CN219419024U - Intelligent power module and equipment with same - Google Patents
Intelligent power module and equipment with same Download PDFInfo
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- CN219419024U CN219419024U CN202223090113.4U CN202223090113U CN219419024U CN 219419024 U CN219419024 U CN 219419024U CN 202223090113 U CN202223090113 U CN 202223090113U CN 219419024 U CN219419024 U CN 219419024U
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Abstract
The utility model discloses an intelligent power module and equipment with the same, wherein the intelligent power module comprises: a package; a control IC chip and a plurality of power chips are arranged in the package body, and each of the plurality of power chips is connected with the control IC chip; the power pins are led out from one side of the packaging body, which is close to the power chips, and each of the power chips is connected with a corresponding power pin in the power pins through a conductive piece; the control IC pin is led out from one side of the packaging body, which is close to the control IC chip, and is electrically connected with the control IC chip. The intelligent power module provided by the embodiment of the utility model has the advantages of strong current capacity, firm connection, high welding efficiency and the like.
Description
Technical Field
The utility model relates to the technical field of semiconductors, in particular to an intelligent power module and equipment with the same.
Background
In the related art, the bonding of the power chips of the intelligent power module generally adopts aluminum wires, and the higher the current specification requirement of the power chips is, the more aluminum wires need to be bonded to a single power chip, and if a plurality of power chips are used, the more aluminum wires are bonded, the more welding times are needed, so that the lower welding efficiency is caused. And bond a plurality of aluminum wires on the power chip, the welding point is relatively small, and the problem of broken welding easily occurs, leads to the reliability of aluminum wire connection to bring challenges. In addition, aluminum wire is elongated and has low resistance to thermal fatigue and mechanical vibration and die flow shocks.
Disclosure of Invention
The present utility model aims to solve at least one of the technical problems existing in the prior art. Therefore, an object of the present utility model is to provide an intelligent power module, in which the number of bonding and soldering times of a power chip is greatly reduced, bonding efficiency and connection reliability are improved, and which has better conductivity, higher thermal fatigue resistance, better mechanical vibration and die impact resistance, lower contact resistance and parasitic inductance, and lower wire bow, and which has improved heat dissipation capability and can disperse bonding pressure on the chip surface.
The utility model also provides equipment with the intelligent power module.
To achieve the above object, according to an embodiment of the present utility model, there is provided an intelligent module including: a package; a control IC chip and a plurality of power chips are arranged in the package body, and each of the plurality of power chips is connected with a corresponding power pin in the plurality of power pins through a conductive piece; the power pins are led out from one side of the packaging body, which is close to the power chip, and each power pin is connected with the corresponding power chip through a conductive piece; the control IC pin is led out from one side of the packaging body, which is close to the control IC chip, and is electrically connected with the control IC chip.
According to the intelligent module provided by the embodiment of the utility model, the power chip is connected with the corresponding power pins through the conductive piece, so that the number of electric connecting pieces is reduced, the welding times are reduced, the single electric connecting piece can be provided with a larger cross-sectional area, the through-flow capacity of the power chip and the power pins is higher, and the fatigue resistance, the mechanical vibration resistance and the die flow impact resistance are higher. In addition, the conductive piece, the power chip and the power pins can form a larger welding area, and the connection is firmer, so that the power module provided by the embodiment of the utility model has the advantages of strong current passing capability, firm connection, high welding efficiency and the like.
According to some embodiments of the utility model, the first end of the conductive member has a first bonding area and a second bonding area that are disposed at intervals along the length direction, the conductive member is respectively bonded to the power chip at the first bonding area and the second bonding area, and the second end of the conductive member is connected to the power pin that is correspondingly connected.
According to some embodiments of the utility model, the conductive member is an aluminum strip, or a conductive strip with an aluminum clad copper core.
