CN218350347U - Chamfering device for wafer test probe - Google Patents

Abstract

The utility model provides a chamfer device of wafer test probe. The chamfering device of the wafer test probe comprises a placing table; the vertical plate is fixedly arranged at the top of the placing table; the top plate is fixedly arranged at the top of the vertical plate; the limiting and placing mechanism is arranged on the placing table and the vertical plate; the rotating mechanism is arranged at the bottom of the top plate; the pressing mechanism is arranged on the rotating mechanism; and the grinding mechanism is arranged below the top plate. The utility model provides a chamfering device of wafer test probe has and makes many probes neatly arranged to improve the quality of polishing, can polish to a plurality of probes simultaneously, and can adjust the inclination on the inclined plane of polishing of probe, and improve the advantage to the chamfer machining efficiency of probe.

Description

Chamfering device for wafer test probe

Technical Field

The utility model relates to a wafer test probe production and processing technology field especially relates to a chamfer device of wafer test probe.

Background

Wafer refers to a silicon wafer used for making silicon semiconductor circuits, the starting material of which is silicon. And dissolving the high-purity polycrystalline silicon, doping the dissolved high-purity polycrystalline silicon into silicon crystal seed crystals, and slowly pulling out the silicon crystal seed crystals to form cylindrical monocrystalline silicon. After the silicon crystal bar is ground, polished and sliced, a silicon wafer, namely a crystal, is formed. The semiconductor industry generally requires high efficiency and accuracy in wafer surface defect detection, and can capture effective defects and realize real-time detection. One of the more common surface inspection techniques is the use of probes for testing. The probe is required to be processed by a chamfering device in the production and processing process, and one end of the probe is cut and polished into a certain inclined plane by the chamfering device to form the end into a tip, or to remove burrs generated by machining on parts and facilitate the assembly of the parts.

However, when the conventional chamfering device is used for chamfering the probes, the probes are mostly polished by using the polishing head driven by the polishing motor, so that the conventional chamfering device is inconvenient for chamfering a plurality of probes simultaneously, and the machining efficiency is low.

Therefore, there is a need to provide a new chamfering apparatus for wafer test probes to solve the above-mentioned problems.

SUMMERY OF THE UTILITY MODEL

The utility model provides a technical problem provide a can make many probes neatly arranged to improve the quality of polishing, can polish to a plurality of probes simultaneously, and can adjust the inclination on the inclined plane of polishing of probe, and improve the chamfer device to the wafer test probe of the chamfer machining efficiency of probe.

In order to solve the above technical problem, the utility model provides a chamfering device of wafer test probe includes: a placing table; the vertical plate is fixedly arranged at the top of the placing table; the top plate is fixedly arranged at the top of the vertical plate; the limiting and placing mechanism is arranged on the placing table and the vertical plate; the rotating mechanism is arranged at the bottom of the top plate; the pressing mechanism is arranged on the rotating mechanism; the polishing mechanism is arranged below the top plate; and the adjusting mechanism is arranged on the grinding mechanism.

Preferably, the limiting and placing mechanism comprises a placing seat and an electric telescopic handle, the placing seat is provided with a plurality of top parts and a plurality of limiting grooves, one side of each limiting groove is provided with an opening, the limiting grooves are matched with the probes, the electric telescopic handle is fixedly installed on one side of the vertical plate, an output rod of the electric telescopic handle is fixedly connected with one side of the placing seat, and the limiting grooves are arranged at equal intervals.

Preferably, the top of the placing table is provided with a chute, the placing seat is arranged in the chute, and the lowest points of the inner walls of the bottoms of the limiting grooves on the placing seat are lower than the top surface of the placing table.

Preferably, the rotating mechanism comprises a bar block, a screw rod, a speed reducing motor and two moving blocks, the bar block is fixedly installed at the bottom of the top plate, an installation groove is formed in the bottom of the bar block, the screw rod is rotatably installed on the inner walls of the two sides of the installation groove, the speed reducing motor is fixedly installed on one side of the bar block, an output shaft of the speed reducing motor is fixedly connected with one end of the screw rod, the two moving blocks are symmetrically sleeved on the screw rod in a threaded manner, and the two moving blocks are both in sliding connection with the inner walls of the two sides of the installation groove.

Preferably, the pressing mechanism comprises two lifting motors and a pressing plate, the two lifting motors are respectively and fixedly installed at the bottoms of the two moving blocks, and the pressing plate is fixedly installed at the bottom ends of output rods of the two lifting motors.

