CN218943286U

CN218943286U - Head end structure, insertion structure and endoscope

Info

Publication number: CN218943286U
Application number: CN202222259332.4U
Authority: CN
Inventors: 陈东; 王苏伟; 李华东; 曹锐
Original assignee: Xinguangwei Medical Technology Suzhou Co ltd
Current assignee: Xinguangwei Medical Technology Suzhou Co ltd
Priority date: 2022-08-26
Filing date: 2022-08-26
Publication date: 2023-05-02
Anticipated expiration: 2032-08-26

Abstract

The utility model discloses a head end structure, an inserting structure and an endoscope, wherein the head end structure comprises a mounting seat, a flexible circuit board, a first electronic element and a second electronic element, the mounting seat is provided with a mounting cavity, the flexible circuit board is at least partially accommodated in the mounting cavity, the flexible circuit board is provided with a mounting surface, the mounting surface is provided with a first connecting point, a second connecting point and an output point, the first connecting point and the second connecting point are respectively and electrically connected with the output point, the first electronic element and the second electronic element are at least partially accommodated in the mounting cavity and are mounted on the mounting surface, and the first electronic element and the second electronic element are respectively and electrically connected with the first connecting point and the second connecting point.

Description

Head end structure, insertion structure and endoscope

Technical Field

The utility model belongs to the technical field of endoscopes, and particularly relates to a head end structure, an insertion structure and an endoscope.

Background

The front end of an endoscope typically has an insertion structure that includes a head end structure that typically mounts electronic components (e.g., illumination devices, camera devices, etc.). When the head end structure is installed, the electronic components are usually required to be welded with the signal transmission lines respectively, then assembled into the installation cavity of the installation seat of the head end structure, and then fixed.

However, this mounting has the following drawbacks: firstly, during welding, the insulating sheath of the signal transmission line needs to be stripped firstly to expose the conductor line inside, however, the outer diameter of the signal transmission line used on the endoscope is extremely small (generally smaller than 0.5 mm), and the stripping is very troublesome and takes time; secondly, the welding spot of the electronic element is small, and when the stripped signal transmission line is manually welded on the welding spot, the welding spot is extremely troublesome and wastes working hours; again, when there are a plurality of electronic components, the electronic components are individually and respectively loaded into the mounting cavities Fei Gongshi; finally, a plurality of electronic components need at least 2 signal transmission lines to be welded, and the cost is high.

Disclosure of Invention

Therefore, the present utility model is to solve the above-mentioned drawbacks of the prior art in the installation method of the headend structure.

In order to solve the above technical problems, the present utility model provides a headend structure, including:

the mounting seat is provided with a mounting cavity;

the flexible circuit board is at least partially accommodated in the mounting cavity, and is provided with a first connecting point, a second connecting point and an output point, the flexible circuit board is provided with two opposite surfaces, the first connecting point and the second connecting point are arranged on the surface of the same side, and the first connecting point and the second connecting point are respectively and electrically connected with the output point; the method comprises the steps of,

the first electronic component and the second electronic component are at least partially accommodated in the mounting cavity and mounted on the surface of the same side of the flexible circuit board, and the first electronic component and the second electronic component are respectively and electrically connected with the first connection point and the second connection point.

Preferably, in the head end structure, the flexible circuit board includes:

the mounting part is accommodated in the mounting cavity and provided with the first connecting point, and the first electronic element is mounted on the mounting part;

the bending part is accommodated in the mounting cavity, extends from the mounting part and bends towards the direction close to the first electronic element, the free end of the bending part is provided with the second connection point, and the free end of the bending part is provided with the second electronic element; the method comprises the steps of,

the connecting part is connected with the mounting part and extends out of the mounting cavity, and the output point is arranged on the connecting part;

wherein the mounting portion is bendable with respect to the connecting portion.

