CN218939660U - Power module and electronic equipment thereof - Google Patents
Power module and electronic equipment thereof Download PDFInfo
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- CN218939660U CN218939660U CN202320139830.7U CN202320139830U CN218939660U CN 218939660 U CN218939660 U CN 218939660U CN 202320139830 U CN202320139830 U CN 202320139830U CN 218939660 U CN218939660 U CN 218939660U
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Abstract
The utility model discloses a power module and electronic equipment thereof, wherein the power module comprises a plastic package body, a substrate, a plurality of power chips, a frame, at least one driving chip and a plurality of conductive pieces, the frame comprises a frame body, a plurality of control pins and a plurality of power pins, and the driving chips are all arranged on the frame body; each conductive piece is arranged on an electrode of the power chip, each conductive piece is electrically connected with the driving chip through a first lead, and the driving chip is electrically connected with the power chip through the first lead and the conductive piece; or the conducting piece is electrically connected with the frame body through the second lead wire, the frame body is electrically connected with the driving chip through the third lead wire, and the driving chip and the power chip are electrically connected through the second lead wire, the conducting piece, the frame body and the third lead wire. According to the power module, the distance between the frame body and the substrate is reduced, and the problem that the lead cannot be bonded with the power chip and the driving chip is solved.
Description
Technical Field
The present utility model relates to the field of power modules, and in particular, to a power module and an electronic device thereof.
Background
The power module IPM (Intelligent Power Module), which integrates the driving circuit and the power semiconductor device in one package, has a smaller volume and weight than IGBT (Insulated Gate Bipolar Transistor), and has a continuously improved integration and stability, and is widely used in the fields of motor driving and various switching power supplies.
In a conventional production flow of the power module, after the chip is mounted, part of bonding pads of the IC chip on the control side are bonded with electrodes of an IGBT (insulated gate bipolar transistor) chip on the circuit board through gold wires in a pull-down mode. For a power module with a thinner thickness, the vertical distance between the frame for placement and the surface of the circuit board is smaller, and gold wires on the IC chip can be bonded with the electrodes of the IGBT chip.
In the related art, along with the requirement of high power, based on the considerations of product strength, insulativity, heat dissipation and the like, the size of the power module is increased, so that the sinking depth of the bonding points of the IC chip to the electrode bonding of the IGBT chip exceeds the vertical operation capability of bonding equipment, alloy wires cannot be bonded, and the types of leads used in the power module are more, thereby leading to more times of switching wire diameters or equipment and influencing the production efficiency of the power module.
In addition, when the sinking depth of the welding spot of the IC chip to the electrode bonding of the IGBT chip is too large, the end stress of the gold wire is increased, and the risk of gold wire disconnection or short circuit is generated.
Disclosure of Invention
The present utility model aims to solve at least one of the technical problems existing in the prior art. Therefore, an object of the present utility model is to provide a power module, which indirectly reduces the distance between the frame body and the substrate, solves the problem that the lead wire cannot be bonded with the power chip and the driving chip after the size of the power module is increased, and reduces the risk of wire breakage or short circuit.
An object of the present utility model is to provide an electronic device employing the above power module.
According to an embodiment of the first aspect of the present utility model, a power module includes: a plastic package body; the substrate is arranged in the plastic package body; the power chips are arranged on the substrate and are distributed at intervals along the length direction of the substrate; the frame comprises a frame body, a plurality of control pins and a plurality of power pins, wherein the frame body is arranged in the plastic package body, the frame body is arranged on one side of the substrate where the power chip is located and is spaced apart from the substrate, the control pins are arranged on one side of the substrate in the width direction, the control pins and the power pins are all arranged at intervals along the length direction of the substrate, one end of each control pin is connected with the frame body, the other end of each control pin extends out of the plastic package body, the power pins are arranged on the other side of the substrate in the width direction, the power pins are arranged at intervals along the length direction of the substrate, one end of each power pin is electrically connected with the power chip, and the other end of each power pin extends out of the plastic package body; at least one driving chip, which is arranged on the frame body; the plurality of conductive pieces are arranged on the electrode of the power chip and extend along the direction towards the frame body; the driving chip and the power chip are electrically connected through the first lead and the conductive piece; or the conducting piece is electrically connected with the frame body through a second lead, the frame body is electrically connected with the driving chip through a third lead, and the driving chip and the power chip are electrically connected through the second lead, the conducting piece, the frame body and the third lead.
