CN218735162U - Low-loss transformer circuit board - Google Patents
Low-loss transformer circuit board Download PDFInfo
- Publication number
- CN218735162U CN218735162U CN202222829125.8U CN202222829125U CN218735162U CN 218735162 U CN218735162 U CN 218735162U CN 202222829125 U CN202222829125 U CN 202222829125U CN 218735162 U CN218735162 U CN 218735162U
- Authority
- CN
- China
- Prior art keywords
- copper sheet
- heat dissipation
- heat conduction
- circuit board
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/14—Thermal energy storage
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model relates to a circuit board technical field just discloses a low-loss type transformer circuit board, the device comprises a device body, the device body has included heat abstractor one, heat abstractor two and circuit board, the inside of heat abstractor two is provided with the backup pad, the inside of heat abstractor two is provided with the condenser pipe, equal fixed connection is equipped with the heat conduction piece on the side that the backup pad was kept away from, the entrance point and the exit end of condenser pipe all are connected with the pipeline, the inside top and the bottom of heat abstractor two are provided with the elasticity copper sheet, the lower extreme of elasticity copper sheet is provided with heat dissipation copper sheet three, two be provided with heat dissipation copper sheet two between the heat dissipation copper sheet three. The arrangement of the condensation pipe and the pipeline in the low-loss transformer circuit board enhances the heat dissipation efficiency of the device, thereby reducing excessive loss caused by high temperature, and the arrangement of the elastic copper sheet enhances the strength of the device.
Description
Technical Field
The utility model relates to a circuit board technical field specifically is a low-loss type transformer circuit board.
Background
The circuit board makes the circuit miniaturized, direct-viewing, play an important role in fixed circuit's batch production and optimization electrical apparatus overall arrangement, and the circuit board can be called printed wiring board or printed circuit board, and the circuit board divides into single-sided board, double-sided board, and three big classifications of multilayer circuit board according to the number of layers.
The search (CN 206865824U) discloses a low-loss transformer circuit board, which includes a circuit board body 1, a slot 11, a diode 2, a diode body 21, a potting slot 12, and a solder leg 22; the circuit board is used for replacing an epoxy resin support which is manually assembled, the distance between welding spots on the circuit board body can be ensured, the insulation distance between two welding pins of the diode and between the diodes can also be ensured after the diode is welded, and the heat dissipation effect can be improved due to the interval between the diode body and the circuit board body.
However, the device has poor heat dissipation efficiency, so that the transformer circuit board may be damaged due to too high temperature during operation and the energy consumption is serious.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a low-loss type transformer circuit board to it is relatively poor to solve to propose this low-loss type transformer circuit board heat dissipation efficiency in the above-mentioned background art, thereby leads to transformer circuit board probably because two harm themselves of high temperature and the serious problem of power consumption at the during operation.
In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a low-loss transformer circuit board, includes the device body, the device body has included heat abstractor one, heat abstractor two and circuit board, the inside of heat abstractor two is provided with the backup pad, and the backup pad is provided with threely, the inside of heat abstractor two is provided with the condenser pipe, and the condenser pipe is provided with threely, equal fixed connection is equipped with the heat conduction piece on the side that the backup pad was kept away from, it is provided with the phase change heat accumulator to press from both sides the inlay between the heat conduction piece, and the phase change heat accumulator is provided with a plurality ofly, the entrance point and the exit end of condenser pipe all are connected with the pipeline, the inside top and the bottom of heat abstractor two are provided with the elasticity copper sheet, the lower extreme of elasticity copper sheet is provided with heat dissipation copper sheet three, and heat dissipation copper sheet three is provided with heat dissipation copper sheet two between the heat dissipation copper sheet three, the elasticity copper sheet is located between two adjacent backup pads, the both ends of heat conduction piece all are provided with thermal working medium and store up the pipe, through setting up the condenser pipe, reduce this circuit board during operation because the high temperature produces damage and too much consume energy.
