CN215343052U - Contact pin - Google Patents

Contact pin Download PDF

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Publication number
CN215343052U
CN215343052U CN202121241725.1U CN202121241725U CN215343052U CN 215343052 U CN215343052 U CN 215343052U CN 202121241725 U CN202121241725 U CN 202121241725U CN 215343052 U CN215343052 U CN 215343052U
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CN
China
Prior art keywords
welding
pins
pin
positioning
contact pin
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Application number
CN202121241725.1U
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Chinese (zh)
Inventor
路晓波
任雪锋
陈斌斌
谢玲
高成钰
薛青颖
刘文力
贺程明
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Changzhou Xingyu Automotive Lighting Systems Co Ltd
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Changzhou Xingyu Automotive Lighting Systems Co Ltd
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Application filed by Changzhou Xingyu Automotive Lighting Systems Co Ltd filed Critical Changzhou Xingyu Automotive Lighting Systems Co Ltd
Priority to CN202121241725.1U priority Critical patent/CN215343052U/en
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Publication of CN215343052U publication Critical patent/CN215343052U/en
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Abstract

The utility model relates to the field of electronics, in particular to a contact pin which comprises a positioning frame and at least two welding pins, wherein a positioning boss is arranged on the positioning frame and is inserted into a positioning groove of a PCB for positioning, the welding pins are connected to the positioning frame, pins are arranged on the welding pins, and when the positioning boss is inserted into the positioning groove of the PCB, the pins are placed into the welding position of the PCB. The utility model solves the technical problem that the existing contact pin can not adapt to the automatic mounting and reflow soldering process so as to realize automatic assembly.