According to some specific embodiments of the utility model, the smart power module further comprises: the substrate is provided with three low-potential side conductive areas and one high-potential side conductive area which are distributed at intervals along the length direction of the packaging body; the power chips comprise three low-potential side power chips and three high-potential side power chips, the three low-potential side power chips are respectively arranged in three low-potential side conductive areas, and the three high-potential side conductive areas are arranged in the high-potential side conductive areas; the control IC chip is connected to each of the plurality of power chips.
Further, the control IC chip comprises a low-potential side control IC chip and a high-potential side control IC chip, the low-potential side control IC chip is respectively connected with the three low-potential side power chips, and the high-potential side control IC chip is respectively connected with the three high-potential side power chips; or (b)
The control IC chip comprises a low-potential side control IC chip and three high-potential side control IC chips, wherein the low-potential side control IC chip is respectively connected with the three low-potential side power chips, and the three high-potential side control IC chips are respectively connected with the three high-potential side chips.
According to some embodiments of the utility model, the substrate is a first copper frame, the upper surface of the first copper frame has three low-potential side conductive regions and one high-potential side conductive region, and one end of the first copper frame is led out from one side of the package body close to the power chip to form the power pin.
Further, the intelligent power module further comprises: the heat dissipation copper plate, the one side of heat dissipation copper plate pass through the insulating layer with the lower surface laminating of first copper frame, the another side of heat dissipation copper plate exposes the encapsulation body.
According to some embodiments of the utility model, the substrate comprises a laminated inner copper-clad layer, a ceramic layer and an outer copper-clad layer, wherein the inner copper-clad layer is provided with three low-potential side conductive areas and one high-potential side conductive area, the inner copper-clad layer is connected with the power pin, and one surface of the outer copper-clad layer is exposed out of the packaging body.
According to some specific embodiments of the utility model, the power chip is an RC-IGBT chip.
An embodiment according to a second aspect of the utility model proposes an apparatus.
An apparatus according to an embodiment of the second aspect of the present utility model comprises a smart power module according to the above-described embodiment of the present utility model and a controller electrically connected to the smart power module.
The device provided by the embodiment of the utility model has the advantages of strong through-flow capability, firm connection, high welding efficiency and the like.
Additional aspects and advantages of the utility model will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the utility model.
Drawings
The foregoing and/or additional aspects and advantages of the utility model will become apparent and may be better understood from the following description of embodiments taken in conjunction with the accompanying drawings in which:
FIG. 1 is a schematic diagram of a prior art smart power module;
FIG. 2 is a schematic diagram of a smart power module according to an embodiment of the present utility model;
FIG. 3 is a schematic diagram of a conductive element of a smart power module connecting a power chip and a power pin according to another embodiment of the present utility model;
FIG. 4 is a schematic diagram of a copper core aluminum encased conductive strip connection power and power pins of an intelligent power module according to an embodiment of the present utility model;
FIG. 5 is a cross-sectional view of the conductive member of FIG. 4;
fig. 6 is a schematic diagram of a structure in a width direction of an intelligent power module according to an embodiment of the present utility model;
fig. 7 is a schematic view of a structure of a smart power module in a width direction according to another embodiment of the present utility model;
fig. 8 is a schematic diagram of a structure of a smart power module in a width direction according to still another embodiment of the present utility model.
Reference numerals:
the prior art comprises the following steps:
intelligent power module 1 ', aluminium wire 10 ', power chip 110 ', power pin 200
The utility model comprises the following steps:
intelligent power module 1, package 100, control IC chip 110, power chip 120, power pin 200,
Conductive member 300, control IC pin 400, first bonding area 310, second bonding area 320, substrate 500,
A first copper frame 501, a low-potential side conductive region 510,
High-side conductive region 520, low-side power chip 530,
A high-potential side power chip 540, a low-potential side control IC chip 550, a high-potential side control IC chip 560,
A heat-dissipating copper plate 700, a copper core 10, aluminum 20, an insulating layer 502, an inner copper-clad layer 503, a ceramic layer 504,
And a copper-clad layer 505 is coated.
Detailed Description
In the description of the present utility model, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "axial", "radial", "circumferential", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings are merely for convenience in describing the present utility model and to simplify the description, and do not indicate or imply that the device or element being referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the present utility model.