Preferably, the polishing mechanism comprises two transverse columns, two rollers, four middle shafts, a polishing belt and a polishing motor, the two rollers are arranged between the two transverse columns, the four middle shafts are respectively and fixedly installed at two ends of the two rollers, the four middle shafts are respectively and rotatably connected with the two transverse columns, the polishing belt is wound on the two rollers, the polishing motor is fixedly installed at one side of one of the transverse columns, and an output shaft of the polishing motor is fixedly connected with one end of one of the middle shafts.

Preferably, adjustment mechanism is including two pneumatic cylinders, mounting panel, two installation poles and two push rod motors, two the equal fixed mounting of pneumatic cylinder is in the bottom of roof, mounting panel fixed mounting is two the bottom of the output pole of pneumatic cylinder, two the equal fixed mounting of installation pole is in the bottom of mounting panel, and two the bottom of installation pole all with one of them the top of spreader is articulated, two the push rod motor all articulates the bottom of mounting panel, and two the output pole bottom of push rod motor all with another the top of spreader is articulated.

Compared with the prior art, the utility model provides a chamfering device of wafer test probe has following beneficial effect:

the utility model provides a chamfer device of wafer test probe:

the plurality of probes can be regularly arranged through the limiting and placing mechanism, so that the polishing quality is improved; the probe can be pressed through the pressing mechanism, so that the probe is prevented from moving when being polished; can polish to a plurality of probes simultaneously through grinding machanism to accessible adjustment mechanism adjusts the inclination on the inclined plane of polishing of probe, can make the probe rotate at the in-process of polishing through slewing mechanism, thereby realizes polishing to the whole round of probe one end, has improved the efficiency of processing the probe chamfer.

Drawings

Fig. 1 is a schematic structural diagram of a chamfering device for wafer test probes according to a preferred embodiment of the present invention;

FIG. 2 is an enlarged view of portion A of FIG. 1;

fig. 3 is a schematic side sectional structural view of the middle pressing mechanism and the rotating mechanism of the present invention;

fig. 4 is the side view structure schematic diagram of the middle polishing mechanism of the present invention.

Reference numbers in the figures: 1. a placing table; 2. a vertical plate; 3. a top plate; 4. a placing seat; 5. an electric telescopic rod; 6. a bar block; 7. a screw; 8. a reduction motor; 9. a moving block; 10. a lifting motor; 11. pressing a plate; 12. a cross post; 13. a drum; 14. a middle shaft; 15. polishing the belt; 16. polishing the motor; 17. a hydraulic cylinder; 18. mounting a plate; 19. mounting a rod; 20. a push rod motor.

Detailed Description

The present invention will be further described with reference to the accompanying drawings and embodiments.

Referring to fig. 1-4, fig. 1 is a schematic structural diagram of a chamfering apparatus for wafer test probes according to a preferred embodiment of the present invention; FIG. 2 is an enlarged view of portion A of FIG. 1; FIG. 3 is a schematic side view of the cross-sectional structure of the pressing mechanism and the rotating mechanism; fig. 4 is a schematic side view of the polishing mechanism of the present invention. The chamfering device of the wafer test probe comprises: a placing table 1; the vertical plate 2 is fixedly arranged at the top of the placing table 1; the top plate 3 is fixedly arranged on the top of the vertical plate 2; the limiting and placing mechanism is arranged on the placing table 1 and the vertical plate 2; the rotating mechanism is arranged at the bottom of the top plate 3; the pressing mechanism is arranged on the rotating mechanism; the polishing mechanism is arranged below the top plate 3; and the adjusting mechanism is arranged on the grinding mechanism.

The limiting placing mechanism comprises a placing seat 4 and an electric telescopic handle 5, a plurality of top parts and one side of the placing seat 4 are provided with open limiting grooves, the limiting grooves are matched with probes, the electric telescopic handle 5 is fixedly installed on one side of the vertical plate 2, an output rod of the electric telescopic handle 5 is fixedly connected with one side of the placing seat 4, the limiting grooves are arranged at equal intervals, and a plurality of probes can be neatly arranged through the limiting placing mechanism, so that the polishing quality is improved.

The top of the placing table 1 is provided with a sliding groove, the placing seat 4 is arranged in the sliding groove, and the lowest points of the inner walls of the bottoms of the limiting grooves on the placing seat 4 are lower than the top surface of the placing table 1, so that the placing seat 4 can be conveniently separated from the probe after the probe is pressed by the pressing plate 11.

