CN108037324B - Surface Mount Device (SMD) test terminal and processing method thereof - Google Patents

Surface Mount Device (SMD) test terminal and processing method thereof Download PDF

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Publication number
CN108037324B
CN108037324B CN201711167545.1A CN201711167545A CN108037324B CN 108037324 B CN108037324 B CN 108037324B CN 201711167545 A CN201711167545 A CN 201711167545A CN 108037324 B CN108037324 B CN 108037324B
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China
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vertical
horizontal
arc transition
patch
test
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CN108037324A (en
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韩志辉
陈守军
毛文涛
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Xiamen Kehua Hengsheng Co Ltd
Zhangzhou Kehua Technology Co Ltd
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Xiamen Kehua Hengsheng Co Ltd
Zhangzhou Kehua Technology Co Ltd
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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/04Housings; Supporting members; Arrangements of terminals
    • G01R1/0408Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0416Connectors, terminals

Abstract

The invention discloses a patch test terminal, comprising: a horizontal absorbing part for absorbing by a suction nozzle of the chip mounter; a vertical part connected with the horizontal sucking part and positioned below the horizontal sucking part; the patch bottom plate is arranged at the bottom of the vertical part and is used for being welded at a terminal point position of the PCB; the horizontal sucking part and the vertical part have the same width at two sides; the horizontal absorbing part, the vertical part and the patch bottom plate are integrally bent and formed; the two sides of the horizontal suction part are provided with clamping side walls for clamping test equipment, and the vertical part is provided with a test through hole for hooking a test probe. The invention also discloses a processing method of the patch test terminal. Above-mentioned paster test terminal can improve the efficiency of being connected with PCB for detection efficiency is showing and is promoting.

Description

Surface Mount Device (SMD) test terminal and processing method thereof
Technical Field
The invention relates to the technical field of patch test terminals, in particular to a patch test terminal and a processing method thereof.
Background
The test terminal is mainly used for debugging single boards and debugging complete machines, no patch test terminal manufacturer exists in China at present, and plug-in test terminals are used on the application. Because the volume of the plug-in test terminal is small, the plug-in is difficult to operate manually, and the welded surface needs to be subjected to pin shearing treatment after welding, so that a large amount of working hours are consumed; meanwhile, the pins of the plug-in test terminal are in an outer splayed shape, the plug-in test terminal needs to be inserted into holes of the printed board during plug-in, and the two pins need to be sequenced, so that the plug-in test terminal is inconvenient to operate. In addition, the plug-in test terminal is easy to deform or break after being tested for many times, and the reliability is poor.
Disclosure of Invention
The invention aims to provide a patch test terminal which can improve the connection efficiency with a PCB; another object of the present invention is to provide a method for processing a chip test terminal, which can improve the production efficiency and reduce the production cost.
In order to achieve the above object, the present invention provides a chip test terminal, including:
a horizontal absorbing part for absorbing by a suction nozzle of the chip mounter;
a vertical part connected with the horizontal sucking part and positioned below the horizontal sucking part;
the patch bottom plate is arranged at the bottom of the vertical part and is used for being welded at a terminal point position of the PCB;
the horizontal sucking part and the vertical part have the same width at two sides; the horizontal absorbing part, the vertical part and the patch bottom plate are integrally bent and formed;
the two sides of the horizontal suction part are provided with clamping side walls for clamping test equipment, and the vertical part is provided with a test through hole for hooking a test probe.
Preferably, the patch base plate comprises a rectangular body and extension parts which are positioned on two sides of the rectangular body and extend along the same horizontal direction perpendicular to the rectangular body.
Preferably, the vertical portion and the rectangular body are connected in a transition mode through a bottom arc, the bottom of the front end face of the vertical portion is attached to the rear end face of the rectangular body, the bottoms of the two outer side walls of the vertical portion are respectively attached to the inner side walls of the two extending portions, and the bottom arc is connected to the bottom of the rear end face of the vertical portion and the lower surface of the rectangular body in a transition mode.
Preferably, a top arc transition is provided between the horizontal suction part and the vertical part, an outer arc wall of the top arc transition is connected to the rear end of the upper surface of the horizontal suction part and the upper portion of the rear end surface of the vertical part, respectively, and an inner arc wall of the top arc transition is connected to the rear end of the lower surface of the horizontal suction part and the upper portion of the front end surface of the vertical part, respectively.
