CN115939073A - Power module and electronic equipment thereof - Google Patents
Power module and electronic equipment thereof Download PDFInfo
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- CN115939073A CN115939073A CN202310072983.9A CN202310072983A CN115939073A CN 115939073 A CN115939073 A CN 115939073A CN 202310072983 A CN202310072983 A CN 202310072983A CN 115939073 A CN115939073 A CN 115939073A
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- 239000000758 substrate Substances 0.000 claims abstract description 96
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 14
- 229910052737 gold Inorganic materials 0.000 claims description 9
- 239000010931 gold Substances 0.000 claims description 9
- 239000000463 material Substances 0.000 claims description 7
- 238000000465 moulding Methods 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 2
- 239000000919 ceramic Substances 0.000 claims description 2
- 229910052802 copper Inorganic materials 0.000 claims description 2
- 239000010949 copper Substances 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 abstract description 8
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 8
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 4
- 230000008901 benefit Effects 0.000 description 3
- 238000013461 design Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000004069 differentiation Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
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Abstract
The invention discloses a power module and electronic equipment thereof, wherein the power module comprises: the device comprises a plastic package body, a substrate, a plurality of power chips, a frame and a plurality of driving chips; the frame body is arranged on the plastic package body and comprises a first frame section and a second frame section which are connected with each other, the second frame section is positioned between the first frame section and the substrate in the thickness direction of the substrate, and the second frame section is electrically connected with the power chip through a first lead; the driving chip is electrically connected with the second frame section through a second lead, and the driving chip and the power chip are electrically connected through the second lead, the second frame section and the first lead; or the driving chip is electrically connected with the first frame section through a fifth lead, and the driving chip and the power chip are electrically connected through the fifth lead, the first frame section, the second frame section and the first lead. According to the power module, the problem that the lead cannot be bonded due to the fact that the vertical distance between the substrate and the frame body is large is solved, and production efficiency is improved.
Description
Technical Field
The present invention relates to the field of power module technologies, and in particular, to a power module and an electronic device thereof.
Background
In the related art, an IGBT chip is attached to the surface of a circuit board, and gold wires on an IC chip are pull-down bonded to electrodes of the IGBT chip. For the power module with thinner thickness, the vertical distance between the frame for placing and the surface of the circuit board is smaller, and gold wires on the IC chip can be bonded with the electrodes of the IGBT chip.
However, with the requirement of high power, the size of the power module is increased based on the consideration of product strength, insulation, heat dissipation, etc., so that the sinking depth of the solder joint of the IC chip to the electrode bonding of the IGBT chip exceeds the vertical operation capability of the bonding equipment, the alloy wire cannot be bonded, and the types of the leads used in the power module are many, which results in more times of switching wire diameters or equipment, and affects the production efficiency of the power module.
In addition, when the sinking depth of the welding point of the IC chip to the electrode bonding of the IGBT chip is too large, the stress of the end part of the gold wire is increased, and the risk of breaking or short circuit of the gold wire is generated.
Disclosure of Invention
The present invention is directed to solving at least one of the problems of the prior art. Therefore, an object of the present invention is to provide a power module, which solves the problem that the leads cannot be bonded due to a large vertical distance between the substrate and the frame body, improves the production efficiency, and reduces the risk of wire breakage or short circuit of the leads.
Another object of the present invention is to provide an electronic device using the above power module.
A power module according to an embodiment of the present invention includes: molding the body; the substrate is arranged on the plastic package body, and the two sides of the substrate in the width direction are respectively a control side and a power side; the power chips are arranged on the substrate and are arranged at intervals along the length direction of the substrate; the frame comprises a frame body, a plurality of control pins and a plurality of power pins, wherein the frame body is arranged in the plastic package body, the frame body is positioned on the control side of the substrate, the frame body is spaced from the substrate on the side of the substrate where the power chip is positioned, the control pins are positioned on the control side, one end of each control pin is connected with the frame body, the other end of each control pin extends out of the plastic package body, the power pins are positioned on the power side, one end of each power pin is electrically connected with the power chip, and the other end of each power pin extends out of the plastic package body, wherein the frame body comprises a first frame section and a second frame section, the second frame section is positioned between the first frame section and the substrate in the thickness direction of the substrate, and the second frame section is electrically connected with the power chip through a first lead; at least one driver chip, said at least one driver chip all set up on said first frame section; the driving chip is electrically connected with the second frame section through a second lead, the driving chip and the power chip are electrically connected through the second lead, the second frame section and the first lead, or the first frame section and the second frame section are connected with each other, the driving chip is electrically connected with the first frame section through a fifth lead, and the driving chip and the power chip are electrically connected through the fifth lead, the first frame section, the second frame section and the first lead.
