CN218825445U - Computer CPU heat abstractor convenient to installation is fixed - Google Patents

Computer CPU heat abstractor convenient to installation is fixed Download PDF

Info

Publication number
CN218825445U
CN218825445U CN202222679840.8U CN202222679840U CN218825445U CN 218825445 U CN218825445 U CN 218825445U CN 202222679840 U CN202222679840 U CN 202222679840U CN 218825445 U CN218825445 U CN 218825445U
Authority
CN
China
Prior art keywords
heat
heat dissipation
module
installation
support
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202222679840.8U
Other languages
Chinese (zh)
Inventor
车葵
邢宇晨
陈广智
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Zhengzhou University of Aeronautics
Original Assignee
Zhengzhou University of Aeronautics
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Zhengzhou University of Aeronautics filed Critical Zhengzhou University of Aeronautics
Priority to CN202222679840.8U priority Critical patent/CN218825445U/en
Application granted granted Critical
Publication of CN218825445U publication Critical patent/CN218825445U/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02DCLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
    • Y02D10/00Energy efficient computing, e.g. low power processors, power management or thermal management

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

The utility model discloses a computer CPU heat abstractor convenient to installation is fixed, including water-cooling component, heat pipe heat dissipation module and fixing support subassembly, water-cooling component's both sides are provided with the motor storehouse, and the inside in motor storehouse is provided with radiator fan, radiator fan's output is provided with the heat conduction air exit, heat pipe heat dissipation module is installed in water-cooling component's top, and the top both ends of heat pipe heat dissipation module are provided with the auxiliary stand, the fin is installed to the both sides of heat pipe heat dissipation module, fixing support unit mount is in the bottom of fin. This computer CPU heat abstractor convenient to installation is fixed utilizes water cooling module can directly effectively dispel the heat to CPU, and unnecessary heat accessible heat pipe heat dissipation module further disperses it simultaneously, and utilizes the fin at both ends can further assist and disperse the heat that CPU released, utilizes the fixing support subassembly to make whole heat abstractor can be stable install on the mainboard while still simplified the mounting means.

