CN209693200U

CN209693200U - A kind of pedestal that patch welds and the encapsulating structure using the pedestal

Info

Publication number: CN209693200U
Application number: CN201822134762.7U
Authority: CN
Inventors: 谭友元; 谭晓庆; 刘伟
Original assignee: Mornsun Guangzhou Science and Technology Ltd
Current assignee: Mornsun Guangzhou Science and Technology Ltd
Priority date: 2018-12-19
Filing date: 2018-12-19
Publication date: 2019-11-26
Anticipated expiration: 2028-12-19

Abstract

The utility model provides a kind of pedestal that patch welds and the encapsulating structure using the pedestal, a kind of pedestal of patch welding, terminal including base body and insertion base body, terminal is set as L shape, wherein one end is set as in horizontally disposed weld part terminal, welding is matched with the terminal welding position of PCB, the terminal of pedestal and PCB welding procedure are simple, it is easily achieved, and terminal welding does not influence another side component placement and the welding of PCB, when being able to solve the generally pedestal with terminal and PCB progress patch reflow soldering, terminal occupy excessive PCB space and a series of problems, such as.

Description

A kind of pedestal that patch welds and the encapsulating structure using the pedestal

Technical field

The present utility model is related to the electronic product of module encapsulation, in particular to a kind of electricity with pedestal, terminal and PCB Sub- product.

Background technique

Currently on the market, the electronic product of the module encapsulation with pedestal, pedestal and PCB connection type are general are as follows: terminal It is welded with PCB by " hole " on PCB, then section is nested again passes through pedestal；Or terminal is embedded in pedestal, then passes through PCB with PCB On " hole " welding.Two ways requires terminal and PCB and is welded by " hole "." hole " can be divided into " through-hole " or " blind Hole ", " through-hole " are required to occupy certain area on the two sides of PCB, reduce the utilization rate of PCB, and through-hole mounting is generally people Work inserting, or pedestal is first filled, it refills PCB and carries out Through-hole reflow, working hour is long.If mounted using equipment, need to do pre- Standby movement, and need to design special frock clamp." blind hole " needs PCB to have certain thickness, can just accomplish PCB one side It is welded for terminal, still can be used for the welding of other elements patch on one side." blind hole " increases the price of PCB, is requiring product height It spends in the design of size, " blind hole " is very big to the increase of finished product.

Utility model content

In view of this, the technical problem to be solved by the present invention is to provide a kind of very simple process structures to realize The welding of terminal and PCB, the pedestal and PCB for solving general type belt terminal carry out patch reflow soldering, and terminal can be the two of PCB The problem of certain space, is occupied in face, and the utility model provides a kind of pedestal with terminal and PCB carries out patch reflow soldering, and Terminal welds another side component placement and the welding for not influencing PCB.

To realize the purpose of this utility model, the technical solution taken are as follows:

A kind of pedestal of patch welding, for carrying out patch reflow soldering with PCB (002), PCB (002) is equipped with terminal Pad (005), pedestal (001) include base body (0011) and the terminal (003) for being embedded in base body (0011), base body (0011) supporting table (0012) for being equipped with terminal hole and being equipped with along one side-lower of terminal hole, terminal (003) is in pedestal (001) two sides There is exposed portion, wherein one end is terminal supportor (0031) to terminal (003), and terminal supportor (0031) passes through base body (0011) Terminal hole simultaneously exposes as finished product pin, and the other end of terminal (003) is terminal head (0032), terminal head (0032) design For L shape, including " I " shape portion and it is vertical with " I " shape portion be in horizontally disposed " one " shape portion, wherein " I " shape portion terminal head is embedding Enter supporting table, " one " shape portion's terminal head is located at below supporting table and exposes to be welded as with the terminal pad (005) of PCB (002) Welding position.

Preferably, base body (0011) is plastic body.

Preferably, the terminal head (0032) of terminal (003), " one " shape portion's terminal head be to chassis outer side be extended or It is extended on the inside of to pedestal.

