffer pin (34) at the same time, the connecting bent plate (35) is arranged at one end, close to a silicon carbide wafer, of the short buffer plate (31), the connecting bent plate (35) is fixedly connected with the long buffer pin (34), one end of the buffer spring (33), close to the silicon carbide wafer, abuts against the connecting bent plate (35), the other end abuts against the short buffer plate (31), one end of the buffer spring (33), far away from the silicon carbide wafer, abuts against the short buffer plate (31), the other end of the buffer spring is in sliding connection with the pin cap of the long buffer pin (34), the limiting roller (39) is arranged at one side, close to the silicon carbide wafer, of the limiting roller (39) is in rolling connection with the silicon carbide wafer, the two second limiting rods (38) are symmetrically arranged at two sides of the two limiting gaskets (37) and fixedly connected with the two limiting rods (38) respectively, the limiting roller (39) is also rotationally connected with the two small damping rods (37), the damping springs (36) are sleeved outside the small damping rods (37), one ends of the damping springs (36) are abutted against the second limiting gaskets (38), and the other ends of the damping springs are abutted against the connecting curved plates (35).
2. A method of using a silicon carbide wafer waxing device comprising the silicon carbide wafer waxing device of claim 1, further comprising the steps of:
s1: before the device operates, an operator firstly places a silicon carbide wafer to be processed at the upper ends of a plurality of suckers (10), the plurality of suckers (10) absorb the silicon carbide wafer, then the operator starts a machine, a driving motor (40) starts, and finally a plurality of limiting rollers (39) clamp the outer edge of the silicon carbide wafer, in the process, a buffer spring (33) can provide wide capacity in the horizontal direction for the silicon carbide wafer, so that the silicon carbide wafer is prevented from being damaged due to overlarge clamping force when a plurality of connecting bent plates (35) move, and meanwhile, bonding wax flows into a spray pipe (4) through the tail end of a triaxial moving mechanism (2);
s2: when the device operates, bonding wax is sprayed out of the spray pipe (4), then drops on the surface of the silicon carbide wafer, the bonding wax is in a liquid state and sticky state along with the temperature rise of the silicon carbide wafer, then the silicon carbide wafer is driven by the rotating mechanism (9) to perform autorotation, and in the autorotation process, the scraper (8) uniformly spreads the liquid state and sticky state bonding wax on the surface of the silicon carbide wafer;
s3: in the silicon carbide wafer rotation process, the silicon carbide wafer passes through sucking disc (10) and rotatory ring (11) fixed connection, when power motor (17) moved, power gyro wheel (16) rotated, and rotatory ring (11) are connected through power belt (15) transmission with power gyro wheel (16), finally power motor (17) can drive rotatory ring (11) and rotate, and two damping springs (36) can provide the tolerance on the vertical direction for the silicon carbide wafer, avoid the silicon carbide wafer to take place the drunkenness and lose balance in the rotation process, and two small-size damping bars (37) can absorb the elastic deformation power of two damping springs (36), when the silicon carbide wafer is beaten, although the vibrations of silicon carbide wafer can be filtered to two damping springs (36), but damping spring (36) self can have reciprocating motion, and the effect of two small-size damping bars (37) just is used for restraining the jump of two damping springs (36) self.
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| CN202211517328.1A CN115889081B (en) | 2022-11-30 | 2022-11-30 | Silicon carbide wafer wax pasting device and method thereof |
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| CN202211517328.1A CN115889081B (en) | 2022-11-30 | 2022-11-30 | Silicon carbide wafer wax pasting device and method thereof |
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| CN115889081B true CN115889081B (en) | 2023-06-27 |
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Citations (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1057875A (en) * | 1996-08-23 | 1998-03-03 | Dainippon Screen Mfg Co Ltd | Substrate treating device |
| US6405739B1 (en) * | 1999-11-09 | 2002-06-18 | Liu Yu-Tsai | Spin chuck capable of providing simultaneous dual-sided processing |
| JP2003092344A (en) * | 2001-09-19 | 2003-03-28 | Dainippon Screen Mfg Co Ltd | Substrate holding mechanism, substrate processor using the same and substrate holding method |
| JP2004235235A (en) * | 2003-01-28 | 2004-08-19 | Dainippon Screen Mfg Co Ltd | Device and method for treating substrate |
| CN209613435U (en) * | 2019-03-07 | 2019-11-12 | 同辉电子科技股份有限公司 | A kind of waxing attachment of silicon carbide wafer grinding technics |
| CN211678526U (en) * | 2019-11-22 | 2020-10-16 | 上海联兴商务咨询中心 | Wafer processing device |