In the description of the utility model, a "first feature" or "second feature" may include one or more of such features.
In the description of the present utility model, "plurality" means two or more.
In the description of the utility model, a first feature "above" or "below" a second feature may include both the first and second features being in direct contact, and may also include the first and second features not being in direct contact but being in contact with each other by another feature therebetween.
The following describes an intelligent power module 1 according to an embodiment of the present utility model with reference to the accompanying drawings.
As shown in fig. 1 to 8, the intelligent power module 1 according to the embodiment of the present utility model includes a package body 100, a plurality of power pins 200, and a control IC pin 400.
The package body 100 is provided therein with a control IC chip 110 and a plurality of power chips 120, each power chip 120 is connected with the control IC chip 110, a plurality of power pins 200 are led out at one side of the package body 100 near the power chip 120, each of the plurality of power chips 200 is connected with a corresponding power pin 200 of the plurality of power pins 200 through one conductive member 300, a control IC pin 400 is led out at one side of the package body 100 near the control IC chip 110, and the control IC pin 400 is electrically connected with the control IC chip 110.
For example, the control IC pin 400 is connected to the PCB of the external controller outside the smart power module 1, and the power pin 200 is connected to the driven member outside the smart power module 1, so as to electrically connect the power chip 120 to the external circuit. The conductive members 300 may be aluminum tape, and each power chip 120 and the power pin 200 are connected through only one conductive member 300. The two ends of the conductive member 300 are connected to the power chip 120 and the power pin 200 by means of soldering.
According to the intelligent power module 1 of the embodiment of the utility model, through the connection between each power pin 200 and the corresponding power chip 120 through one conductive piece 300, an integral connection structure is formed between the corresponding power chip 120 and the power pin 200, so that the conductive piece 300 can be provided with a shape with a larger cross-sectional area, the through-flow capability between the power chip 120 and the power pin 200 is stronger, the conductive piece 300 generates lower heat, and the conductive piece 300 can also have lower contact resistance and parasitic inductance, thereby realizing lower wire arc. And because of the larger cross-sectional area of the conductive member 300, the conductive member 300 has better resistance to thermal fatigue and mechanical vibration and die flow shocks. And each power chip 120 is connected with the corresponding power pin 200 through one conductive piece 300, and the connection part of the conductive piece 300 and the power chip 120 and the power pin 200 can form a larger welding area. And, the junction of electrically conductive piece 300 and power chip 120 and power pin 200 forms great welding area, and the welding position is comparatively concentrated, and the welding area is bigger, and electrically conductive piece 300 is more firm with the connection of power chip 120 and power pin 200, and the reliability is higher.
In addition, the power chips 120 and the power pins 200 are in one-to-one correspondence, each power chip 120 is independently driven by the corresponding power pin 200, so that each power chip 120 is independently and electrically connected with the corresponding power pin 200, the control IC chip 110 is connected with the plurality of power chips 120, so that the plurality of power chips 120 can respectively drive the corresponding power pins 200, the power pins 200 can be arranged at different positions of the package 100 in a dispersed manner, and the arrangement positions are more flexible when the power pins 200 are electrically connected with an external driving piece.
Therefore, the intelligent power module 1 provided by the embodiment of the utility model has the advantages of strong through-current capability, firm connection, high welding efficiency and the like.
In some embodiments of the present utility model, as shown in fig. 3, a first end of the conductive member 300 has a first bonding area 310 and a second bonding area 320 spaced apart along a length direction, the conductive member 300 is respectively bonded to the power chip 120 at the first bonding area 310 and the second bonding area 320, and a second end of the conductive member 300 is connected to the power pin 200 correspondingly connected.
For example, the conductive member 300 forms a conductive strip in a shape of a strip, the first and second bonding areas 310 and 320 extend along short sides of the conductive member 300, respectively, and the first and second bonding areas 310 and 320 form bonding areas of two parallel lines, so that the bonding of the conductive member 300 to the power chip 120 is more secure. And compared with the welding mode of aluminum wires, the welding area of the conductive piece 300 is larger, each aluminum wire is not required to be independently welded, only the whole conductive piece 300 is required to be independently welded, and the welding times are reduced.
