CN219205090U

CN219205090U - Water-cooling heat dissipation mechanism

Info

Publication number: CN219205090U
Application number: CN202223516227.0U
Authority: CN
Inventors: 陈建国
Original assignee: Dongguan Songde Hardware Electronics Co ltd
Current assignee: Dongguan Songde Hardware Electronics Co ltd
Priority date: 2022-12-28
Filing date: 2022-12-28
Publication date: 2023-06-16
Anticipated expiration: 2032-12-28

Abstract

The utility model relates to the technical field of water cooling, in particular to a water cooling mechanism, which comprises a water cooling head and a liquid cooling system connected with the water cooling head, wherein the water cooling head comprises a heat conducting plate connected with electronic equipment, a water cooling seat is arranged at the top of the heat conducting plate, and a water inlet head and a water outlet head are respectively arranged at the top of the water cooling seat; the liquid heat dissipation system comprises a heat dissipation conduit, wherein heat dissipation fins are nested on the surface of the heat dissipation conduit, heat dissipation support plates are arranged at two ends of the heat dissipation conduit, a first pump body connected with a water inlet head is arranged at one end of the heat dissipation conduit, and a second pump body connected with a water outlet head is arranged at the other end of the heat dissipation conduit; cooling liquid passing through the liquid cooling system enters the water cooling seat through the first pump body; and then the cooling liquid with a certain temperature is discharged into the heat dissipation conduit through the water outlet head to be discharged into the second pump body, heat dissipation and cooling are performed in the liquid heat dissipation system, and the guide system with double pump bodies is adopted, so that the flow speed of the cooling liquid is increased, and the heat of the cooling liquid can be rapidly discharged, thereby improving the heat dissipation efficiency.

Description

Water-cooling heat dissipation mechanism

Technical Field

The utility model relates to the technical field of water cooling, in particular to a water cooling mechanism.

Background

With the development of electronic technology, electronic devices are increasingly developed towards high frequency, high speed, modularization and intellectualization, and the wide application of high-power IGBT modules enables the heat generated by the electronic devices to be increased all the time, and the operation errors or damages of electronic equipment are mostly caused by overheating, so that the cooling of the electronic devices is becoming an important link in the development and the development of electronic products. The heat dissipation directly affects the service life, safety, reliability and stability of the electronic product.

In the existing heat dissipation mode, although the water-cooling radiator and the air-cooling radiator can meet the heat dissipation requirements required by most environments, in certain extreme or special environments, the temperature of the electronic device can be rapidly increased or even exploded once the water path or the air path of the air-cooling radiator is failed, which brings fatal risks.

The utility model of China with the patent number of CN201320247719.6 discloses a water-cooling and heat pipe combined radiator which comprises a water-cooling base plate, a cover plate, cooling fins and a heat pipe, wherein the water-cooling base plate is a base plate with a liquid flow passage milled, the cover plate is welded on the water-cooling base plate, the heat pipe is arranged at a reserved assembly position on the water-cooling base plate, and the cooling fins are assembled on the heat pipe by interference fit or welding. According to the utility model, the installation position of the liquid inlet and outlet can be determined according to the use environment, and the liquid inlet and outlet can be arranged at the position on the water-cooling substrate, which is convenient for installation. When in use, the radiator is arranged on the frame of the equipment cabinet body and can also be arranged in the air duct. The scheme adopts two heat dissipation modes of water cooling heat dissipation and air cooling heat dissipation, if one heat dissipation mode fails, the other heat dissipation mode can provide reliable and effective heat dissipation performance, and the two modes can also play roles simultaneously, so that the heat dissipation device works more reliably and safely and can be applied to special occasions with higher reliability requirements.

The existing water cooling system has slower conduction speed on water cooling liquid, and the flowing speed of the liquid in the cavity and the pipeline is slower, so that heat cannot be rapidly discharged, and the heat dissipation efficiency is affected.

Disclosure of Invention

The utility model aims to provide a water cooling mechanism aiming at the defects of the prior art.

In order to achieve the above purpose, the technical scheme of the utility model is as follows:

the water cooling mechanism comprises a water cooling head and a liquid cooling system connected with the water cooling head, wherein the water cooling head comprises a heat conducting plate connected with electronic equipment, a water cooling seat is arranged at the top of the heat conducting plate, and a water inlet head and a water outlet head are respectively arranged at the top of the water cooling seat; the liquid heat dissipation system comprises a heat dissipation conduit, heat dissipation fins are nested on the surface of the heat dissipation conduit, heat dissipation support plates are installed at two ends of the heat dissipation conduit, a first pump body connected with a water inlet head is installed at one end of the heat dissipation conduit, and a second pump body connected with a water outlet head is installed at the other end of the heat dissipation conduit.

Further: the heat dissipation supporting plates are arranged at intervals in parallel, the number of the heat dissipation conduits is more than three, and two ends of each heat dissipation conduit respectively penetrate through the heat dissipation supporting plates.

Further: the heat dissipation conduit is inserted between the two heat dissipation support plates in a meandering manner.

Further: the radiating fins are in a spiral structure and are arranged along the length direction of the radiating pipe to surround the radiating pipe.

Further: the outlet of the first pump body is connected with a first connector, and the first connector is connected with one end of all the heat dissipation pipes.

Further: the inlet of the second pump body is connected with a second connector, and the second connector is connected with the other ends of all the heat dissipation pipes.

Further: the water inlet head is communicated with an inlet of the first pump body; the water outlet head is communicated with an outlet of the second pump body.

Further: the two water cooling seats are respectively arranged at the top of the heat conducting plate at intervals, and a communicating pipe connected with the two water cooling seats is arranged between the two water cooling seats.

Further: the water cooling seat is internally provided with a water cooling cavity for liquid circulation.

The utility model has the beneficial effects that: the cooling liquid passing through the liquid cooling system is connected with the first pump body through the cooling conduit, and the first pump body is output to the water inlet head of the water cooling seat so as to enter the water cooling seat; the heat that the heat conduction board produced makes the liquid in the water-cooling seat produce the heating, later discharges the second pump body through the water outlet head, and the second pump body will have the coolant liquid of certain temperature to discharge into the heat dissipation pipe, dispel the heat cooling in liquid cooling system, adopts the guide system of two pump bodies for the flow rate of coolant liquid accelerates, and the heat of coolant liquid can discharge fast, thereby improves radiating efficiency.

Drawings

Fig. 1 is a schematic structural diagram of a water cooling mechanism.

Fig. 2 is a schematic structural diagram of a liquid heat dissipation system.

The reference numerals include:

1-a water cooling head,

11-heat-conducting plate, 12-water cooling seat, 13-communicating pipe, 14-water inlet head, 15-water outlet head,

16-a first pump body, 17-a second pump body,

2-liquid heat dissipation system,

21-heat dissipation supporting plate, 22-heat dissipation conduit, 23-heat dissipation fin, 24-first joint, 25-second joint.

Detailed Description

The present utility model will be described in detail below with reference to the accompanying drawings.

As shown in fig. 1-2, a water cooling mechanism comprises a water cooling head 1 and a liquid cooling system 2 connected with the water cooling head 1, wherein the water cooling head 1 comprises a heat conducting plate 11 connected with electronic equipment, a pair of water cooling seats 12 arranged at intervals are arranged at the top of the heat conducting plate 11, water cooling cavities for liquid fluid are arranged in the water cooling seats 12, a water inlet head 14 and a water outlet head 15 are respectively arranged at the top of the water cooling seats 12, the water inlet head 14 and the water outlet head 15 are respectively communicated with the water cooling cavities, the water cooling cavities between the two water cooling seats 12 are provided with communicating pipes 13 connected, the cooling liquid of the two water cooling seats 12 is communicated through the communicating pipes 13, and heat generated by the heat conducting plate 11 can be conducted and radiated by the cooling liquid in the water cooling cavities with larger volumes, so that the temperature of the whole cooling liquid is controllable and cannot be too high.

