CN214007307U - A high-efficiency heat dissipation and high temperature resistant generator set - Google Patents
A high-efficiency heat dissipation and high temperature resistant generator set Download PDFInfo
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- CN214007307U CN214007307U CN202120018507.5U CN202120018507U CN214007307U CN 214007307 U CN214007307 U CN 214007307U CN 202120018507 U CN202120018507 U CN 202120018507U CN 214007307 U CN214007307 U CN 214007307U
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Abstract
本实用新型涉及玩发电机组技术领域，具体为一种高效散热耐高温发电机组，包括发电机组外壳，所述发电机组外壳的内部设有毛细管，且毛细管的一端连接有汇流管，所述汇流管的顶部连接有抽取泵，且抽取泵固定在发电机组外壳顶部，所述抽取泵的输出端连接有输送管，且输送管的末端连接有散热板，所述散热板的另一端插接有连接管，且连接管的末端安装有冷却室，所述冷却室内部一侧设有散热管，且散热管的末端连接有水箱，所述水箱的一侧底端嵌合有半导体制冷片。本装置通过对水冷散热机构进行快速降温从而保证冷却液可以一直吸热，持续降低冷却液的吸热饱和度，从而实现发电机散热机构的高效散热，同时降低水冷机构的成本。
The utility model relates to the technical field of electric generator sets, in particular to a high-efficiency heat dissipation and high temperature resistant generator set, comprising a generator set casing, a capillary tube is arranged inside the generator set casing, and one end of the capillary tube is connected with a confluence pipe. The top of the pump is connected with an extraction pump, and the extraction pump is fixed on the top of the casing of the generator set. A cooling chamber is installed at the end of the connecting pipe, a heat dissipation pipe is arranged on one side of the interior of the cooling chamber, and the end of the heat dissipation pipe is connected with a water tank, and a bottom end of one side of the water tank is fitted with a semiconductor refrigeration sheet. The device rapidly cools the water-cooled heat-dissipating mechanism to ensure that the cooling liquid can absorb heat all the time, and continuously reduces the heat-absorbing saturation of the cooling liquid, thereby realizing the efficient heat dissipation of the generator heat-dissipating mechanism and reducing the cost of the water-cooling mechanism.
Description
Technical Field
The utility model relates to a play generating set technical field, specifically a high-efficient heat dissipation high temperature resistant generating set.
Background
The radiator is a main part of a generator set cooling system and has the function of dissipating heat generated in the working process of the generator set into the air through cooling liquid, so the performance of the generator set is directly influenced by the performance of the radiator, and the performance requirement of the radiator is high due to high heat generation of the generator set.
Most of existing generator heat dissipation mechanisms adopt air cooling and water cooling, wherein the air cooling has requirements on the power of a generator, the generator with too high power is not suitable for air cooling, the water cooling has a better effect than the air cooling, but the manufacturing cost is more expensive, and the saturation of the water cooling is limited, so that the generator is inconvenient, and certain influence is brought in the using process. Therefore, the person skilled in the art provides a high-efficiency heat-dissipation high-temperature-resistant generator set to solve the problems mentioned in the above background art.
Disclosure of Invention
An object of the utility model is to provide a high-efficient heat dissipation high temperature resistant generating set to solve the problem that proposes in the above-mentioned background art.
In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a high-efficient heat dissipation high temperature resistant generating set, includes the generating set shell, the inside of generating set shell is equipped with the capillary, and the one end of capillary is connected with the collector pipe, the top of collector pipe is connected with the extraction pump, and the extraction pump is fixed at generating set shell top, the output of extraction pump is connected with the conveyer pipe, and the end-to-end connection of conveyer pipe has the heating panel, the other end of heating panel is pegged graft and is had the connecting pipe, and the end-to-end installation of connecting pipe has the cooling chamber, inside one side of cooling chamber is equipped with the cooling tube, and the end-to-end connection of cooling tube has the water tank, one side bottom gomphosis of water tank has the semiconductor refrigeration piece, and the refrigeration of semiconductor refrigeration piece end equidistance is pegged graft and is had the transmission piece, the transmission piece extends to in the water tank.
As a further aspect of the present invention: the radiating pipe is in a circuitous structure in the cooling chamber, the radiating pipe is a copper material component, and radiating holes are formed in the side face of the cooling chamber and close to the radiating pipe.
As a further aspect of the present invention: the water tank is internally provided with an overflow plate at a position close to the transfer sheet, a guide pipe is inserted into one side of the overflow plate in the water tank, and the tail end of the guide pipe is connected with an atomizer.