Preferably, the horizontal sorption part, the top arc transition, the vertical part, the bottom arc transition and the patch base plate are all the same in thickness; and the widths of the horizontal suction part, the top arc transition part, the vertical part and the bottom arc transition part at two sides are the same as the distance between the inner side walls of the two extending parts.
Preferably, the vertical part is located at the position 2/5-3/5 in the length direction of the patch bottom plate, the outer arc wall and the inner arc wall of the top arc transition are both located at the rear end of the vertical part, and the ratio of the outer arc diameter of the top arc transition to the inner arc diameter of the top arc transition is 1: 7-1: 14; the projection of the outer arc side wall of the top arc transition in the vertical direction does not exceed the tail end of the patch bottom plate, and the projection of the front end of the horizontal suction part in the vertical direction does not exceed the front end of the patch bottom plate.
Preferably, the test through hole is oval, and the major axis of the oval extends in the vertical direction.
Preferably, the ratio of the major axis to the minor axis of the ellipse is between 5:2 and 10: 7.
The invention also provides a processing method of the patch test terminal, which comprises the following steps:
placing the convex conductive plate on a workbench of production equipment;
bending the protruding end of the conductive plate upwards to form a vertical body and a patch bottom plate for point position welding with a terminal of a PCB;
bending the top of the vertical body to form a vertical part and a horizontal suction part which is positioned above the vertical part and used for being sucked by a suction nozzle of a chip mounter, wherein clamping side walls used for clamping test equipment are formed on two sides of the horizontal suction part; the horizontal sucking part and the vertical part have the same width at two sides;
and punching a test through hole for hooking the test probe on the vertical part to form a chip test terminal.
Preferably, the first and second electrodes are formed of a metal,
to be the electrically conductive panel of type of protruding place on production facility's workstation with will the protruding end of electrically conductive panel is upwards buckled, forms vertical body and be used for still including with PCB's between the terminal point location welded paster bottom plate:
cutting a preset depth to the body end of the conductive plate along the extending direction of the two sides of the protruding end of the conductive plate, wherein the preset depth is not more than the total length of the front end and the rear end of the body end;
will the protruding end of conducting plate upwards buckles, and it specifically is to form paster bottom plate and vertical body:
and bending the protruding end upwards by taking the cutting tail end as a reference to form a vertical body and a patch bottom plate with a rectangular body and extending parts, wherein the two extending parts are respectively positioned at two sides of the rectangular body, are perpendicular to the rectangular body and extend along the same horizontal direction.
Preferably, the first and second electrodes are formed of a metal,
will the top of vertical body is buckled, forms vertical portion and is located vertical portion top, the horizontal sorption portion that is used for supplying chip mounter suction nozzle to adsorb specifically do:
bending a first position of the top of the vertical body along a first direction;
bending a second position at the top of the vertical body along a second direction to form a vertical part, a top arc transition part and a horizontal sucking part; wherein the first position is lower than the second position, the first direction being opposite to the second direction; the top arc transition is positioned between the horizontal suction part and the vertical part, the outer arc wall of the top arc transition is respectively connected to the rear end of the upper surface of the horizontal suction part and the upper part of the rear end surface of the vertical part, and the inner arc wall of the top arc transition is respectively connected to the rear end of the lower surface of the horizontal suction part and the upper part of the front end surface of the vertical part;
or specifically:
utilize horizontal mould right the preset position at vertical body top is along the horizontal direction punching press, forms vertical portion, top arc transition and horizontal absorption portion, the top arc transition is located horizontal absorption portion with between the vertical portion, just the outer arc wall of top arc transition connect respectively in the rear end of horizontal absorption portion upper surface with the upper portion of vertical portion rear end face, the inner arc wall of top arc transition connect respectively in the rear end of horizontal absorption portion lower surface with the upper portion of vertical portion front end face.
Compared with the background technology, the patch test terminal provided by the invention has the following beneficial effects:
first, horizontal sorption portion, vertical portion and paster bottom plate three are the integrated into one piece shaping of buckling, are different from the modular structure among the prior art, help improving the production efficiency of paster test terminal, reduction in production cost.