Description

Contact pin
Technical Field
The utility model relates to the field of electronics, in particular to a contact pin.
Background
The development of the automobile electronic industry is changed day by day, the development period of new products is shorter and shorter, and the tool efficiency of electronic assembly must be improved to meet the later challenges. At present, pin assembly is mainly manual plug-in, and the pin assembly has low working efficiency, high cost and poor quality consistency. Therefore, new pins need to be developed and new processes are adopted to improve the working efficiency, reduce the production cost and improve the quality. According to practical summary, the defects of manual plug-in can be overcome by using an automatic chip mounting technology and a reflow soldering process, and the current technical bottleneck is broken.
In order to meet the requirements of the automatic mounting and reflow soldering processes of the contact pins, the structure of the contact pins needs to be changed. The contact pin after the change will guarantee absorbing the stability of in-process self form, and the contact pin will guarantee the accurate nature of subsides dress, and the contact pin guarantees the stability of form when reflow soldering, and the contact pin will balance the pulling force that the tin cream melted and the crystallization produced in welding process, will satisfy the welding strength requirement after the welding.
Disclosure of Invention
The utility model provides a contact pin and solves the technical problem that the existing contact pin cannot adapt to automatic mounting and reflow soldering processes and cannot realize automatic assembly.
The technical scheme adopted by the utility model for solving the technical problems is as follows:
the utility model provides a contact pin, comprising: the positioning frame is provided with a positioning boss, and the positioning boss is inserted into the positioning groove of the PCB for positioning; the PCB welding fixture comprises at least two welding pins, wherein the welding pins are connected to a positioning frame, pins are arranged on the welding pins, and when the positioning bosses are inserted into positioning grooves of the PCB, the pins are placed into welding positions of the PCB.
According to the contact pin, the positioning frame of the contact pin is sucked by the suction nozzle of the chip mounter, the contact pin is conveyed to the mounting position of the PCB, specifically, the contact pin is positioned by inserting the positioning boss of the positioning frame into the positioning groove of the PCB, and then the positioned pin is welded on the PCB through reflow soldering, so that the automatic production of contact pin assembly is realized, and the production efficiency and the soldering quality are improved. Meanwhile, the positioning boss is used for balancing the gravity of the contact pin, and the stability of the contact pin in the suction and transportation process is guaranteed.
Furthermore, a guard plate is further arranged on the positioning frame and arranged on one side of the positioning boss.
Furthermore, a through hole is formed in the joint of the positioning boss and the guard plate, and the welding pin is clamped in the through hole.
Furthermore, the number of the welding pins is two, the two welding pins penetrate through the corresponding through holes to be connected with the positioning frame, the protruding part of one protruding end of each welding pin is provided with the pin extending transversely, and the extending directions of the pins of the two welding pins are opposite and are located on the same plane.
Further, the pin is perpendicular to the extending direction of the welding pin.
Further, the locating rack is made of PA9T material.
Based on the technical scheme, the utility model can realize the following technical effects:
according to the contact pin, the positioning frame of the contact pin is sucked by the suction nozzle of the chip mounter, the contact pin is conveyed to the mounting position of the PCB, specifically, the contact pin is positioned by inserting the positioning boss of the positioning frame into the positioning groove of the PCB, and then the positioned pin is welded on the PCB through reflow soldering, so that the automatic production of contact pin assembly is realized, and the production efficiency and the soldering quality are improved. Meanwhile, the positioning boss is used for balancing the gravity of the contact pin, and the stability of the contact pin in the suction and transportation process is guaranteed.
Drawings
FIG. 1 is a schematic diagram of the overall construction of a pin of the present invention;
FIG. 2 is a schematic view of a pin keeper of the present invention;
FIG. 3 is another schematic view of the pin keeper of the present invention;
FIG. 4 is a schematic view of a weld pin of the contact pin of the present invention;
FIG. 5 is a schematic view of the pin of the present invention inserted into a PCB board;
fig. 6 is another schematic view of the pin of the present invention inserted into a PCB board.
Wherein: 1-a positioning frame, 11-a positioning boss, 12-a guard plate and 13-a through hole; 2-welding pins, 21-pins, 3-PCB and 31-positioning grooves.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the utility model, its application, or uses. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It is noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of example embodiments according to the present application. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, and it should be understood that when the terms "comprises" and/or "comprising" are used in this specification, they specify the presence of stated features, steps, operations, devices, components, and/or combinations thereof, unless the context clearly indicates otherwise.
The relative arrangement of the components and steps, the numerical expressions and numerical values set forth in these embodiments do not limit the scope of the present invention unless specifically stated otherwise. Meanwhile, it should be understood that the sizes of the respective portions shown in the drawings are not drawn in an actual proportional relationship for the convenience of description. Techniques, methods, and apparatus known to those of ordinary skill in the relevant art may not be discussed in detail but are intended to be part of the specification where appropriate. In all examples shown and discussed herein, any particular value should be construed as merely illustrative, and not limiting. Thus, other examples of the exemplary embodiments may have different values. It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, further discussion thereof is not required in subsequent figures.
In the description of the present invention, it is to be understood that the orientation or positional relationship indicated by the orientation words such as "front, rear, upper, lower, left, right", "lateral, vertical, horizontal" and "top, bottom", etc. are usually based on the orientation or positional relationship shown in the drawings, and are only for convenience of description and simplicity of description, and in the case of not making a reverse description, these orientation words do not indicate and imply that the device or element being referred to must have a specific orientation or be constructed and operated in a specific orientation, and therefore, should not be considered as limiting the scope of the present invention; the terms "inner and outer" refer to the inner and outer relative to the profile of the respective component itself.
Spatially relative terms, such as "above … …," "above … …," "above … …," "above," and the like, may be used herein for ease of description to describe one device or feature's spatial relationship to another device or feature as illustrated in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if a device in the figures is turned over, devices described as "above" or "on" other devices or configurations would then be oriented "below" or "under" the other devices or configurations. Thus, the exemplary term "above … …" can include both an orientation of "above … …" and "below … …". The device may be otherwise variously oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.
It should be noted that the terms "first", "second", and the like are used to define the components, and are only used for convenience of distinguishing the corresponding components, and the terms have no special meanings unless otherwise stated, and therefore, the scope of the present invention should not be construed as being limited.
In order to meet the requirements of the automatic mounting and reflow soldering processes of the contact pins, the structure of the contact pins needs to be changed. The contact pin after the change will guarantee absorbing the stability of in-process self form, and the contact pin will guarantee the accurate nature of subsides dress, and the contact pin guarantees the stability of form when reflow soldering, and the contact pin will balance the pulling force that the tin cream melted and the crystallization produced in welding process, will satisfy the welding strength requirement after the welding.
As shown in fig. 1 to 6, the contact pin of this embodiment is a symmetrical design, and includes two welding pins 2 and a positioning frame 1 sleeved on the welding pins 2, the positioning frame 1 includes a protection plate 12 and a positioning boss 11, the protection plate 12 and the positioning boss 11 are integrally formed, one side of the protection plate 12 away from the positioning boss 11 is used for being adsorbed by a suction nozzle of a chip mounter, the other side of the protection plate 12 is provided with the positioning boss 11, the positioning boss 11 is inserted into a positioning groove 31 of a PCB 3 to position the entire contact pin on the PCB 3, two parallel through holes 13 are formed at a connection of the positioning boss 11 and the protection plate 12, the two welding pins 2 pass through the corresponding through holes 13 and are clamped in the through holes 13, one protruding end of the welding pins 2 is provided with a laterally extending pin 21, the pin 21 is designed in a single-side flying wing shape, specifically, the pin 21 is perpendicular to the welding pins 2, and the extending directions of the pins 21 of the two welding pins 2 are opposite and located on the same plane.
The contact pin of this example, backplate 12 through the locating rack 1 of chip mounter's suction nozzle absorption contact pin transports the contact pin to PCB board 3's installation position, specifically fixes a position the contact pin through the positioning groove 31 that inserts PCB board 3 with locating rack 1's location boss 11, then welds PCB board 3 through reflow soldering to the pin 21 of the contact pin of good location on to realized the automated production of contact pin assembly, improved production efficiency and welding quality. Meanwhile, the positioning boss 11 is used for balancing the gravity of the contact pin, the stability of the contact pin in the suction transportation process is guaranteed, furthermore, the single-side wing-shaped pin 21 of the welding pin 2 is used for increasing the welding area and improving the welding strength, and the single-side wing-shaped pins 21 which are symmetrically arranged can balance the tensile force generated by solder paste in the welding process, so that the contact pin is prevented from shaking on the PCB 3 in the welding process, and the position accuracy of the contact pin on the PCB 3 is guaranteed.
Furthermore, the locating rack 1 is made of PA9T material, which has high temperature resistance and thermal deformation temperature above 280 ℃, and can ensure that the contact pin is not deformed during reflow soldering.
It should be understood that the above-described specific embodiments are merely illustrative of the present invention and are not intended to limit the present invention. Obvious variations or modifications which are within the spirit of the utility model are possible within the scope of the utility model.