Preferably, " one " the shape portion terminal head of terminal head (0032) is set as rectangle or square or other are conducive to welding Shape.

Preferably, the length of " one " the shape portion terminal head of terminal head (0032), width dimensions are respectively less than on PCB (002) The length of terminal pad (005), width dimensions.

Preferably, the surface of the exposed portion of terminal supportor (0031) and terminal head (0032) be coated with one layer of tin or gold or its He is easy to the metal welded.

Preferably, terminal supportor (0031) is designed as straight cutting " I " shape or straight cutting L shape.

The utility model also provides a kind of encapsulating structure of electronic product, the pedestal (001) including above-mentioned patch welding, Further include package casing, PCB (005), component is mounted on PCB (005), PCB is mounted on what package casing was constituted with pedestal In closed encapsulated space, the exposed portion of the terminal head (0032) of terminal (003) is matched with the terminal pad on PCB (002) Welding, the terminal supportor (0031) of terminal (003) are located at the outside of encapsulating structure.

Preferably, package casing and base body (0011) are the shell of identical material, as plastic body.

Preferably, package casing is the shell with base body (0011) unlike material.

Compared with prior art, the directly nested plastic packaging of the terminal of the utility model enters pedestal, and the wherein terminal of one end It is made into the shape for being applicable in patch, when operation, first pastes the element on PCB, then mount pedestal, then carry out reflow soldering, pedestal Terminal and PCB welding procedure are simple, it is easy to accomplish, and terminal welding does not influence another side component placement and the welding of PCB, it can When solving the generally pedestal with terminal and PCB progress patch reflow soldering, terminal occupies excessive PCB space and waits a series of ask Topic.

Detailed description of the invention

Fig. 1 is the pedestal and PCB assembling structure schematic diagram of the patch welding of the first embodiment of the utility model；

Fig. 2 is the pedestal and PCB assembling structure schematic diagram of the patch welding of the second embodiment of the utility model；

Fig. 3 is the terminal pad schematic diagram of the PCB of the utility model；

Fig. 4 is the schematic diagram of the encapsulating structure using DIP sorts of electronic product of the utility model；

Fig. 5 is the package structure diagram using SMD type resistance product of the utility model.

Specific embodiment

In order to make those skilled in the art more fully understand the technical solution of the utility model, below with reference to embodiment It is clearly and completely described with technical effect of the attached drawing to the design of the utility model, specific structure and generation, with fully Understand the purpose of this utility model, feature and effect.Obviously, described embodiment is that a part of the utility model is implemented Example, rather than whole embodiments, are based on the embodiments of the present invention, and those skilled in the art is not making the creative labor Under the premise of other embodiments obtained, belong to the utility model protection range.In addition, mentioned in this patent DIP, SMD/SMT are respectively dual-inline package technology and surface mount device/surface patch encapsulation in the art Technology, all connections/welding relationship, referring to can be according to specific implementation situation, and by adding or reducing couple auxiliary, Lai Zucheng is more Excellent coupling structure.Each technical characteristic in the utility model creation, can interact under the premise of not conflicting conflict Combination.

First embodiment

Fig. 1 is the schematic diagram for the pedestal that the patch of the present embodiment welds, as shown, a kind of pedestal of patch welding, is used In carrying out patch reflow soldering with PCB002, Fig. 5 is the schematic diagram of the terminal pad of PCB, and PCB 002 is equipped with terminal pad 005, terminal pad 005 is the single side pad of non-hole type, it should be noted that is additionally provided on PCB 002 and mounts for component Pad, for convenience of the solder pad of recognition terminal pad 005 and other components, Fig. 5 only shows terminal pad 005.Pedestal 001 includes base body 0011 and the terminal 003 for being embedded in base body 0011, and base body 0011 is equipped with to be installed for terminal 003 Terminal hole and the supporting table 0012 that is equipped with positioned at 001 1 lateral edge terminal hole of pedestal, one side-lower, supporting table be used for fixing terminal 003, terminal 003 is in the 001 two sides exposed portion Jun You of pedestal, and wherein one end is terminal supportor 0031 to terminal 003, and terminal supportor 0031 is worn It crosses the terminal hole of base body 0011 and exposes as finished product pin, 003 other end of terminal is terminal head 0032 and designs It is L-shaped, it can adapt to matching and the welding of 002 terminal pad 005 of PCB, including " I " shape portion and vertical with " I " shape portion be in Horizontally disposed " one " shape portion, wherein being connect in " I " shape portion's terminal head insertion supporting table with terminal supportor 0031, " one " shape portion terminal Head is located at below supporting table and exposes as the patch pad solder welding position with PCB 005.