According to the power module of the embodiment of the invention, the second frame section is arranged between the first frame section and the substrate in the thickness direction of the substrate, and the power chip and the driving chip are electrically connected with the second frame section through the leads. Therefore, compared with the traditional power module, the problem that the lead cannot be bonded due to the fact that the vertical distance between the substrate and the frame body is large is solved through the second frame section, and production efficiency is improved.
According to some embodiments of the invention, the first lead and the second lead are made of the same material, or the first lead and the fifth lead are made of the same material.
According to some embodiments of the invention, the first lead and the second lead are both gold wires, or the first lead and the fifth lead are both gold wires.
According to some embodiments of the invention, a height difference between a side surface of the base plate adjacent to the second frame segment and a side surface of the second frame segment remote from the base plate is Δ h 1 Wherein said Δ h 1 Satisfies the following conditions: delta h less than or equal to 0mm 1 Less than 2.3mm; and/or the height difference between the surface of one side of the second frame section far away from the substrate and the surface of one side of the first frame section far away from the substrate is delta h 2 Wherein said Δ h 2 Satisfies the following conditions: delta h less than or equal to 0mm 2 ＜2.3mm。
According to some embodiments of the invention, a height difference between a side surface of the base plate adjacent to the second frame segment and a side surface of the second frame segment remote from the base plate is Δ h 1 The height difference between the surface of one side of the second frame section far away from the substrate and the surface of one side of the first frame section far away from the substrate is delta h 2 Wherein said Δ h 1 、△h 2 Satisfies the following conditions: delta h 1 ≥△h 2 。
According to some embodiments of the invention, a width of the second frame section in a width direction of the substrate is smaller than a width of the first frame section.
According to some embodiments of the present invention, the first frame section and the second frame section are arranged at intervals along a width direction of the substrate, and the second frame section and the substrate are arranged at intervals along the width direction of the plastic package body.
According to some embodiments of the invention, the frame further comprises: the connecting sections are arranged between the first frame section and the second frame section and are arranged at intervals along the length direction of the first frame section; each of the connecting sections extends obliquely in a direction away from the second frame section.
According to some embodiments of the invention, the first conductive layer is arranged on one side surface of the insulating layer, which is adjacent to the frame body, the power chip is arranged on the first conductive layer, the insulating layer is exposed outside the plastic package body, and one side surface of the insulating layer, which is far away from the first conductive layer, is flush with one side surface of the plastic package body in the thickness direction.
According to some embodiments of the invention, the substrate further comprises: the second conducting layer, first conducting layer with the second conducting layer is established respectively the both sides of the thickness direction of insulating layer, the second conducting layer exposes outside the plastic envelope body, just keeping away from of second conducting layer one side surface of insulating layer with one side surface parallel and level of the thickness direction of the plastic envelope body.
According to some embodiments of the invention, the first and second conductive layers are both copper layers and the insulating layer is a ceramic layer.
An electronic device according to an embodiment of the second aspect of the present invention includes the power module according to the above-described embodiment of the first aspect of the present invention.
Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.
Drawings
The above and/or additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:
FIG. 1 is a schematic diagram of a power module according to an embodiment of the invention;
FIG. 2 is an enlarged partial view of the power module shown in FIG. 1;
FIG. 3 is a side view of a power module according to an embodiment of the invention;
fig. 4 is a schematic diagram of a frame of a power module according to an embodiment of the invention.