Preferably, in the head end structure, the bending portion includes a first section extending from the mounting portion and bending toward the vicinity of the first electronic component, and a second section extending from the first section toward a direction away from the first electronic component, the first section being disposed against the first electronic component, the second section being provided with the second connection point and mounting the second electronic component, the second section being bendable with respect to the first section;

the mounting part is provided with a first mounting surface, the first mounting surface is provided with the first electronic component, the second section is provided with a second mounting surface, the second mounting surface is provided with the second electronic component, and the facing directions of the first mounting surface and the second mounting surface are the same.

Preferably, in the head end structure, the number of the second electronic components is two; the number of the bending parts is two, the two bending parts are respectively arranged on two sides of the mounting part, and the two second electronic components are respectively mounted on the two bending parts.

Preferably, in the head end structure, the first electronic component is an image pickup device; and/or, the second electronic element is a lighting device;

preferably, in the head end structure, the image pickup device is a CMOS camera, and the illumination device is an LED lamp.

Preferably, in the head end structure, a transparent cover is further included, and the transparent cover is covered on the first electronic component and the second electronic component and is mounted on the mounting seat.

Preferably, in the head end structure, a first step surface and a second step surface are arranged in the mounting cavity, the first step surface is arranged at a corresponding position of the mounting part, the mounting part is supported on the first step surface, the second step surface is arranged at a corresponding position of the second section, and the second section is supported on the second step surface.

In order to achieve the above object, the present utility model also provides an insertion structure, and the endoscope includes the head end structure.

In order to achieve the above object, the present utility model also provides an endoscope including the above insertion structure.

The technical scheme provided by the utility model has the following advantages:

according to the utility model, the first electronic element and the second electronic element are arranged on the same surface of the flexible circuit board, the flexible circuit board is provided with the first connecting point, the second connecting point and the output point, the first electronic element and the second electronic element are respectively and electrically connected with the first connecting point and the second connecting point, the first connecting point and the second connecting point are respectively and electrically connected with the output point, and the output point is electrically connected with the signal transmission line, so that the first electronic element and the second electronic element can meet the transmission requirement only by 1 signal transmission line, in addition, the output spot welding point of the flexible circuit board can be increased, the wire stripping difficulty of the signal transmission line and the welding difficulty of the signal transmission line are reduced, and the assembly time is greatly shortened;

furthermore, taking the first electronic element as a CMOS camera, and taking the second electronic element as an example, the structure of the utility model is adopted, and the signal transmission requirement can be met by only 1 signal wire, so that the cost is saved; the CMOS camera and the 2 LED lamps can be assembled at one time, the assembly process is simple, and the working hours are shortened; the welding spots of the CMOS camera and the 2 LED lamps are LED out (output points) through the flexible circuit board, so that the welding spots can be increased, the welding difficulty is reduced, the assembly time is greatly shortened, the wire stripping difficulty of the signal wire is reduced (because the CMOS camera and the 2 LED lamps share one signal wire, the diameter of the signal wire is increased), and the assembly time is shortened; in addition, the requirement on the mounting seat is simple, and the material cost is saved.

Because the first electronic element and the second electronic element are arranged on the same side surface of the flexible circuit board, the flexible circuit board is only required to be horizontally laid when the first electronic element and the second electronic element are welded, the flexible circuit board does not need to be turned over in the welding process, the installation is convenient, and the working time is saved; the first section of the bent part can be abutted against the first electronic element, the second section is turned towards the outside of the first electronic element, and the whole size of the flexible circuit board can be made smaller; after the flexible circuit board is mounted to the mounting cavity of the mounting seat, the first section of the bending part is abutted against the side walls of the first electronic element and the mounting cavity respectively, the mounting part is abutted against the first step surface of the mounting cavity, and the second section of the bending part is abutted against the second step surface of the mounting cavity, so that the first electronic element and the second electronic element are more stable.

Drawings

In order to more clearly illustrate the embodiments of the present utility model or the technical solutions in the prior art, the drawings that are needed in the description of the embodiments or the prior art will be briefly described, and it is obvious that the drawings in the description below are some embodiments of the present utility model, and other drawings can be obtained according to the drawings without inventive effort for a person skilled in the art.

