CN218649043U - Tube shell for reflow soldering of PCB and radio frequency connector - Google Patents
Tube shell for reflow soldering of PCB and radio frequency connector Download PDFInfo
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- CN218649043U CN218649043U CN202222814455.XU CN202222814455U CN218649043U CN 218649043 U CN218649043 U CN 218649043U CN 202222814455 U CN202222814455 U CN 202222814455U CN 218649043 U CN218649043 U CN 218649043U
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Abstract
The utility model belongs to the field of radio frequency circuit assembly, in particular to a tube for reflow soldering of PCB and radio frequency connector, the tube designed by the utility model is a hollow through cuboid, a PCB mounting step is arranged in the tube, the side wall of the tube is provided with a through hole for arranging the connector; the shell designed by the invention enables the connector to be partially exposed, and when the printed board is assembled, the reflow soldering of the PCB and the connector is realized through the point coating of the soldering paste, so that the assembly process flow of the product is greatly simplified, the operation difficulty is reduced, and the shell has the characteristics of low cost, strong product applicability and the like, and is suitable for batch production.
Description
Technical Field
The utility model belongs to radio frequency circuit assembly field, concretely relates to a tube that is used for PCB and radio frequency connector reflow soldering.
Background
The SMA/SMP connector is used as an input/output port of a radio frequency signal of a product, and the assembly quality of the SMA/SMP directly influences the performance index of the whole set of product. In particular, with the need for miniaturization and high reliability of the products, the airtight assembly of SMA/SMP connectors is also a difficult problem that the manufacturing process has to face.
The SMA/SMP connector is mostly assembled by adopting a silver paste bonding or preset solder ring method. The silver paste bonding process is complicated, the tube shell is easily stained in the bonding process, the bonding strength is not high, and the phenomenon that the SMA/SMP connector falls off due to silver paste embrittlement can occur in the using process. The solder ring used in the method for presetting the solder ring needs to be independently customized, the processing period is long, the method has high processing requirement on the tube shell, a large number of air holes are generated between the SMA/SMP connector and the tube shell in the melting and shrinking process of the solder, and the problem that the welding quality cannot be visually checked exists. Meanwhile, a small number of SMA/SMP connectors are also applied in a manual spot welding assembly mode, but the tube shell is not suitable for batch production due to large heat capacity, quick heat dissipation and large operation difficulty. In addition, part of the tube shell manufacturers can provide an integrated sintered tube shell, so that the better assembly quality can be ensured, but the tube seat which is sintered in advance by the SMA/SMP connector sometimes hinders the later installation of a printed board, and the processing and manufacturing cost of the tube shell is sharply increased, so that the practical application of the tube shell is greatly limited.
Disclosure of Invention
In order to solve the problems, the utility model provides a tube shell for reflow soldering of a PCB and a radio frequency connector, which is a hollow penetrating cuboid structure, wherein a PCB mounting step is arranged in the tube shell and used for placing a PCB; the side wall of the tube shell is provided with a through hole for arranging a connector; and the upper end of the through hole is provided with a U-shaped tin groove for point coating of solder paste.
Further, if the connector arranged on the tube shell is a circular SMA connector, and the circular SMA connector comprises an inner conductor and an outer conductor; the through hole of the tube shell is set to be a circular through hole for inserting the outer conductor of the circular SMA connector; the upper end of the round through hole is provided with a U-shaped tin bath, the width of the U-shaped tin bath is 1/2-1 of the diameter of the outer conductor of the round SMA connector, and the length of the U-shaped tin bath is 1/2-2/3 of the length of the outer conductor of the round SMA connector.
Further, if the connector arranged on the shell is a round SMP connector, the round SMP connector comprises an inner conductor and a step-shaped outer conductor; the through hole of the tube shell is set to be a stepped through hole for inserting the stepped outer conductor of the round SMP connector; the upper end of the stepped through hole is provided with a U-shaped tin bath, the width of the U-shaped tin bath is 1/2-1 of the first step diameter of the stepped outer conductor of the round SMP connector, and the length of the U-shaped tin bath is 1/2-2/3 of the total length of the stepped outer conductor of the round SMP connector.