According to the power module provided by the embodiment of the utility model, the conductive piece is arranged on the electrode of the power chip, and the driving chip is electrically connected with the conductive piece through the lead. Therefore, compared with the traditional power module, the distance between the frame body and the substrate can be indirectly reduced, the problem that the lead wire cannot be bonded with the power chip and the driving chip after the size of the power module is increased is solved, and the increase of the stress of the end part of the lead wire can be avoided, so that the breakage or short circuit of the lead wire can be prevented, and the production efficiency of the power module can be improved.
According to some embodiments of the utility model, the first, second and third leads are the same material.
According to some embodiments of the utility model, the first, second and third leads are gold wires.
According to some embodiments of the utility model, a height difference between a side surface of each of the conductive members remote from the substrate and a side surface of the frame body remote from the substrate is Δh 1 Wherein the Δh 1 The method meets the following conditions: delta h is less than or equal to 0mm 1 ＜2.3mm。
According to some embodiments of the utility model, the height of each of the conductive elements is h 1 The method comprises the steps of carrying out a first treatment on the surface of the The distance between the side surface of the power chip far away from the substrate and the side surface of the frame body far away from the substrate is H 1 Wherein the H 1 、h 1 The method meets the following conditions: h 1 ＝2h 1 。
According to some embodiments of the utility model, each of the conductive members includes a plurality of conductive bumps stacked in a thickness direction of the conductive bumps, and the conductive bumps at the end portions of the plurality of conductive bumps are electrically connected to the first lead.
According to some embodiments of the utility model, the conductive member is provided in a middle portion of the electrode of the power chip, and an edge of each of the conductive blocks is spaced apart from an edge of the electrode.
According to some embodiments of the utility model, the substrate comprises an insulating layer and a first conductive layer, the first conductive layer is arranged on one side surface of the insulating layer adjacent to the frame body, the power chip is arranged on the first conductive layer, the insulating layer is exposed out of the plastic package body, and one side surface of the insulating layer far away from the first conductive layer is flush with one side surface of the plastic package body in the thickness direction.
According to some embodiments of the utility model, the substrate includes an insulating layer, a first conductive layer and a second conductive layer, the first conductive layer and the second conductive layer are respectively disposed on two sides of the insulating layer in a thickness direction, the plurality of power chips are all disposed on the first conductive layer, the second conductive layer is exposed outside the plastic package, and a surface of one side of the second conductive layer, which is far away from the insulating layer, is flush with a surface of one side of the plastic package in the thickness direction.
According to some embodiments of the utility model, the first conductive layer and the second conductive layer are both copper layers and the insulating layer is a ceramic layer.
An electronic device according to an embodiment of the second aspect of the present utility model comprises a power module according to an embodiment of the first aspect of the present utility model.
Additional aspects and advantages of the utility model will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the utility model.
Drawings
The foregoing and/or additional aspects and advantages of the utility model will become apparent and may be better understood from the following description of embodiments taken in conjunction with the accompanying drawings in which:
FIG. 1 is a schematic diagram of a power module according to an embodiment of the utility model;
FIG. 2 is a schematic diagram of the power module shown in FIG. 1, wherein the plastic enclosure is not shown;
fig. 3 is a side view of the power module shown in fig. 1, with the plastic enclosure not shown
FIG. 4 is an assembly view of a substrate, a driver chip, a power chip, and control pins of the power module shown in FIG. 1;
fig. 5 is a schematic diagram of a power chip of a power module according to an embodiment of the utility model.