FIG. 1 is a perspective view of one embodiment of a headend structure according to the present utility model;

FIG. 2 is a perspective view of one embodiment of the mount of FIG. 1;

FIG. 3 is a cross-sectional view of FIG. 2;

FIG. 4 is a schematic diagram of a portion of the structure of FIG. 1;

FIG. 5 is a schematic diagram of an embodiment of the flexible circuit board of FIG. 4;

fig. 6 is a schematic diagram of the flexible circuit board in fig. 4 before bending.

The utility model is described by reference numerals:

reference numerals	Name of the name	Reference numerals	Name of the name
				100	Head end structure	22	Bending part
1	Mounting base	221	First section
				11	Mounting cavity	222	Second section
111	Front opening	2221	Second connection point
				112	Rear opening	23	Connecting part
113	A first step surface	231	Output point
				114	Second step surface	3	First electronic component
2	Flexible circuit board	31	CMOS camera
				21	Mounting part	4	Second electronic component
211	First connection point	41	LED lamp

The achievement of the objects, functional features and advantages of the present utility model will be further described with reference to the accompanying drawings, in conjunction with the embodiments.

Detailed Description

The following description of the embodiments of the present utility model will be made apparent and fully in view of the accompanying drawings, in which some, but not all embodiments of the utility model are shown. The utility model will be described in detail hereinafter with reference to the drawings in conjunction with embodiments. It should be noted that, without conflict, the embodiments of the present utility model and features of the embodiments may be combined with each other.

It should be noted that the terms "first," "second," and the like in the description and the claims of the present utility model and the above figures are used for distinguishing between similar objects and not necessarily for describing a particular sequential or chronological order.

In the present utility model, unless otherwise indicated, terms of orientation such as "upper, lower, top, bottom" are used generally with respect to the orientation shown in the drawings or with respect to the component itself in the vertical, upright or gravitational direction; also, for ease of understanding and description, "inner and outer" refers to inner and outer relative to the profile of each component itself, but the above-mentioned orientation terms are not intended to limit the present utility model.

In the prior art, when in welding, the insulation sheath of the signal transmission line needs to be stripped firstly to expose the conductor line inside, however, the outer diameter of the signal transmission line used on the endoscope is extremely small (generally smaller than 0.5 mm), and the stripping is very troublesome and takes time; secondly, the welding spots of the electronic components are small (taking a CMOS camera and an LED lamp as an example, the welding spots of the CMOS camera are usually 0.2mm, and the welding spots of the LED lamp are approximately 0.25 mm), and when the stripped signal transmission line is manually welded on the welding spots, the welding spots are extremely troublesome and waste the working hours; again, when there are a plurality of electronic components, the electronic components are individually and respectively loaded into the mounting cavities Fei Gongshi; finally, the plurality of electronic components at least need 2 signal transmission lines to be welded (taking a CMOS camera and 2 LED lamps as an example, the 2 LED lamps share one signal line, and also need at least two signal lines), so that the cost is high.

Example 1

The utility model provides a head end structure, referring to fig. 1 and 4, the head end structure comprises a mounting seat 1, a flexible circuit board 2, a first electronic component 3 and a second electronic component 4, wherein the mounting seat 1 is provided with a mounting cavity 11, the flexible circuit board 2 is at least partially accommodated in the mounting cavity 11, the flexible circuit board 2 is provided with a first connecting point 211, a second connecting point 2221 and an output point 231, the flexible circuit board 2 is provided with two opposite surfaces, the first connecting point 211 and the second connecting point 2221 are arranged on the same side surface, the first connecting point 211 and the second connecting point 2221 are respectively electrically connected with the output point 231, the first electronic component 3 and the second electronic component 4 are at least partially accommodated in the mounting cavity 11 and are mounted on the same side surface of the flexible circuit board 2, and the first electronic component 3 and the second electronic component 4 are respectively electrically connected with the first connecting point 211 and the second connecting point 2221.