Description

Computer CPU heat abstractor convenient to installation is fixed
Technical Field
The utility model relates to a heat dissipation technical field specifically is a computer CPU heat abstractor convenient to installation is fixed.
Background
The CPU can generate a large amount of heat when working, if the heat is not dissipated in time, the heat is easy to crash, the CPU can be burnt out, and the CPU radiator is used for radiating the CPU. The heat radiator plays a decisive role in the stable operation of the CPU, wherein the CPU heat radiator can be divided into air cooling, heat pipe and water cooling according to the heat radiation mode.
The utility model discloses a low noise CPU radiator as application number CN 202121286669.3's utility model discloses a this low noise CPU radiator is through being provided with protective structure, first protecting band and second protecting band are the bonding in the inside of blade and have certain toughness, under its combined action, can prevent that the blade from producing crackle or fracture and splash, damage other parts, the life who increases the device has been realized, prevent the blade fracture, but the structural unable stable assembly of CPU heat abstractor itself similar to in above-mentioned file, lack the convenient installation that the structure that corresponds helped whole device.
In view of the above, a computer CPU heat dissipation device that is easy to mount and fix is proposed to overcome the drawbacks of the conventional structure.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a computer CPU heat abstractor convenient to installation is fixed to solve the problem that proposes among the above-mentioned background art.
In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a computer CPU heat abstractor convenient to installation is fixed, includes water-cooling subassembly, heat pipe heat dissipation module and fixing support subassembly, water-cooling subassembly's both sides are provided with the motor storehouse, and the inside in motor storehouse is provided with radiator fan, radiator fan's output is provided with the heat conduction air exit, heat pipe heat dissipation module is installed in water-cooling subassembly's top, and the top both ends of heat pipe heat dissipation module are provided with the auxiliary stand, the fin is installed to heat pipe heat dissipation module's both sides, fixing support unit mount is in the bottom of fin, the fixing support subassembly includes main support, middle part pillar, fixing bolt, balanced support and stabilizing bolt, one side of main support is connected with the middle part pillar, and the top of middle part pillar is provided with fixing bolt, one side that the main support was kept away from to the middle part pillar is connected with balanced support, and the top of balanced support is provided with stabilizing bolt.
Further, the water-cooling subassembly includes heat dissipation storehouse, heat-conducting layer, heat dissipation calandria and heat conduction sheet layer, the surface in heat dissipation storehouse is provided with the heat-conducting layer, and the inside in heat dissipation storehouse is erect and is equipped with the heat dissipation calandria, be provided with the heat conduction sheet layer between the heat dissipation calandria.
Further, heat pipe heat dissipation module includes imbibition core pipe, steam passageway, cooling segment, braced frame and heat dissipation net, imbibition core pipe's surface is surrounded there is steam passageway, and the both ends of imbibition core pipe are provided with the cooling segment, one side of imbibition core pipe is provided with braced frame, and one side that braced frame kept away from imbibition core pipe is provided with the heat dissipation net.
Furthermore, the auxiliary support is symmetrically arranged with the vertical central axis of the heat pipe heat dissipation module, and the radiating fins are symmetrically and fixedly installed with the vertical central axis of the heat pipe heat dissipation module.
Furthermore, the motor cabin is symmetrically and fixedly installed by the vertical central axis of the water cooling component, and the horizontal central axis of the motor cabin of the cooling fan is symmetrically installed.
Furthermore, the fixed support component is symmetrically and fixedly installed by using the vertical central axis of the water cooling component, and the water cooling component, the heat pipe radiating module, the radiating fin and the fixed support component are in combined connection in a shape like a Chinese character 'chi'.
Furthermore, the steam channel spirally surrounds the surface of the liquid absorption core pipe, and the cooling sections are symmetrically connected and installed by the vertical middle axis of the liquid absorption core pipe.
The utility model provides a computer CPU heat abstractor convenient to installation is fixed possesses following beneficial effect:
1. the water cooling assembly can be used for directly contacting the CPU to effectively dissipate heat, meanwhile, redundant heat can be further dissipated through the heat pipe heat dissipation module when redundant heat is generated, heat released by the CPU can be further dissipated in an auxiliary mode through the heat dissipation fins at the two ends, and the mounting mode is simplified when the fixing support assembly is used for enabling the whole heat dissipation device to be stably mounted on the mainboard.
