CN220788852U - Semiconductor wafer metal electroplating clamp - Google Patents

Abstract

The utility model discloses a metal electroplating clamp for a semiconductor wafer, which comprises a fixed box, wherein the bottom of the fixed box is fixedly connected with a fixed plate, the inside of the fixed plate is provided with a sliding groove, the inside of the sliding groove is movably provided with a clamping column, and the outer wall of the bottom end of the clamping column is fixedly connected with an anti-skid sleeve; the top fixedly connected with movable block of grip post, and the inside threaded connection of movable block has the threaded rod, the one end rotation of threaded rod is connected with the limiting plate. This semiconductor wafer metal electroplates anchor clamps, motor drive connecting gear rotatory back, and the linkage gear is rotatory gear second through the belt for gear second drives gear first and the threaded rod of avris and rotates, then removes the movable block under the spacing of limiting plate, thereby carries out the centre gripping to the wafer through the grip post, and because connecting gear meshing connects the linkage gear, and then conveniently uses a plurality of clamping structures simultaneously, thereby conveniently improves the work efficiency of semiconductor wafer metal and electroplates anchor clamps.

Description

Semiconductor wafer metal electroplating clamp

Technical Field

The utility model relates to the technical field of wafers, in particular to a metal electroplating clamp for a semiconductor wafer.

Background

The wafer refers to a silicon wafer used for manufacturing a silicon semiconductor circuit, the original material is silicon, high-purity polycrystalline silicon is dissolved and then is doped with silicon crystal seeds, then the silicon crystal seeds are slowly pulled out to form cylindrical monocrystalline silicon, a silicon crystal rod is ground, polished and sliced to form the silicon wafer, namely the wafer, a metal electroplating link exists in the process of processing the semiconductor wafer, and an electroplating clamp is needed in the process of electroplating the wafer.

However, the commonly used electroplating clamp has some defects, when the electroplating clamp is used, a disc clamp is usually used for clamping and fixing a wafer, and then when the clamping structure is driven by a motor to be used, only one clamp can be controlled to be used, so that the electroplating clamp is inconvenient to process different numbers of wafers simultaneously as required, and the electroplating processing efficiency of the wafers is affected.

Disclosure of utility model

The utility model aims to provide a semiconductor wafer metal electroplating clamp, which solves the problem that the prior art is inconvenient to control a plurality of clamps to use according to requirements and affects the wafer electroplating processing efficiency.

In order to achieve the above purpose, the present utility model provides the following technical solutions: the semiconductor wafer metal electroplating clamp comprises a fixed box, wherein the bottom of the fixed box is fixedly connected with a fixed plate, a chute is formed in the fixed plate, a clamping column is movably arranged in the chute, and an anti-skid sleeve is fixedly connected with the outer wall of the bottom end of the clamping column;

The top fixedly connected with movable block of grip post, and the inside threaded connection of movable block has the threaded rod, the one end rotation of threaded rod is connected with the limiting plate, and the other end fixed mounting of threaded rod has gear one, the top meshing of gear one has gear two.

Preferably, the sliding grooves are symmetrically formed in the bottom of the fixed plate, the outer sides of the anti-slip sleeves are provided with wafers in an extrusion mode, and the moving blocks are arranged in the limiting plates in a moving mode.

Preferably, the threaded rod and the first equal distance of gear set up in the outside of gear two, and the top fixedly connected with steering column of gear two, the steering column rotates the inside of installing at fixed box, and one side fixedly connected with bar box of fixed box.

Preferably, the inside of bar box rotates installs the jack post, and the outer wall of jack post rotates and is connected with the belt, the outer wall fixedly connected with linkage gear of jack post, and the jack post passes through the belt and rotates with the column of gear two and be connected.

Preferably, one side fixed mounting of bar box has the movable plate, and the outside of movable plate is provided with fixed box, one side fixedly connected with connecting block of movable plate, and the movable plate removes the setting in fixed box inside.

Preferably, the bottom fixed mounting of connecting block has the pneumatic cylinder, and the telescopic link top of pneumatic cylinder and the bottom fixed connection of connecting block, the connecting block removes the setting inside one side of fixed box, and the bottom fixed mounting of fixed box has the backup pad.

Preferably, the connecting gear is rotatably arranged in the fixed box, the connecting gear is meshed with one side of the linkage gear, the rotating shaft is fixedly connected with the inner wall of the connecting gear, the motor is fixedly arranged at the top end of the rotating shaft, and the motor is fixedly arranged at the top of the fixed box.

Compared with the prior art, the utility model has the beneficial effects that: the semiconductor wafer metal plating jig;

1. After the motor drives the connecting gear to rotate, the linkage gear rotates the gear II through the belt, so that the gear II drives the gear I at the side and the threaded rod to rotate, and then the moving block moves under the limit of the limiting plate, so that the wafer is clamped through the clamping column, and the connecting gear is meshed with the linkage gear, so that a plurality of clamping structures are conveniently used simultaneously, and the working efficiency of the semiconductor wafer metal electroplating clamp is conveniently improved;

2. Move down the connecting block that corresponds through the pneumatic cylinder to remove the movable plate at fixed incasement portion, then remove bar box and fixed box, remove linkage gear and connecting gear simultaneously and separate, and then the use of convenient control correspondence anchor clamps, thereby the use quantity of convenient according to the processing demand, adjust anchor clamps, and then improve the flexibility that semiconductor wafer metal electroplating anchor clamps used.