As a further aspect of the present invention: the output end of the atomizer is connected with an expansion chamber, the bottom of the expansion chamber is connected with a mixing chamber, one side of the mixing chamber is connected with an inflator, and the other end of the mixing chamber is connected with a return pipe.
As a further aspect of the present invention: the capillary is located the upper and lower both ends of generating set shell, and the generating set components and parts are wrapped up to the capillary, be equipped with the fin between the capillary, and fin and generating set components and parts contact.
As a further aspect of the present invention: the conveyer pipe is located inside one section of heating panel and is the surrounding type dish and close up in the heating panel, and the rear end gomphosis of heating panel has a set of fan, connecting pipe and conveyer pipe end connection.
As a further aspect of the present invention: the water tank is wrapped by a heat insulation material, the bottom of the water tank is arranged at the mounting position of the semiconductor refrigeration piece and is designed into a concave structure, the hot end of the semiconductor refrigeration piece is connected with a heat dissipation plate, and the heat dissipation plate penetrates through the cooling chamber and extends to the outside.
Compared with the prior art, the beneficial effects of the utility model are that: the device can ensure that the cooling liquid can absorb heat all the time by rapidly cooling the water cooling heat dissipation mechanism, continuously reduce the heat absorption saturation of the cooling liquid, thereby realizing the high-efficiency heat dissipation of the heat dissipation mechanism of the generator, and simultaneously reduce the cost of the water cooling mechanism, most of the traditional water cooling mechanisms utilize the compressor to dissipate the heat of the cooling liquid, however, the price of the compressor is too high, so the device can dissipate the heat of the cooling liquid through the semiconductor refrigerating sheet and other heat dissipation mechanisms, after the cooling liquid in the device absorbs the heat of the generator set, the cooling liquid is firstly conveyed to the heat dissipation plate through the extraction pump, the cooling is firstly carried out through the fan, the conveying pipe is arranged in the heat dissipation plate in a winding way to increase the surface area so as to improve the cooling speed, then the cooling liquid enters the cooling chamber through the connecting pipe, the heat dissipation pipes are arranged in the cooling chamber, the heat dissipation pipes are arranged in a circuitous way to increase the surface area, and then the cooling liquid is injected into the water tank, the semiconductor refrigerating sheet is used for cooling, the cooling liquid is atomized through the atomizer, the atomized cooling liquid is conveyed into the capillary tube through pressurization of the inflator, heat absorption and cooling are carried out, and the heat absorption effect of the atomized cooling liquid is better.
Drawings
FIG. 1 is a schematic structural diagram of a high-efficiency heat-dissipation high-temperature-resistant generator set;
FIG. 2 is a schematic structural diagram of a cooling chamber in an efficient heat dissipation and high temperature resistance generator set;
fig. 3 is a schematic structural diagram of a heat dissipation mechanism in a generator set shell in a high-efficiency heat dissipation and high temperature resistance generator set.
In the figure: 1. a cooling chamber; 2. a connecting pipe; 3. a pump; 4. a heat dissipation plate; 5. a fan; 6. a delivery pipe; 7. a generator set housing; 8. a return pipe; 9. a radiating pipe; 10. a water tank; 11. a transfer sheet; 12. a semiconductor refrigeration sheet; 13. an overflow plate; 14. an inflator; 15. a mixing chamber; 16. an expansion chamber; 17. an atomizer; 18. a guide tube; 19. a collector pipe; 20. a heat sink; 21. a capillary tube.
Detailed Description
Please refer to fig. 1-3, in the embodiment of the utility model, a high-efficient heat dissipation high temperature resistant generating set, including generating set shell 7, generating set shell 7's inside is equipped with capillary 21, and capillary 21's one end is connected with collecting pipe 19, collecting pipe 19's top is connected with extraction pump 3, and extraction pump 3 fixes at generating set shell 7 top, extraction pump 3's output is connected with conveyer pipe 6, and conveyer pipe 6's end-to-end connection has heating panel 4, it has connecting pipe 2 to peg graft to the other end of heating panel 4, and connecting pipe 2's end is installed cooling chamber 1, 1 inside one side of cooling chamber is equipped with cooling tube 9, and the end-to-end connection of cooling tube 9 has water tank 10, one side bottom gomphosis of water tank 10 has semiconductor refrigeration piece 12, and the refrigeration end equidistance of semiconductor refrigeration piece 12 is pegged graft and is had transmission piece 11, transmission piece 11 extends to in the water tank 10.