2. The utility model discloses, through having set up water cooling unit, utilize the heat-conducting layer can be fast with the heat that produces when CPU functions directly transmit the core temperature in order to reduce CPU in the heat dissipation storehouse, utilize the inside radiator fan of the motor storehouse inside that the heat dissipation storehouse set up to take the inside in the scattered hot storehouse of heat dissipation calandria conduction heat fast simultaneously, also can help forcing the heat of CPU side to send out through wind-force and dissipate.
3. The utility model discloses, through having set up heat pipe heat dissipation module, when CPU work reached the certain degree and the heat that gives off can't in time dispel the heat through water-cooling components, the heat of surplus can transmit the inside of heat pipe heat dissipation magic cube through the heat-conducting layer at heat dissipation storehouse top, utilizes steam channel to cool down heat transmission to the cooling zone, utilizes the fin of cooling zone side to assist quick heat dissipation simultaneously.
4. The utility model discloses, through having set up the fixing support subassembly, aim at the mounting hole on the mainboard of required installation with the hole of middle part pillar and balanced support after, twist fixing bolt and stabilizing bolt respectively wherein can be quick convenient whole heat abstractor of installation, the fixing support subassembly can be in the stable condition of having supported whole device and avoiding appearing the installation skew in both sides again simultaneously.
Drawings
FIG. 1 is a schematic side view of a computer CPU heat sink device of the present invention;
FIG. 2 is a schematic structural view of a heat pipe heat dissipation module of the computer CPU heat dissipation device of the present invention, which is convenient for installation and fixation;
fig. 3 is the utility model relates to a computer CPU heat abstractor's fixing support subassembly spatial structure schematic diagram convenient to installation is fixed.
In the figure: 1. a water-cooling assembly; 101. a heat dissipation bin; 102. a heat conductive layer; 103. a heat dissipation calandria; 104. a heat-conducting plate layer; 2. a motor compartment; 3. a heat radiation fan; 4. a heat-conducting air outlet; 5. a heat pipe heat dissipation module; 501. a wick tube; 502. a steam channel; 503. a cooling section; 504. a support frame; 505. a heat dissipation grid; 6. an auxiliary support; 7. a heat sink; 8. a fixed support assembly; 801. a main support; 802. a middle strut; 803. fixing the bolt; 804. a balance bracket; 805. and stabilizing the bolt.
Detailed Description
The following describes embodiments of the present invention in further detail with reference to the accompanying drawings and examples. The following examples are provided to illustrate the invention but are not intended to limit the scope of the invention.
As shown in fig. 1-2, a computer CPU heat dissipation device convenient for installation and fixation includes a water cooling component 1, a heat pipe heat dissipation module 5 and a fixed support component 8, a motor chamber 2 is disposed on two sides of the water cooling component 1, a heat dissipation fan 3 is disposed inside the motor chamber 2, an output end of the heat dissipation fan 3 is provided with a heat conduction air outlet 4, the heat pipe heat dissipation module 5 is installed on a top of the water cooling component 1, and two ends of a top of the heat pipe heat dissipation module 5 are provided with auxiliary supports 6, heat dissipation fins 7 are installed on two sides of the heat pipe heat dissipation module 5, the fixed support component 8 is installed on a bottom of the heat dissipation fins 7, the water cooling component 1 includes a heat dissipation chamber 101, a heat conduction layer 102, a heat dissipation calandria 103 and a heat conduction layer 104, a heat dissipation calandria 103 is installed on a surface of the heat dissipation chamber 101, a heat conduction plate layer 104 is installed between the heat dissipation calandria 103, the motor chamber 2 is symmetrically installed with a vertical central axis of the water cooling component 1, and the motor chamber 2 is installed symmetrically, when the CPU operates, the heat dissipation calandria high temperature can be continuously released, the heat dissipation calandria heat dissipation fluid can be directly transmitted to the heat dissipation chamber 101 through the heat dissipation chamber 101, the heat dissipation fan 2, and the heat dissipation chamber can be quickly circulated and the heat dissipation fluid can be absorbed by the heat dissipation fluid 103, and the heat dissipation chamber 101, and the heat dissipation fluid can be quickly.