Reference numerals:
100: a power module;
1: a plastic package body; 2: a substrate; 21: an insulating layer; 22: a first conductive layer; 23: a second conductive layer; 3: a power chip; 31: an electrode; 32: a source electrode; 33: an IGBT chip; 34: a freewheeling diode; 4: a frame; 41: a frame body; 42: a control pin; 43. A power pin; 5: a driving chip; 6: a conductive member; 61: a conductive block; 7: a first lead; 8: a second lead; 9: a third lead; 10: a fourth lead; 11: and a fifth lead.
Detailed Description
A power module 100 according to an embodiment of the first aspect of the utility model is described below with reference to fig. 1-5.
As shown in fig. 1 to 5, a power module 100 according to an embodiment of the first aspect of the present utility model includes a plastic package 1, a substrate 2, a plurality of power chips 3, a frame 4, at least one driving chip 5, and a plurality of conductive members 6. In the description of the present utility model, "plurality" means two or more.
Specifically, the substrate 2 is provided in the molding compound 1, the plurality of power chips 3 are provided on the substrate 2, and the plurality of power chips 3 are arranged at intervals along the longitudinal direction (for example, the left-right direction in fig. 3) of the substrate 2. The frame 4 includes a frame body 41, a plurality of control pins 42 and a plurality of power pins 43, the frame body 41 is disposed in the molding body 1, the frame body 41 is spaced apart from the substrate 2 on a side of the substrate 2 where the power chip 3 is located, the control pins 42 are located on a side of the substrate 2 in a width direction (e.g., a front-rear direction in fig. 3), the plurality of control pins 42 are arranged at intervals along a length direction of the substrate 2, one end of each control pin 42 is connected with the frame body 41, the other end of each control pin 42 extends out of the molding body 1, the plurality of power pins 43 are located on the other side of the substrate 2 in the width direction, the plurality of power pins 43 are arranged at intervals along the length direction of the substrate, one end of each power pin 43 is electrically connected with the power chip 3, and the other end of each power pin 43 extends out of the molding body 1. At least one driving chip 5 is provided on the frame body 41, each conductive member 6 is provided on the electrode 31 of the power chip 3, and each conductive member 6 extends in a direction toward the frame body 41.
Wherein, the conductive piece 6 is electrically connected with the driving chip 5 through the first lead 7, and the driving chip 5 and the power chip 3 are electrically connected with the conductive piece 6 through the first lead 7; or the conductive piece 6 is electrically connected with the frame body 41 through the second lead 8, the frame body 41 is electrically connected with the driving chip 5 through the third lead 9, and the driving chip 5 and the power chip 3 are electrically connected through the second lead 8, the conductive piece 6, the frame body 41 and the third lead 9.
For example, in the example of fig. 1 to 4, the two sides in the width direction of the substrate 2 are a control side and a power side, respectively, the plurality of power chips 3 are provided on the control side of the substrate 2, and the plurality of power chips 3 are arranged at uniform intervals along the length direction of the substrate 2. The driving chip 5 is disposed on a surface of the frame body 41, which is far from the substrate 2, the plurality of control pins 42 are disposed on a control side of the substrate 2, and the plurality of power pins 43 are disposed on a power side of the substrate 2.
The conductive member 6 is disposed on the electrode 31 of the power chip 3, and the extending direction of the conductive member 6 is perpendicular to the electrode 31. When in connection, one end of the first lead wire 7 is bonded with a bonding pad of the driving chip 5 to realize the electric connection between the first lead wire 7 and the driving chip 5, and the other end of the first lead wire 7 is bonded with the conductive piece 6 to realize the electric connection between the first lead wire 7 and the conductive piece 6, so that the electric connection between the driving chip 5 and the power chip 3 can be realized through the first lead wire 7 and the conductive piece 6. Or, when in connection, one end of the second lead 8 is bonded with the frame body 41 to realize the electrical connection between the second lead 8 and the frame body 41, the other end of the second lead 8 is bonded with the conductive member 6 to realize the electrical connection between the second lead 8 and the conductive member 6, one end of the third lead 9 is electrically connected with the frame body 41, and the other end of the third lead 9 is electrically connected with the bonding pad of the driving chip 5 to realize the electrical connection between the driving chip 5 and the frame body 41, so that the electrical connection between the driving chip 5 and the power chip 3 can be realized through the first lead 7, the conductive member 6, the frame body 41, the second lead 8 and the third lead 9.