In fig. 2, the heat dissipation pipe 9 is a circuitous structure in the cooling chamber 1, and the heat dissipation pipe 9 is a copper material member, the heat dissipation holes are opened on the side surface of the cooling chamber 1 and near the heat dissipation pipe 9, the heat dissipation pipe 9 is circuitously arranged to increase the surface area, the excellent heat conductivity of the copper material is utilized to rapidly cool the cooling liquid, and the heat dissipation holes are used to increase the circulation of the external air to accelerate the heat dissipation.
In fig. 2, the position of the water tank 10 close to the transfer sheet 11 is provided with the overflow plate 13, and the guide pipe 18 is inserted into one side of the overflow plate 13 in the water tank 10, the end of the guide pipe 18 is connected with the atomizer 17, the overflow plate 13 blocks the cooling liquid to slow down the flow velocity of the cooling liquid, so that the cooling liquid has better cooling effect.
In fig. 2, an expansion chamber 16 is connected to an output end of the atomizer 17, a mixing chamber 15 is connected to a bottom of the expansion chamber 16, an inflator 14 is connected to one side of the mixing chamber 15, and a return pipe 8 is connected to the other end of the mixing chamber 15, the expansion chamber 16 is used for temporarily storing the expansion chamber 16 after the cooled coolant is atomized by the atomizer 17, and the atomized coolant enters the mixing chamber 15 from the expansion chamber 16, is pressurized by the inflator 14, and is sprayed out through the return pipe 8 and enters the capillary tube 21.
In fig. 3, the capillary tubes 21 are located at the upper and lower ends of the generator set housing 7, the capillary tubes 21 wrap the generator set components, the heat sinks 20 are arranged between the capillary tubes 21, the heat sinks 20 are in contact with the generator set components, and heat generated by the generator is dissipated through the heat sinks 20 and then absorbed through the capillary tubes 21.
In fig. 1, a section of the conveying pipe 6 located inside the heat dissipation plate 4 is coiled and squated in the heat dissipation plate 4, the rear end of the heat dissipation plate 4 is embedded with a group of fans 5, the tail parts of the connecting pipe 2 and the conveying pipe 6 are connected, when the cooling liquid in the device absorbs heat of the generator set, the cooling liquid is firstly conveyed to the heat dissipation plate 4 through the extraction pump 3, the cooling is firstly carried out through the fans 5, the conveying pipe 6 is arranged around the heat dissipation plate 4 to increase the surface area, so that the cooling speed is increased, and then the cooling liquid enters the cooling chamber 1 through the connecting pipe 2.
In fig. 2, the outer parcel of water tank 10 has insulation material, and the installation department that the bottom of water tank 10 is located semiconductor refrigeration piece 12 designs into sunken column structure, and the hot junction of semiconductor refrigeration piece 12 is connected with the heating panel, and the heating panel runs through cooling chamber 1 and extends to outside, and insulation material prevents that the coolant liquid in the water tank 10 from absorbing external heat, and the sunken column structure of the bottom of water tank 10 can ensure that the cold junction air conditioning of semiconductor refrigeration piece 12 can be fully absorbed by the coolant liquid in the water tank 10.
The utility model discloses a theory of operation is: the heat generated by the generator of the device is radiated by the radiating fins 20 and then absorbed by the capillary tubes 21, then the heat absorbed cooling liquid is pumped out by the pump 3 (model: NX-C75) and sent into the heat dissipation plate 4 through the delivery pipe 6, the temperature is firstly reduced by the fan 5, the delivery pipe 6 is arranged in the heat dissipation plate 4 in a surrounding way to increase the surface area so as to improve the cooling speed, then the cooling liquid enters the cooling chamber 1 through the connecting pipe 2, the cooling liquid is arranged in a circuitous way again through the radiating pipe 9 to increase the surface area, the cooling liquid is rapidly cooled by utilizing the excellent heat conductivity of copper materials, the circulation of outside air is improved through the radiating holes to accelerate the heat dissipation, the cooling liquid temporarily exists in the water tank 10 and cools the water tank 10 through the semiconductor refrigerating sheet 12 (model: TECL-12706), and when the cooled cooling liquid is atomized by the atomizer 17 (model: M1007-2) and then temporarily stored in the expansion chamber 16, the atomized coolant enters the mixing chamber 15 from the expansion chamber 16, is pressurized by the inflator 14, and is then ejected through the return pipe 8 into the capillary tube 21.
The above-mentioned, only be the concrete implementation of the preferred embodiment of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art is in the technical scope of the present invention, according to the technical solution of the present invention and the utility model, the concept of which is equivalent to replace or change, should be covered within the protection scope of the present invention.