The rotating mechanism comprises a bar block 6, a screw 7, a speed reducing motor 8 and two moving blocks 9, the bar block 6 is fixedly installed at the bottom of the top plate 3, an installation groove is formed in the bottom of the bar block 6, the screw 7 is rotatably installed on the inner walls of the two sides of the installation groove, the speed reducing motor 8 is fixedly installed on one side of the bar block 6, an output shaft of the speed reducing motor 8 is fixedly connected with one end of the screw 7, the two moving blocks 9 are symmetrically sleeved on the screw 7 in a threaded manner, the two moving blocks 9 are both in sliding connection with the inner walls of the two sides of the installation groove, and the probe can be rotated in the polishing process through the rotating mechanism, so that polishing of the whole circle of one end of the probe is achieved, and the efficiency of chamfering processing of the probe is improved.

The pressing mechanism comprises two lifting motors 10 and a pressing plate 11, the two lifting motors 10 are respectively and fixedly installed at the bottoms of the two moving blocks 9, the pressing plate 11 is fixedly installed at the bottom ends of output rods of the two lifting motors 10, and the probes can be pressed through the pressing mechanism, so that the probes are prevented from moving when being polished.

The polishing mechanism comprises two cross columns 12, two rollers 13, four middle shafts 14, a polishing belt 15 and a polishing motor 16, wherein the two rollers 13 are arranged between the two cross columns 12, the four middle shafts 14 are respectively and fixedly installed at two ends of the two rollers 13, the four middle shafts 14 are respectively and rotatably connected with the two cross columns 12, the polishing belt 15 is wound on the two rollers 13, the polishing motor 16 is fixedly installed at one side of one of the cross columns 12, an output shaft of the polishing motor 16 is fixedly connected with one end of one of the middle shafts 14, and a plurality of probes can be simultaneously polished through the polishing mechanism.

Adjustment mechanism is including two pneumatic cylinders 17, mounting panel 18, two installation pole 19 and two push rod motors 20, two the equal fixed mounting of pneumatic cylinder 17 is in the bottom of roof 3, mounting panel 18 fixed mounting is two the bottom of the output pole of pneumatic cylinder 17, two the equal fixed mounting of installation pole 19 is in the bottom of mounting panel 18, and two the bottom of installation pole 19 all with one of them the top of spreader 12 is articulated, two push rod motors 20 all articulates the bottom of mounting panel 18, and two the output pole bottom of push rod motors 20 all with another the top of spreader 12 is articulated, adjusts the inclination on the inclined plane of polishing of probe through adjustment mechanism.

The utility model provides a wafer test probe's chamfer device's theory of operation as follows: when in use, a plurality of probes are placed on the placing table 1, and one ends of the probes are respectively placed in the limiting grooves on the placing seat 4, so that the probes can be orderly arranged;

then, determining that the two lifting motors 10 enable the pressing plate 11 to descend to press all the probes, and then starting the electric telescopic rod 5 to shorten the output rod and drive the placing seat 4 to be separated from the probes;

then, starting the two hydraulic cylinders 17 to enable the polishing mechanism to descend, starting the two push rod motors 20 to enable the output rods to extend to enable the polishing mechanism to incline, so that the inclination angle of the inclined plane polished by the probes is adjusted, starting the polishing motor 16 to drive the roller 13 to rotate, so that the polishing belt 15 rotates, and the polishing belt 15 is in contact with one end of each probe to polish all the probes;

and, start gear motor 8 and drive screw rod 7 and rotate to make two movable blocks 9 synchronous movement, and then drive clamp plate 11 and remove, because the probe is cylindrical, so clamp plate 11 removes the in-process and drives the probe, thereby make the whole round of one end of probe can both be polished by polishing area 15 and polish, thereby realize polishing a plurality of probes simultaneously.

Compared with the prior art, the utility model provides a wafer test probe's chamfer device has following beneficial effect:

the utility model provides a chamfering device for wafer test probes, which can arrange a plurality of probes orderly through a limiting and placing mechanism, thereby improving the polishing quality; the probe can be pressed through the pressing mechanism, so that the probe is prevented from moving when being polished; can polish a plurality of probes simultaneously through grinding mechanism to accessible adjustment mechanism adjusts the inclination on the inclined plane of polishing of probe, can make the probe rotate at the in-process of polishing through slewing mechanism, thereby realizes polishing to the whole round of probe one end, has improved the efficiency of processing probe chamfer.