The fixing support assembly 8 comprises a main support 801, a middle support 802, a fixing bolt 803, a balance support 804 and a stabilizing bolt 805, wherein the middle support 802 is connected to one side of the main support 801, the fixing bolt 803 is arranged at the top end of the middle support 802, the balance support 804 is connected to one side, far away from the main support 801, of the middle support 802, the stabilizing bolt 805 is arranged at the top of the balance support 804, the fixing support assembly 8 is symmetrically and fixedly installed with the vertical central axis of the water cooling assembly 1, the heat pipe heat dissipation module 5, the radiating fins 7 and the fixing support assembly 8 are connected in a combined shape like a Chinese character 'chi', after holes of the middle support 802 and the balance support 804 are aligned to installation holes in a mainboard to be installed, the fixing bolt 803 and the stabilizing bolt 805 are respectively screwed into the installation holes, the whole heat dissipation device can be installed quickly and conveniently, and meanwhile, the fixing support assembly 8 can stably support the whole device at two sides to avoid installation deviation.
The heat pipe heat dissipation module 5 includes a wick core pipe 501, a steam channel 502, a cooling section 503, a support frame 504 and a heat dissipation grid 505, the steam channel 502 surrounds the surface of the wick core pipe 501, the cooling section 503 is disposed at two ends of the wick core pipe 501, the support frame 504 is disposed at one side of the wick core pipe 501, the heat dissipation grid 505 is disposed at one side of the support frame 504 away from the wick core pipe 501, the steam channel 502 spirally surrounds the surface of the wick core pipe 501, the cooling section 503 is symmetrically connected and mounted with the vertical central axis of the wick core pipe 501, the auxiliary support 6 is symmetrically disposed with the vertical central axis of the heat pipe heat dissipation module 5, and the heat dissipation fins 7 are symmetrically and fixedly mounted with the vertical central axis of the heat pipe heat dissipation module 5, when the CPU runs to a certain power, the generated high temperature cannot be timely dissipated by the water cooling module 1, the rest heat can be transferred to the heat pipe heat dissipation module 5 through the heat conduction layer 102, when the heat pipe heat dissipation module 5 runs, the steam channel 502 absorbs heat, acetone liquid in the wick core pipe 501 is heated and boiled into steam, and then the steam with heat is continuously condensed to the capillary tube cooling section 503, and the steam is repeatedly transferred to the capillary tube wall 501.
In summary, as shown in fig. 1-3, when the heat dissipation device for a computer CPU is used, first, the fixing support assembly 8 is used to align the holes of the middle pillar 802 and the balance bracket 804 with the mounting holes of the motherboard to be mounted, and then the fixing bolts 803 and the stabilizing bolts 805 are screwed into the holes respectively, so that the whole heat dissipation device can be mounted quickly and conveniently;
when the CPU operates, high temperature is continuously released, the high temperature is directly conducted into the heat dissipation chamber 101 through the heat conduction layer 102 at the bottom of the heat dissipation chamber 101, cooling liquid circulates inside the heat dissipation calandria 103 arranged inside the heat dissipation chamber 101, the heat is absorbed by the circulation flow of the cooling liquid inside the heat dissipation calandria 103, the heat conduction plate layer 104 quickly transfers temperature between the heat dissipation calandria 103, meanwhile, a part of heat is conducted to the motor chambers 2 at the two sides of the heat dissipation chamber 101, and the heat is quickly transferred away from the heat conduction exhaust outlet 4 by using wind energy through the heat dissipation fans 3 operating inside the motor chambers 2; when the CPU runs to a certain power, and the generated high temperature cannot be dissipated by the water cooling module 1 in time, the remaining heat will transfer the heat to the heat pipe heat dissipation module 5 through the heat conduction layer 102, when the heat pipe heat dissipation module 5 runs, the steam channel 502 absorbs the heat, so that the acetone liquid in the wick core pipe 501 is heated and boiled into steam, then the steam with heat moves from the surrounding steam channel 502 on the surface of the wick core pipe 501 to the cooling section 503 thereof, when the steam transfers the heat to the cooling section 503, the steam is condensed into liquid, then the condensed liquid returns to the steam channel 502 through the capillary action of the wick on the wall of the wick core pipe 501, and meanwhile, the heat dissipation grid 505 and the support frame 504 assist in dissipating the heat while supporting and protecting the heat pipe heat dissipation module 5, so that the above-mentioned cycle process is repeated to dissipate the heat continuously.
The embodiments of the present invention have been presented for purposes of illustration and description, and are not intended to be exhaustive or limited to the invention in the form disclosed. Many modifications and variations will be apparent to those of ordinary skill in the art. The embodiment was chosen and described in order to best explain the principles of the invention and the practical application, and to enable others of ordinary skill in the art to understand the invention for various embodiments with various modifications as are suited to the particular use contemplated.