Wherein, base body 0011 is plastic body.

Wherein, the terminal head 0032 of terminal 003, it is L-shaped in " one " shape portion terminal head can be for towards pedestal Lateral direction be extended or carry out towards pedestal interior direction extended.

Wherein, terminal head 0032 its it is L-shaped in " one " shape portion terminal head can be set as rectangle or square or its He is conducive to the shape of welding.

Wherein, terminal head 0032 its it is L-shaped in the length of " one " shape portion terminal head, width dimensions are respectively less than on PCB The length of patch pad, width dimensions, be designed in this way beneficial being welded and fixed between terminal and PCB, the welding of terminal head Position is fallen into the pad of PCB, and scolding tin can encase very well terminal when welding and be fixed, and is not easy weldering and movement.

Wherein, the surface of the exposed portion of terminal supportor 0031 and terminal head 0032 is coated with one layer of tin or gold or other are easily welded The metal connect.

Wherein, the terminal supportor 0031 of the present embodiment is designed as straight cutting " I " shape, can match the assembly of DIP series of products.

The process of the present embodiment is described as follows:

1,001 supplied materials of pedestal uses winding belt package；

It 2, first will be on the component below pedestal 001 all attachment to PCB 002 when patch；

3, then pedestal 001 is attached on PCB 002 using chip mounter, and when patch is the terminal head the terminal 003 of pedestal 0031 is attached on 002 upper terminal pad of PCB, 005 position, the bottom surface in L-shaped " one " shape portion and terminal soldering in terminal head 003 Disk 005 is bonded；

4, the mistake reflow soldering together with the PCB for posting component of pedestal 001, which weld, is fixed.

The unified collocation structure of pedestal and terminal provided in this embodiment improves encapsulation of the existing electronic product with terminal Pedestal and PCB welding design, and the utility model can either realize the welding with terminal pedestal and PCB, and terminal welding does not influence The another side component placement of PCB and welding can reduce terminal and account for pcb board space, improve PCB utilization rate, the property of may also adapt to The volume for reducing product is conducive to product and submits miniaturization and reduce production cost.

In addition, the present embodiment additionally provides a kind of encapsulating structure of electronic product using above-mentioned pedestal, by above-mentioned pedestal 001, PCB002 and package casing are constituted, and the pedestal 001 and PCB 002 after reflow soldering is carried out group with package casing Dress is to get the encapsulating structure is arrived, after being installed, as shown in figure 4, using the encapsulating structure of DIP sorts of electronic product Schematic diagram, pcb board are located in the space that package casing and pedestal are constituted, and pedestal upper terminal foot 0032 is located at entire encapsulating structure Outside.

It should be noted that package casing here can be the shell with base body for identical material, as plastics Body can also be the shell with the different material of base body, such as metallic object other materials.

Second embodiment

Fig. 2 is the structural schematic diagram for the pedestal that the patch of the present embodiment welds, different from the first embodiment, this implementation The terminal supportor 0031 of the terminal 003 of example is designed as straight cutting L shape, as shown, 0031 one end of terminal supportor passes through the bottom of pedestal 001 The terminal hole of seat ontology 0011 exposes, and exposed division extends along 0011 lateral direction of base body in horizontally disposed, it is preferable that end Sub- 0031 exposed portion of foot can partially be fallen into base body 0011.The pedestal of the present embodiment is mainly used for matching the production of SMD series The assembly of product is installed, and the mounting process of the present embodiment pedestal and PCB are identical with the first embodiment, and are not repeated.