In some embodiments of the present utility model, the conductive member 300 is an aluminum tape. The aluminum strip has larger welding width and the welding process is relatively simple. And the aluminum strip is more reliable than the aluminum wire, the surface that the aluminum strip contacted with the power chip 120 and the power pin 300 forms a plane, the bonding between the aluminum strip and the power chip 120 and between the aluminum strip and the power pin 200 is more firm, and the aluminum strip connects the electrode of the power chip 120 and the power pin 200 to form a loop, so that the problem of jump point tearing can not be caused.
In other embodiments of the present utility model, the conductive member 300 is a conductive tape of aluminum 20 wrapped around the copper core 10, and as shown in fig. 5, the conductive tape of aluminum 20 wrapped around the copper core 10 is connected to the power chip 120 and the power pins 200. The cross section of the conductive strip of aluminum 20 wrapped around copper core 10 is shown in fig. 4, and the conductive strip of copper core 10 wrapped around aluminum 20 has good solderability. And a dense oxide film is formed on the outer circumferential surface of the copper core 10, improving the durability of the conductive member 300.
In some embodiments of the present utility model, as shown in fig. 1, the smart power module 1 further includes a substrate 500.
The substrate 500 has three low-side conductive regions 510 and one high-side conductive region 520 spaced apart along the length direction of the package body 100. The plurality of power chips 120 includes three low-potential side power chips 530 and three high-potential side power chips 540, the three low-potential side power chips 530 are respectively disposed in the three low-potential side conductive regions 510, the three high-potential side conductive regions 520 are disposed in the high-potential side conductive regions 520, and the control IC chip 110 is respectively connected to each of the plurality of power chips 530.
The substrate 500 may separate the power chip and the control IC chip into two regions by providing three low-side conductive regions 510 and one high-side conductive region 520. And, three low-potential side conductive regions 510 and three high-potential side conductive regions 520 are spaced apart from each other, each low-potential side conductive region 510 is mounted with one low-potential side power chip 530, and each high-potential side conductive region 520 is mounted with three high-potential side power chips 540. For example, three low-potential side power chips 530 and one high-potential side power chip 540 are disposed at intervals along the length direction of the package body 100, and the three low-potential side power chips 530 and the three high-potential side power chips 540 are at the same width position in the package body 100. The plurality of power pins 200 are arranged at intervals along the length direction of the package body 100, and the conductive members 300 can be connected with the corresponding power chips 120 and the power pins 200 along the same direction, so that the space of the package body 100 is fully utilized, and the arrangement is tidy. For example, the three low-potential side power chips 530 and the three high-potential side power chips 540 are controlled 110 with the same control IC chip, and the number of used chips is small, so that the arrangement of the intelligent power module 1 is facilitated.
In some embodiments of the present utility model, the control IC chip 110 includes a low-potential side control IC chip 550 and a high-potential side control IC chip 560, the low-potential side control IC chip 550 is connected to the three low-potential side power chips 530, and the high-potential side control IC chip 560 is connected to the three high-potential side power chips 540, respectively.
Thus, the low-side control IC chip 550 can control three low-side power chips 530, and the high-side control IC chip 560 can control three high-side power chips 540. For example, one low-potential side control IC chip 550 is provided, one low-potential side control IC chip 550 may control three low-potential side power chips 530, respectively, one high-potential side power chip 540 is provided, and one high-potential side control IC chip 560 may control three high-potential side power chips 540, respectively. Centralized control of the plurality of low-potential side power chips 530 and centralized control of the plurality of high-potential side power chips 540 are realized.
In some embodiments of the present utility model, the control IC chip includes a low-potential side control IC chip 550 and three high-potential side control IC chips 560, the low-potential side control IC chip 550 is connected to the three low-potential side power chips 530, and the three high-potential side control IC chips 550 are connected to the three high-potential side power chips 540, respectively.