Drawings

FIG. 1 is a schematic diagram of the overall structure of the present utility model;

FIG. 2 is a schematic diagram of the position structure of the motor of the present utility model;

FIG. 3 is a schematic diagram of the connection structure of the linkage gear and the connecting gear of the present utility model;

fig. 4 is a schematic view of the internal structure of the fixing case of the present utility model.

In the figure: 1. a fixed box; 2. a fixing plate; 3. a chute; 4. a clamping column; 5. an anti-skid sleeve; 6. a moving block; 7. a threaded rod; 8. a limiting plate; 9. a first gear; 10. a second gear; 11. a strip-shaped box; 12. a linkage gear; 13. a moving plate; 14. a fixed box; 15. a connecting block; 16. a hydraulic cylinder; 17. a support plate; 18. a connecting gear; 19. and a motor.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

Example one:

Referring to fig. 1-4, the present utility model provides a technical solution: the utility model provides a semiconductor wafer metal electroplating clamp, includes fixed box 1, fixed box 1's bottom fixedly connected with fixed plate 2, and spout 3 has been seted up to the inside of fixed plate 2, and the inside of spout 3 is provided with grip post 4 in the removal, and grip post 4's bottom outer wall fixedly connected with anti-skidding cover 5;

The top end of the clamping column 4 is fixedly connected with a moving block 6, the inner thread of the moving block 6 is connected with a threaded rod 7, one end of the threaded rod 7 is rotationally connected with a limiting plate 8, the sliding chute 3 is symmetrically arranged at the bottom of the fixed plate 2, the outer side of the anti-slip sleeve 5 is provided with a wafer in an extrusion mode, and the moving block 6 is movably arranged in the limiting plate 8;

The other end of the threaded rod 7 is fixedly provided with a first gear 9, the top of the first gear 9 is meshed with a second gear 10, the threaded rod 7 and the first gear 9 are arranged on the outer side of the second gear 10 at equal distance, the top of the second gear 10 is fixedly connected with a rotating column, and the rotating column is rotatably arranged in the fixed box 1;

after the motor 19 drives the connecting gear 18 to rotate, the linkage gear 12 rotates the gear two 10 through a belt, so that the gear two 10 drives the gear one 9 and the threaded rod 7 at the side to rotate, and then the moving block 6 moves under the limit of the limit plate 8, so that the wafer is clamped through the clamping column 4, and the connecting gear 18 is meshed with the linkage gear 12, so that a plurality of clamping structures can be conveniently used simultaneously, and the working efficiency of the semiconductor wafer metal electroplating clamp is conveniently improved;

the anti-skid sleeves 5 are arranged to facilitate the protection of the clamping columns 4, so that the wafer can be clamped and fixed conveniently and better, the sliding grooves 3 are arranged to facilitate the clamping columns 4 to move inside the fixed plate 2, meanwhile, the limiting plates 8 are arranged to facilitate the limiting movement of the moving blocks 6, and the gears 9 can be driven to rotate through the rotation of the gears 10, so that the clamping columns 4 can be controlled to shrink inwards of the fixed plate 2 conveniently, and the wafer can be clamped and fixed;

Example two:

On the basis of the first example, in order to increase the flexibility of using the clamp, referring to fig. 1-3, one side of the fixed box 1 is fixedly connected with a bar box 11, a shaft post is rotatably installed in the bar box 11, the outer wall of the shaft post is rotatably connected with a belt, the outer wall of the shaft post is fixedly connected with a linkage gear 12, and the shaft post is rotatably connected with a rotating post of a gear two 10 through the belt;

A movable plate 13 is fixedly arranged on one side of the strip-shaped box 11, a fixed box 14 is arranged on the outer side of the movable plate 13, a connecting block 15 is fixedly connected on one side of the movable plate 13, the movable plate 13 is movably arranged in the fixed box 14, a hydraulic cylinder 16 is fixedly arranged at the bottom of the connecting block 15, the top end of a telescopic rod of the hydraulic cylinder 16 is fixedly connected with the bottom of the connecting block 15, and the connecting block 15 is movably arranged in one side of the fixed box 14;

The bottom of the fixed box 14 is fixedly provided with a supporting plate 17, the inside of the fixed box 14 is rotatably provided with a connecting gear 18, the connecting gear 18 is meshed with one side of the linkage gear 12, the inner wall of the connecting gear 18 is fixedly connected with a rotating shaft, the top end of the rotating shaft is fixedly provided with a motor 19, and the motor 19 is fixedly arranged at the top of the fixed box 14;

The corresponding connecting blocks 15 are moved downwards through the hydraulic cylinders 16, so that the movable plate 13 moves in the fixed box 14, then the strip-shaped box 11 and the fixed box 1 are moved, and meanwhile, the linkage gear 12 and the connecting gear 18 are moved and separated, so that the use of corresponding clamps is conveniently controlled, the use quantity of the clamps is conveniently adjusted according to the processing requirements, and the use flexibility of the semiconductor wafer metal electroplating clamp is improved;

The convenient to use of different pneumatic cylinders 16 drives the removal of different position connecting blocks 15 to the convenience removes corresponding movable plate 13, makes connecting gear 18 and linkage gear 12 remove to stagger, and then the use of the different quantity anchor clamps of convenient control, and the pedestal of linkage gear 12 is convenient to be connected with the column of gear two 10 through the belt, thereby conveniently drives gear two 10 rotatory use, and connecting gear 18's setting is convenient to support fixed case 14.