Furthermore, the stepped through hole comprises a first stepped circular hole and a second stepped circular hole, the diameter of the second stepped circular hole is smaller than that of the first stepped circular hole, and a tin guide groove is arranged at the joint of the first stepped circular hole and the second stepped circular hole; the tin guide groove is an annular through groove, the width of the tin guide groove is about 0.5 mm-1 mm, and the groove depth of the tin guide groove is about 0.5 mm-1 mm.
Furthermore, the width of the PCB installation step is 1 mm-2 mm.
The utility model has the advantages that:
the utility model discloses the position of settling the connector at the tube is equipped with the through-hole, the through-hole upper end is equipped with U type molten tin bath for the connector exposes partly, during the printed board assembly, in the PCB installation step of casing point soldering cream, direct spot welding tin cream above the part that the connector exposes, realize the synchronous reflow soldering of PCB and connector, the assembly process flow of product has greatly been simplified, reduce the operation degree of difficulty, and have with low costs, characteristics such as product suitability is strong, and is suitable for batch production.
Drawings
Fig. 1 is an assembly view of a circular SMA connector housing of the present invention;
fig. 2 is a tube assembly view of the circular SMP connector and the row SMA connector of the present invention;
fig. 3 is a schematic view of a circular SMA connector used in the present invention;
FIG. 4 is a schematic view of a circular SMP connector used in the present invention;
the PCB comprises a 1-PCB mounting step, a 2-U-shaped tin groove, a 31-circular through hole, a 32-oval through hole, a 33-step through hole, a 4-PCB, a 5-tin guide groove, a 60-circular SMA connector, a 61-inner conductor of the circular SMA connector, an outer conductor of the 62-circular SMA connector, a 70-circular SMP connector, a 71-first step, a 72-second step, a 73-inner conductor, a 74-step and an 80-row type SMA connector.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
In one embodiment, a case for reflow soldering of a PCB and a circular SMA connector, the circular SMA connector is composed of three parts, an inner conductor 61, an outer conductor 62 and an insulating medium, as shown in fig. 3; the tube shell is a hollow penetrating cuboid structure, as shown in figure 1, a PCB mounting step 1 is arranged in the tube shell and used for mounting a PCB; the side wall of the tube shell is provided with a circular through hole 31 for installing a circular SMA connector; the upper end of the round through hole 31 is provided with a U-shaped tin bath 2 for spot coating of soldering paste; the round SMA connector 60 is inserted into the round through hole 31 from the outside of the tube shell, the opening diameter of the round through hole 31 is the diameter of the outer conductor 62 of the round SMA connector 60, the width L1 of the U-shaped tin groove 2 (namely the width of the U-shaped opening) is 1/2-1,U of the diameter of the outer conductor 62 of the round SMA connector 60, the length L2 of the U-shaped tin groove 2 (namely the length from the U-shaped opening to the bottom of the bending part) is 1/2-2/3 of the length of the outer conductor 62 of the round SMA connector 60, in the vertical direction of the side wall of the tube shell, the distance L3 from the lower groove surface of the U-shaped tin groove 2 to the lower bottom surface of the round through hole 31 is 1/2-2/3 of the diameter of the outer conductor 62 of the round SMA connector 60, the hole diameter processing precision is a positive tolerance, and the tolerance is [0,0.1] mm.
Preferably, if the connector arranged on the tube shell is a row-type SMA connector, the through hole on the side wall of the tube shell is an elliptical through hole 32, as shown in fig. 2, the upper end of the elliptical through hole 32 is provided with a U-shaped tin bath, the width of a U-shaped opening of the U-shaped tin bath is 1/2-1,U tin bath (the length from the U-shaped opening to the bottom of a bending part) of the length of the long axis of the elliptical outer conductor of the row-type SMA connector 80 is 1/2-2/3 of the height of the elliptical outer conductor of the row-type SMA connector 80, and in fig. 2, the distance from the lower bath surface of the U-shaped tin bath to the lower bottom surface of the elliptical through hole is 1/2-2/3 of the length of the short axis of the elliptical outer conductor of the row-type SMA connector 80 in the vertical direction of the side wall of the tube shell.