Preferably, the inside of the first heat dissipation device is provided with a conductive copper sheet, the top and the bottom of the conductive copper sheet are fixedly connected with an insulating adhesive layer, the surface of the insulating adhesive layer is provided with a heat conduction copper sheet, the heat conduction copper sheet and the insulating adhesive layer are fixedly connected, the top and the bottom of the heat conduction copper sheet are both provided with FR4 reinforcing plates, the FR4 reinforcing plates are fixedly connected with the heat conduction copper sheet, and the heat conduction copper sheet can transfer heat to the heat dissipation copper sheet through a heat conduction copper bar by the aid of the heat dissipation copper sheet.
Preferably, the top and the bottom of FR4 stiffening plate all are provided with the protective layer, and the protective layer is fixed connection with the FR4 stiffening plate, the top and the bottom of protective layer all are provided with heat dissipation copper sheet one, the surface of heat conduction copper sheet is provided with the heat conduction copper bar, and heat conduction copper sheet and heat conduction copper bar be fixed connection, the one end that the heat conduction copper sheet was kept away from to the heat conduction copper bar runs through FR4 stiffening plate and protective layer in proper order and with a heat dissipation copper sheet fixed connection, through setting up the protective layer to protect the FR4 stiffening plate.
Preferably, the mounting hole has been seted up to the surperficial four corners department of device body, the surface of device body is provided with the via hole, and the via hole is provided with a plurality ofly, and the setting of mounting hole makes the device not only can fix through the plug connector, also can use the mounting hole to install simultaneously, has increased the device's practicality.
Preferably, the outer wall of the left side of the device body is provided with a plug connector, the bottom end of the outer wall of the right side of the device body is provided with a wire, the circuit board is arranged between the first heat dissipation device and the second heat dissipation device, and the electronic element on the circuit board is subjected to heat dissipation treatment when working, so that loss is reduced.
Preferably, the surface of heat conduction copper sheet is provided with viscose layer one, and heat conduction copper sheet and viscose layer one fixed connection, the heat conduction copper sheet passes through the bottom surface fixed connection of viscose layer one with the FR4 stiffening plate, the surface of FR4 stiffening plate is provided with viscose layer two, and FR4 stiffening plate and viscose layer two fixed connection, the FR4 stiffening plate passes through the bottom surface fixed connection of viscose layer two with the protective layer, the surface of protective layer is provided with viscose layer three, and viscose layer three is fixed connection with the protective layer, the protective layer passes through the bottom surface fixed connection of viscose layer three with heat dissipation copper sheet one.
Compared with the prior art, the beneficial effects of the utility model are that: according to the low-loss transformer circuit board, the condensing pipe, the pipeline and the elastic copper sheet are arranged, so that the heat dissipation efficiency of the device is enhanced, excessive loss caused by high temperature is reduced, the bending resistance of the device is enhanced due to the arrangement of the elastic copper sheet, and the strength of the device is enhanced.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only examples of the embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without any creative effort.
Fig. 1 is a schematic perspective view of an embodiment of the present invention;
fig. 2 is a schematic cross-sectional view of a heat dissipation device according to an embodiment of the present invention;
fig. 3 is a schematic diagram of a two-section structure of a heat dissipation device according to an embodiment of the present invention.
In the figure: 1. a device body; 2. a first heat dissipation device; 3. a second heat dissipation device; 4. a first heat dissipation copper sheet; 5. a protective layer; 6. an FR4 stiffening plate; 7. a heat conductive copper bar; 8. a thermally conductive copper sheet; 9. a conductive copper sheet; 10. a first adhesive layer; 11. a second adhesive layer; 12. a third adhesive layer; 13. an elastic copper sheet; 14. a second heat dissipation copper sheet; 15. a third heat dissipation copper sheet; 16. mounting holes; 17. a pipeline; 18. a condenser tube; 19. a heat conducting block; 20. a support plate; 21. a hot working medium storage tube; 22. a via hole; 23. a plug-in unit; 24. a wire; 25. a circuit board; 26. a phase change heat accumulator; 27. and an insulating glue layer.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention more apparent, the following describes the embodiments of the present invention in detail with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
In the description of the embodiments of the present invention, it should be understood that the terms "upper", "lower", "front", "rear", "inner", "outer", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only used for convenience in describing the embodiments of the present invention and simplifying the description, but do not indicate or imply that the devices or elements referred to must have specific orientations, be constructed in specific orientations, and be operated, and thus, should not be construed as limiting the embodiments of the present invention.