Reference numerals are as follows:
100: a power module;
1: molding the body; 2: a substrate; 21: an insulating layer; 22: a first conductive layer; 23: a second conductive layer; 3: a power chip; 31: an IGBT chip; 32: a freewheeling diode; 4: a frame: 41: a frame body; 411: a first frame section; 412: a second frame section; 413: a connection section; 42: a control pin; 43: a power pin; 5: a first lead; 6: a driving chip; 7: a second lead; 8: a third lead; 9: a fourth lead; 10. and a fifth lead.
Detailed Description
A power module 100 according to an embodiment of the first aspect of the invention is described below with reference to fig. 1-4.
As shown in fig. 1 to 4, a power module 100 according to an embodiment of the present invention includes a plastic package body 1, a substrate 2, a plurality of power chips 3, a frame 4, and at least one driving chip 6. In the description of the present invention, "a plurality" means two or more.
Specifically, the substrate 2 is provided on the molded body 1. The substrate 2 may be entirely located in the plastic package body 1, or at least a portion of the substrate 2 is exposed outside the plastic package body 1. Both sides in the width direction (for example, the front-rear direction in fig. 1) of the substrate 2 are a control side and a power side, respectively. The plurality of power chips 3 are each provided on the substrate 2, and the plurality of power chips 3 are provided at intervals along the longitudinal direction (for example, the left-right direction in fig. 1) of the substrate 2. For example, in the example of fig. 1, the number of the power chips 3 may be 6, the 6 power chips 3 are all provided on one side surface in the thickness direction (for example, the up-down direction in fig. 1) of the substrate 2, and the 6 power chips 3 are arranged at regular intervals along the length direction of the substrate 2.
The frame comprises a frame body 41, a plurality of control pins 42 and a plurality of power pins 43, wherein the frame body 41 is arranged in the plastic package body 1, the frame body 41 is positioned at the control side of the substrate 2, the frame body 41 is spaced apart from the substrate 2 at the side of the substrate 2 where the power chip 3 is positioned, the plurality of control pins 42 are positioned at the control side, one end of each control pin 42 is connected with the frame body 41, and the other end of each control pin 42 extends out of the plastic package body 1. The plurality of power pins 43 are located on the power side, one end of each power pin 43 is electrically connected with the power chip 3, and the other end of each power pin 43 extends out of the plastic package body 1. The frame body 41 includes a first frame section 411 and a second frame section 412, the second frame section 412 is located between the first frame section 411 and the substrate 2 in the thickness direction of the substrate 2, and the second frame section 412 is electrically connected to the power chip 3 through the first lead 5.
The driving chip 6 is disposed on the first frame section 411, and the driving chip 6 is electrically connected to the second frame section 412 through the second lead 7. The driving chip 6 and the power chip 3 are electrically connected through the second lead 7, the second frame section 412 and the first lead 5; or the first frame section 411 and the second frame section 412 are connected to each other, the driving chip 6 is electrically connected to the first frame section 411 through the fifth lead 10, and the driving chip 6 and the power chip 3 are electrically connected through the fifth lead 10, the first frame section 411, the second frame section 412 and the first lead 5.
Referring to fig. 1 to 4, the frame body 41 is located on the control side of the substrate 2, the second frame section 412 is located on the side of the first frame section 411 adjacent to the substrate 2, the one end of the control lead 42 is connected to the first frame section 411, the driving chip 6 is disposed on the surface of the first frame section 411 away from the substrate 2, one end of the second lead 7 is bonded to the pad of the driving chip 6, and the other end of the second lead 7 is bonded to the surface of the second frame section 412 away from the substrate 2, or one end of the fifth lead 10 is bonded to the pad of the driving chip 6, and the other end of the fifth lead 10 is bonded to the surface of the first frame section 411 away from the substrate 2. One end of the first lead 5 is bonded to the power chip 3, and the other end of the first lead 5 is bonded to a side surface of the second frame segment 412 away from the substrate 2. Thereby, the power chip 3 and the driver chip 6 are electrically connected.