According to the utility model, the first electronic element 3 and the second electronic element 4 are arranged on the same surface of the flexible circuit board 2 (FPC), the flexible circuit board 2 is provided with the first connecting point 211, the second connecting point 2221 and the output point 231, the first electronic element 3 and the second electronic element 4 are respectively and electrically connected with the first connecting point 211 and the second connecting point 2221, and the first connecting point 211 and the second connecting point 2221 are respectively and electrically connected with the output point 231, so that the first electronic element 3 and the second electronic element 4 can meet the transmission requirement only by 1 signal transmission line, in addition, the welding point of the flexible circuit board 2 can be increased, the wire stripping difficulty of the signal transmission line and the welding difficulty of the signal transmission line are reduced, and the assembly working hour is greatly shortened. When the electronic device is mounted, the first electronic component 3 is soldered to the first connection point 211, the second electronic component 4 is soldered to the second connection point 2221, and the first electronic component 3, the second electronic component 4, and the flexible circuit board 2 are integrally mounted to the mounting cavity 11.

Further, taking the first electronic element 3 as the CMOS camera 31, the second electronic element 4 includes 2 LED lamps 41 as an example, with the structure of the present utility model, only 1 signal line is needed to meet the signal transmission requirement, so as to save the cost; the CMOS camera 31 and the 2 LED lamps 41 can be assembled at one time, the assembly process is simple, and the working hours are shortened; the welding spots of the CMOS camera 31 and the 2 LED lamps 41 are LED out (the output spot 231) through the flexible circuit board 2, so that the welding spots can be increased, the welding difficulty is reduced, the assembly working hour is greatly shortened, the wire stripping difficulty of the signal wire is reduced (because the CMOS camera 31 and the 2 LED lamps 41 share one signal wire, the diameter of the signal wire is increased), and the assembly working hour is shortened; in addition, the requirement on the mounting seat 1 is simple, and the material cost is saved.

Specifically, referring to fig. 4 and 5, the flexible circuit board 2 includes a mounting portion 21, a bending portion 22, and a connecting portion 23, the mounting portion 21 is accommodated in the mounting cavity 11 and is provided with the first connecting point 211, the first electronic component 3 is mounted on the mounting portion 21, the bending portion 22 is accommodated in the mounting cavity 11 and extends from the mounting portion 21 and bends in a direction close to the first electronic component 3, the free end of the bending portion 22 is provided with the second connecting point 2221, the free end of the bending portion 22 is provided with the second electronic component 4, the connecting portion 23 is connected with the mounting portion 21 and extends out of the mounting cavity 11, the connecting portion 23 is provided with the output point 231, and the mounting portion 21 can be bent relative to the connecting portion 23.

The head end structure may be, but not limited to, an endoscope, the first electronic component 3 may be, but not limited to, an image pickup device, and the second electronic component 4 may be, but not limited to, an illumination device. For convenience of explanation, the first electronic component 3 is a CMOS (Complementary Metal Oxide Semiconductor) camera, and the lighting device is an LED lamp 41, taking a head end structure as a part of an endoscope.

In the mounting process, the CMOS camera 31 and the first connection point 211 are welded and bonded to the mounting portion 21, the LED lamp 41 and the second connection point 2221 are welded and bonded to the free end of the bending portion 22, and the bending portion 22 is bent and abutted against the CMOS camera 31, so that the whole occupied space is small.

Specifically, the bending portion 22 includes a first section 221 extending from the mounting portion 21 and bending toward the vicinity of the first electronic component 3, and a second section 222 extending from the first section 221 toward a direction away from the first electronic component 3, the first section 221 being disposed against the first electronic component 3, the second section 222 being provided with the second connection point 2221 and mounting the second electronic component 4, the second section 222 being bendable with respect to the first section 221. In the mounting, the CMOS camera 31 and the first connection point 211 are welded and bonded to the mounting portion 21, the LED lamp 41 and the second connection point 2221 are welded and bonded to the second section 222, and after the mounting is completed, the first section 221 is bent to bring the first section 221 into close contact with the CMOS camera 31.