Secondly, the two sides of the horizontal sucking part are provided with clamping side walls for clamping the test equipment, and the vertical part is provided with a test through hole for hooking the test probe; in the testing process, the clamping side wall or the testing through hole can be alternatively used for testing, when the position where the chip testing terminal is located is not convenient for clamping the clamping side wall of the horizontal suction part, the testing through hole can be hooked from top to bottom, the chip testing terminal is contacted, and the testing process is completed.
Finally, the horizontal absorption part is used for realizing that the chip mounting test terminal is absorbed by the chip mounter and conveyed to a required position, and the chip mounting test terminal is welded on the terminal point position of the PCB through the chip mounting bottom plate, so that the mode of manual plug-in the prior art is distinguished, the test efficiency is obviously improved, the manual strength is reduced, and the low-cost test is realized.
Compared with the background art, the processing method of the patch test terminal provided by the invention has the beneficial effects, and details are not repeated herein.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the provided drawings without creative efforts.
Fig. 1 is an isometric view of a patch test terminal provided by an embodiment of the present invention;
FIG. 2 is a front view of FIG. 1;
FIG. 3 is a side view of FIG. 1;
FIG. 4 is a top view of FIG. 1;
fig. 5 is a flowchart of a processing method of a patch test terminal according to an embodiment of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In order that those skilled in the art will better understand the disclosure, the invention will be described in further detail with reference to the accompanying drawings and specific embodiments.
Referring to fig. 1 to 5, fig. 1 is an axial view of a patch test terminal according to an embodiment of the present invention; FIG. 2 is a front view of FIG. 1; FIG. 3 is a side view of FIG. 1; FIG. 4 is a top view of FIG. 1; fig. 5 is a flowchart of a processing method of a patch test terminal according to an embodiment of the present invention.
It should be noted that: the two ends in the text refer to two ends which extend along the X-axis direction by taking the figure 1 as an example in the specification; two sides are two sides extending in the Y-axis direction by taking the figure 1 as an example in the specification; the height direction is the Z-axis direction, i.e., the up-down direction, taking the example of fig. 1 of the specification as an example.
The invention provides a patch test terminal, which comprises a horizontal suction part 10, a vertical part 20 and a patch bottom plate 30 which are sequentially arranged from top to bottom, and the horizontal suction part 10, the vertical part 20 and the patch bottom plate are integrally bent and formed, as shown in the attached drawings 1 to 4 in the specification.
The upper surface of the horizontal sucking part 10 is a horizontal plane for the suction nozzle of the chip mounter to suck; in the test process, a suction nozzle of the chip mounter is sucked on the upper surface of the horizontal suction part 10, so that the whole chip test terminal is sucked and moved to a terminal point of a PCB (Printed Circuit Board), and then the subsequent steps such as soldering are completed.
The vertical part 20 is connected to the horizontal suction part 10, and the vertical part 20 is located below the horizontal suction part 10; the chip bottom plate 30 is located at the bottom of the vertical portion 20, and the bottom surface of the chip bottom plate 30 can be welded with the terminal point position of the PCB, so that the purpose that the chip testing terminal is fixed to the terminal point position of the PCB is achieved.
The horizontal suction part 10 and the vertical part 20 have the same width on both sides, which means: before machining, the horizontal suction part 10 and the vertical part 20 are an integral plate, and after bending, the vertical part 20 and the horizontal suction part 10 positioned above the vertical part 20 are formed; the horizontal suction portion 10 and the vertical portion 20 are not two different members, but are regions having different functions formed by bending a single plate.
The horizontal suction part 10 has clamping sidewalls 101 at both sides thereof for clamping the test equipment, and the vertical part 20 has test through holes 201 for hooking the test probes. In the testing process, the suction nozzle of the chip mounter is adsorbed on the upper surface of the horizontal adsorption part 10, so that the whole chip mounting test terminal is sucked up and moved to the terminal point position of the PCB, the bottom surface of the chip mounting base plate 30 is welded with the terminal point position of the PCB, however, the test through hole 201 is clamped by the test equipment or the test probes of the detection equipment such as the oscilloscope are hooked, so that the relevant parameters of the PCB are transmitted to the test equipment or the detection equipment through the chip mounting test terminal, and the test operation is completed. Due to the clamping side wall 101 and the test through hole 201, in the test process, if the clamping side wall 101 is not convenient to clamp, the test can be realized by hooking the test through hole 201, so that the test diversity is improved, and the test efficiency is improved.