Working principle: when the semiconductor wafer metal electroplating clamp is used, a wafer is placed between clamping columns 4, then the wafer is correspondingly arranged on one side of an anti-slip sleeve 5, then a motor 19 drives a connecting gear 18 to rotate, and then the connecting gear 18 drives a linkage gear 12 to rotate, so that a shaft column in the linkage gear 12 drives a rotating column of a gear two 10 through a belt;

Then the gear II 10 rotates in the fixed box 1, then the gear I9 drives the threaded rod 7 to rotate at the inner side of the limiting plate 8, and when the threaded rod 7 rotates, the moving block 6 moves in the limiting plate 8, and meanwhile the clamping column 4 moves in the sliding groove 3, so that the anti-skid sleeve 5 is extruded at the side of a wafer, the clamping column 4 clamps the wafer, and a plurality of clamps simultaneously clamp a plurality of wafers through the connection of the connecting gear 18;

The connecting block 15 is moved downwards through the hydraulic cylinder 16, so that the movable plate 13 is moved inside the fixed box 14, the strip-shaped box 11 and the fixed box 1 are driven to move downwards, the wafer is placed downwards inside the electroplating liquid for electroplating operation, the corresponding clamp is moved through the use convenience of the hydraulic cylinder 16, the connecting gear 18 and the linkage gear 12 are moved and staggered, the corresponding clamp is deactivated, and the use quantity of the clamp is selected according to the requirement conveniently.

Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.

Claims (7)

1. The utility model provides a semiconductor wafer metal electroplating clamp, includes fixed box (1), its characterized in that: the bottom of the fixing box (1) is fixedly connected with a fixing plate (2), a sliding groove (3) is formed in the fixing plate (2), a clamping column (4) is movably arranged in the sliding groove (3), and an anti-slip sleeve (5) is fixedly connected with the outer wall of the bottom end of the clamping column (4);

The top fixedly connected with movable block (6) of spliced pole (4), and the inside threaded connection of movable block (6) has threaded rod (7), the one end rotation of threaded rod (7) is connected with limiting plate (8), and the other end fixed mounting of threaded rod (7) has gear one (9), the top meshing of gear one (9) has gear two (10).

2. The semiconductor wafer metal plating fixture according to claim 1, wherein the sliding grooves (3) are symmetrically formed in the bottom of the fixed plate (2), the outer side of the anti-slip sleeve (5) is provided with a wafer in an extrusion mode, and the moving block (6) is movably arranged in the limiting plate (8).

3. The semiconductor wafer metal plating jig according to claim 1, wherein the threaded rod (7) and the first gear (9) are arranged at equal distances on the outer side of the second gear (10), a rotating column is fixedly connected to the top of the second gear (10), the rotating column is rotatably installed in the fixed box (1), and a strip-shaped box (11) is fixedly connected to one side of the fixed box (1).

4. A semiconductor wafer metal plating jig according to claim 3, wherein a shaft post is rotatably mounted in the bar-shaped case (11), and a belt is rotatably connected to an outer wall of the shaft post, a linkage gear (12) is fixedly connected to an outer wall of the shaft post, and the shaft post is rotatably connected to a rotary post of the gear two (10) through the belt.

5. The semiconductor wafer metal plating jig according to claim 4, wherein a movable plate (13) is fixedly installed on one side of the bar-shaped box (11), a fixed box (14) is provided on the outer side of the movable plate (13), a connecting block (15) is fixedly connected to one side of the movable plate (13), and the movable plate (13) is movably arranged inside the fixed box (14).

6. The semiconductor wafer metal plating jig according to claim 5, wherein a hydraulic cylinder (16) is fixedly installed at the bottom of the connection block (15), the top end of a telescopic rod of the hydraulic cylinder (16) is fixedly connected with the bottom of the connection block (15), the connection block (15) is movably arranged inside one side of the fixed box (14), and a supporting plate (17) is fixedly installed at the bottom of the fixed box (14).

7. The semiconductor wafer metal plating jig according to claim 6, wherein a connecting gear (18) is rotatably installed inside the fixed case (14), and the connecting gear (18) is disposed on one side of the linkage gear (12) in a meshing manner, a rotating shaft is fixedly connected to an inner wall of the connecting gear (18), and a motor (19) is fixedly installed at a top end of the rotating shaft, and the motor (19) is fixedly installed at a top of the fixed case (14).