More specifically, the mounting portion 21 has a first mounting surface on which the first electronic component 3 is mounted, the second section 222 has a second mounting surface on which the second electronic component 4 is mounted, and the first and second mounting surfaces face in the same direction, so that the CMOS camera 31 and the LED lamp 41 are mounted on the first and second mounting surfaces, respectively, and are oriented in the same direction for convenient use.

Preferably, the number of the second electronic components 4 is two; the number of the bending parts 22 is two, the two bending parts 22 are respectively arranged at two sides of the mounting part 21, and the two second electronic components 4 are respectively mounted at the two bending parts 22. Two sides of the CMOS camera 31 are respectively provided with an LED lamp 41, so that the endoscope has a clearer visual angle in the uterine cavity.

In addition, the head-end structure further includes a transparent cover (not shown in the drawings), which covers the first electronic component 3 and the second electronic component 4 and is mounted on the mount 1. The lens pollution caused in the process of using the died laser can be improved and the scratch and the dirt of the CMOS lens can be avoided by arranging the transparent cover.

Referring to fig. 2 and 3, the mounting cavity 11 is disposed with openings at two ends along a first direction (in this embodiment, an axial direction of the mounting seat 1), that is, includes a front opening 111 and a rear opening 112 distributed along the first direction, a first step surface 113 and a second step surface 114 are disposed in the mounting cavity 11, the first step surface 113 is disposed at a corresponding position of the mounting portion 21, the mounting portion 21 is supported on the first step surface 113, the second step surface 114 is disposed at a corresponding position of the second section 222, and the second section 222 is supported on the second step surface 114. When mounted, the mounting portion 21 is supported on the first step surface 113, the second section 222 is supported on the second step surface 114, and the connecting portion 23 extends from the rear opening 112. The welding spots of the CMOS camera 31 and the LED lamp 41 are LED out to the output point 231 through the connecting part 23, that is, the welding spots corresponding to the CMOS camera 31 and the LED lamp 41 are respectively arranged on the connecting part 23, and the corresponding welding spots can be designed to be larger, so that the welding efficiency is improved.

In addition, the transparent adhesive (UV adhesive in the present embodiment) needs to be filled in the head end structure to protect, i.e., seal, the LED lamp 41, and the head end structure is applied to the endoscope, for example, because the head end structure is at the forefront end of the endoscope, and is in the interior of the human body at the time of operation, and the interior of the human body is often filled with liquid such as body fluid, physiological saline, etc., good sealing performance needs to be maintained, and otherwise the liquid enters the interior of the endoscope through the place where the head end is not sealed, and further causes faults such as short circuit of the internal signal transmission line.

Example 2

The utility model also provides an insertion structure comprising the head end structure. Embodiments of the insertion structure include embodiments of the head end structure described above, and all of the benefits of the head end structure described above may be applicable to the insertion structure.

Example 3

The utility model also provides an endoscope comprising the insertion structure. Embodiments of the endoscope include embodiments of the insertion structure described above, and all of the benefits of the insertion structure described above may be applicable to the endoscope.

Example 4

The utility model also provides an installation method of the head end structure, and the head end structure comprises all the embodiments and beneficial effects of the embodiment 1. The following description will take the first electronic component 3 as the CMOS camera 31 and the second electronic component 4 as the LED lamp 41 as an example, but the mounting method defined by the present utility model is not limited to the first electronic component 3 as the CMOS camera 31 and the second electronic component 4 as the LED lamp 41.