In the description of the embodiments of the present invention, it should be noted that, unless otherwise explicitly stated or limited, the terms "mounted," "connected," and "connected" are to be interpreted broadly, and may be, for example, fixedly connected, integrally connected, or detachably connected; may be communication within two elements; the terms may be directly connected or indirectly connected through an intermediate, and those skilled in the art can understand the specific meanings of the above terms in the embodiments of the present invention in a specific case.
Referring to fig. 1-3, the embodiment of the present invention provides a low loss type transformer circuit board, including a device body 1, the device body 1 includes a first heat dissipation device 2, a second heat dissipation device 3 and a circuit board 25, the inside of the second heat dissipation device 3 is provided with a support plate 20, and the support plate 20 is provided with three, the inside of the second heat dissipation device 3 is provided with a condenser tube 18, and the condenser tube 18 is provided with three, the side of the support plate 20 away from is provided with a heat conduction block 19, the heat conduction block 19 is provided with a phase change heat accumulator 26 in a clamping and embedding manner, and the phase change heat accumulator 26 is provided with a plurality of heat conduction blocks, the inlet end and the outlet end of the condenser tube 18 are both connected with a pipeline 17, the inside top end and the bottom end of the second heat dissipation device 3 are provided with elastic copper sheets 13, the lower end of the elastic copper sheets 13 is provided with three heat dissipation copper sheets 15, and the three heat dissipation copper sheets 15 are provided with two, the second heat dissipation copper sheets 14 are provided between the three heat dissipation copper sheets 15, the elastic copper sheets 13 are located between the two adjacent support plates 20, both ends of the heat conduction block 19 are provided with thermal medium storage tubes 21, and the elastic copper sheets 13 are provided with the elastic copper sheets 13, and the anti-folding performance of the device is enhanced, thereby enhancing the strength of the device.
The inside of heat abstractor 2 is provided with electrically conductive copper sheet 9, the equal fixedly connected with insulating glue film 27 in top and bottom of electrically conductive copper sheet 9, the surface of insulating glue film 27 is provided with heat conduction copper sheet 8, and heat conduction copper sheet 8 is fixed connection with insulating glue film 27, the top and the bottom of heat conduction copper sheet 8 all are provided with FR4 stiffening plate 6, and FR4 stiffening plate 6 is fixed connection with heat conduction copper sheet 8, the top and the bottom of FR4 stiffening plate 6 all are provided with protective layer 5, and protective layer 5 and FR4 stiffening plate 6 are fixed connection, the top and the bottom of protective layer 5 all are provided with heat dissipation copper sheet 4, the surface of heat conduction copper sheet 8 is provided with heat conduction copper bar 7, and heat conduction copper sheet 8 is fixed connection with heat conduction copper bar 7, the one end that heat conduction copper bar 7 keeps away from heat conduction copper sheet 8 runs through FR4 stiffening plate 6 and protective layer 5 in proper order and with heat dissipation copper sheet 4 fixed connection, mounting hole 16 has been seted up to the surperficial four corners department of device body 1, the surface of device body 1 is provided with via hole 22, and via hole 22 is provided with a plurality of, the setting of insulating nature of insulating copper sheet 27, the electrically conductive copper sheet between 9 and the electrically conductive copper sheet 8 has been guaranteed.