Thereby, by providing the conductive member 6, the distance between the frame body 41 and the substrate 2 can be reduced indirectly, so that the vertical distance between the side surface of the driving chip 5 away from the frame body 41 and the end surface of the free end of the conductive member 6 is within the range of the vertical operation capability of the bonding apparatus, the bonding of the first, second and third leads 7, 8 and 9 is facilitated, and the increase in the end stress of the leads can be avoided, whereby the breakage or short circuit of the leads can be prevented.
According to the power module 100 of the embodiment of the present utility model, the conductive member 6 is disposed on the electrode 31 of the power chip 3, and the conductive member 6 is electrically connected to the driving chip 5 or the frame body 41 through the lead wire. Therefore, compared with the conventional power module, the distance between the frame body 41 and the substrate 2 can be indirectly reduced, the problem that the lead wire cannot be bonded with the power chip 3 and the driving chip 5 after the size of the power module 100 is increased is solved, the lead wire is bonded with the first lead wire 7, and the increase of the end stress of the lead wire can be avoided, so that the lead wire breakage or short circuit can be prevented, and the production efficiency of the power module 100 is improved.
According to some embodiments of the present utility model, the first, second and third leads 7, 8 and 9 are the same material. For example, the first lead 7, the second lead 8 and the third lead 9 may be gold wires with the same wire diameter, so that the types of leads of the power module 100 may be reduced, and the number of times that the bonding apparatus switches wires may be reduced. In addition, the bonding efficiency of the gold wire is greater than that of the fine aluminum wire, so that the production efficiency can be further improved.
According to some embodiments of the present utility model, as shown in fig. 4, the height difference between the side surface of each conductive member 6 away from the substrate 2 and the side surface of the frame body 41 away from the substrate 2 is Δh 1 Wherein Deltah is 1 The method meets the following conditions: delta h is less than or equal to 0mm 1 < 2.3mm. Since the driving chip 5 is provided on the side of the frame body 41 away from the substrate 2, when Δh 1 At > 2.3mm, the vertical distance between the conductive member 6 and the frame body 41 is large, so that the two ends of the first lead 7 cannot be bonded to the driving chip 5 and the conductive member 6 at the same time. Thereby, by setting the height difference between the side surface of each conductive member 6 away from the substrate 2 and the side surface of the frame body 4141 away from the substrate 22 at 0 mm. Ltoreq.Δh 1 Within the interval < 2.3mm, such that each conductive element 6 is remote from the baseThe height distance between one side surface of the board 2 and one side surface of the frame body 41 far from the substrate 22 is designed more reasonably, so that the vertical operation capability of the bonding equipment is satisfied, and the bonding of the first lead 7 is facilitated.
According to some embodiments of the utility model, as shown in FIG. 2, each conductive element 6 has a height h 1 The distance between the side surface of the power chip 3 far from the substrate 2 and the side surface of the frame body 41 far from the substrate 2 is H 1 Wherein H is 1 、h 1 The method meets the following conditions: h 1 ＝2h 1 . That is, the free end of each conductive member 6 is located in the middle between the power chip 33 and the driving chip 56. So set up, when guaranteeing that the vertical distance between electrically conductive spare 6 and the drive chip 5 satisfies the vertical operation ability within range of bonding equipment, can avoid electrically conductive spare 6 to interfere with frame body 41, further improved bonding efficiency.