Meanwhile it being based on the present embodiment, a kind of encapsulating structure of SMD sorts of electronic product can be equally obtained, such as Fig. 5 institute Show, be the package structure diagram of SMD sorts of electronic product, compared with the matched electronic product packaging of first embodiment institute, no Be only that terminal supportor 0031 along pedestal extending direction in horizontally disposed.

The encapsulating structure equally obtained to the present embodiment is illustrated, and package casing here can be is with base body The shell of identical material, as plastic body can also be the shell with the different material of base body, such as metallic object other materials.

Above embodiments are merely used to help understand the method and core concept of the utility model, to the general of the art For logical technical staff, without departing from the principle of this utility model, it can be associated naturally by above description and citing Other equivalent application schemes, and to some improvements and modifications that the utility model carries out, each fall within the power of the utility model The protection scope of sharp claim.

Claims

1. a kind of pedestal of patch welding, for carrying out patch reflow soldering with PCB (002), PCB (002) is equipped with terminal soldering Disk (005), it is characterised in that: pedestal (001) includes base body (0011) and the terminal for being embedded in base body (0011) (003), the supporting table (0012) that base body (0011) is equipped with terminal hole and is equipped with along one side-lower of terminal hole, terminal (003) In pedestal (001) the two sides exposed portion Jun You, wherein one end is terminal supportor (0031) to terminal (003), and terminal supportor (0031) passes through The terminal hole of base body (0011) simultaneously exposes as finished product pin, and the other end of terminal (003) is terminal head (0032), Terminal head (0032) is designed as L shape, including " I " shape portion and it is vertical with " I " shape portion be in horizontally disposed " one " shape portion, wherein " I " shape portion's terminal head is embedded in supporting table, and " one " shape portion's terminal head is located at below supporting table and exposes as the end with PCB (002) The welding position of sub- pad (005) welding.

2. the pedestal of patch welding according to claim 1, it is characterised in that: base body (0011) is plastic body.

3. the pedestal of patch welding according to claim 1, it is characterised in that: the terminal head (0032) of terminal (003), " one " shape portion's terminal head is to be extended to chassis outer side or be extended to pedestal inside.

4. the pedestal of patch welding according to claim 1, it is characterised in that: " one " the shape portion terminal of terminal head (0032) Head is set as rectangle or square or other are conducive to the shape of welding.

5. the pedestal of patch welding according to claim 1, it is characterised in that: " one " the shape portion terminal of terminal head (0032) The length of head, width dimensions are respectively less than the length of the terminal pad (005) on PCB (002), width dimensions.

6. the pedestal of patch welding according to claim 1, it is characterised in that: terminal supportor (0031) and terminal head (0032) Exposed portion surface be coated with one layer of tin or gold or other be easy to weld metals.

7. the pedestal of patch welding according to claim 1, it is characterised in that: terminal supportor (0031) is designed as straight cutting " I " Shape or straight cutting L shape.

8. a kind of encapsulating structure of electronic product, it is characterised in that: including the described in any item patch welding of claim 1 to 7 Pedestal (001), further include package casing, PCB (002), component mounted on PCB (002), it is outer that PCB (002) is mounted on encapsulation In the closed encapsulated space that shell and pedestal (001) are constituted, the terminal head (0032) of terminal (003) on PCB (002) Terminal pad (005) matching welding, the terminal supportor (0031) of terminal (003) are located at the outside of encapsulating structure.

9. encapsulating structure according to claim 8, it is characterised in that: package casing is same material with base body (0011) The shell of matter, as plastic body.

10. encapsulating structure according to claim 8, it is characterised in that: package casing is different from base body (0011) The shell of material.