| CN112509964A (en) * | 2021-02-05 | 2021-03-16 | 宁波润华全芯微电子设备有限公司 | Clamping structure for cleaning based on Internet of things |
| CN112536635A (en) * | 2020-12-21 | 2021-03-23 | 丽水市莲都区天机机械设计服务部 | Intelligent machine tool carrier with secondary positioning detection function |
| CN113171950A (en) * | 2021-04-26 | 2021-07-27 | 高必静 | Glue homogenizing machine for gluing semiconductor processing wafer |
| CN113182137A (en) * | 2021-03-26 | 2021-07-30 | 江苏星特亮科技有限公司 | A rubber coating device for carborundum seed crystal bonds |
| CN215088531U (en) * | 2021-03-26 | 2021-12-10 | 江苏星特亮科技有限公司 | A rubber coating device for carborundum seed crystal bonds |
| CN215843842U (en) * | 2021-07-16 | 2022-02-18 | 杭州汇家厨卫用品有限公司 | Panel side japanning all-in-one |
| CN114289266A (en) * | 2021-12-24 | 2022-04-08 | 湖南绿舟新型材料科技有限公司 | Production device for environment-friendly decorative material plate |
| CN114505208A (en) * | 2022-04-19 | 2022-05-17 | 成都泰美克晶体技术有限公司 | Waxing machine for wafer |
| CN114628303A (en) * | 2022-05-16 | 2022-06-14 | 四川上特科技有限公司 | Crystal grain stripping off device |
| CN114939509A (en) * | 2022-06-21 | 2022-08-26 | 智程半导体设备科技(昆山)有限公司 | Automatic gluing device and method for semiconductor silicon wafer |
| CN115083992A (en) * | 2022-06-10 | 2022-09-20 | 智程半导体设备科技(昆山)有限公司 | Chuck assembly of wafer cleaning equipment, use method and wafer cleaning equipment |
| CN115097700A (en) * | 2022-07-06 | 2022-09-23 | 江苏晶杰光电科技有限公司 | Wafer sucker structure for photoetching machine |
| CN115106262A (en) * | 2022-07-05 | 2022-09-27 | 河南通用智能装备有限公司 | Rotary gluing vacuum carrying platform of wafer laser low-k equipment |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2001084621A1 (en) * | 2000-04-27 | 2001-11-08 | Ebara Corporation | Rotation holding device and semiconductor substrate processing device |
| US6932558B2 (en) * | 2002-07-03 | 2005-08-23 | Kung Chris Wu | Wafer aligner |
| JP4391217B2 (en) * | 2003-12-16 | 2009-12-24 | 株式会社トプコン | Surface inspection device |
| JP5789546B2 (en) * | 2011-04-26 | 2015-10-07 | 東京エレクトロン株式会社 | Coating processing apparatus, coating and developing processing system, coating processing method, and recording medium recording a program for executing the coating processing method |
| JP6289241B2 (en) * | 2013-06-20 | 2018-03-07 | 東京エレクトロン株式会社 | Liquid processing method, liquid processing apparatus, and storage medium |
-
2022
- 2022-11-30 CN CN202211517328.1A patent/CN115889081B/en active Active
Patent Citations (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1057875A (en) * | 1996-08-23 | 1998-03-03 | Dainippon Screen Mfg Co Ltd | Substrate treating device |
| US6405739B1 (en) * | 1999-11-09 | 2002-06-18 | Liu Yu-Tsai | Spin chuck capable of providing simultaneous dual-sided processing |
| JP2003092344A (en) * | 2001-09-19 | 2003-03-28 | Dainippon Screen Mfg Co Ltd | Substrate holding mechanism, substrate processor using the same and substrate holding method |
| JP2004235235A (en) * | 2003-01-28 | 2004-08-19 | Dainippon Screen Mfg Co Ltd | Device and method for treating substrate |
| CN209613435U (en) * | 2019-03-07 | 2019-11-12 | 同辉电子科技股份有限公司 | A kind of waxing attachment of silicon carbide wafer grinding technics |
| CN211678526U (en) * | 2019-11-22 | 2020-10-16 | 上海联兴商务咨询中心 | Wafer processing device |
| CN112536635A (en) * | 2020-12-21 | 2021-03-23 | 丽水市莲都区天机机械设计服务部 | Intelligent machine tool carrier with secondary positioning detection function |
| CN112509964A (en) * | 2021-02-05 | 2021-03-16 | 宁波润华全芯微电子设备有限公司 | Clamping structure for cleaning based on Internet of things |
| CN215088531U (en) * | 2021-03-26 | 2021-12-10 | 江苏星特亮科技有限公司 | A rubber coating device for carborundum seed crystal bonds |
| CN113182137A (en) * | 2021-03-26 | 2021-07-30 | 江苏星特亮科技有限公司 | A rubber coating device for carborundum seed crystal bonds |
| CN113171950A (en) * | 2021-04-26 | 2021-07-27 | 高必静 | Glue homogenizing machine for gluing semiconductor processing wafer |
| CN215843842U (en) * | 2021-07-16 | 2022-02-18 | 杭州汇家厨卫用品有限公司 | Panel side japanning all-in-one |
| CN114289266A (en) * | 2021-12-24 | 2022-04-08 | 湖南绿舟新型材料科技有限公司 | Production device for environment-friendly decorative material plate |
| CN114505208A (en) * | 2022-04-19 | 2022-05-17 | 成都泰美克晶体技术有限公司 | Waxing machine for wafer |
| CN114628303A (en) * | 2022-05-16 | 2022-06-14 | 四川上特科技有限公司 | Crystal grain stripping off device |
| CN115083992A (en) * | 2022-06-10 | 2022-09-20 | 智程半导体设备科技(昆山)有限公司 | Chuck assembly of wafer cleaning equipment, use method and wafer cleaning equipment |
| CN114939509A (en) * | 2022-06-21 | 2022-08-26 | 智程半导体设备科技(昆山)有限公司 | Automatic gluing device and method for semiconductor silicon wafer |
| CN115106262A (en) * | 2022-07-05 | 2022-09-27 | 河南通用智能装备有限公司 | Rotary gluing vacuum carrying platform of wafer laser low-k equipment |
| CN115097700A (en) * | 2022-07-06 | 2022-09-23 | 江苏晶杰光电科技有限公司 | Wafer sucker structure for photoetching machine |
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|---|---|
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