According to some embodiments of the present utility model, each of the conductive members 6 includes a plurality of conductive blocks 61, the plurality of conductive blocks 61 are stacked in a thickness direction of the conductive blocks 61, and the conductive block 61 located at an end of the plurality of conductive blocks 61 is electrically connected to the first lead 7. For example, in the example of fig. 2 to 4, each conductive member 6 may include 8 conductive blocks 61,8 conductive blocks 61 stacked in the thickness direction thereof. By electrically connecting the first lead 7 with the outermost conductive block 61 among the plurality of conductive blocks 61, on the one hand, the end faces of the outermost conductive block 61 are all exposed, so that the first lead 7 is bonded with the conductive member 6; on the other hand, the length of the leads can be shortened so that the leads can be regularly arranged in the plastic package body 1, and the cost can be reduced.
According to some embodiments of the present utility model, as shown in fig. 5, the conductive member 6 is disposed at a middle portion of the electrode 31 of the power chip 3, for example, the middle portion of the electrode 31 of the power chip 3 may be ball-mounted a plurality of times, so that the solder balls are stacked in a direction perpendicular to the electrode 31 to form the conductive member 6. The edge of each conductive bump 61 is spaced apart from the edge of the electrode 31, that is, the cross-sectional area of the conductive member 6 is smaller than the cross-sectional area of the electrode 31. Since the outer periphery of the electrode 31 is provided with the source electrode 32, by spacing the edge of each conductive block 61 from the edge of the electrode 31, the conductive blocks 61 are prevented from being connected to the source electrode 32 at the time of processing.
According to some embodiments of the present utility model, the frame body 41 and the substrate 2 are arranged at intervals along the width direction of the molding body 1. That is, the frame body 41 and the substrate 2 are spaced apart in both the width direction of the molding body 1 and the thickness direction of the molding body 1. Thereby, the bonding of the wires is facilitated, and the heat transfer between the power chip 3 and the driving chip 5 can also be reduced.
In some alternative embodiments, the substrate 2 includes an insulating layer 21, a first conductive layer 22, and a second conductive layer 23, the first conductive layer 22 and the second conductive layer 23 are respectively disposed on both sides of the insulating layer 21 in a thickness direction, and the plurality of power chips 3 are disposed on the first conductive layer 22. As shown in fig. 1 to fig. 4, the first conductive layer 22, the insulating layer 21 and the second conductive layer 23 are sequentially arranged from top to bottom along the thickness direction of the substrate 2, the insulating layer 21 may space the first conductive layer 22 and the second conductive layer 23, where the first conductive layer 22 is used for mounting the power chip 33 and other electronic components, the second conductive layer 23 may be exposed outside the plastic package body 1, and the second conductive layer 23 may be flush with one side surface of the plastic package body 1 in the thickness direction, and heat generated by the operation of the power module 100 may be transferred to the outside through the second conductive layer 23, so as to implement heat dissipation of the power module 100.
In some alternative embodiments, as shown in fig. 1, the second conductive layer 23 is exposed outside the plastic package body 1, and a side surface of the second conductive layer 23, which is far from the insulating layer 21, is flush with a side surface of the plastic package body 1 in a thickness direction. The second conductive layer 23 can be exposed outside the plastic package body 1, and heat generated by the operation of the power module 100 can be transferred to the outside through the second conductive layer 23, so that heat dissipation of the power module 100 is realized. One side surface of the second conductive layer 23 in the thickness direction is flush with one side surface of the plastic package body 1 in the thickness direction, so that the one side surface of the plastic package body 1 in the thickness direction is a flat surface, and the power module 100 can be attached to a radiator, so that heat dissipation of the power module 100 can be performed quickly.
In other alternative embodiments, the substrate 2 includes an insulating layer 21 and a first conductive layer 22, the first conductive layer 22 being provided on a side surface of the insulating layer 21 adjacent to the frame body 41, and the power chip being provided on the first conductive layer 22. Wherein the first conductive layer 22 is used for mounting the power chip 3 and other electronic components.