According to the arrangement mode of the test through holes 201, the test through holes 201 can be arranged to be oval, and the major axis of the oval extends in the vertical direction, as shown in the attached figure 2 in the specification. After the paster test terminal welds in PCB terminal point location, vertical portion 20 is vertical form, and in the test process, the test through-hole 201 is hooked to the test probe who utilizes check out test set such as oscilloscope, and the test through-hole 201 is often hooked by from top to bottom to the test probe, and based on this, set up test through-hole 201 to oval, and oval major axis extends along vertical direction, has certain surplus in vertical direction, makes things convenient for the test probe to stretch into test through-hole 201, is convenient for hook. Specifically, the ratio of the major axis to the minor axis of the ellipse can be 5:2 to 10:7, preferably 2:1, which can satisfy the operation of most of the test probes at present, so that the test probes can be hooked on the test through holes 201 conveniently, thereby improving the test efficiency.
More specifically, the patch base plate 30 includes a rectangular body 301 and two extending portions 302, the rectangular body 301 and the two extending portions 302 are integrally disposed, the rectangular body 301 and the two extending portions 302 are perpendicular in a horizontal plane, the two extending portions 302 are respectively located at two sides of the patch base plate 30, and the two extending portions 302 extend along the same horizontal direction, that is, along the X-axis direction shown in fig. 1 of the specification.
The paster bottom plate 30 that so sets up, two extensions 302 compare in rectangle body 301 increased with the welding area of PCB terminal point location, further satisfy the encapsulation welding demand, the area of tin material when having improved the welding has strengthened the connection reliability.
For the patch base plate 30 arranged in the above manner, the vertical portion 20 is connected with the rectangular body 301 through the bottom arc transition 320, and the bottom of the front end face of the vertical portion 20 is attached to the rear end face of the rectangular body 301, wherein the front end face of the vertical portion 20 refers to the left end face of the vertical portion 20, which is taken as an example in the description of fig. 1; the rear end face of the rectangular body 301 refers to the right end face of the rectangular body 301, taking fig. 1 as an example in the specification. Based on that the patch bottom plate 30 and the vertical portion 20 are integrally bent and formed, that is, after bending, the bottom of the front end surface of the vertical portion 20 should be closely attached to the rear end surface of the rectangular body 301. Meanwhile, after bending, a bottom arc transition 320 is formed between the vertical portion 20 and the rectangular body 301, the bottom portions of the two outer side walls of the vertical portion 20 are respectively attached to the inner side walls of the two extending portions 302, and the bottom arc transition 320 is respectively connected to the bottom portion of the rear end face of the vertical portion 20 and the lower surface of the rectangular body 301.
It can be seen that the patch base plate 30, the vertical portion 20 and the bottom arc transition 320 are a conductive plate of an integral structure before production and processing, and the conductive plate is in a convex shape and symmetrical on two sides; the body end can be a rectangular body; in the production process, firstly, a convex conductive plate can be cut, and then, aiming at the conductive plate, the body end of the conductive plate is cut by a preset depth along the extending direction of the two sides of the convex end of the conductive plate to form two cutting marks with the same length; the preset depth (namely the length of the cutting mark) is not more than the total length of the front end and the rear end of the body end, namely the body end cannot be cut; then, carrying out a first bending operation, bending the protruding end upwards by taking the cutting tail end as a reference, forming a vertical body and the patch base plate 30 with the rectangular body 301 and the extension part 302, and forming a bottom arc transition 320; the second bending operation is performed with respect to the vertical body, and the horizontal suction portion 10 and the vertical portion 20 are formed. The extensions 302 on both sides of the rectangular body 301 are due to the cutting, and the length of the extensions 302 is the predetermined depth of the cutting.
A top arc transition 120 is provided between the horizontal suction part 10 and the vertical part 20, an outer arc wall of the top arc transition 120 is connected to a rear end of an upper surface of the horizontal suction part 10 and an upper portion of a rear end surface of the vertical part 20, respectively, and an inner arc wall of the top arc transition 120 is connected to a rear end of a lower surface of the horizontal suction part 10 and an upper portion of a front end surface of the vertical part 20, respectively, as shown in fig. 1 of the specification.
