CN112509964A - Clamping structure for cleaning based on Internet of things - Google Patents
Clamping structure for cleaning based on Internet of things Download PDFInfo
- Publication number
- CN112509964A CN112509964A CN202110157179.1A CN202110157179A CN112509964A CN 112509964 A CN112509964 A CN 112509964A CN 202110157179 A CN202110157179 A CN 202110157179A CN 112509964 A CN112509964 A CN 112509964A
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- Prior art keywords
- main body
- wafer
- things
- internet
- sliding
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/02—Measures preceding sorting, e.g. arranging articles in a stream orientating
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/34—Sorting according to other particular properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/36—Sorting apparatus characterised by the means used for distribution
- B07C5/361—Processing or control devices therefor, e.g. escort memory
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B13/00—Accessories or details of general applicability for machines or apparatus for cleaning
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention discloses a clamping structure for cleaning based on the Internet of things, and relates to the technical field of wafer cleaning; the wafer clamping device comprises a main body, at least three claw parts which are connected to one end of the main body in a sliding mode and used for clamping a wafer, a detection mechanism used for detecting the roundness of the wafer, a control mechanism used for controlling the claw parts to be opened and closed, a processing module connected with the detection mechanism, and a wireless communication module connected with the processing module; the end part of the main body is provided with a plurality of supporting columns for supporting wafers; the jaws are arranged in an annular array centered on the axis of the body. The invention provides a clamping structure for cleaning based on the Internet of things, which can be used for remote monitoring.
Description
Technical Field
The invention belongs to the technical field of wafer cleaning, and particularly relates to a clamping structure for cleaning based on the Internet of things.
Background
After the wafer is produced, the wafer needs to be cleaned, and when the wafer is cleaned, the wafer is clamped by the clamping structure and then cleaned.
The existing clamping structure cannot be remotely monitored.
Disclosure of Invention
The invention aims to overcome the defects in the prior art, and provides a clamping structure for cleaning based on the Internet of things, which can be used for remote monitoring.
In order to achieve the purpose, the invention adopts the following technical scheme:
a clamping structure for cleaning based on the Internet of things comprises a main body, at least three claw parts which are connected to one end of the main body in a sliding mode and used for clamping a wafer, a detection mechanism used for detecting the roundness of the wafer, a control mechanism used for controlling the claw parts to be opened and closed, a processing module connected with the detection mechanism, and a wireless communication module connected with the processing module; the end part of the main body is provided with a plurality of supporting columns for supporting wafers; the jaws are arranged in an annular array centered on the axis of the body. The wafer is placed on the supporting column, the claw part is controlled by the control mechanism, the wafer is clamped and cleaned, the clamping function is achieved, the detection mechanism can detect whether the wafer is circular or not, if the wafer is a defective (non-circular) wafer, cleaning is not conducted, the wireless communication module sends the wafer detection condition to the terminal, and remote monitoring is facilitated.
Preferably, a sliding groove is formed in the end portion of the main body at a position corresponding to the claw portion, a sliding block is connected in the sliding groove, the claw portion is connected with the corresponding sliding block, a second sliding groove is formed in one side, close to a shaft of the main body, of the sliding groove, a third sliding groove is formed in the main body, a push rod is connected in the second sliding groove in a sliding mode, a guide surface used for pushing the sliding block to slide in the sliding groove is arranged at the upper end of the push rod, a spring used for pushing the sliding block to be tightly pressed on the guide surface is arranged on the main body, a connector is connected in the third sliding groove in a sliding mode, the; the control mechanism is an electric cylinder; the electric cylinder is connected with the driving rod. The driving rod is driven by the electric cylinder, the sliding block is driven to move in the second sliding groove by the guide surface, and the spring provides clamping force for the claw part.
Preferably, the claw part comprises a rotating shaft, a connecting rod, a positioning column, a support, a sliding shaft, a roller, a second spring and a servo motor, wherein one end of the rotating shaft is rotatably connected to the sliding block; the detection mechanism comprises a pressure sensor and a rotating mechanism, wherein the pressure sensor is positioned between the sliding shaft and the second spring, the rotating mechanism is used for rotating the wafer, and the pressure sensor is connected with the wireless communication module. The claw part has double functions, the clamping and positioning functions are realized through the positioning column, and the roller wheel is matched with the detection mechanism to realize the function of judging whether the wafer is circular or not.