Further, the insulating layer 21 is exposed outside the plastic package body 1, and a surface of a side of the insulating layer 21 away from the first conductive layer 22 is flush with a surface of a side of the plastic package body 1 in a thickness direction. Thus, the heat generated by the power module 100 can be transferred to the outside through the first conductive layer 22, so as to realize heat dissipation of the power module 100.
In some alternative embodiments, the first conductive layer 22 and the second conductive layer 23 are both copper layers, and the insulating layer 21 is a ceramic layer. Among them, the copper layer has good conductivity and excellent corrosion resistance, effectively improving the conductivity and the stability in use of the first conductive layer 22 and the second conductive layer 23. The ceramic layer has excellent properties such as high mechanical strength, good wear resistance and corrosion resistance, good thermal stability, etc., and the ceramic layer can prevent the insulation performance of the insulation layer 21 from being reduced and deformed after long-term use, and can prolong the service life of the substrate 2.
According to some embodiments of the present utility model, referring to fig. 3, the power pin 43 is electrically connected with the power chip 3 through the fourth lead 10. Alternatively, the wire diameter of the fourth wire 10 is larger than the wire diameter of the first wire 7, or the wire diameter of the fourth wire 10 is larger than the wire diameters of the second wire 8 and the third wire 9. For example, the fourth lead 10 may be a thick aluminum wire to ensure connection reliability of the power chip 3 and the power pin 43.
The control pin 42 is electrically connected to the driving chip 5 through the fifth lead 11. Alternatively, the wire diameter of the fifth wire 11 is smaller than the wire diameter of the fourth wire 10. The wire diameter of the fifth wire 11 may be the same as the wire diameter of the first wire 7, the wire diameter of the second wire 8, and the wire diameter of the third wire 9. For example, the fifth wire 11 may be a gold wire.
In some alternative embodiments, each power chip 3 may include an IGBT chip 33 and a flywheel diode 34, the IGBT chip 33 may be disposed on the control side of the substrate 2, the flywheel diode 34 may be disposed on the power side of the substrate 2, the IGBT chip 33 is electrically connected to the flywheel diode 34 through a thick aluminum wire, the flywheel diode 33 is electrically connected to the corresponding power pin 43 through a thick aluminum wire, and the IGBT chip 33 and the driving chip 5 are electrically connected to the frame body 41 through gold wires to realize the electrical connection of the IGBT chip 33 and the driving chip 5, and the driving chip 5 is electrically connected to the control pin 42 through gold wires.
In other alternative embodiments, the freewheeling diode 34 may be integrated on the IGBT chip 33 to form the power chip 3.
The power chip 3 may also be a MOSFET chip.
An electronic device (not shown) according to an embodiment of the second aspect of the present utility model comprises a power module 100 according to an embodiment of the first aspect of the present utility model described above.
According to the electronic equipment provided by the embodiment of the utility model, the bonding efficiency is greatly improved by adopting the power module 100, and the production efficiency of the electronic equipment is improved.
Other constructions and operations of electronic devices according to embodiments of the present utility model are known to those of ordinary skill in the art and will not be described in detail herein
In the description of the present utility model, it should be understood that the terms "center," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like indicate orientations or positional relationships based on the orientation or positional relationships shown in the drawings, are merely for convenience in describing the present utility model and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present utility model.
In the description of the present application, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the terms in this application will be understood by those of ordinary skill in the art in a specific context.
In the description of the present specification, reference to the terms "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the utility model. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiments or examples.
While embodiments of the present utility model have been shown and described, it will be understood by those of ordinary skill in the art that: many changes, modifications, substitutions and variations may be made to the embodiments without departing from the spirit and principles of the utility model, the scope of which is defined by the claims and their equivalents.