Claims (7)

1. The utility model provides a computer CPU heat abstractor convenient to installation is fixed, includes water cooling module (1), heat pipe heat dissipation module (5) and fixing support subassembly (8), its characterized in that: the utility model discloses a water-cooling module, including water-cooling module (1), heat pipe heat dissipation module (8), fixing support subassembly (8), cooling fin (7), heat pipe heat dissipation module (5), auxiliary support (6) are installed at the top of water-cooling module (1), and the top both ends of heat pipe heat dissipation module (5), fin (7) are installed to the both sides of heat pipe heat dissipation module (5), install in the bottom of fin (7) fixing support subassembly (8), fixing support subassembly (8) are including main support pillar (801), middle part pillar (802), fixing bolt (803), balanced support (804) and stabilizing bolt (805), one side of main support pillar (801) is connected with middle part pillar (802), and the top of middle part pillar (802) is provided with fixing bolt (803), one side that main support pillar (801) was kept away from to middle part pillar (802) is connected with balanced support (804), and the top of balanced support (804) is provided with stabilizing bolt (805).
2. The computer CPU heat sink convenient for installation and fixation as claimed in claim 1, wherein the water cooling assembly (1) comprises a heat dissipation chamber (101), a heat conduction layer (102), heat dissipation pipes (103) and a heat conduction plate layer (104), the heat conduction layer (102) is disposed on the surface of the heat dissipation chamber (101), the heat dissipation pipes (103) are erected inside the heat dissipation chamber (101), and the heat conduction plate layer (104) is disposed between the heat dissipation pipes (103).
3. The computer CPU heat dissipation device convenient to mount and fix as claimed in claim 1, wherein the heat pipe heat dissipation module (5) comprises a liquid core pipe (501), a steam channel (502), a cooling section (503), a support frame (504) and a heat dissipation grid (505), the steam channel (502) is surrounded on the surface of the liquid core pipe (501), the cooling section (503) is disposed at two ends of the liquid core pipe (501), the support frame (504) is disposed at one side of the liquid core pipe (501), and the heat dissipation grid (505) is disposed at one side of the support frame (504) away from the liquid core pipe (501).
4. The computer CPU heat sink device convenient for installation and fixation according to claim 1, wherein the auxiliary bracket (6) is symmetrically arranged with respect to the vertical central axis of the heat pipe heat sink module (5), and the heat sink fins (7) are symmetrically and fixedly installed with respect to the vertical central axis of the heat pipe heat sink module (5).
5. The computer CPU heat sink convenient for installation and fixation according to claim 1, wherein the motor chamber (2) is symmetrically and fixedly installed with respect to the vertical central axis of the water cooling module (1), and the heat dissipation fan (3) is symmetrically installed with respect to the horizontal central axis of the motor chamber (2).
6. The computer CPU heat dissipation device convenient for installation and fixation of claim 1, wherein the fixing support components (8) are symmetrically and fixedly installed on a vertical central axis of the water cooling component (1), and the water cooling component (1), the heat pipe heat dissipation module (5), the heat dissipation fins (7) and the fixing support components (8) are in combined connection in a shape of Chinese character 'chi'.
7. The computer CPU heat sink device convenient for installation and fixation as claimed in claim 3, wherein said steam channel (502) is spirally wound around the surface of the wick tube (501), and said cooling section (503) is symmetrically installed with the vertical central axis of the wick tube (501).
CN202222679840.8U 2022-10-12 2022-10-12 Computer CPU heat abstractor convenient to installation is fixed Active CN218825445U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202222679840.8U CN218825445U (en) 2022-10-12 2022-10-12 Computer CPU heat abstractor convenient to installation is fixed

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202222679840.8U CN218825445U (en) 2022-10-12 2022-10-12 Computer CPU heat abstractor convenient to installation is fixed

Publications (1)

Publication Number Publication Date
CN218825445U true CN218825445U (en) 2023-04-07

Family

ID=87250692

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202222679840.8U Active CN218825445U (en) 2022-10-12 2022-10-12 Computer CPU heat abstractor convenient to installation is fixed

Country Status (1)

Country Link
CN (1) CN218825445U (en)

Similar Documents

Publication Publication Date Title
CN207301955U (en) A kind of radiator of host computer
CN108268110A (en) A kind of area of computer aided radiator
CN108519805A (en) A kind of efficient auxiliary radiating device of computer
CN202887086U (en) Side-blown water-cooled central processing unit (CPU) radiator
CN218825445U (en) Computer CPU heat abstractor convenient to installation is fixed
CN106132177A (en) A kind of cooling system of inverter
CN216991078U (en) Noise treatment and heat dissipation device for high-precision horizontal machining center
CN210666654U (en) Notebook computer mainboard heat dissipation mechanism
CN211047721U (en) Heat dissipation circuit board for fan
CN206774522U (en) A kind of chip heat radiator
CN209216031U (en) A kind of radiator on computer
CN220208210U (en) Novel computer radiator
CN219716062U (en) High-power radiator
CN219758750U (en) Computer heat abstractor
CN217011559U (en) Air-cooled water-cooled radiator for electronic equipment
CN218158944U (en) Temperature equalizing plate heat radiator of central processing chip board for super computer
CN215814058U (en) Notebook computer radiator
CN212112395U (en) Mounting structure of computer radiator
CN214221576U (en) Fan controller
CN219394574U (en) Shockproof generator
CN220511527U (en) Heat radiation protection device for photovoltaic inverter
CN214007307U (en) High-efficient heat dissipation high temperature resistant generating set
CN220963313U (en) FPGA chip cooling device
CN215896377U (en) Improved fin-type radiator structure of SIC power module
CN219019330U (en) Power supply shell with good heat dissipation effect

Legal Events

Date Code Title Description
GR01 Patent grant
GR01 Patent grant