The left outer wall of the device body 1 is provided with a plug connector 23, the bottom end of the right outer wall of the device body 1 is provided with a wire 24, a circuit board 25 is arranged between a first heat dissipation device 2 and a second heat dissipation device 3, the surface of a heat conduction copper sheet 8 is provided with a first adhesive layer 10, the heat conduction copper sheet 8 is fixedly connected with the bottom surface of an FR4 reinforcing plate 6 through the first adhesive layer 10, the surface of the FR4 reinforcing plate 6 is provided with a second adhesive layer 11, the FR4 reinforcing plate 6 is fixedly connected with the bottom surface of a protective layer 5 through the second adhesive layer 11, the surface of the protective layer 5 is provided with a third adhesive layer 12, the protective layer 5 is fixedly connected with the bottom surface of the first heat dissipation copper sheet 4 through the third adhesive layer 12, the protective layer 5 and the third adhesive layer 12 are arranged, so that the connection between the protective layer 5 and the first heat dissipation copper sheet 4 is more tight, and the heat dissipation effect is enhanced while the protection is provided.
The working principle is as follows: firstly, fixing a first heat dissipation device 2, a second heat dissipation device 3 and a circuit board 25, inserting a plug connector 23 into a high-voltage transformer package framework, selecting whether the high-voltage transformer package framework needs to be fixed through a mounting hole 16 according to actual conditions, and performing heat dissipation through mutual matching of a heat conduction copper bar 7, a heat conduction copper sheet 8 and a heat dissipation copper sheet 4 in the first heat dissipation device 2; when the device is still heated continuously because the working efficiency is increased or the working time is too long, the device is recooled by the condensation tube 18, the second heat dissipation copper sheet 14 and the third heat dissipation copper sheet 15 in the second heat dissipation device 3.
While there has been shown and described what are considered to be preferred embodiments of the invention, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention.
Claims (6)
1. A low loss type transformer circuit board, includes device body (1), its characterized in that: the device body (1) comprises a first heat dissipation device (2), a second heat dissipation device (3) and a circuit board (25), the inside of the second heat dissipation device (3) is provided with a support plate (20), the support plate (20) is provided with three, the inside of the second heat dissipation device (3) is provided with a condenser pipe (18), the condenser pipe (18) is provided with three, the side surface away from the support plate (20) is provided with a heat conduction block (19) in a manner of being fixedly connected with the heat conduction block (19), the heat conduction block (19) is provided with a phase change heat accumulator (26) in a clamping and embedding manner, the phase change heat accumulator (26) is provided with a plurality of heat conduction blocks, the inlet end and the outlet end of the condenser pipe (18) are connected with a pipeline (17), the inside top end and the bottom end of the second heat dissipation device (3) are provided with elastic copper sheets (13), the lower end of the elastic copper sheets (13) is provided with three heat dissipation copper sheets (15), the three heat dissipation copper sheets (15) are provided with two and two heat dissipation copper sheets (14), the elastic copper sheets (13) are located between the two adjacent support plates (20), and the two heat dissipation copper sheets (21) are arranged at the two ends of the heat conduction block (19).
2. The low loss type transformer circuit board according to claim 1, wherein: the inside of heat abstractor (2) is provided with electrically conductive copper sheet (9), the equal fixedly connected with insulating glue film (27) in top and the bottom of electrically conductive copper sheet (9), the surface of insulating glue film (27) is equipped with heat conduction copper sheet (8), and heat conduction copper sheet (8) is fixed connection with insulating glue film (27), the top and the bottom of heat conduction copper sheet (8) all are provided with FR4 stiffening plate (6), and FR4 stiffening plate (6) is fixed connection with heat conduction copper sheet (8).
3. The low-loss transformer circuit board according to claim 2, wherein: the top and the bottom of FR4 stiffening plate (6) all are provided with protective layer (5), and protective layer (5) and FR4 stiffening plate (6) are fixed connection, the top and the bottom of protective layer (5) all are equipped with heat dissipation copper sheet (4), the surface of heat conduction copper sheet (8) is equipped with heat conduction copper bar (7), and heat conduction copper sheet (8) and heat conduction copper bar (7) are fixed connection, the one end that heat conduction copper sheet (8) were kept away from in heat conduction copper bar (7) runs through FR4 stiffening plate (6) and protective layer (5) in proper order and with heat dissipation copper sheet (4) fixed connection.