Wherein, by disposing the second frame section 412 between the first frame section 411 and the substrate 2 in the thickness direction of the substrate 2, the distance between the frame body 41 and the substrate 2 can be reduced, so that the vertical distance between the surface of the first frame section 411 away from the substrate 2 and the surface of the second frame section 412 away from the substrate 2 satisfies the vertical operation capability of the bonding apparatus, and the vertical distance between the surface of the second frame section 412 away from the substrate 2 and the substrate 2 satisfies the vertical operation capability of the bonding apparatus, which is beneficial for the bonding of the first lead 5 and the second lead 7, and can avoid the stress increase of the ends of the first lead 5 and the second lead 7, thereby preventing the first lead 5 or the second lead 7 from being broken or short-circuited, and improving the production efficiency.
In addition, since the position of the first frame segment 411 is the same as the position of the frame of the existing power module, in the assembling process, the existing tooling fixture can be used for clamping the first frame segment 411, and the driving chip 6 is installed on the first frame segment 411, so that the development cost can be reduced.
According to the power module 100 of the embodiment of the present invention, by disposing the second frame section 412 between the first frame section 411 and the substrate 2 in the thickness direction of the substrate 2, and both the power chip 3 and the driving chip 6 are electrically connected to the second frame section 412 through the leads (i.e., the above-described first lead 5 and second lead 7). Therefore, compared with the conventional power module, the problem that the lead cannot be bonded due to the large vertical distance between the substrate 2 and the frame body 41 is solved by the second frame section 412, and the first lead 5 or the second lead 7 can be prevented from being broken or short-circuited, so that the production efficiency is improved.
According to some embodiments of the present invention, the first lead 5 and the second lead 7 are the same material. For example, the first lead 5 and the second lead 7 may be all gold wires of the same wire diameter. Alternatively, the first lead 5 and the fifth lead 10 are made of the same material. For example, the first lead 5 and the fifth lead 10 may be all gold wires of the same wire diameter. Therefore, the lead types of the power module 100 can be reduced, and the number of times of switching wires by the bonding equipment can be reduced. In addition, the bonding efficiency of the gold wire is higher than that of the thin aluminum wire, so that the production efficiency can be further improved.
According to some embodiments of the present invention, as shown in fig. 3, a height difference between a side surface of the substrate 2 adjacent to the second frame section 412 and a side surface of the second frame section 412 far from the substrate 2 is Δ h 1 Wherein Δ h 1 Satisfies the following conditions: delta h less than or equal to 0mm 1 Less than 2.3mm; and/or the height difference between the surface of the second frame section 412 on the side far from the substrate 2 and the surface of the first frame section 411 on the side far from the substrate 2 is Δ h 2 Wherein Δ h 2 Satisfies the following conditions: delta h less than or equal to 0mm 2 Is less than 2.3mm. Wherein, can be Δ h 1 、△h 2 Simultaneously, the following requirements are met: 0mm less than or equal to△h 1 ＜2.3mm，0mm≤△h 2 Less than 2.3mm; alternatively, only Δ h 1 Satisfies the following conditions: delta h less than or equal to 0mm 1 Less than 2.3mm; or again, only Δ h 2 Satisfies the following conditions: delta h less than or equal to 0mm 2 ＜2.3mm。
Since the driving chip 6 is disposed on the side of the first frame section 411 away from the substrate 2, when Δ h 1 > 2.3mm or Δ h 2 The vertical distance between the substrate 2 or the first frame segment 411 and the second frame segment 412 is large > 2.3mm, so that both ends of the first lead 5 or the second lead 7 cannot be bonded simultaneously. So arranged that by applying Δ h 1 And/or Δ h 2 Limited between 0mm and 2.3mm so that Δ h 1 And/or Δ h 2 The range of the vertical operation capability of the bonding apparatus is satisfied, and the sinking depth of the first lead 5 or the second lead 7 can be prevented from exceeding the vertical operation capability of the bonding apparatus, so as to ensure that both ends of the first lead 5 can be bonded with the power chip 3 and the second frame section 412 respectively, and/or both ends of the second lead 7 can be bonded with the second frame section 412 and the driving chip 6 respectively.