As can be seen from the above description, after the second bending operation is performed on the vertical body, the horizontal suction part 10, the vertical part 20, and the top arc transition 120 may be formed, where the outer arc wall of the top arc transition 120 refers to the arc wall with the larger surface area, and the inner arc wall refers to the arc wall with the smaller surface area; stress at the joint of the horizontal suction part 10 and the vertical part 20 can be prevented from being excessively concentrated by the arrangement of the top arc transition 120, and the structural strength of the chip test terminal is improved, so that the service life of the chip test terminal is prolonged.
Wherein, the thicknesses of the horizontal suction part 10, the top arc transition 120, the vertical part 20, the bottom arc transition 320 and the patch base plate 30 are the same; and the widths of the horizontal suction part 10, the top arc transition 120, the vertical part 20 and the bottom arc transition 320 at both sides are the same as the distance between the inner sidewalls of the two extension parts 302.
That is, the conductive plate is a plate with uniform thickness, and the thicknesses of the horizontal suction portion 10, the top arc transition 120, the vertical portion 20, the bottom arc transition 320 and the patch board 30 obtained by the above processing operation are the same; the widths of two sides of the protruding end of the conductive plate (in a shape of a Chinese character 'tu') are the same, the two side walls of the protruding end are parallel, and the two cutting marks are also parallel to each other; after the first bending operation is performed, the widths of the horizontal suction portion 10, the top arc transition 120, the vertical portion 20, and the bottom arc transition 320 are the same, and the widths are the same as the distance between the inner sidewalls of the two extending portions 302.
Furthermore, the vertical part 20 can be arranged at the position 2/5-3/5 in the length direction (X-axis direction) of the patch base plate 30, and the outer arc wall and the inner arc wall of the top arc transition 120 are both positioned at the rear end of the vertical part 20, as shown in the attached figure 3 of the specification; the ratio of the outer arc diameter of the top arc transition 120 to the inner arc diameter of the top arc transition 120 is 1:7 to 1: 14; the projection of the outer arc sidewall of the top arc transition 120 in the vertical direction does not exceed the end of the chip bottom plate 30, and the projection of the front end of the horizontal suction portion 10 in the vertical direction does not exceed the front end of the chip bottom plate 30.
So set up, the focus of paster test terminal is located vertical portion 20, and when paster test terminal was adsorbed and when removing, under the action of gravity, the phenomenon of rocking around paster test terminal can not take place, and paster bottom plate 30 keeps the level with horizontal absorption portion 10 throughout, avoids the slope of paster test terminal and falls the emergence of a phenomenon.
More preferably, the vertical portion 20 may be disposed at a middle position (i.e., 1/2) in the length direction (X-axis direction) of the chip chassis 30, the ratio of the outer arc diameter of the top arc transition 120 to the inner arc diameter of the top arc transition 120 is 1:10, and the rest of the disposition is as described above, so that the center of gravity of the chip test terminal can be further ensured to be stable, and a phenomenon of low production efficiency due to inclination and dropping of the chip test terminal can be avoided.
The present invention also provides a method for processing a patch test terminal, where the name of the processing method is the same as the name of the patch test terminal described above, and can be understood with reference to fig. 1 to 4, and the main flow of the processing method of the patch test terminal is shown in fig. 5 of the specification, and mainly includes:
s1, placing the convex conductive plate on a workbench of production equipment;
s2, bending the protruding end of the conductive plate upwards to form a vertical body and a patch bottom plate 30 for point welding with a terminal of a PCB;
s3, bending the top of the vertical body to form a vertical part 20 and a horizontal suction part 10 which is positioned above the vertical part 20 and used for being sucked by a suction nozzle of a chip mounter, wherein clamping side walls 101 used for clamping test equipment are formed on two sides of the horizontal suction part 10; and the horizontal sucking part 10 and the vertical part 20 have the same width at both sides;
and S4, punching a through hole 201 for the test probe to hook on in the vertical part 20, and forming a chip test terminal.
Aiming at the step S1, placing the convex conductive plate on a workbench of production equipment, wherein the convex conductive plate can be produced in a stamping mode; that is, before step S1, a rectangular or other conductive plate material may be punched to obtain a convex conductive plate material.
Aiming at the step S2, bending the protruding end of the conductive plate upwards to form a vertical body and a patch bottom plate 30, wherein the patch bottom plate 30 is used for being welded with a terminal point of a PCB; the vertical body is now perpendicular to the patch panel 30.