Claims (7)
1. The utility model provides a high-temperature resistant generating set of high-efficient heat dissipation, includes generating set shell (7), its characterized in that: the generator set is characterized in that a capillary tube (21) is arranged inside a generator set shell (7), one end of the capillary tube (21) is connected with a collecting tube (19), the top of the collecting tube (19) is connected with an extraction pump (3), the extraction pump (3) is fixed to the top of the generator set shell (7), the output end of the extraction pump (3) is connected with a conveying tube (6), the tail end of the conveying tube (6) is connected with a heat dissipation plate (4), the other end of the heat dissipation plate (4) is connected with a connecting tube (2) in an inserting mode, a cooling chamber (1) is installed at the tail end of the connecting tube (2), a heat dissipation tube (9) is arranged on one side inside the cooling chamber (1), the tail end of the heat dissipation tube (9) is connected with a water tank (10), a semiconductor refrigeration sheet (12) is embedded in the bottom end of one, the transfer sheet (11) extends into the water tank (10).
2. The high-efficiency heat-dissipation high-temperature-resistant generator set according to claim 1, wherein the heat-dissipation pipe (9) has a circuitous structure in the cooling chamber (1), the heat-dissipation pipe (9) is a copper member, and heat-dissipation holes are formed in the side surface of the cooling chamber (1) and near the heat-dissipation pipe (9).
3. The generator set with high efficiency and heat dissipation and high temperature resistance as claimed in claim 1, wherein an overflow plate (13) is arranged inside the water tank (10) and close to the transfer plate (11), a guide pipe (18) is inserted into one side of the overflow plate (13) inside the water tank (10), and the end of the guide pipe (18) is connected with an atomizer (17).
4. A high-efficiency heat-dissipation high-temperature-resistant generator set according to claim 3, wherein the output end of the atomizer (17) is connected with an expansion chamber (16), the bottom of the expansion chamber (16) is connected with a mixing chamber (15), one side of the mixing chamber (15) is connected with an inflator (14), and the other end of the mixing chamber (15) is connected with a return pipe (8).
5. The generator set with the characteristics of claim 1, wherein the capillaries (21) are positioned at the upper end and the lower end of the generator set shell (7), the capillaries (21) wrap generator set components, the heat dissipation fins (20) are arranged between the capillaries (21), and the heat dissipation fins (20) are in contact with the generator set components.
6. The generator set with high efficiency, heat dissipation and high temperature resistance as claimed in claim 1, wherein a section of the conveying pipe (6) located inside the heat dissipation plate (4) is coiled and squated in the heat dissipation plate (4), a group of fans (5) is embedded in the rear end of the heat dissipation plate (4), and the connecting pipe (2) is connected with the tail of the conveying pipe (6).
7. The efficient heat-dissipation high-temperature-resistant generator set according to claim 1, wherein the water tank (10) is wrapped with a heat-insulating material, the bottom of the water tank (10) is designed into a concave structure at the installation position of the semiconductor refrigeration sheet (12), the hot end of the semiconductor refrigeration sheet (12) is connected with a heat dissipation plate, and the heat dissipation plate extends to the outside through the cooling chamber (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120018507.5U CN214007307U (en) | 2021-01-06 | 2021-01-06 | A high-efficiency heat dissipation and high temperature resistant generator set |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120018507.5U CN214007307U (en) | 2021-01-06 | 2021-01-06 | A high-efficiency heat dissipation and high temperature resistant generator set |
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| Publication Number | Publication Date |
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| CN214007307U true CN214007307U (en) | 2021-08-20 |
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| CN202120018507.5U Active CN214007307U (en) | 2021-01-06 | 2021-01-06 | A high-efficiency heat dissipation and high temperature resistant generator set |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113914987A (en) * | 2021-09-09 | 2022-01-11 | 武汉理工大学 | Waterwheel type intelligent heat dissipation device |
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2021
- 2021-01-06 CN CN202120018507.5U patent/CN214007307U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113914987A (en) * | 2021-09-09 | 2022-01-11 | 武汉理工大学 | Waterwheel type intelligent heat dissipation device |
| CN113914987B (en) * | 2021-09-09 | 2025-01-21 | 武汉理工大学 | Waterwheel type intelligent cooling device |
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Effective date of registration: 20250731 Address after: 225651 Jiangsu Province Yangzhou City Gaoyou City Songqiao Town Guo Ling Road 88 Haizhou District Patentee after: Yangzhou Jinpeng Photovoltaic Power Generation Co.,Ltd. Country or region after: China Address before: No. 79, Xingling Road, hailing Industrial Park, Hailing District, Taizhou City, Jiangsu Province 225300 Patentee before: Jiangsu Sudong Power Equipment Co.,Ltd. Country or region before: China |