Further, referring to fig. 3, Δ h 1 、△h 2 Further satisfies the following conditions: delta h 1 ≥△h 2 . So set up, when guaranteeing that first lead wire 5 and second lead wire 7 homoenergetic and second frame section 412 bonding, can reduce frame body 41's height to reduce power module 100's height, do benefit to the miniaturized design of power module 100, the distance between first frame section 411 and the second frame section 412 is less simultaneously, can improve frame body 41's structural strength, avoids frame body 41 to take place deformation. In addition, the distance between the power chip 3 and the first frame segment 411 may be increased, and the heat generated by the operation of the power chip 3 may be reduced from being transferred to the driving chip 6, thereby reducing the thermal influence on the driving chip 6.
For example, the distance between the surface of the substrate 2 adjacent to the side of the second frame section 412 and the surface of the second frame section 412 away from the substrate 2 is h 1 A side surface of the substrate 2 adjacent to the second frame section 412 and a side surface of the first frame section 411 remote from the substrate 2 are spaced apart by a distance H 1 Wherein H is 1 、h 1 Satisfies the following conditions: h 1 ＝2h 1 . That is, the side surface of the second frame section 412 remote from the substrate 2 is located in the middle between the power chip 3 and the driving chip 6. So set up, can make the length of first lead wire 5 the same with the length of second lead wire 7, and because first lead wire 5 and second lead wire 7 can be the same lead wire to can save the differentiation to the lead wire in the assembling process, further improve and produce efficiency on the market.
According to some embodiments of the present invention, the width of the second frame section 412 is smaller than the width of the first frame section 411 in the width direction of the substrate 2. With such an arrangement, firstly, since the driving chip 6 is disposed on the first frame section 411, the driving chip 6 can be conveniently mounted by making the width of the first frame section 411 larger; secondly, since the control pin 42 is connected to the first frame section 411, the structural strength of the first frame section 411 can be improved by making the width of the first frame section 411 larger, and deformation of the control pin 42 is avoided. By making the width of the second frame section 412 smaller, the width of the power module 100 can be reduced, facilitating a compact design of the power module 100.
According to some embodiments of the present invention, the first frame section 411 and the second frame section 412 are arranged at intervals along the width direction of the substrate 2, and the second frame section 412 and the substrate 2 are arranged at intervals along the width direction of the plastic package body 1. That is, the first frame segment 411 and the second frame segment 412 are spaced apart both in the width direction of the plastic package body 1 and in the thickness direction of the plastic package body 1 from the substrate 2. Thereby, the second frame section 412 is exposed between the substrate 2 and the first frame section 411, facilitating bonding of the first lead 5 and the second lead 7. Heat transfer may also be reduced.
Further, the frame further comprises a plurality of connecting segments 413, each connecting segment 413 is arranged between the first frame segment 411 and the second frame segment 412, and the plurality of connecting segments 413 are arranged at intervals along the length direction of the first frame segment 411. Referring to fig. 2 and 4, the number of the connection segments 413 is 11, the 11 connection segments 413 are spaced apart along the length direction of the first frame segment 411, and each connection segment 413 extends obliquely in a direction away from the second frame segment 412. Thereby, while the structural strength of the frame is ensured, the distance between the first frame section 411 and the second frame section 412 may be further reduced, and the thickness of the power module 100 may be further reduced.
In some alternative embodiments, the substrate 2 includes an insulating layer 21 and a first conductive layer 22, the first conductive layer 22 is disposed on a side surface of the insulating layer 21 adjacent to the frame body 41, and the power chip is disposed on the first conductive layer 22. Wherein the first conductive layer 22 is used for mounting the power chip 3 and other electronic components.
Optionally, the insulating layer 21 is exposed outside the plastic package body 1, and a surface of one side of the insulating layer 21 away from the first conductive layer 22 is flush with a surface of one side of the plastic package body 1 in the thickness direction. With such an arrangement, heat generated by the operation of the power module 100 can be transferred to the outside through the first conductive layer 22, so as to dissipate heat of the power module 100.