Preferably, the rotating mechanism comprises a rotating disc rotatably connected to the end of the main body and a rotating motor for rotating the rotating disc; one end of the supporting column is connected with the turntable; the rotating mechanism further comprises a sucker positioned at one end of the supporting column far away from the turntable, an air suction hole positioned on the sucker and an air pump connected with the air suction hole. The wafer is adsorbed on the sucking disc, and the wafer is difficult to damage.
Preferably, the cross-section of the positioning post is circular. The wafer is not easy to be damaged.
Preferably, the positioning column, the connecting rod and the bracket are of an integrally formed structure. Is convenient for production.
Preferably, the number of the claw portions is four. The stability of the clamping is increased.
The invention has the beneficial effects that: the invention provides a clamping structure for cleaning based on the Internet of things, which comprises (1) a wafer is placed on a sucker, an electric cylinder runs, and a positioning column is abutted against the outer edge of the wafer to position the wafer; (2) the servo motor rotates 180 degrees, the roller is abutted against the wafer, the second spring is compressed, the turntable drives the wafer to rotate, and whether the wafer is circular or not is judged through the numerical value of the pressure sensor; detecting the wafer; (3) the wireless communication module sends the detection result of the wafer to a terminal for a worker to check; the remote monitoring function is provided.
Drawings
FIG. 1 is a schematic view of the present invention;
FIG. 2 is an enlarged view of FIG. 1 at A;
FIG. 3 is a top view of the present invention;
FIG. 4 is a schematic view of the positioning post abutting against the wafer;
FIG. 5 is a schematic view of the roller abutting against the wafer.
In the figure: the device comprises a main body 1, a wafer 2, a chute 3, a support column 4, a sliding block 5, a wireless communication module 6, a second chute 7, a third chute 8, a push rod 9, a guide surface 10, a spring 11, a connector 12, a driving rod 13, an electric cylinder 14, a rotating shaft 15, a connecting rod 16, a positioning column 17, a support 18, a sliding shaft 19, a roller 20, a second spring 21, a servo motor 22, a pressure sensor 23, a turntable 24, a rotating motor 25, a suction cup 26, a suction hole 27, an air pump 28 and a processing module 29.
Detailed Description
The invention is explained in further detail below with reference to the figures and the detailed description:
example (b):
referring to fig. 1 to 5, a clamping structure for cleaning based on the internet of things comprises a main body 1, at least three claw parts which are connected to one end of the main body 1 in a sliding manner and used for clamping a wafer 2, a detection mechanism used for detecting the roundness of the wafer 2, a control mechanism used for controlling the claw parts to open and close, a processing module 29 connected with the detection mechanism, and a wireless communication module 6 connected with the processing module 29;
the end part of the main body 1 is provided with a plurality of supporting columns 4 for supporting the wafer 2; the number of the claw portions is four.
The jaws are arranged in an annular array centered on the axis of the body 1.
The end part of the main body 1 is provided with a sliding chute 3 at a position corresponding to the claw part, the sliding chute 3 is internally and slidably connected with a sliding block 5, the claw part is connected with the corresponding sliding block 5, one side of the sliding chute 3, which is close to the shaft of the main body 1, is provided with a second sliding chute 7, the main body 1 is internally provided with a third sliding chute 8, the second sliding chute 7 is internally and slidably connected with a push rod 9, the upper end of the push rod 9 is provided with a guide surface 10 for pushing the sliding block 5 to slide in the sliding chute 3, the main body 1 is provided with a spring 11 for pushing the sliding block 5 tightly against the guide surface 10, the third sliding chute 8 is internally and slidably connected with a connector 12, the push rod 9 is connected with the;
the control mechanism is an electric cylinder 14;
the electric cylinder 14 is connected to the drive rod 13.