In one embodiment, a package for reflow soldering of a PCB and a circular SMP connector, the circular SMP connector 70 is composed of three parts, an inner conductor 73, a stepped outer conductor and an insulating medium, the stepped outer conductor is a two-layer structure including a first step 71 and a second step 72, as shown in fig. 4. The tube shell is a hollow through cuboid structure, as shown in figure 2, a PCB mounting step 1 is arranged in the tube shell and used for mounting a PCB; the side wall of the pipe shell is provided with a step through hole 32 for arranging the round SMP connector 70; the upper end of the stepped through hole 32 is provided with a U-shaped tin bath 2 for solder paste spot coating; inserting a round SMP connector 70 into the stepped through hole 33 from the outside of the tube shell, wherein the width of a U-shaped opening of a U-shaped tin groove 2,U-shaped tin groove 2 arranged at the upper end of the stepped through hole 33 is 1/2-1,U-shaped tin groove 2 (the length from the U-shaped opening to the bottom of a bending part) of the diameter of a first step 71 of a stepped outer conductor of the round SMP connector 70, the length of the U-shaped tin groove 2 is 1/2-2/3 of the total length of the stepped outer conductor of the round SMP connector 70, the length of the U-shaped tin groove 2 is greater than the length of a second step 72 of the stepped outer conductor of the round SMP connector 70, in the vertical direction of the side wall of the tube shell, the distance from the lower groove surface of the U-shaped tin groove 2 to the lower bottom surface of the SMP of the stepped through hole 33 is 1/2-2/3 of the diameter of the first step 71 of the stepped outer conductor of the round SMP connector 70, the processing precision is positive tolerance, and the aperture is [0,0.1 ]/mm;
specifically, the circular SMP connector is shaped as shown in fig. 4, and includes a stepped outer conductor, an inner conductor 73 and an insulating medium, where the stepped outer conductor includes a first step 71 and a second step 72, the first step 71 and the second step 72 are coaxially connected in a penetrating manner, and a step 74 is provided at a connection position of the first step 71 and the second step 72; the step through holes are correspondingly arranged according to the shape of the step-shaped outer conductor and comprise a first step-shaped circular hole and a second step-shaped circular hole which are coaxially connected in a penetrating manner, and the diameter of the second step-shaped circular hole is smaller than that of the first step-shaped circular hole; the second stepped circular hole is close to the inside of the tube shell, and the first stepped circular hole is close to the outside of the tube shell; the first stepped circular hole and the second stepped circular hole correspond to a first step and a second step of the stepped outer conductor, respectively.
Preferably, if the connector for the cartridge installation is a circular SMP connector, a tin guide groove is arranged at the position where the connector is installed on the cartridge, specifically, a tin guide groove is arranged at a connecting step of the first stepped circular hole and the second stepped circular hole; the tin guide groove is an annular through groove, the width of the tin guide groove is about 0.5 mm-1 mm, and the groove depth of the tin guide groove is about 0.5 mm-1 mm.
In an embodiment, adopt the utility model discloses a process that PCB and connector reflow soldering were carried out to tube, include following step:
s1, centrifugally stirring soldering paste uniformly and then pouring the soldering paste into a dispensing syringe;
s2, continuously and uniformly dispensing soldering paste on the PCB mounting step of the tube shell by using a dispensing syringe;
s3, after the solder paste is dispensed, placing the PCB at a PCB mounting step, and lightly pressing the PCB by using tweezers to fully attach the PCB to the tube shell;
preferably, the PCB can be pressed and held by a tool clamp or the pipe shell and the printed board can be provided with screw holes for auxiliary installation, so that the close fit between the PCB and the pipe shell in the reflow soldering process is ensured.
S4, inserting the connector into the through hole of the tube shell, and spot-coating soldering paste at the U-shaped tin groove;
s5, manually welding the connection point of the inner conductor of the connector and the PCB, fixing the connector, and preventing the connector from shifting in the backflow process to influence the assembly effect;
s6, putting the product obtained in the step S5 into a reflow oven with proper oven temperature, and melting the solder to realize reflow soldering of the PCB, the connector and the tube shell;
s7, welding spot repair welding is carried out on welding spots of the inner lead of the connector of the product obtained in the step S6;
and S8, after repair welding, putting the whole body into a cleaning agent, soaking to remove the residues of the soldering flux, taking out, putting into an oven, and baking to finish assembly.