The low-potential side power chips 530 are controlled by one low-potential side control IC chip 550, three high-potential side power chips 540 are connected with three high-potential side control IC chips 560 in a one-to-one correspondence manner, and the three high-potential side power chips 540 are individually controlled by the three high-potential side control IC chips 560, so that the control modes of the plurality of high-potential side power chips 540 are more various.
In some embodiments of the present utility model, as shown in fig. 4, the substrate 500 is a first copper frame 501, and the upper surface of the first copper frame 501 has three low-side conductive regions 510 and one high-side conductive region 520, and one end of the first copper frame 501 is led out from the side of the package 100 near the power chip 120 to form the power pin 200.
The first copper frame 501 and the second copper frame 601 have good conductive performance, the first copper frame 501 and the second copper frame are arranged at intervals along the length direction of the package body 100, the first copper frame 501 and the second copper frame 601 can enable the intelligent power module 1 to form high structural strength, and three low-potential side conductive areas 510 and one high-potential side conductive area 520 are arranged on the first copper frame 501 and the second copper frame 601 along the length direction of the package body 100. The first copper frame 501 and the second copper frame 502 can both form an integral structure, the first copper frame 501 directly forms the power pins 200, the power pins 200 do not need to be additionally arranged, the integral performance is high, and the structural strength is high.
Further, as shown in fig. 5, the intelligent power module further includes a heat dissipation copper plate 700, one surface of the heat dissipation copper plate 700 is attached to the lower surface of the first copper frame 501 through the insulating layer 502, and the other surface of the heat dissipation copper plate 700 exposes the package body 100.
The edge of the insulating layer 502 attached to the first copper frame 501 exceeds the first copper frame 501, the edge of the insulating layer 502 is flush with the edge of the heat dissipation copper plate 700, the insulating layer 502 plays an insulating role between the heat dissipation copper plate 700 and the first copper frame 501, for example, the insulating layer 502 is an insulating resin sheet, heat generated during operation of the power chip 120 is conducted to the heat dissipation copper plate 700 through the insulating resin sheet, and both the insulativity and the conductivity are excellent.
In some embodiments of the present utility model, as shown in fig. 6, the substrate 500 includes an inner copper-clad layer 503, a ceramic layer 504 and an outer copper-clad layer 505 stacked together, wherein the inner copper-clad layer 503 has three low-side conductive regions 510 and one high-side conductive region 520, the inner copper-clad layer 503 is connected to the power pin 200, and one surface of the outer copper-clad layer 505 exposes the package 100.
Specifically, the substrate 500 may be a copper-clad ceramic board, and the substrate 500 is configured into a structure of an inner copper-clad layer 503, a ceramic layer 504 and an outer copper-clad layer 505, the inner copper-clad layer 503 is connected with the power pins 200, the shape of the inner copper-clad layer 503 can be more flexibly arranged according to the relative positions of the chip and the power pins 200, the whole substrate 500 is encapsulated in the package body 100 by plastic, the power pins 200 can be flexibly arranged at different positions of the inner copper-clad layer 503, and the outer copper-clad layer 505 can be attached to the heat sink while exposing the package body 100, so that the power chip 120 has better heat dissipation performance.
In some embodiments, the power chip 120 integrates the IGBT chip and the FRD chip into one chip, so that the power chip 120 forms an RC-IGBT (reverse conducting type insulated gate bipolar transistor) chip, the area of the package 100 occupied by the chip is reduced, the RC-IGBT chip is arranged neatly, and welding of the IGBT chip and the FRD chip is not required, thereby further simplifying the welding operation.
An apparatus according to an embodiment of the present utility model is described below.
The device according to an embodiment of the utility model comprises an intelligent power module 1 and a controller according to the above-described embodiments of the utility model. The controller is electrically connected with the intelligent power module 1.
The device according to the embodiment of the utility model has the advantages of strong current capacity, firm connection, high welding efficiency and the like by utilizing the intelligent power module 1 according to the embodiment of the utility model.