Continuing to bend the top of the vertical body to form a vertical part 20 and a horizontal suction part 10 in step S3, wherein the horizontal suction part 10 is located above the vertical part 20 and is used for being sucked by a suction nozzle of a chip mounter; meanwhile, clamping side walls 101 for clamping the test equipment are formed at both sides of the horizontal suction part 10; and both side widths of the horizontal suction part 10 and the vertical part 20 are the same.
As above, since the vertical part 20 and the horizontal suction part 10 are formed by bending the vertical body, the vertical part 20 and the horizontal suction part 10 are integrally formed; the meaning that the widths of both sides of the horizontal suction part 10 and the vertical part 20 are the same is not limited to the case that the vertical body is rectangular, and if the vertical body is other shapes (for example, the two sides of the vertical body are not parallel to each other), the vertical part 20 and the horizontal suction part 10 which are integrally formed are also protected within the range that the widths of both sides of the horizontal suction part 10 and the vertical part 20 are the same after bending.
With respect to step S4, a test through hole 201 is punched in the vertical portion 20 for the test probe to hook, thereby forming a chip test terminal.
So set up, can obtain the paster test terminal of above, can improve the efficiency of being connected with PCB to because the existence of centre gripping lateral wall 101 and test through hole 201, make near paster test terminal have when other higher objects interfere, can be by from top to bottom hook test through hole 201, need not to carry out the centre gripping to centre gripping lateral wall 101, and then increased the test direction, improve efficiency of software testing.
Between the above step S1 and step S2, the method may further include:
cutting a body end of the conductive plate to a preset depth along the extending direction of the two sides of the protruding end of the conductive plate, wherein the preset depth is not more than the total length of the front end and the rear end of the body end;
bending the protruding end of the conductive plate upwards to form a patch bottom plate 30 and a vertical body, wherein the patch bottom plate and the vertical body are specifically as follows:
the protruding end is bent upward with the cut end as a reference to form a vertical body and a patch base plate 30 having a rectangular body 301 and extending portions 302, wherein the two extending portions 302 are respectively located at two sides of the rectangular body 301, are perpendicular to the rectangular body 301, and extend along the same horizontal direction.
That is, by cutting a predetermined depth, the rectangular body 301 and the extension 302 can be formed when bent, and the vertical portion 20 is located between the front and rear ends of the patch chassis 30. Two extension portions 302 compare in rectangle body 301 and have increased the welding area with PCB terminal point position, further satisfy the encapsulation welding demand, the area of tin material when having improved the welding has strengthened the connection reliability.
For the step S3, a specific processing method is as follows:
bending a first position of the top of the vertical body along a first direction;
bending a second position of the top of the vertical body along a second direction to form a vertical part 20, a top arc transition 120 and a horizontal suction part 10; wherein the first position is lower than the second position, the first direction being opposite to the second direction; the top arc transition is positioned between the horizontal suction part and the vertical part, the outer arc wall of the top arc transition is respectively connected to the rear end of the upper surface of the horizontal suction part and the upper part of the rear end surface of the vertical part, and the inner arc wall of the top arc transition is respectively connected to the rear end of the lower surface of the horizontal suction part and the upper part of the front end surface of the vertical part.
In brief, the vertical body is bent twice at different positions of the top thereof, and the directions of the two bending operations are different, so as to finally form the vertical portion 20, the top arc transition 120 and the horizontal suction portion 10, as shown in fig. 1 to 4 of the specification.
The other specific processing mode is as follows:
and stamping the preset position at the top of the vertical body along the horizontal direction by using a horizontal die to form a vertical part 20, a top arc transition 120 and a horizontal suction part 10, wherein the top arc transition 120 is positioned between the horizontal suction part 10 and the vertical part 20, the outer arc wall of the top arc transition 120 is respectively connected to the rear end of the upper surface of the horizontal suction part 10 and the upper part of the rear end surface of the vertical part 20, and the inner arc wall of the top arc transition 120 is respectively connected to the rear end of the lower surface of the horizontal suction part 10 and the upper part of the front end surface of the vertical part 20.