It should be noted that the device structure and the accompanying drawings of the present invention mainly describe the principle of the present invention, and in the design principle, the settings of the power mechanism, the power supply system, the control system, and the like of the device are not completely described, and on the premise that the skilled person understands the principle of the present invention, the details of the power mechanism, the power supply system, and the control system can be clearly known;

furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise;

in addition, in the present invention, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "fixed" are to be construed broadly, e.g., as fixed or detachable connections or integral parts; may be mechanically coupled, may be electrically coupled or may be in communication with each other; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.

The above-mentioned only be the embodiment of the present invention, not consequently the restriction of the patent scope of the present invention, all utilize the equivalent structure or equivalent flow transform made of the content of the specification and the attached drawings, or directly or indirectly use in other relevant technical fields, all including in the same way the patent protection scope of the present invention.

Claims (7)

1. A chamfering apparatus for a wafer test probe, comprising:

a placing table;

the vertical plate is fixedly arranged at the top of the placing table;

the top plate is fixedly arranged at the top of the vertical plate;

the limiting and placing mechanism is arranged on the placing table and the vertical plate;

the rotating mechanism is arranged at the bottom of the top plate;

the pressing mechanism is arranged on the rotating mechanism;

the polishing mechanism is arranged below the top plate;

and the adjusting mechanism is arranged on the grinding mechanism.

2. The chamfering device for wafer test probes according to claim 1, wherein the position-limiting placing mechanism comprises a placing seat and an electric telescopic rod, the placing seat is provided with a plurality of limiting grooves with top portions and one side being open, the limiting grooves are matched with the probes, the electric telescopic rod is fixedly installed on one side of the vertical plate, an output rod of the electric telescopic rod is fixedly connected with one side of the placing seat, and the plurality of limiting grooves are arranged at equal intervals.

3. The device as claimed in claim 2, wherein a sliding groove is formed at a top of the mounting platform, the mounting base is disposed in the sliding groove, and a height of a lowest point of an inner wall of a bottom of the plurality of limiting grooves on the mounting base is lower than a height of a top surface of the mounting platform.

4. The chamfering device for wafer test probes as claimed in claim 1, wherein the rotating mechanism includes a bar block, a screw, a gear motor and two moving blocks, the bar block is fixedly installed at the bottom of the top plate, an installation groove is formed at the bottom of the bar block, the screw is rotatably installed on the inner walls of the two sides of the installation groove, the gear motor is fixedly installed at one side of the bar block, an output shaft of the gear motor is fixedly connected with one end of the screw, the two moving blocks are symmetrically sleeved on the screw by threads, and the two moving blocks are both slidably connected with the inner walls of the two sides of the installation groove.

5. The chamfering apparatus for wafer test probes as claimed in claim 4, wherein the down-pressing mechanism includes two lift motors and a pressing plate, the two lift motors are respectively fixedly installed at the bottoms of the two moving blocks, and the pressing plate is fixedly installed at the bottom ends of the output rods of the two lift motors.

6. The chamfering apparatus for wafer test probes according to claim 1, wherein the polishing mechanism comprises two lateral posts, two rollers, four middle shafts, a polishing belt and a polishing motor, the two rollers are disposed between the two lateral posts, the four middle shafts are respectively fixedly mounted at two ends of the two rollers, the four middle shafts are respectively rotatably connected with the two lateral posts, the polishing belt is wound on the two rollers, the polishing motor is fixedly mounted at one side of one of the lateral posts, and an output shaft of the polishing motor is fixedly connected with one end of one of the middle shafts.

7. The chamfering apparatus for wafer test probes according to claim 6, wherein the adjusting mechanism comprises two hydraulic cylinders, a mounting plate, two mounting rods and two push rod motors, wherein the two hydraulic cylinders are both fixedly mounted at the bottom of the top plate, the mounting plate is fixedly mounted at the bottom ends of the output rods of the two hydraulic cylinders, the two mounting rods are both fixedly mounted at the bottom of the mounting plate, the bottom ends of the two mounting rods are both hinged to the top of one of the cross posts, the two push rod motors are both hinged to the bottom of the mounting plate, and the bottom ends of the output rods of the two push rod motors are both hinged to the top of the other cross post.

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