CN220755143U - Circuit board assembly and electronic equipment - Google Patents

Abstract

The application provides a circuit board assembly, circuit board and electronic component that circuit board assembly includes the electricity connection, the circuit board includes the circuit layer, a plurality of recesses have been seted up to one side of circuit layer, circuit board assembly still includes a plurality of connecting pieces, be provided with the connecting piece in every recess, electronic component includes electronic component body and a plurality of liner, a plurality of liner set up in one side of electronic component body, electronic component body sets up in one side that a plurality of recesses have been seted up at the circuit layer, be provided with the liner in every recess, the connecting piece is fixed the liner to in the recess, and be connected circuit board and electronic component electricity. Therefore, by arranging the connecting piece and the gasket of the electronic component in the groove, even if the circuit board is bent under the action of external force, the connecting piece can not crack, and further, the electronic equipment provided with the circuit board assembly can not be abnormal because the joint of the circuit board and the electronic component cracks. The application also provides electronic equipment.

Description

Circuit board assembly and electronic equipment

Technical Field

The present disclosure relates to the field of circuit boards, and more particularly to a circuit board assembly and an electronic device having the same.

Background

Ball Grid Array (BGA) packaging technology has advantages of high density, good thermal conductivity, good electrical conductivity, low inductance pins, etc., making BGA packaging technology one of the preferred packaging technologies for securing integrated circuits (Integrated Circuit, ICs) to circuit boards.

In the process of assembling an IC to a circuit board and in the process of transporting the assembled circuit board, the circuit board is often easy to bend under the action of external force, so that the joint between the IC and the circuit board is cracked, and the electronic equipment assembled with the circuit board and the IC is abnormal.

Therefore, how to solve the problem of abnormality of the electronic device caused by easy cracking of the connection of the IC and the circuit board is a urgent need for those skilled in the art.

Disclosure of Invention

In view of the foregoing deficiencies of the prior art, an object of the present application is to provide a circuit board assembly and an electronic device having the circuit board assembly, which are intended to solve the problem of abnormality of the electronic device caused by easy cracking of the connection between the IC and the circuit board.

To solve the above technical problem, the embodiment of the application provides a circuit board assembly, the circuit board assembly includes circuit board and electronic component that the electricity is connected, the circuit board includes the circuit layer, a plurality of recesses have been seted up to one side of circuit layer, the circuit board assembly still includes a plurality of connecting pieces, every be provided with in the recess the connecting piece, the electronic component includes electronic component body and a plurality of liner, a plurality of the liner set up in one side of electronic component body, the electronic component body set up in a plurality of one side of recess has been seted up to the circuit layer, every be provided with in the recess the liner, the connecting piece will the liner is fixed to in the recess, and will the circuit board with the electronic component electricity is connected.

In summary, in the circuit board assembly provided in the embodiment of the present application, the connecting piece and the pad of the electronic component are disposed in the groove of the circuit board, even if the circuit board is bent under the action of external force, the connecting piece will not crack, and thus the electronic device assembled with the circuit board assembly will not be abnormal due to the crack of the connection part of the circuit board and the electronic component.

In an exemplary embodiment, the spacer is reduced in size in a direction in which the spacer faces away from the electronic component body.

In an exemplary embodiment, the dimensions of the inner walls of the recess decrease in the direction of the circuit layer facing away from the electronic component body.

In exemplary embodiments, the pad is hemispherical, semi-ellipsoidal, frustoconical, prismatic, conical, or pyramidal in overall shape. The whole of the groove is a hemispherical groove, a semi-ellipsoidal groove, a circular table groove, a prismatic table groove, a conical groove or a pyramid groove.

In an exemplary embodiment, the height of the groove is greater than the height of the pad, and a size of an end of the pad connected to the electronic component body is smaller than a size corresponding to an opening of the groove.

In an exemplary embodiment, a conductive film is disposed on an inner wall of each of the grooves, and the connection member is disposed between the conductive film and the pad.

In an exemplary embodiment, the volume of the connector within each groove is 0.5 to 0.9 times the difference in volume of the groove and the gasket.

In an exemplary embodiment, the circuit board further includes a substrate disposed on a side of the circuit layer facing away from the electronic component body. The substrate is provided with a hollowed-out part penetrating through the substrate, and the position of the hollowed-out part corresponds to the position of the electronic element.

In an exemplary embodiment, the circuit board further includes a packaging element, the packaging element is disposed on the hollowed-out portion, and a thickness of the packaging element is smaller than a thickness of the substrate.

Based on the same inventive concept, the embodiment of the application also provides an electronic device, which comprises a shell and the circuit board assembly as claimed in the claims, wherein the circuit board assembly is arranged in the shell.

In summary, the electronic device provided in the embodiment of the present application includes a housing and a circuit board assembly, where the circuit board assembly includes a connecting piece and a pad of an electronic component disposed in the recess of the circuit board, and even if the circuit board is bent under the action of external force, the connecting piece will not crack, and thus the electronic device assembled with the circuit board assembly will not be abnormal due to the crack at the connection between the circuit board and the electronic component.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present application, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

Fig. 1 is a schematic view of a layer structure of a circuit board assembly disclosed in a first embodiment of the present application before assembly;

fig. 2 is a schematic view of a layer structure of a circuit board assembly according to a first embodiment of the present application after assembly;

FIG. 3 is an enlarged schematic view of structure III of the circuit board assembly shown in FIG. 1;

FIG. 4 is an enlarged schematic view of structure IV of the circuit board assembly shown in FIG. 2;

fig. 5 is a schematic bottom view of a substrate of a circuit board assembly according to a first embodiment of the present disclosure;

FIG. 6 is a schematic view of a process for coating a connector with an electronic component according to a first embodiment of the present application;

fig. 7 is a schematic structural view of a circuit board coated connector according to the first embodiment of the present disclosure;

fig. 8 is a schematic layer structure of an electronic device according to a second embodiment of the present application.

Reference numerals illustrate:

1-printing a steel mesh; 1 a-a through hole; 2-a spray head; 3-solder paste; 10-a circuit board; 11-a circuit layer; 11 a-grooves; 12-a conductive film; 13-a substrate; 13 a-a hollowed-out part; 15-packaging the components; 20-an electronic component; 21-an electronic component body; 22-pad; 30-connecting piece; 100-a circuit board assembly; 200-a housing; 300-a display panel; 400-electronic device.

Detailed Description

In order to facilitate an understanding of the present application, a more complete description of the present application will now be provided with reference to the relevant figures. Preferred embodiments of the present application are shown in the accompanying drawings. This application may, however, be embodied in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.

The following description of the embodiments refers to the accompanying drawings, which illustrate specific embodiments that can be used to practice the present application. The numbering of the components itself, e.g. "first", "second", etc., is used herein merely to distinguish between the described objects and does not have any sequential or technical meaning. The terms "coupled" and "connected," as used herein, are intended to encompass both direct and indirect coupling (coupling), unless otherwise indicated. Directional terms referred to in this application, such as "upper", "lower", "front", "rear", "left", "right", "inner", "outer", "side", etc., are merely directions referring to the attached drawings, and thus, directional terms are used for better, more clear description and understanding of the present application, rather than indicating or implying that the apparatus or element being referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the present application.

In the description of the present application, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; may be a mechanical connection; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the terms in this application will be understood by those of ordinary skill in the art in a specific context. It should be noted that the terms "first," "second," and the like in the description and claims of the present application and in the drawings are used for distinguishing between different objects and not for describing a particular sequential order. Furthermore, the terms "comprises," "comprising," "includes," "including," "may be" or "including" as used in this application mean the presence of the corresponding function, operation, element, etc. disclosed, but not limited to other one or more additional functions, operations, elements, etc. Furthermore, the terms "comprises" or "comprising" mean that there is a corresponding feature, number, step, operation, element, component, or combination thereof disclosed in the specification, and that there is no intention to exclude the presence or addition of one or more other features, numbers, steps, operations, elements, components, or combinations thereof. It will also be understood that the meaning of "at least one" as described herein is one and more, such as one, two or three, etc., and the meaning of "a plurality" is at least two, such as two or three, etc., unless specifically defined otherwise.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the description of the application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.

Referring to fig. 1 and fig. 2, fig. 1 is a schematic layer structure diagram of a circuit board assembly according to a first embodiment of the present application before assembly, and fig. 2 is a schematic layer structure diagram of a circuit board assembly according to a first embodiment of the present application after assembly. The circuit board assembly 100 provided in the embodiment of the application includes a circuit board 10 and an electronic component 20 disposed on one side of the circuit board 10, where the electronic component 20 is electrically connected to the circuit board 10 to transmit an electrical signal.

In the embodiment of the application, referring to fig. 3 and 4, fig. 3 is an enlarged schematic view of a structure III in the circuit board assembly shown in fig. 1, and fig. 4 is an enlarged schematic view of a structure IV in the circuit board assembly shown in fig. 2. The circuit board 10 includes a circuit layer 11, and a plurality of grooves 11a are formed in one side of the circuit layer 11. The circuit board assembly 100 further includes a plurality of connectors 30, one connector 30 being disposed in each of the recesses 11a. The electronic component 20 includes a plurality of pads 22 corresponding to the electronic component body 21 and the plurality of grooves 11a, and the plurality of pads 22 are disposed on one side of the electronic component body 21 and electrically connected to the electronic component body 21. The electronic component body 21 is located at one side of the circuit layer 11 where a plurality of grooves 11a are formed, one pad 22 is disposed in each groove 11a, and the connecting member 30 fixes the pad 22 into the groove 11a and electrically connects the circuit board 10 with the electronic component 20.

It is understood that the connector 30 may be solder paste, and by disposing the connector 30 and the pad 22 of the electronic component 20 in the recess 11a, the connector 30 will not crack even if the circuit board 10 bends under the action of external force, and thus an abnormality of the electronic device equipped with the circuit board assembly 100 will not occur due to the crack of the connection between the circuit board 10 and the electronic component 20.

In an exemplary embodiment, the circuit board 10 may be a printed circuit board (Printed Circuit Board, PCB) and the electronic component 20 may be an integrated circuit (Integrated Circuit, IC).

In the exemplary embodiment, the number of the grooves 11a is determined by the number of the pads 22 of the electronic component 20, which is not particularly limited in the present application.

In the embodiment of the present application, referring to fig. 3 and 4, the size of the pad 22 gradually decreases in a direction in which the pad 22 faces away from the electronic component body 21. That is, the dimension of the cross section of the spacer 22 perpendicular to the thickness direction gradually decreases in the direction in which the spacer 22 faces away from the electronic component body 21. The cross section of the pad 22 is perpendicular to the direction of the pad 22 facing away from the electronic component body 21, and the thickness direction of the pad 22 is parallel to the direction of the pad 22 facing away from the electronic component body 21.

It can be appreciated that the alignment accuracy of the spacer 22 and the groove 11a is advantageously improved by the dimension of the spacer 22 gradually decreasing in the direction of the spacer 22 facing away from the electronic component body 21. Since the end of the pad 22 facing away from the electronic component body 21 has a smaller size, when the circuit board 10 is assembled with the electronic component 20, the pad 22 can be accommodated in the groove 11a as long as the end of the pad 22 facing away from the electronic component body 21 falls within the range of the opening of the groove 11a, thereby improving the alignment accuracy of the pad 22 and the groove 11a.

In an exemplary embodiment, the pad 22 may have a hemispherical shape, a semi-ellipsoidal shape, a truncated cone shape, a truncated pyramid shape, a conical shape, a pyramid shape, etc., which is not particularly limited in this application. The overall shape of the pad 22 shown in the drawings of the present application is hemispherical, and the diameter of the cross section of the pad 22 gradually decreases in the direction of the circuit layer 11 facing away from the electronic component body 21.

In this embodiment, referring to fig. 3 and 4, the dimensions corresponding to the inner walls of the recess 11a gradually decrease in the direction of the circuit layer 11 facing away from the electronic component body 21. That is, the size corresponding to the opening of the groove 11a is larger than the size corresponding to the bottom of the groove 11a.

It will be appreciated that the connecting member 30 is applied to the end of the spacer 22 facing away from the electronic component body 21, and that the connecting member 30 is dispersed to the surface of the connecting member 30 and the inner wall of the recess 11a by the pressing action between the end of the spacer 22 facing away from the electronic component body 21 and the bottom of the recess 11a when the spacer 22 is fitted into the recess 11a. Therefore, the size of the inner wall of the groove 11a is gradually reduced in the direction of the circuit layer 11 facing away from the electronic component body 21, so that the connector 30 can move towards the opening of the groove 11a more easily under the extrusion action, and the connector 30 is more uniformly dispersed.

In an exemplary embodiment, the groove 11a may be a hemispherical groove, a semi-ellipsoidal groove, a circular table groove, a prismatic table groove, a conical groove, a pyramid groove, etc., which is not particularly limited in this application, and the shape of the groove 11a matches the shape of the pad 22. The groove 11a shown in the drawings is a hemispherical groove, and the diameter corresponding to the inner wall of the groove 11a gradually decreases in the direction of the circuit layer 11 facing away from the electronic component body 21.

In an exemplary embodiment, referring to fig. 3 and 4, the height of the groove 11a is greater than the height of the pad 22, and the dimension of the end of the pad 22 connected to the electronic component body 21 is smaller than the dimension corresponding to the opening of the groove 11a, so that the pad 22 may be completely contained in the groove 11a, so that a portion of the pad 22 is prevented from extending out of the groove 11a, and the pad 22 is further prevented from being affected by impurities such as moisture, oxygen, or dust.

In this embodiment, referring to fig. 4, a conductive film 12 is disposed on an inner wall of each groove 11a, and the connection member 30 is disposed between the conductive film 12 and the pad 22, and the conductive film 12 is used for conducting electricity.

It will be appreciated that a portion of the inner wall of the recess 11a is a conductive element in the circuit layer 11, and the conductive film 12 is disposed on the inner wall of the recess 11a, so that the conductive film 12 is electrically connected to the conductive element in the circuit layer 11, and further electrically connects the pad 22 to the conductive element in the circuit layer 11.

In an exemplary embodiment, the thickness of the conductive film 12 may be the same as the thickness of the conductive elements within the circuit layer 11.

In an exemplary embodiment, the material of the conductive film 12 may include any one or more of platinum (Pt), gold (Au), aluminum (Al), copper (Cu), titanium (Ti), silver (Ag), scandium (Sc), yttrium (Y), chromium (Cr), nickel (Ni), etc., which is not particularly limited in this application. In the embodiment of the present application, the material of the conductive film 12 and the conductive element in the circuit layer 11 is exemplified by Cu.

In an exemplary embodiment, the conductive film 12 may be formed by a deposition process in which a tight control of deposition time and temperature is required to ensure thickness and uniformity of the conductive film 12. After the deposition process is completed, it is necessary to clean the circuit board 10 and remove the unnecessary portion of the conductive film 12.

In the present embodiment, the volume of the connector 30 in each of the grooves 11a is 0.5 to 0.9 times, for example, 0.5 times, 0.53 times, 0.6 times, 0.7 times, 0.78 times, 0.8 times, 0.85 times, 0.9 times, or other values of the volume difference between the groove 11a and the pad 22, which is not particularly limited in the present application.

It will be appreciated that if the volume of the connecting member 30 of the recess 11a is less than 0.5 times the difference between the volume of the recess 11a and the volume of the pad 22, that is, the volume of the connecting member 30 in the recess 11a is small, the occurrence of the cold joint leakage of the connecting member 30 in the recess 11a is liable to occur. If the volume of the connecting member 30 of the groove 11a is greater than 0.9 times the volume difference between the groove 11a and the pad 22, that is, the volume of the connecting member 30 in the groove 11a is greater, the conductive film 12 is further disposed on the inner wall of the groove 11a, the connecting member 30 overflows the groove 11a, and thus a short circuit caused by bridging of adjacent connecting members 30 is likely to occur.

In this embodiment, referring to fig. 1, fig. 2 and fig. 5, fig. 5 is a schematic bottom view of a substrate of a circuit board assembly disclosed in a first embodiment of the present application. The circuit board 10 further includes a substrate 13, the substrate 13 is disposed on a side of the circuit layer 11 opposite to the electronic component body 21, and the substrate 13 is used for supporting the circuit layer 11.

In this embodiment, the substrate 13 is provided with a hollowed-out portion 13a penetrating through the substrate 13, and the position of the hollowed-out portion 13a corresponds to the position of the electronic component 20, that is, the orthographic projection of the hollowed-out portion 13a on the substrate 13 and the orthographic projection of the electronic component 20 on the substrate 13 are at least partially overlapped.

It will be appreciated that the electronic component 20 generates heat during operation and the conductive film 12 also generates heat when conducting electrical current. The hollowed-out portion 13a reduces the thickness of the circuit board 10 at a portion corresponding to the electronic component 20, so that the heat conducted to the circuit board 10 by the electronic component 20 and the heat of the conductive film 12 can be dissipated more rapidly.

In this embodiment, the circuit board 10 further includes a packaging element 15, where the packaging element 15 is disposed on the hollowed-out portion 13a, and the thickness of the packaging element 15 is smaller than that of the substrate 13, and the packaging element 15 is used to make a portion corresponding to the hollowed-out portion 13a isolated from the circuit layer 11 and the outside, so as to avoid that a portion of the conductive element and the guide hole in the circuit layer 11 are affected by moisture, oxygen or dust and other impurities, and increase the air tightness of the circuit layer 11. Wherein the conductive elements within the circuit layer 11 may be traces.

It will be appreciated that the thermal conductivity of the package 15 is greater than that of the substrate 13, and thus the heat of the circuit layer 11 can be rapidly conducted to the package 15. When the encapsulation element 15 is not disposed on the hollowed-out portion 13a, the hollowed-out portion 13a may be exposed by the conductive element and the via hole in the circuit layer 11 corresponding to the hollowed-out portion 13a.

In an exemplary embodiment, the encapsulation member 15 may be formed by curing an encapsulation gel applied to the hollowed-out portion 13a.

Referring to fig. 6, fig. 6 is a schematic diagram illustrating a process of coating a connector with an electronic component according to a first embodiment of the present application. A printing steel mesh 1 is provided, wherein a plurality of through holes 1a are formed in the printing steel mesh 1. The plurality of pads 22 of the electronic component 20 are arranged upwards, the printing steel mesh 1 is arranged on the plurality of pads 22, the positions of the plurality of through holes 1a are in one-to-one correspondence with the positions of the plurality of pads 22, and part of the pads 22 are exposed from the through holes 1a. And placing a spray head 2 of an automatic printer on the printing steel mesh 1, wherein the spray head 2 is pre-coated with a layer of solder paste 3 on the printing steel mesh 1, and part of the solder paste 3 flows into a plurality of through holes 1a. Referring to fig. 7, fig. 7 is a schematic structural diagram of a circuit board coated connection member according to the first embodiment of the present application, and after the printed steel mesh 1 is removed, the connection member 30 is formed on each of the pads 22.

It will be appreciated that the volume of the solder paste 3 in each of the through holes 1a should correspond to the volume of the connector 30 in each of the grooves 11a described above. Therefore, by pre-coating the solder paste 3 on the printing steel mesh 1, that is, forming the connection members 30 on the plurality of pads 22 of the electronic component 20, it is possible to precisely control the volume of the connection members 30 formed on each pad 22, and then to assemble the pads 22 of the electronic component 20 into the grooves 11a of the circuit layer 11. Wherein the pad 22 can be assembled into the groove 11a by means of a punch.

It will also be appreciated that the application of the solder paste 3 to the circuit board 10 may result in uncontrollable volumes and locations of the solder paste 3 in each of the grooves 11a, which may result in the occurrence of a cold solder leak in the connector 30 within the groove 11a or an overflow of the connector 30 from the groove 11a.

In an exemplary embodiment, the strength of the precoating of the spray head 2 and the thickness of the solder paste 3 may be determined by optimal parameters determined by the quality tool DOE.

In an exemplary embodiment, the volume of each through hole 1a is between the minimum volume and the maximum volume of the connector 30.

In an exemplary embodiment, the through hole 1a may be a cylindrical hole, a prismatic hole, a truncated cone hole, etc., which is not particularly limited in this application.

In summary, the circuit board assembly 100 provided in the embodiment of the present application includes the circuit board 10 and the electronic component 20 electrically connected. The circuit board 10 includes a circuit layer 11, and a plurality of grooves 11a are formed in one side of the circuit layer 11. The circuit board assembly 100 further includes a plurality of connectors 30, and the connectors 30 are disposed in each of the grooves 11a. The electronic component 20 includes an electronic component body 21 and a plurality of pads 22, and the plurality of pads 22 are disposed on one side of the electronic component body 21 and electrically connected to the electronic component body 21. The pads 22 are provided in each of the grooves 11a, and the connector 30 fixes the pads 22 into the grooves 11a and electrically connects the circuit board 10 with the electronic component 20. Therefore, by disposing the connector 30 and the pad 22 of the electronic component 20 in the recess 11a, even if the circuit board 10 is bent by external force, the connector 30 is not cracked, and thus an abnormality of the electronic device equipped with the circuit board assembly 100 due to the cracking of the connection of the circuit board 10 and the electronic component 20 does not occur. Moreover, by providing a plurality of grooves 11a on one side of the circuit layer 11, there is no need to add a new process and new equipment, and there is no need to add additional materials, so that the cost is reduced, the mass productivity is high, the circuit board 10 is convenient to rapidly produce, and the competitiveness is increased.

Referring to fig. 8, fig. 8 is a schematic layer structure of an electronic device according to a second embodiment of the present application, and the electronic device 400 provided in the embodiment of the present application includes a housing 200 and the above-mentioned circuit board assembly 100, where the circuit board assembly 100 is disposed in the housing 200. For a description of the circuit board assembly 100, please refer to the description of the first embodiment of the present application, and the description is omitted herein.

In an exemplary embodiment, the electronic apparatus 400 may be a display device, the electronic apparatus 400 includes a display panel 300, the housing 200, and the circuit board assembly 100, and the display panel 300 and the circuit board assembly 100 are both located within the housing 200. The display panel 300 includes a light-emitting side and a non-light-emitting side, the light-emitting side of the display panel 300 is exposed out of the housing 200, and the circuit board assembly 100 may be disposed on the non-light-emitting side of the display panel 300. The circuit board assembly 100 is electrically connected to the display panel 300 to provide an electric signal to the display panel 300, and the display panel 300 is used for displaying pictures.

In an exemplary embodiment, the display panel 300 may be a liquid crystal display panel (Liquid Crystal Display, LCD), an Organic Light-Emitting Diode (OLED) display panel, or a Micro Light-Emitting Diode (Micro LED) display panel, which is not particularly limited in this application.

In summary, the electronic device 400 provided in the embodiment of the utility model includes the housing 200 and the circuit board assembly 100, and the circuit board assembly 100 includes the circuit board 10 and the electronic component 20 electrically connected. The circuit board 10 includes a circuit layer 11, and a plurality of grooves 11a are formed in one side of the circuit layer 11. The circuit board assembly 100 further includes a plurality of connectors 30, and the connectors 30 are disposed in each of the grooves 11a. The electronic component 20 includes an electronic component body 21 and a plurality of pads 22, and the plurality of pads 22 are disposed on one side of the electronic component body 21 and electrically connected to the electronic component body 21. The pads 22 are provided in each of the grooves 11a, and the connector 30 fixes the pads 22 into the grooves 11a and electrically connects the circuit board 10 with the electronic component 20. Therefore, by disposing the connector 30 and the pad 22 of the electronic component 20 in the recess 11a, even if the circuit board 10 is bent by external force, the connector 30 is not cracked, and thus an abnormality of the electronic device equipped with the circuit board assembly 100 due to the cracking of the connection of the circuit board 10 and the electronic component 20 does not occur.

In the description of the present specification, reference to the terms "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present application. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiments or examples. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

It is to be understood that the application of the present application is not limited to the examples described above, but that modifications and variations can be made by a person skilled in the art from the above description, all of which modifications and variations are intended to fall within the scope of the claims appended hereto. Those skilled in the art will recognize that the implementations of all or part of the procedures described in the embodiments described above and in accordance with the equivalent arrangements of the claims are within the scope of the present application.

Claims (10)

1. The circuit board assembly comprises a circuit board and an electronic element which are electrically connected, and is characterized in that the circuit board comprises a circuit layer, a plurality of grooves are formed in one side of the circuit layer, connecting pieces are arranged in each groove, the electronic element comprises an electronic element body and a plurality of gaskets, the gaskets are arranged on one side of the electronic element body, the electronic element body is arranged on one side of the circuit layer, a plurality of grooves are formed in the circuit layer, the gaskets are arranged in each groove, and the connecting pieces are used for fixing the gaskets in the grooves and electrically connecting the circuit board with the electronic element.

2. The circuit board assembly of claim 1, wherein the pad decreases in size in a direction in which the pad faces away from the electronic component body.

3. The circuit board assembly of claim 1, wherein the inner walls of the recess decrease in size in a direction of the circuit layer away from the electronic component body.

4. The circuit board assembly of claim 1, wherein the pad has a hemispherical, semi-ellipsoidal, frustoconical, prismatic, conical or pyramidal shape overall;

the whole of the groove is a hemispherical groove, a semi-ellipsoidal groove, a circular table groove, a prismatic table groove, a conical groove or a pyramid groove.

5. The circuit board assembly of claim 1, wherein the height of the recess is greater than the height of the pad, and the size of the end of the pad that is connected to the electronic component body is smaller than the size corresponding to the opening of the recess.

6. The circuit board assembly of claim 1, wherein an electrically conductive film is disposed on an inner wall of each of the grooves, and the connector is disposed between the conductive film and the pad.

7. The circuit board assembly of claim 1, wherein the volume of the connector within each recess is 0.5 times to 0.9 times the volume difference of the recess and the pad.

8. The circuit board assembly of any one of claims 1-7, wherein the circuit board further comprises a substrate disposed on a side of the circuit layer facing away from the electronic component body;

the substrate is provided with a hollowed-out part penetrating through the substrate, and the position of the hollowed-out part corresponds to the position of the electronic element.

9. The circuit board assembly of claim 8, wherein the circuit board further comprises a packaging element disposed in the hollowed-out portion, and wherein a thickness of the packaging element is less than a thickness of the substrate.

10. An electronic device comprising a housing and the circuit board assembly of any one of claims 1-9 disposed within the housing.