Claims (6)

1. A pin, comprising:
the positioning frame (1) is provided with a positioning boss (11), and the positioning boss (11) is inserted into a positioning groove (31) of the PCB (3) for positioning;
at least two welding needles (2), welding needle (2) are connected on locating rack (1), be provided with pin (21) on welding needle (2), when location boss (11) inserted positioning groove (31) of PCB board (3), the welding position of PCB board (3) is put into in pin (21).
2. A pin according to claim 1, characterized in that a guard plate (12) is further provided on the retainer (1), the guard plate (12) being provided on one side of the positioning boss (11).
3. A contact pin according to claim 2, characterized in that a through hole (13) is formed at the joint of the positioning boss (11) and the guard plate (12), and the welding pin (2) is clamped in the through hole (13).
4. A contact pin according to claim 3, characterized in that the number of the welding pins (2) is two, the two welding pins (2) are connected with the positioning frame (1) through the corresponding through holes (13), the protruding part of one protruding end of the welding pins (2) is provided with the pins (21) extending transversely, and the extending directions of the pins (21) of the two welding pins (2) are opposite and are located on the same plane.
5. A pin according to claim 4, characterized in that the pins (21) are perpendicular to the extension of the soldering pin (2).
6. A pin as claimed in claim 1, characterized in that the spacer (1) is made of PA9T material.
CN202121241725.1U 2021-06-04 2021-06-04 Contact pin Active CN215343052U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202121241725.1U CN215343052U (en) 2021-06-04 2021-06-04 Contact pin

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202121241725.1U CN215343052U (en) 2021-06-04 2021-06-04 Contact pin

Publications (1)

Publication Number Publication Date
CN215343052U true CN215343052U (en) 2021-12-28

Family

ID=79551131

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202121241725.1U Active CN215343052U (en) 2021-06-04 2021-06-04 Contact pin

Country Status (1)

Country Link
CN (1) CN215343052U (en)

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