Other configurations and operations of the intelligent power module 1 and the apparatus according to the embodiments of the present utility model are known to those skilled in the art, and will not be described in detail herein.
In the description of the present specification, reference to the terms "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the utility model. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiments or examples.
While embodiments of the present utility model have been shown and described, it will be understood by those of ordinary skill in the art that: many changes, modifications, substitutions and variations may be made to the embodiments without departing from the spirit and principles of the utility model, the scope of which is defined by the claims and their equivalents.
Claims (10)
1. An intelligent power module, comprising:
a package;
a control IC chip and a plurality of power chips are arranged in the package body, and each of the plurality of power chips is connected with the control IC chip;
the power pins are led out from one side of the packaging body, which is close to the power chips, and each of the power chips is connected with a corresponding power pin in the power pins through a conductive piece;
the control IC pin is led out from one side of the packaging body, which is close to the control IC chip, and is electrically connected with the control IC chip.
2. The intelligent power module according to claim 1, wherein the first end of the conductive member has a first welding area and a second welding area which are disposed at intervals along the length direction, the conductive member is welded to the power chip at the first welding area and the second welding area respectively, and the second end of the conductive member is connected to the power pin correspondingly connected.
3. The intelligent power module according to claim 1 or 2, wherein the conductive member is an aluminum tape or an aluminum-clad copper core conductive tape.
4. The intelligent power module of claim 1 or 2, further comprising:
the substrate is provided with three low-potential side conductive areas and one high-potential side conductive area which are distributed at intervals along the length direction of the packaging body;
the power chips comprise three low-potential side power chips and three high-potential side power chips, the three low-potential side power chips are respectively arranged in three low-potential side conductive areas, and the three high-potential side conductive areas are arranged in the high-potential side conductive areas;
the control IC chip is connected to each of the plurality of power chips.
5. The intelligent power module according to claim 4, wherein the control IC chip includes a low-potential side control IC chip and a high-potential side control IC chip, the low-potential side control IC chip being connected to the three low-potential side power chips, respectively, and the high-potential side control IC chip being connected to the three high-potential side power chips, respectively; or (b)
The control IC chip comprises a low-potential side control IC chip and three high-potential side control IC chips, wherein the low-potential side control IC chip is respectively connected with the three low-potential side power chips, and the three high-potential side control IC chips are respectively connected with the three high-potential side power chips.
6. The intelligent power module according to claim 4, wherein the substrate is a copper frame, the copper frame has three low-potential side conductive regions and one high-potential side conductive region on an upper surface thereof, and one end of the copper frame is led out from a side of the package body close to the power chip to form the power pin.
7. The intelligent power module of claim 6, wherein the power module further comprises:
the heat dissipation copper plate, one side of heat dissipation copper plate pass through the insulating layer with the lower surface laminating of copper frame, the another side of heat dissipation copper plate exposes the encapsulation body.
8. The intelligent power module according to claim 4, wherein,
the substrate comprises an inner copper-clad layer, a ceramic layer and an outer copper-clad layer which are laminated, wherein the inner copper-clad layer is provided with three low-potential side conductive areas and one high-potential side conductive area, the inner copper-clad layer is connected with the power pins, and one surface of the outer copper-clad layer is exposed out of the packaging body.
9. The intelligent power module of claim 1, wherein the power chip is an RC-IGBT chip.
10. An apparatus comprising the smart power module of any one of claims 1-9 and a controller electrically connected to the smart power module.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN202223090113.4U CN219419024U (en) | 2022-11-17 | 2022-11-17 | Intelligent power module and equipment with same |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223090113.4U CN219419024U (en) | 2022-11-17 | 2022-11-17 | Intelligent power module and equipment with same |
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| Publication Number | Publication Date |
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| CN219419024U true CN219419024U (en) | 2023-07-25 |
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| CN202223090113.4U Active CN219419024U (en) | 2022-11-17 | 2022-11-17 | Intelligent power module and equipment with same |
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