In brief, the vertical portion 20, the top arc transition 120 and the horizontal suction portion 10 can be obtained after the vertical portion, the top arc transition 120 and the horizontal suction portion 10 are obtained by directly stamping the preset position of the top of the vertical body, and the stamping direction is along the horizontal direction, that is, the outer arc wall and the inner arc wall of the top arc transition 120 are both located at the rear end of the vertical portion 20; obviously, the depth of the punch determines the size of the top arc transition 120 and its position relative to the upright 20; preferably, the ratio of the outer arc diameter of the top arc transition 120 to the inner arc diameter of the top arc transition 120 after horizontal stamping is between 1:7 and 1: 14; the projection of the outer arc side wall of the top arc transition 120 in the vertical direction does not exceed the tail end of the patch bottom plate 30, and the projection of the front end of the horizontal suction part 10 in the vertical direction does not exceed the front end of the patch bottom plate 30; so set up, paster test terminal is by the absorption in-process, and paster bottom plate 30 keeps the level with horizontal sorption portion 10 throughout, avoids paster test terminal's slope and the emergence of a phenomenon of falling.
It is noted that, in this specification, relational terms such as first and second, and the like are used solely to distinguish one entity from another entity without necessarily requiring or implying any actual such relationship or order between such entities.
The patch test terminal and the processing method thereof provided by the invention are described in detail above. The principles and embodiments of the present invention are explained herein using specific examples, which are presented only to assist in understanding the method and its core concepts. It should be noted that, for those skilled in the art, it is possible to make various improvements and modifications to the present invention without departing from the principle of the present invention, and those improvements and modifications also fall within the scope of the claims of the present invention.

Claims (11)

1. A patch test terminal, comprising:
a horizontal suction part (10) for suction of a suction nozzle of the chip mounter;
a vertical part (20) connected to the horizontal suction part (10) and located below the horizontal suction part (10);
the patch bottom plate (30) is arranged at the bottom of the vertical part (20) and is used for being welded to a terminal point of a PCB;
the horizontal sucking part (10) and the vertical part (20) have the same width at two sides; the horizontal suction part (10), the vertical part (20) and the patch bottom plate (30) are integrally bent and formed;
the two sides of the horizontal suction part (10) are provided with clamping side walls (101) for clamping test equipment, and the vertical part (20) is provided with a test through hole (201) for hooking a test probe.
2. The patch test terminal according to claim 1, wherein the patch base plate (30) includes a rectangular body (301), and further includes extensions (302) located at both sides of the rectangular body (301) and extending in the same horizontal direction perpendicular to the rectangular body (301).
3. The chip test terminal according to claim 2, wherein the vertical portion (20) is connected to the rectangular body (301) through a bottom arc transition (320), the bottom of the front end surface of the vertical portion (20) is attached to the rear end surface of the rectangular body (301), the bottom of the two outer side walls of the vertical portion (20) is attached to the inner side walls of the two extending portions (302), and the bottom arc transition (320) is connected to the bottom of the rear end surface of the vertical portion (20) and the lower surface of the rectangular body (301).
4. The patch test terminal according to claim 3, wherein a top arc transition (120) is provided between the horizontal suction part (10) and the vertical part (20), an outer arc wall of the top arc transition (120) is connected to a rear end of an upper surface of the horizontal suction part (10) and an upper portion of a rear end surface of the vertical part (20), respectively, and an inner arc wall of the top arc transition (120) is connected to a rear end of a lower surface of the horizontal suction part (10) and an upper portion of a front end surface of the vertical part (20), respectively.
5. The patch test terminal according to claim 4, wherein the horizontal sorbent (10), the top arc transition (120), the vertical portion (20), the bottom arc transition (320) and the patch bottom plate (30) are all the same thickness; and the widths of the horizontal suction part (10), the top arc transition (120), the vertical part (20) and the bottom arc transition (320) at two sides are the same as the distance between the inner side walls of the two extending parts (302).
6. The patch test terminal according to claim 5, wherein the vertical part (20) is located at 2/5-3/5 in the length direction of the patch base plate (30), the outer arc wall and the inner arc wall of the top arc transition (120) are both located at the rear end of the vertical part (20), and the ratio of the outer arc diameter of the top arc transition (120) to the inner arc diameter of the top arc transition (120) is 1: 7-1: 14; the projection of the outer arc side wall of the top arc transition (120) in the vertical direction does not exceed the tail end of the patch bottom plate (30), and the projection of the front end of the horizontal suction part (10) in the vertical direction does not exceed the front end of the patch bottom plate (30).
7. The patch test terminal according to any one of claims 1 to 6, wherein the test through hole (201) has an oval shape, and a major axis of the oval shape extends in a vertical direction.
