CN210607911U - Shell structure suitable for insulator replaces SMP - Google Patents
Shell structure suitable for insulator replaces SMP Download PDFInfo
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- CN210607911U CN210607911U CN201921137504.2U CN201921137504U CN210607911U CN 210607911 U CN210607911 U CN 210607911U CN 201921137504 U CN201921137504 U CN 201921137504U CN 210607911 U CN210607911 U CN 210607911U
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- insulator
- shell
- smp
- structure suitable
- counter bore
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Abstract
The utility model relates to a shell structure suitable for an insulator to replace SMP, which comprises a shell, insulators and a base plate; a counter bore is formed in the outer surface of the shell, and a coaxial through hole for assembling the insulator body is formed below the counter bore; the shell is attached to the substrate, counter bores are formed in corresponding positions on the substrate, and the inner conductor of the insulator is exposed out of the through hole and inserted into the counter bores. The utility model discloses a mode that insulator and shell structure combined together reaches SMP's structure and performance effect, and SMP simpler and more simple and convenient easy to operate of assembly of insulator.
Description
Technical Field
The utility model relates to a shell structure, especially a shell structure suitable for insulator replaces SMP.
Background
With the continuous increase of frequency bands of radio frequency products, SMP (radio frequency coaxial connector) in high frequency bands are more and more widely applied, but the manufacturing cost of SMP in high frequency bands is higher, which leads to the continuous increase of the cost of radio frequency products. It is imperative to develop a low cost solution that can achieve the same performance requirements.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a shell structure suitable for replace SMP with the insulator.
Realize the utility model discloses the technical solution of purpose does: a shell structure suitable for replacing SMP by insulators comprises a shell, insulators and a substrate; a first counter bore is formed in the outer surface of the shell, and a coaxial through hole for assembling the insulator body is formed below the first counter bore; the shell is attached to the substrate, a second counter bore is formed in the corresponding position on the substrate, and the inner conductor of the insulator is exposed out of the through hole and inserted into the second counter bore.
Compared with the prior art, the utility model discloses a show the advantage and do: the first counter bore on the outer wall of the shell, the through hole below the first counter bore and the insulator form a structure similar to an SMP sintered part, and the structure greatly reduces the array area of an SMP array and can meet the same performance requirement; the insulator is more convenient and easier to assemble than the SMP.
Drawings
Fig. 1 is a schematic partial cross-sectional view of a housing structure suitable for insulator replacement of SMP according to the present invention.
Fig. 2 is a schematic diagram of the local solder of the shell structure suitable for replacing SMP by the insulator of the present invention.
Detailed Description
As shown in fig. 1, a housing structure suitable for an insulator to replace SMP includes a housing 1, an insulator 4, and a substrate 7; a first counter bore 2 is formed in the outer surface of the shell 1, and a coaxial through hole 5 for assembling an insulator body is formed below the first counter bore 2; the shell 1 is attached to a substrate 7, a second counter bore 6 is arranged at a corresponding position on the substrate 7, and the inner conductor of the insulator 4 is exposed out of the through hole 5 and inserted into the second counter bore 6.
Further, the insulator 4 body is fixed in the through hole 5 through the clamp 3 and then welded through a preformed solder ring.
Further, the housing 1 and the substrate 7 are fixed by welding through a preformed soldering lug.
Furthermore, the depth of the second counter bore 6 of the substrate 7 is 0.1-0.3 mm larger than the length of the inner conductor of the insulator 4 exposed out of the through hole 5.
Further, the inner conductor of the insulator 4 at one end exposed out of the inner wall of the shell is welded with the substrate 7 through a solder ball in the second counterbore 6.
Further, the diameter D1 of the second counterbore is equal to the diameter +0.05mm of the inner conductor of the insulator.
The present invention will be described in detail with reference to the accompanying drawings and examples.
Examples
As shown in fig. 1, a housing structure suitable for an insulator to replace SMP includes a housing 1, an insulator 4, and a substrate 7; the outer surface of the shell 1 is provided with a first counter bore 2; the first counter bore 2 is provided with a coaxial through hole 5 for assembling an insulator 4 body; the shell 1 and the substrate 7 are folded, the inner conductor at one end in the shell of the insulator 4 is exposed out of the through hole 5 and inserted into the second counterbore 6 of the substrate 7, and the diameter D1 of the second counterbore is equal to the diameter of the inner conductor of the insulator +0.05 mm. The depth of the second counter bore 6 is matched with the length of the insulator 4 exposed out of the inner conductor of the through hole 5, and the second counter bore abuts against the insulator 4 through the clamp 3.
As shown in fig. 2, the housing 1 and the insulator body are connected by soldering in the housing through hole with solder 8, and the housing 1 and the substrate 7 are connected by soldering with a pre-formed soldering lug 9. The inner conductor of the insulator at one end exposed out of the inner wall of the shell is connected with the substrate in a welding mode through the welding flux 10 in the second counter bore.
The first counter bore of the outer wall of the shell, the through hole below the first counter bore and the insulator form a structure similar to an SMP sintered part, and the structure greatly reduces the array area of an SMP array and can meet the same performance requirement.
Claims (6)
1. A shell structure suitable for insulator to replace SMP is characterized in that the shell structure comprises a shell (1), an insulator (4) and a substrate (7); a first counter bore (2) is formed in the outer surface of the shell (1), and a coaxial through hole (5) for assembling the insulator body is formed below the first counter bore (2); the shell (1) is attached to the substrate (7), a second counter bore (6) is formed in the corresponding position of the substrate (7), and the inner conductor exposure through hole (5) of the insulator (4) is inserted into the second counter bore (6).
2. Shell structure suitable for insulator replacement SMP according to claim 1, characterized in that, the shell (1) and the insulator (4) body are fixed in the through hole (5) by a clamp (3) and welded by a preformed solder ring.
3. Shell structure suitable for insulator replacement SMP according to claim 1, characterized in that the shell (1) and the base plate (7) are fixed by preformed soldering lugs.
4. The housing structure suitable for insulator replacement SMP according to claim 1 wherein the second counterbore (6) depth of the base plate (7) is 0.1-0.3 mm greater than the length of the inner conductor of the insulator (4) exposed through the through hole (5).
5. Housing structure suitable for insulator replacement SMP according to claim 1, characterized in that the inner conductor of the insulator (4) at the end exposed to the housing inner wall is soldered to the base plate (7) by solder balls in the second counterbore (6).
6. The housing structure suitable for insulator replacement SMP according to claim 1, wherein the second counterbore diameter D1 is +0.05mm insulator inner conductor diameter.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921137504.2U CN210607911U (en) | 2019-07-19 | 2019-07-19 | Shell structure suitable for insulator replaces SMP |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921137504.2U CN210607911U (en) | 2019-07-19 | 2019-07-19 | Shell structure suitable for insulator replaces SMP |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210607911U true CN210607911U (en) | 2020-05-22 |
Family
ID=70696393
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921137504.2U Active CN210607911U (en) | 2019-07-19 | 2019-07-19 | Shell structure suitable for insulator replaces SMP |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210607911U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112881803A (en) * | 2021-01-14 | 2021-06-01 | 中电国基南方集团有限公司 | Glass insulator arrangement device and detection method |
-
2019
- 2019-07-19 CN CN201921137504.2U patent/CN210607911U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112881803A (en) * | 2021-01-14 | 2021-06-01 | 中电国基南方集团有限公司 | Glass insulator arrangement device and detection method |
| CN112881803B (en) * | 2021-01-14 | 2023-01-24 | 中电国基南方集团有限公司 | Glass insulator arrangement device and detection method |
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