Further, as shown in fig. 3, the substrate 2 further includes a second conductive layer 23, and the first conductive layer 22 and the second conductive layer 23 are respectively provided on both sides of the insulating layer 21 in the thickness direction. Optionally, the second conductive layer 23 is exposed outside the plastic package body 1, and a surface of one side of the second conductive layer 23 away from the insulating layer 21 is flush with a surface of one side of the plastic package body 1 in the thickness direction. The second conductive layer 23 may be exposed outside the plastic package body 1, and heat generated by the operation of the power module 100 may be transferred to the outside through the second conductive layer 23, so as to dissipate heat of the power module 100. One side surface of the thickness direction of the second conductive layer 23 is flush with one side surface of the thickness direction of the plastic package body 1, so that the one side surface of the thickness direction of the plastic package body 1 is a flat surface, the power module 100 can be attached to a radiator, and the power module 100 can be rapidly cooled.
According to some embodiments of the present invention, referring to fig. 1 in combination with fig. 3, the power pin 43 is electrically connected with the power chip 3 through the third lead 8. Optionally, the wire diameter of the third lead 8 is larger than the wire diameter of the first lead 5, and the wire diameter of the third lead 8 is larger than the wire diameter of the second lead 7. For example, the third lead 8 may be a thick aluminum wire to ensure the connection reliability of the power chip 3 and the power pin 43.
The control pin 42 is electrically connected to the driving chip 6 through the fourth lead 9. Optionally, the wire diameter of the fourth lead 9 is smaller than the wire diameter of the third lead 8. The wire diameter of the fourth lead 9 may be the same as the wire diameter of the first lead 5 and the wire diameter of the second lead 7. For example, the fourth lead 9 may be a gold wire.
In some alternative embodiments, each power chip 3 may include an IGBT chip 31 and a freewheeling diode 32, the IGBT chip 31 may be disposed on the control side of the substrate 2, the freewheeling diode 32 may be disposed on the power side of the substrate 2, the IGBT chip 31 is electrically connected to the freewheeling diode 32 through a thick aluminum wire, the freewheeling diode 32 is electrically connected to the corresponding power pin 43 through a thick aluminum wire, the IGBT chip 31 and the driver chip 6 are electrically connected to the frame body 41 through gold wires, so as to electrically connect the IGBT chip 31 and the driver chip 6, and the driver chip 6 is electrically connected to the control pin 42 through a gold wire.
In further alternative embodiments, the freewheeling diode 32 may be integrated on the IGBT chip 31 to form the power chip 3.
The power chip 3 may also be a MOSFET chip.
An electronic device (not shown) according to an embodiment of the second aspect of the invention comprises the power module 100 according to the above-described embodiment of the first aspect of the invention.
According to the electronic device of the embodiment of the invention, by adopting the power module 100, the bonding efficiency is greatly improved, and the production efficiency of the electronic device is favorably improved.
Other configurations and operations of electronic devices according to embodiments of the present invention are known to those of ordinary skill in the art and will not be described in detail herein.
In the description of the present invention, it is to be understood that the terms "center", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like, indicate orientations and positional relationships based on those shown in the drawings, and are used only for convenience in describing the present invention and simplifying the description, but do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention.
In the description of the present application, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present application can be understood in a specific case by those of ordinary skill in the art.
In the description of the present specification, reference to the description of "one embodiment," "some embodiments," "an illustrative embodiment," "an example," "a specific example," or "some examples" or the like means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example.
While embodiments of the invention have been shown and described, it will be understood by those of ordinary skill in the art that: various changes, modifications, substitutions and alterations can be made to the embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.