4. The low-loss transformer circuit board according to claim 3, wherein: mounting holes (16) are formed in four corners of the surface of the device body (1), through holes (22) are formed in the surface of the device body (1), and the through holes (22) are multiple.
5. The low-loss transformer circuit board according to claim 4, wherein: the device is characterized in that a plug connector (23) is arranged on the outer wall of the left side of the device body (1), a wire (24) is arranged at the bottom end of the outer wall of the right side of the device body (1), and the circuit board (25) is arranged between the first heat dissipation device (2) and the second heat dissipation device (3).
6. The low-loss transformer circuit board according to claim 5, wherein: the surface of heat conduction copper sheet (8) is equipped with adhesive layer one (10), and heat conduction copper sheet (8) and adhesive layer one (10) fixed connection, heat conduction copper sheet (8) are through the bottom surface fixed connection of adhesive layer one (10) and FR4 stiffening plate (6), the surface of FR4 stiffening plate (6) is provided with adhesive layer two (11), and FR4 stiffening plate (6) and adhesive layer two (11) fixed connection, FR4 stiffening plate (6) are through the bottom surface fixed connection of adhesive layer two (11) and protective layer (5), the surface of protective layer (5) is provided with adhesive layer three (12), and adhesive layer three (12) and protective layer (5) are fixed connection, protective layer (5) are through the bottom surface fixed connection of adhesive layer three (12) and heat dissipation copper sheet (4).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222829125.8U CN218735162U (en) | 2022-10-26 | 2022-10-26 | Low-loss transformer circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222829125.8U CN218735162U (en) | 2022-10-26 | 2022-10-26 | Low-loss transformer circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218735162U true CN218735162U (en) | 2023-03-24 |
Family
ID=85591472
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222829125.8U Active CN218735162U (en) | 2022-10-26 | 2022-10-26 | Low-loss transformer circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218735162U (en) |
-
2022
- 2022-10-26 CN CN202222829125.8U patent/CN218735162U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN209282354U (en) | A kind of power battery module that internal can be heated or cooled | |
| CN218735162U (en) | Low-loss transformer circuit board | |
| CN201064069Y (en) | Heat radiating structure for circuit board | |
| CN208923316U (en) | The lithium battery of high-multiplying power discharge is for electric unit | |
| CN215871957U (en) | Fine circuit flexible circuit board combining thick gold, immersion gold and OSP | |
| CN210866417U (en) | Battery module fast dispels heat | |
| CN210272335U (en) | Chip heat radiation structure | |
| CN111341740A (en) | Novel power management chip packaging system | |
| CN217088300U (en) | Improved low-voltage direct-current compressor controller | |
| CN110690529A (en) | Battery module fast dispels heat | |
| CN215451184U (en) | Aluminum electrolytic capacitor with plug-in pins | |
| CN217426895U (en) | Battery package and car | |
| CN219068466U (en) | Temperature-resistant printed circuit board | |
| CN217849766U (en) | Circuit soft board with good heat dissipation performance | |
| CN212305749U (en) | LED double-layer circuit board module | |
| CN217825490U (en) | Multilayer printed circuit board with high heat conduction function | |
| CN220400699U (en) | Heat conduction and insulation structure of battery circuit board | |
| CN215580903U (en) | Electromagnetic filter | |
| CN212392814U (en) | Rectifier bridge heat radiation structure | |
| CN218976912U (en) | Capacitor circuit board with ladder structure | |
| CN218731259U (en) | Heat management structure, battery module and battery package | |
| CN216721664U (en) | Multilayer circuit board | |
| CN218277263U (en) | PCB heat dissipation device | |
| CN215073611U (en) | Large element heat dissipation device of PCB | |
| CN220232931U (en) | Vehicle-mounted charging high-temperature direct-current filter capacitor |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |