CN213126576U - Circuit board - Google Patents

Abstract

The utility model relates to the field of electronic technology, a circuit board is provided, including base plate and electronic component, electronic component with the base plate is connected. The electronic element is arranged in the mounting groove, so that the part of the electronic element is lower than the substrate when the electronic element is mounted, and the height of the electronic element relative to the surface of the substrate is smaller than the diameter of the electronic element, thereby reducing the mounting height of the circuit board.

Description

Circuit board

[ technical field ] A method for producing a semiconductor device

The utility model relates to the technical field of electronics, in particular to circuit board.

[ background of the invention ]

The circuit board generally includes a substrate and an electronic device mounted on a surface of the substrate, wherein the electronic device is provided with a pin, and the pin is soldered on the substrate. The traditional horizontal mounting mode of the electronic element is that two upright pins are bent through a bending machine, then the electronic element is assembled on a substrate in a manual mounting mode and then welded, the electronic element is horizontally mounted on the surface of the substrate, the height of the electronic element relative to the surface of the substrate is at least the diameter of the electronic element, and the mounting height is high and is not suitable for occasions with height limitation.

[ Utility model ] content

In order to solve the above technical problem, an embodiment of the present invention provides a circuit board, which can reduce the installation height of an electronic component.

The embodiment of the utility model provides a solve its technical problem and adopt following technical scheme:

provided is a circuit board, characterized by comprising:

the mounting structure comprises a base plate, a mounting groove and a positioning piece, wherein the base plate is provided with the mounting groove which penetrates through the base plate;

the electronic element comprises an element body and pins, the element body is arranged in the mounting groove, the pins extend from one end of the element body to be welded with the substrate, the axes of the two pins and the axis of the element body are located on the same plane, the axes of the element body are parallel to the substrate, and one end of each pin, facing the element body, is attached to the first surface of the substrate, so that the mounting height of the electronic element is the minimum;

the mounting height is the height of the electronic component protruding from the first surface.

Optionally, the substrate is provided with a welding hole; the pins are arranged in the welding holes.

Optionally, the number of the welding holes is two, the number of the pins is also two, and each pin corresponds to one welding hole.

Optionally, the mounting height is a minimum of a sum of radii of the component body and the pin.

Optionally, an end of the pin facing away from the component body is bent and passes through the welding hole.

Optionally, the pin is welded in the welding hole.

Optionally, the substrate is annular, U-shaped, or L-shaped.

Optionally, the electronic element is one of a capacitor, an inductor, and a diode.

Compared with the prior art, the embodiment of the utility model provides an in the base plate on seted up the mounting groove, the mounting groove link up in the base plate, electronic component sink in the mounting groove, can make electronic component for the base plate surface highly be less than electronic component's diameter to reduce the mounting height of circuit board.

[ description of the drawings ]

One or more embodiments are illustrated in drawings corresponding to, and not limiting to, the embodiments, in which elements having the same reference number designation may be represented as similar elements, unless specifically noted, the drawings in the figures are not to scale.

FIG. 1 is a schematic diagram of a conventional circuit board;

fig. 2 is a schematic structural diagram of a circuit board according to an embodiment of the present invention;

FIG. 3 is a schematic structural diagram of a substrate of the circuit board shown in FIG. 2;

FIG. 4 is a schematic diagram of the structure of the electronic components of the circuit board shown in FIG. 2;

FIG. 5 is a schematic view of another configuration of the circuit board of FIG. 2;

FIG. 6 is a schematic diagram of another perspective view of the circuit board shown in FIG. 2;

fig. 7 is a schematic structural diagram of a circuit board according to another embodiment of the present invention;

fig. 8 is a schematic structural view of a circuit board according to another embodiment of the present invention;

fig. 9 is a schematic structural view of a circuit board according to another embodiment of the present invention.

[ detailed description ] embodiments

In order to facilitate understanding of the present invention, the present invention will be described in more detail with reference to the accompanying drawings and specific embodiments. It is noted that when an element is referred to as being "secured to"/"mounted to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may be present. The terms "upper", "lower", "inner", "outer", "vertical", "horizontal", and the like as used herein are used in the description to indicate orientations and positional relationships based on the orientations and positional relationships shown in the drawings, and are used only for convenience in describing the present invention and for simplicity in description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

Furthermore, the technical features mentioned in the different embodiments of the invention described below can be combined with each other as long as they do not conflict with each other.

Referring to fig. 1, fig. 1 is a schematic structural diagram of a conventional circuit board 900. The conventional circuit board 900 includes a substrate 91 and an electronic component 92 mounted on the substrate 91, wherein the electronic component 92 is a capacitor as an example. Be equipped with two welding holes on the base plate 91, the condenser includes capacitor body 920 and two pins 922, and two pins 922 extend from the one end of capacitor body 920 respectively.

In a traditional horizontal capacitor mounting mode, two pins 922 are bent through a bending machine respectively, so that the two pins 922 present a bending angle of about 90 degrees relative to a capacitor body 920 to form a part capable of being welded with a substrate 91; then the capacitor is assembled on the substrate 91 by manual installation, the capacitor body 920 is arranged on the surface of the substrate 92, and the two pins 922 are respectively inserted into the two welding holes on the substrate 91 and then welded.

The pins of the capacitor are bent through machinery in the traditional circuit board mounting mode, and then are manually positioned and assembled, so that the whole assembly process is time-consuming and labor-consuming, and the defect of high assembly cost exists. In addition, the mounting height of the circuit board after mounting is the diameter of the capacitor, and the height of the circuit board is relatively high as a whole, so that the circuit board is not suitable for being mounted in occasions with height limitation.

Referring to fig. 2, fig. 2 is a schematic diagram of a circuit board 100 according to an embodiment of the present invention. The circuit board 100 includes a substrate 10 and an electronic component 20 mounted on the circuit board, and the electronic component 20 is electrically connected to the substrate 10. The electronic component 20 may be a capacitor, an inductor, a potentiometer, a diode, or the like.

Referring to fig. 3, fig. 3 is a schematic structural diagram of the substrate 10. The substrate 10 includes two surfaces, which are a first surface and a second surface, respectively, and the first surface and the second surface are oppositely disposed. The middle of the substrate 10 is opened with a mounting groove 11, the mounting groove 11 penetrates through two surfaces of the substrate 10, so that the substrate 10 forms a ring shape, and the mounting groove 11 is used for mounting the electronic component 20. In the present embodiment, the mounting groove 11 is rectangular, and it is understood that in some other embodiments, the mounting groove 11 is configured in other shapes according to actual requirements, such as circular, oval, fan-shaped, etc., only that the mounting groove 11 can provide the mounting position of the electronic component 20. The substrate 10 is further provided with a welding hole 12, the welding hole 12 is arranged on one side of the mounting groove 12, the welding hole 12 penetrates through two surfaces of the substrate 10, and the welding hole 12 is used for being electrically connected with the electronic element 20.

Referring to fig. 4, fig. 4 is a schematic structural diagram of the electronic device 20. The electronic component 20 includes a component body 21 and a pin 22, and the component body 21 is connected to the pin 22. The element body 21 is cylindrical, the pin 22 extends from one end of the element body 21, and the extending direction of the pin 22 is the same as the axial direction of the element body 21. The component body 21 is installed in the installation groove 11, and the pins 22 are welded to the welding holes 12. It is understood that in some other embodiments, the shape of the element body 21 may be set according to actual requirements, such as an elliptic cylinder, a rectangular cylinder, etc., and is not limited herein. When the element body 21 is non-cylindrical, the axis of the element body 21 is a center line in the direction of the opposite end faces.

In this embodiment, the number of the pins 22 is two, the two pins 22 are respectively disposed at one end of the component body 21, and the axes of the two pins 22 and the axis of the component body 21 are disposed on the same plane. Correspondingly, the number of the welding holes 12 is also two, and each pin 22 corresponds to one welding hole 12. It will be appreciated that in some other embodiments, the number of the pins 22 may be increased or decreased according to actual requirements, such as one or more.

Referring to fig. 5 and fig. 6 together, fig. 5 is a schematic structural diagram of the substrate 10 and the electronic element 20 in an inserted state, and fig. 6 is a schematic structural diagram of the substrate 10 and the electronic element 20 in an assembled state. When the substrate 10 and the electronic component 20 are assembled, the electronic component 20 is mounted on the substrate 10 by an automatic component inserter, so that the pins 22 are inserted into the soldering holes 12, the insertion direction of the pins 22 is the direction in which the first surface faces to the second surface, and the axial direction of the component body 21 is approximately perpendicular to the substrate 10; then the pins 22 are soldered on the substrate 10 by wave soldering; then, the element body 21 is pressed into the mounting groove 11 through manual operation, the pin 22 is correspondingly bent, and one end of the pin 22 facing the element body 21 is attached to the first surface, so that assembly is completed. The positioning and welding between the electronic element 20 and the substrate 10 are completed mechanically, which can effectively reduce labor cost, accelerate work efficiency and improve the level of mounting process.

After the assembly is completed, the axis of the element body 21 is parallel to the substrate 10, one end of the pin 22 facing the element body 21 is attached to the first surface of the substrate 10, and one end of the pin 22 facing away from the element body 21 is bent. At this time, the mounting height of the electronic component 20 is the minimum, which is the sum of the radii of the component body 21 and the leads 22. Wherein the mounting height is a height at which the electronic component 20 protrudes from the first surface. The electronic component 20 is reduced in mounting height and is convenient to use in mounting places with height restrictions.

In this embodiment, after the electronic component 20 and the component body 21 are assembled, the component body 21 and the substrate 10 are bonded by an adhesive, so that the component body 21 is fixed in the mounting groove 11. It is understood that in some other embodiments, a positioning structure may be disposed in the mounting groove 11 to fix the element body 21, or alternatively, a positioning structure may be disposed on an external structure to fix the element body 21, which is not limited herein.

Referring to fig. 7, fig. 7 and fig. 8 are schematic structural diagrams of a circuit board 200 according to another embodiment of the present invention, respectively. The circuit board 200 is different from the circuit board 100 of the above-described embodiment in the shape of the substrate. Specifically, the circuit board 200 includes a base plate 10a, the base plate 10a is U-shaped, a mounting groove 11a is formed on the base plate 10a, and the mounting groove 11a is provided with an opening without being completely closed. The element body 21 is installed in the installation groove 11a, and one surface of the element body 21, which faces the opening of the installation groove 11a, can be connected with an external structure, so that different assembly requirements are met. As shown in fig. 7, an opening of the mounting groove 11a may be set as an end of the mounting groove 11a facing away from the welding hole 12, so that an end surface of the component body 21 facing away from the pin 22 may be connected with an external structure, or, as shown in fig. 8, an opening of the mounting groove 11a may be set at one side of the mounting groove 11a, so that a side surface of the component body 21 may be connected with an external structure.

Referring to fig. 9, fig. 9 is a schematic view illustrating a circuit board 300 according to another embodiment of the present invention. The circuit board 300 is different from the circuit boards 100 and 200 in the above embodiments in the shape of the substrate. Specifically, the circuit board 300 includes a substrate 10b, the substrate 10b is L-shaped, a mounting groove 11b is formed in the substrate 10b, and the mounting groove 11b is not completely closed. The base plate 10b includes two side plates, the two side plates are perpendicular to each other, one of the side plates is provided with the welding hole 12, one of the side plates is used for connecting with the pin 22, and the other side plate is used for positioning with the side surface of the element body 21. Under the condition of realizing the assembly of the substrate 10b and the electronic element 20, the area of the substrate is reduced, different assembly requirements are met, and the production material of the substrate can be saved.

Compared with the prior art, the embodiment of the utility model provides an in the base plate on seted up the mounting groove, the mounting groove link up in the base plate, electronic component sink in the mounting groove, can make when electronic component installs the part be less than the base plate makes mounting height is less than electronic component's diameter, thereby reduces the mounting height of circuit board.

Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit it; within the idea of the invention, also technical features in the above embodiments or in different embodiments can be combined, steps can be implemented in any order, and there are many other variations of the different aspects of the invention as described above, which are not provided in detail for the sake of brevity; although the present invention has been described in detail with reference to the foregoing embodiments, it should be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications and substitutions do not depart from the spirit and scope of the present invention.

Claims (8)

1. A circuit board, comprising:

the mounting structure comprises a base plate, a mounting groove and a positioning piece, wherein the base plate is provided with the mounting groove which penetrates through the base plate;

the electronic element comprises an element body and pins, the element body is arranged in the mounting groove, the pins extend from one end of the element body to be welded with the substrate, the axes of the two pins and the axis of the element body are located on the same plane, the axes of the element body are parallel to the substrate, and one end of each pin, facing the element body, is attached to the first surface of the substrate, so that the mounting height of the electronic element is the minimum;

the mounting height is the height of the electronic component protruding from the first surface.

2. The circuit board of claim 1, wherein the substrate is provided with solder holes; the pins are arranged in the welding holes.

3. The circuit board of claim 2, wherein the number of the soldering holes is two, and the number of the pins is also two, and each of the pins corresponds to one of the soldering holes.

4. The circuit board of claim 2, wherein the mounting height is at least the sum of the radii of the component body and the pin.

5. The circuit board of claim 2, wherein an end of the pin facing away from the component body is bent and passes through the soldering hole.

6. The circuit board of any one of claims 2-5, wherein the pin is soldered within the solder hole.

7. The circuit board of any one of claims 1-5, wherein the substrate is ring-shaped, U-shaped, or L-shaped.

8. The circuit board according to any one of claims 1 to 5, wherein the electronic component is one of a capacitor, an inductor, and a diode.

Images