Claims (12)
1. A power module, comprising:
molding the body;
the substrate is arranged on the plastic package body, and the two sides of the substrate in the width direction are respectively a control side and a power side;
the power chips are arranged on the substrate and are arranged at intervals along the length direction of the substrate;
the frame comprises a frame body, a plurality of control pins and a plurality of power pins, wherein the frame body is arranged in the plastic package body, the frame body is positioned on the control side of the substrate, the frame body is spaced from the substrate on the side of the substrate where the power chip is positioned, the control pins are positioned on the control side, one end of each control pin is connected with the frame body, the other end of each control pin extends out of the plastic package body, the power pins are positioned on the power side, one end of each power pin is electrically connected with the power chip, and the other end of each power pin extends out of the plastic package body, wherein the frame body comprises a first frame section and a second frame section, the second frame section is positioned between the first frame section and the substrate in the thickness direction of the substrate, and the second frame section is electrically connected with the power chip through a first lead;
at least one driver chip disposed on the first frame section;
the driving chip is electrically connected with the second frame section through a second lead, and the driving chip and the power chip are electrically connected through the second lead, the second frame section and the first lead; or
The first frame section and the second frame section are connected with each other, the driving chip is electrically connected with the first frame section through a fifth lead, and the driving chip and the power chip are electrically connected through the fifth lead, the first frame section, the second frame section and the first lead.
2. The power module according to claim 1, wherein the first lead and the second lead are made of the same material, or the first lead and the fifth lead are made of the same material.
3. The power module according to claim 2, wherein the first lead and the second lead are both gold wires, or wherein the first lead and the fifth lead are both gold wires.
4. The power module of claim 1, wherein the substrate is adjacent to the second frame segmentIs different from a side surface of the second frame segment away from the substrate by a height difference of delta h 1 Wherein said Δ h 1 Satisfies the following conditions: delta h less than or equal to 0mm 1 Less than 2.3mm; and/or
The height difference between the surface of one side of the second frame section far away from the substrate and the surface of one side of the first frame section far away from the substrate is delta h 2 Wherein said Δ h 2 Satisfies the following conditions: delta h less than or equal to 0mm 2 ＜2.3mm。
5. The power module of claim 1, wherein a height difference between a side surface of the base plate adjacent to the second frame segment and a side surface of the second frame segment remote from the base plate is Δ h 1 The height difference between the surface of one side of the second frame section far away from the substrate and the surface of one side of the first frame section far away from the substrate is delta h 2 Wherein said Δ h 1 、△h 2 Satisfies the following conditions: delta h 1 ≥△h 2 。
6. The power module of claim 1, wherein a width of the second frame segment is less than a width of the first frame segment in a width direction of the substrate.
7. The power module of any of claims 1-6, wherein the first frame segment and the second frame segment are spaced apart along a width of the substrate, and the second frame segment and the substrate are spaced apart along a width of the molded body.
8. The power module of claim 7, wherein the frame further comprises:
the connecting sections are arranged between the first frame section and the second frame section and are arranged at intervals along the length direction of the first frame section;
each of the connecting sections extends obliquely in a direction away from the second frame section.
9. The power module according to claim 1, wherein the substrate includes an insulating layer and a first conductive layer, the first conductive layer is disposed on a side surface of the insulating layer adjacent to the frame body, the power chip is disposed on the first conductive layer, the insulating layer is exposed outside the plastic package body, and a side surface of the insulating layer away from the first conductive layer is flush with a side surface of the plastic package body in a thickness direction.
10. The power module of claim 9, wherein the substrate further comprises:
the second conducting layer, first conducting layer with the second conducting layer is established respectively the both sides of the thickness direction of insulating layer, the second conducting layer exposes outside the plastic envelope body, just keeping away from of second conducting layer one side surface of insulating layer with one side surface parallel and level of the thickness direction of the plastic envelope body.
11. The power module of claim 10, wherein the first and second conductive layers are both copper layers and the insulating layer is a ceramic layer.
12. An electronic device, characterized in that it comprises a power module according to any one of claims 1-11.
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| CN202310072983.9A CN115939073A (en) | 2023-01-31 | 2023-01-31 | Power module and electronic equipment thereof |
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| CN202310072983.9A CN115939073A (en) | 2023-01-31 | 2023-01-31 | Power module and electronic equipment thereof |
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| CN115939073A true CN115939073A (en) | 2023-04-07 |
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| CN116631972A (en) * | 2023-04-28 | 2023-08-22 | 海信家电集团股份有限公司 | Power module and electronic equipment with same |
| CN116666341A (en) * | 2023-04-28 | 2023-08-29 | 海信家电集团股份有限公司 | Intelligent power module and electronic equipment with same |
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