The liquid heat dissipation system 2 includes a pair of heat dissipation support plates 21 arranged in parallel at intervals, and four heat dissipation pipes 22 are inserted in the two heat dissipation support plates 21 in a meandering manner. The surface of each heat dissipation conduit 22 is nested with a heat dissipation fin 23, and the heat dissipation fins 23 are arranged in a spiral structure along the length direction of the heat dissipation conduit 22 to surround the heat dissipation conduit 22. So that the cooling liquid introduced into the heat dissipation conduit 22 can be dissipated by the heat dissipation fins 23, one heat dissipation conduit 22 dissipates heat by adopting one heat dissipation fin 23, and the single-tube single-heat dissipation structure is realized, and the heat dissipation effect is obvious.

The water inlet head 14 is connected with a first pump body 16, and the water outlet head 15 is connected with a second pump body 17. The outlet of the first pump body 16 is connected with a first joint 24, and the first joint 24 is connected with one end of all the heat dissipation conduits 22. The inlet of the second pump body 17 is connected with a second joint 25, and the second joint 25 is connected with the other ends of all the heat dissipation conduits 22.

In this embodiment, the cooling liquid passing through the liquid cooling system 2 is connected with the first pump body 16 through the cooling conduit 22, and the first pump body 16 is output to the water inlet head 14 of the water cooling seat 12, so as to enter the water cooling seat 12; the heat generated by the heat conducting plate 11 heats the liquid in the water cooling seat 12, and then the liquid is discharged to the second pump body 17 through the water outlet head 15, the second pump body 17 discharges the cooling liquid with a certain temperature into the heat radiating conduit 22, and the heat radiation and cooling are carried out in the liquid heat radiating system 2.

In view of the above, the present utility model has the above-mentioned excellent characteristics, so that it can be used to improve the performance and practicality of the prior art, and is a product with great practical value.

The foregoing is merely exemplary of the present utility model, and those skilled in the art should not be considered as limiting the utility model, since modifications may be made in the specific embodiments and application scope of the utility model in light of the teachings of the present utility model.

Claims

1. The utility model provides a water-cooling heat dissipation mechanism, includes the water-cooling head and with the liquid cooling system that the water-cooling head is connected, its characterized in that: the water cooling head comprises a heat conducting plate connected with the electronic equipment, a water cooling seat is arranged at the top of the heat conducting plate, and a water inlet head and a water outlet head are respectively arranged at the top of the water cooling seat; the liquid heat dissipation system comprises a heat dissipation conduit, heat dissipation fins are nested on the surface of the heat dissipation conduit, heat dissipation support plates are installed at two ends of the heat dissipation conduit, a first pump body connected with a water inlet head is installed at one end of the heat dissipation conduit, and a second pump body connected with a water outlet head is installed at the other end of the heat dissipation conduit.

2. The water cooling mechanism of claim 1, wherein: the heat dissipation support plates are arranged at intervals in parallel, the number of the heat dissipation guide pipes is more than three, and two ends of each heat dissipation guide pipe respectively penetrate through the heat dissipation support plates.

3. The water cooling mechanism of claim 2, wherein: the heat dissipation conduit is inserted between the two heat dissipation support plates in a meandering manner.

4. A water cooling mechanism as claimed in claim 3, wherein: the radiating fins are of a spiral structure and are arranged along the length direction of the radiating pipeline to surround the radiating pipeline.

5. The water cooling mechanism of claim 4, wherein: the outlet of the first pump body is connected with a first connector, and the first connector is connected with one end of all the heat dissipation pipes.

6. The water cooling mechanism of claim 5, wherein: and the inlet of the second pump body is connected with a second connector, and the second connector is connected with the other ends of all the heat dissipation pipes.

7. The water cooling mechanism of claim 6, wherein: the water inlet head is communicated with an inlet of the first pump body; the water outlet head is communicated with an outlet of the second pump body.

8. The water cooling mechanism of claim 7, wherein: the two water cooling seats are respectively arranged at the top of the heat conducting plate at intervals, and a communicating pipe connected with each other is arranged between the two water cooling seats.

9. The water cooling mechanism of claim 1, wherein: the water cooling seat is internally provided with a water cooling cavity for liquid circulation.