Specifically, the solder paste needs to be warmed before use, and the warming time is more than 2 hours.
Specifically, the grounding pad corresponding to the position of the PCB mounting step of the tube shell on the PCB is wider than the PCB mounting step of the tube shell by more than 1mm so as to contain and extrude the overflowing soldering paste to form a high-strength welding line.
Specifically, the soaking time is 3-5 minutes, and the soaked product is placed into an oven with the temperature of 85 ℃ for baking for 10 minutes.
Preferably, the shell for housing the round SMP connector is provided with a solder guide groove that enhances high flow spreading of molten solder, enabling higher quality SMP connector soldering.
In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "disposed," "connected," "fixed," "rotated," and the like are to be construed broadly, e.g., as meaning fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; the terms may be directly connected or indirectly connected through an intermediate, and may be communication between two elements or interaction relationship between two elements, unless otherwise specifically limited, and the specific meaning of the terms in the present invention will be understood by those skilled in the art according to specific situations.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (5)
1. A tube shell for reflow soldering of a PCB and a radio frequency connector is a hollow through cuboid structure and is characterized in that a PCB mounting step is arranged in the tube shell and used for placing a PCB; the side wall of the tube shell is provided with a through hole for arranging a connector; and the upper end of the through hole is provided with a U-shaped tin groove for spot coating of soldering paste.
2. A package for reflow soldering of PCB and rf connector in accordance with claim 1, wherein if the package is configured with a round SMA connector, said round SMA connector comprises an inner conductor and an outer conductor; the through hole of the tube shell is set to be a circular through hole for inserting the outer conductor of the circular SMA connector; the upper end of the circular through hole is provided with a U-shaped tin bath, the width of the U-shaped tin bath is 1/2-1 of the diameter of the outer conductor of the circular SMA connector, and the length of the U-shaped tin bath is 1/2-2/3 of the length of the outer conductor of the circular SMA connector.
3. A package for reflow soldering of PCBs and radio frequency connectors, as recited in claim 1, wherein if the connector on which the package is mounted is a circular SMP connector, said circular SMP connector comprises an inner conductor and a stepped outer conductor; the through hole of the tube shell is set as a stepped through hole for inserting the stepped outer conductor of the round SMP connector; the upper end of the stepped through hole is provided with a U-shaped tin bath, the width of the U-shaped tin bath is 1/2-1 of the first step diameter of the stepped outer conductor of the round SMP connector, and the length of the U-shaped tin bath is 1/2-2/3 of the total length of the stepped outer conductor of the round SMP connector.
4. The package for reflow soldering of PCB and RF connector as recited in claim 3, wherein the stepped through hole comprises a first stepped circular hole and a second stepped circular hole coaxially connected through, and the diameter of the second stepped circular hole is smaller than that of the first stepped circular hole, and a solder guiding groove is provided at the connecting step of the first stepped circular hole and the second stepped circular hole; the tin guide groove is an annular through groove, the width of the tin guide groove is 0.5 mm-1 mm, and the groove depth of the tin guide groove is 0.5 mm-1 mm.
5. A package for reflow soldering of a PCB and a radio frequency connector as claimed in claim 1, wherein the width of the PCB mounting step is 1mm to 2mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222814455.XU CN218649043U (en) | 2022-10-25 | 2022-10-25 | Tube shell for reflow soldering of PCB and radio frequency connector |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222814455.XU CN218649043U (en) | 2022-10-25 | 2022-10-25 | Tube shell for reflow soldering of PCB and radio frequency connector |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218649043U true CN218649043U (en) | 2023-03-17 |
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ID=85494693
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222814455.XU Active CN218649043U (en) | 2022-10-25 | 2022-10-25 | Tube shell for reflow soldering of PCB and radio frequency connector |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218649043U (en) |
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2022
- 2022-10-25 CN CN202222814455.XU patent/CN218649043U/en active Active
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