The claw part comprises a rotating shaft 15 with one end rotatably connected to the sliding block 5, a connecting rod 16 connected to the other end of the rotating shaft 15, a positioning column 17 connected to one end of the connecting rod 16 close to the shaft of the main body 1, a support 18 connected to the other end of the connecting rod 16, a sliding shaft 19 penetrating through the support 18, a roller 20 rotatably connected to one end of the sliding shaft 19 far away from the positioning column 17, a second spring 21 positioned between the sliding shaft 19 and the positioning column 17, and a servo motor 22 for rotating the rotating shaft 15; the cross section of the positioning post 17 is circular. The positioning column 17, the connecting rod 16 and the bracket 18 are of an integrally formed structure.
The detection mechanism comprises a pressure sensor 23 positioned between the sliding shaft 19 and the second spring 21 and a rotating mechanism for rotating the wafer 2, wherein the pressure sensor 23 is connected with the wireless communication module 6.
The rotating mechanism comprises a rotating disc 24 rotatably connected to the end part of the main body 1 and a rotating motor 25 for rotating the rotating disc 24;
one end of the supporting column 4 is connected with the rotary disc 24;
the rotating mechanism further comprises a suction cup 26 positioned at one end of the supporting column 4 far away from the rotating disc 24, an air suction hole 27 positioned on the suction cup 26, and an air pump 28 connected with the air suction hole 27.
Principle of embodiment:
the wafer is placed on the sucking disc 26, the electric cylinder 14 operates, the driving rod 13 moves towards one side far away from the rotary disc 24, under the action of the spring 11, the sliding block 5 moves towards one side of the shaft of the main body 1, at the moment, the straight line of the connecting rod 16 intersects with the shaft of the main body 1, the positioning column 17 abuts against the outer edge of the wafer, see fig. 4, then the servo motor 22 rotates 180 degrees, the roller 20 abuts against the wafer, the second spring 21 is compressed, the pressure sensor 23 detects the force between the second spring 21 and the sliding shaft 19, the rotary disc 24 drives the wafer to rotate, see fig. 5, when the wafer is not circular, the second spring 21 can stretch, the force detected by the pressure sensor 23 can change, conversely, when the wafer is circular, the second spring 21 cannot stretch, and the wireless communication module 6 sends the detection result of the wafer to the terminal for a worker to check. The wireless communication module and the processing module are the prior art, and the processing module adopts plc.
If the wafer is circular, the next step of cleaning is performed.
If the wafer is not circular, no cleaning is performed and the next wafer is ready for cleaning.
Claims (7)
1. A clamping structure for cleaning based on the Internet of things is characterized by comprising a main body, at least three claw parts, a detection mechanism, a control mechanism, a processing module and a wireless communication module, wherein the claw parts are connected to one end of the main body in a sliding mode and used for clamping a wafer, the detection mechanism is used for detecting the roundness of the wafer, the control mechanism is used for controlling the claw parts to be opened and closed, the processing module is connected with the detection mechanism, and the wireless communication module is connected with the processing;
the end part of the main body is provided with a plurality of supporting columns for supporting wafers;
the jaws are arranged in an annular array centered on the axis of the body.
2. The clamping structure for cleaning based on the internet of things of claim 1 is characterized in that a sliding groove is formed in the end portion of the main body at a position corresponding to the claw portion, a sliding block is connected in the sliding groove in a sliding mode, the claw portion is connected with the corresponding sliding block, a second sliding groove is formed in one side, close to the shaft of the main body, of the sliding groove, a third sliding groove is formed in the main body, a push rod is connected in the second sliding groove in a sliding mode, a guide surface used for pushing the sliding block to slide in the sliding groove is arranged at the upper end of the push rod, a spring used for pushing the sliding block to the guide surface is arranged on the main body, a connector is connected in the third sliding groove in a sliding mode, the push rod;
the control mechanism is an electric cylinder;
the electric cylinder is connected with the driving rod.
3. The Internet of things-based clamping structure for cleaning is characterized in that the claw part comprises a rotating shaft, a connecting rod, a positioning column, a support frame, a sliding shaft, a roller, a second spring and a servo motor, wherein one end of the rotating shaft is rotatably connected to the sliding block;
the detection mechanism comprises a pressure sensor and a rotating mechanism, wherein the pressure sensor is positioned between the sliding shaft and the second spring, the rotating mechanism is used for rotating the wafer, and the pressure sensor is connected with the wireless communication module.
4. The Internet of things-based cleaning clamping structure is characterized in that the rotating mechanism comprises a turntable which is rotatably connected to the end of the main body, and a rotating motor for rotating the turntable;
one end of the supporting column is connected with the turntable;
the rotating mechanism further comprises a sucker positioned at one end of the supporting column far away from the turntable, an air suction hole positioned on the sucker and an air pump connected with the air suction hole.
5. The Internet of things-based clamping structure for cleaning is characterized in that the cross section of the positioning column is circular.
6. The Internet of things-based clamping structure for cleaning is characterized in that the positioning column, the connecting rod and the support are of an integrally formed structure.
7. The Internet of things-based cleaning clamping structure is characterized in that the number of the claw parts is four.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110157179.1A CN112509964B (en) | 2021-02-05 | 2021-02-05 | Clamping structure for cleaning based on Internet of things |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110157179.1A CN112509964B (en) | 2021-02-05 | 2021-02-05 | Clamping structure for cleaning based on Internet of things |
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| Publication Number | Publication Date |
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| CN112509964A true CN112509964A (en) | 2021-03-16 |
| CN112509964B CN112509964B (en) | 2021-05-18 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202110157179.1A Active CN112509964B (en) | 2021-02-05 | 2021-02-05 | Clamping structure for cleaning based on Internet of things |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113083740A (en) * | 2021-04-08 | 2021-07-09 | 吉林大华机械制造有限公司 | Detection device for automobile product |
| CN113380670A (en) * | 2021-05-21 | 2021-09-10 | 昆山基侑电子科技有限公司 | Wafer cleaning monitoring system based on Internet of things |
| CN115889081A (en) * | 2022-11-30 | 2023-04-04 | 安徽微芯长江半导体材料有限公司 | Silicon carbide wafer wax pasting device and method thereof |
| CN116705691A (en) * | 2023-08-09 | 2023-09-05 | 浙江晶盛机电股份有限公司 | Wafer cleaning device and wafer cleaning method |
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| US20040151574A1 (en) * | 2001-05-29 | 2004-08-05 | Zhimin Lu | Method and apparatus to correct wafer drift |
| CN101480762A (en) * | 2008-12-12 | 2009-07-15 | 江阴市东发机械设备制造有限公司 | Method for producing steel-based composite board tower |
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| CN108987311A (en) * | 2017-05-31 | 2018-12-11 | 株式会社斯库林集团 | Substrate board treatment and substrate processing method using same |
| CN110993553A (en) * | 2019-12-12 | 2020-04-10 | 荆门欧曼凯机电设备有限公司 | Magnetic control type self-centering chip wafer robot complete machine |
| CN111599744A (en) * | 2019-02-21 | 2020-08-28 | 细美事有限公司 | Apparatus and method for processing substrate |
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2021
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| US20040151574A1 (en) * | 2001-05-29 | 2004-08-05 | Zhimin Lu | Method and apparatus to correct wafer drift |
| CN101480762A (en) * | 2008-12-12 | 2009-07-15 | 江阴市东发机械设备制造有限公司 | Method for producing steel-based composite board tower |
| CN102751228A (en) * | 2011-06-28 | 2012-10-24 | 清华大学 | Wafer clamping device by utilizing spring pinch cock |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113083740A (en) * | 2021-04-08 | 2021-07-09 | 吉林大华机械制造有限公司 | Detection device for automobile product |
| CN113380670A (en) * | 2021-05-21 | 2021-09-10 | 昆山基侑电子科技有限公司 | Wafer cleaning monitoring system based on Internet of things |
| CN115889081A (en) * | 2022-11-30 | 2023-04-04 | 安徽微芯长江半导体材料有限公司 | Silicon carbide wafer wax pasting device and method thereof |
| CN115889081B (en) * | 2022-11-30 | 2023-06-27 | 安徽微芯长江半导体材料有限公司 | Silicon carbide wafer wax pasting device and method thereof |
| CN116705691A (en) * | 2023-08-09 | 2023-09-05 | 浙江晶盛机电股份有限公司 | Wafer cleaning device and wafer cleaning method |
| CN116705691B (en) * | 2023-08-09 | 2023-11-14 | 浙江晶盛机电股份有限公司 | Wafer cleaning device and wafer cleaning method |
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| Publication number | Publication date |
|---|---|
| CN112509964B (en) | 2021-05-18 |
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