8. A patch test terminal according to claim 7, wherein the ratio of the major axis to the minor axis of the ellipse is between 5:2 and 10: 7.
9. A processing method of a patch test terminal is characterized by comprising the following steps:
placing the convex conductive plate on a workbench of production equipment;
bending the protruding end of the conductive plate upwards to form a vertical body and a patch bottom plate for point position welding with a terminal of a PCB;
bending the top of the vertical body to form a vertical part and a horizontal suction part which is positioned above the vertical part and used for being sucked by a suction nozzle of a chip mounter, wherein clamping side walls used for clamping test equipment are formed on two sides of the horizontal suction part; the horizontal sucking part and the vertical part have the same width at two sides;
and punching a test through hole for hooking the test probe on the vertical part to form a chip test terminal.
10. The process of claim 9,
to be the electrically conductive panel of type of protruding place on production facility's workstation with will the protruding end of electrically conductive panel is upwards buckled, forms vertical body and be used for still including with PCB's between the terminal point location welded paster bottom plate:
cutting a preset depth to the body end of the conductive plate along the extending direction of the two sides of the protruding end of the conductive plate, wherein the preset depth is not more than the total length of the front end and the rear end of the body end;
will the protruding end of conducting plate upwards buckles, and it specifically is to form paster bottom plate and vertical body:
and bending the protruding end upwards by taking the cutting tail end as a reference to form a vertical body and a patch bottom plate with a rectangular body and extending parts, wherein the two extending parts are respectively positioned at two sides of the rectangular body, are perpendicular to the rectangular body and extend along the same horizontal direction.
11. The process of claim 10,
will the top of vertical body is buckled, forms vertical portion and is located vertical portion top, the horizontal sorption portion that is used for supplying chip mounter suction nozzle to adsorb specifically do:
bending a first position of the top of the vertical body along a first direction;
bending a second position at the top of the vertical body along a second direction to form a vertical part, a top arc transition part and a horizontal sucking part; wherein the first position is lower than the second position, the first direction being opposite to the second direction; the top arc transition is positioned between the horizontal suction part and the vertical part, the outer arc wall of the top arc transition is respectively connected to the rear end of the upper surface of the horizontal suction part and the upper part of the rear end surface of the vertical part, and the inner arc wall of the top arc transition is respectively connected to the rear end of the lower surface of the horizontal suction part and the upper part of the front end surface of the vertical part;
or specifically:
utilize horizontal mould right the preset position at vertical body top is along the horizontal direction punching press, forms vertical portion, top arc transition and horizontal absorption portion, the top arc transition is located horizontal absorption portion with between the vertical portion, just the outer arc wall of top arc transition connect respectively in the rear end of horizontal absorption portion upper surface with the upper portion of vertical portion rear end face, the inner arc wall of top arc transition connect respectively in the rear end of horizontal absorption portion lower surface with the upper portion of vertical portion front end face.
CN201711167545.1A 2017-11-21 2017-11-21 Surface Mount Device (SMD) test terminal and processing method thereof Active CN108037324B (en)

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA2221525C (en) * 1996-12-20 2009-01-20 Siecor Corporation System for locating patch cord ends
CN101587996A (en) * 2009-06-19 2009-11-25 郑里 Surface pasting connection needle, surface pasting connector, circuit board and making method thereof
CN201740796U (en) * 2010-04-14 2011-02-09 天津柯瑞特尔科贸有限公司 Multifunctional test fixture for PCB
CN205488693U (en) * 2016-04-01 2016-08-17 潘昌雄 Paster terminal structure
CN106093484A (en) * 2016-07-28 2016-11-09 中国电子科技集团公司第二十六研究所 Surface mount SAW filter test fixture

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA2221525C (en) * 1996-12-20 2009-01-20 Siecor Corporation System for locating patch cord ends
CN101587996A (en) * 2009-06-19 2009-11-25 郑里 Surface pasting connection needle, surface pasting connector, circuit board and making method thereof
CN201740796U (en) * 2010-04-14 2011-02-09 天津柯瑞特尔科贸有限公司 Multifunctional test fixture for PCB
CN205488693U (en) * 2016-04-01 2016-08-17 潘昌雄 Paster terminal structure
CN106093484A (en) * 2016-07-28 2016-11-09 中国电子科技集团公司第二十六研究所 Surface mount SAW filter test fixture

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