Claims (11)
1. A power module, comprising:
a plastic package body;
the substrate is arranged in the plastic package body;
the power chips are arranged on the substrate and are distributed at intervals along the length direction of the substrate;
the frame comprises a frame body, a plurality of control pins and a plurality of power pins, wherein the frame body is arranged in the plastic package body, the frame body is arranged on one side of the substrate where the power chip is located and is spaced apart from the substrate, the control pins are arranged on one side of the substrate in the width direction, the control pins are arranged at intervals along the length direction of the substrate, one end of each control pin is connected with the frame body, the other end of each control pin extends out of the plastic package body, the power pins are arranged on the other side of the substrate in the width direction, the power pins are arranged at intervals along the length direction of the substrate, one end of each power pin is electrically connected with the power chip, and the other end of each power pin extends out of the plastic package body;
at least one driving chip, which is arranged on the frame body;
the plurality of conductive pieces are arranged on the electrode of the power chip and extend along the direction towards the frame body;
the driving chip and the power chip are electrically connected through the first lead and the conductive piece; or (b)
The conductive piece is electrically connected with the frame body through a second lead, the frame body is electrically connected with the driving chip through a third lead, and the driving chip and the power chip are electrically connected through the second lead, the conductive piece, the frame body and the third lead.
2. The power module of claim 1, wherein the first, second and third leads are the same material.
3. The power module of claim 2, wherein the first, second, and third leads are gold wires.
4. The power module according to claim 1, wherein a height difference between a side surface of each of the conductive members remote from the substrate and a side surface of the frame body remote from the substrate is Δh 1 Wherein the Δh 1 The method meets the following conditions: delta h is less than or equal to 0mm 1 ＜2.3mm。
5. The power module of claim 1 wherein each of said conductive members has a height h 1 ；
The distance between the side surface of the power chip far away from the substrate and the side surface of the frame body far away from the substrate is H 1 Which is provided withIn the above, the H 1 、h 1 The method meets the following conditions: h 1 ＝2h 1 。
6. The power module according to claim 1, wherein each of the conductive members includes a plurality of conductive bumps, the plurality of conductive bumps are stacked in a thickness direction of the conductive bumps, and the conductive bumps at end portions of the plurality of conductive bumps are electrically connected to the first leads.
7. The power module of claim 4 wherein the conductive members are disposed in a middle portion of the electrodes of the power chip and an edge of each of the conductive members is spaced apart from an edge of the electrode.
8. The power module according to any one of claims 1 to 7, wherein the substrate includes an insulating layer and a first conductive layer provided on a side surface of the insulating layer adjacent to the frame body, the power chip is provided on the first conductive layer, the insulating layer is exposed outside the plastic package, and a side surface of the insulating layer remote from the first conductive layer is flush with a side surface of the plastic package in a thickness direction.
9. The power module according to any one of claims 1 to 7, wherein the substrate includes an insulating layer, a first conductive layer and a second conductive layer, the first conductive layer and the second conductive layer are respectively disposed on two sides of the insulating layer in a thickness direction, the plurality of power chips are disposed on the first conductive layer, the second conductive layer is exposed outside the plastic package, and a surface of a side of the second conductive layer away from the insulating layer is flush with a surface of a side of the plastic package in the thickness direction.
10. The power module of claim 9 wherein the first and second conductive layers are copper layers and the insulating layer is a ceramic layer.
11. An electronic device comprising a power module according to any of claims 1-10.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320139830.7U CN218939660U (en) | 2023-01-31 | 2023-01-31 | Power module and electronic equipment thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320139830.7U CN218939660U (en) | 2023-01-31 | 2023-01-31 | Power module and electronic equipment thereof |
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| Publication Number | Publication Date |
|---|---|
| CN218939660U true CN218939660U (en) | 2023-04-28 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320139830.7U Active CN218939660U (en) | 2023-01-31 | 2023-01-31 | Power module and electronic equipment thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218939660U (en) |
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2023
- 2023-01-31 CN CN202320139830.7U patent/CN218939660U/en active Active
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