The installation method comprises the following steps:

step S210, the first electronic component 3 and the second electronic component 4 are respectively mounted on the corresponding positions of the first connection point 211 and the second connection point 2221 on the same side surface of the flexible circuit board 2, and the welding points of the first electronic component 3 and the second electronic component 4 are respectively abutted to the first connection point 211 and the second connection point 2221 to realize electrical connection, so as to form a circuit board assembly;

specifically, the first electronic component 3 and the second electronic component 4 are mounted on the same side surface of the flexible circuit board 2 at positions corresponding to the first connection point 211 and the second connection point 2221, respectively, and are typically bonded, and in this embodiment, the SMT bonding method is used for bonding.

And step S220, bending the flexible circuit board 2 so that the first electronic component 3 and the second electronic component 4 are at their final set positions, wherein the final set positions are positions of the first electronic component 3 and the second electronic component 4 on the flexible circuit board 2 after the flexible circuit board 2 is mounted to the mounting cavity.

Specifically, referring to fig. 6, the bending includes three parts, namely, bending the mounting portion 21 relative to the connecting portion 23, bending the bending portion 22 relative to the mounting portion 21, and bending the second section 222 of the bending portion 22 relative to the first section 221; wherein the bending direction of the mounting portion 21 with respect to the connecting portion 23 is the opposite direction with respect to the first connecting point 211, the bending direction of the bending portion 22 with respect to the mounting portion 21 is the same direction toward the first connecting point 211, and the bending direction of the second section 222 of the bending portion 22 with respect to the first section 221 is the opposite direction with respect to the second connecting point 2221; the three parts can be bent according to the actual situation to select the sequence.

Step S230, integrally mounting the circuit board assembly to the mounting cavity 11 of the mounting seat 1.

Specifically, the bent flexible circuit board 2 is inserted into the mounting cavity 11 of the mounting seat 1 in the first direction, so that the mounting portion 21 abuts against the first step surface 113 of the mounting cavity 11, and the second section 222 of the bending portion 22 abuts against the second step surface 114 of the mounting cavity 11.

Because the first electronic element 3 and the second electronic element 4 are arranged on the same side surface of the flexible circuit board 2, the flexible circuit board is only required to be horizontally arranged when the first electronic element 3 and the second electronic element 4 are welded, and the flexible circuit board is not required to be turned over during the welding process, so that the working time is saved; after bending, the first section 221 of the bending part 22 can be abutted against the first electronic component 3, the second section 222 turns towards the outside of the first electronic component 3, the overall size of the flexible circuit board can be smaller, after the flexible circuit board is mounted in the mounting cavity 11 of the mounting seat 1, the first section 221 of the bending part 22 is abutted against the side walls of the first electronic component 3 and the mounting cavity 11 respectively, the mounting part 21 is abutted against the first step surface 113 of the mounting cavity 11, and the second section 222 of the bending part 22 is abutted against the second step surface 114 of the mounting cavity 11, so that the first electronic component 3 and the second electronic component 4 are more stable.

Wherein, after step S230, further comprises: the signal line is soldered to the output point 231.

More specifically, the method for installing the headend structure includes:

(1) The structure and specific position of the flexible circuit board 2 are determined according to the solder joint sizes and actual assembly positions of the CMOS camera 31 and the LED lamp 41.

Specifically, referring to fig. 6, taking 1

CMOS camera

31 and 2 LED lamps 41 as an example, the flexible circuit board 2 may include: the mounting portion 21, the connecting portion 23, the bending portion 22, wherein, the mounting portion 21 is connected with the bending portion 22 along the both sides of second direction respectively, and the mounting portion 21 is connected with the connecting portion 23 along the second direction, and the mounting portion 21 is equipped with first tie point 211, and the bending portion 22 is equipped with second tie point 2221, and the connecting portion 23 is equipped with output point 231. In which the dashed lines in fig. 6 illustrate the region to be bent.

(2) The flexible circuit board 2 is put into an automatic tin plating device, steel meshes are respectively covered at the corresponding positions of the first connecting point 211 and the second connecting point 2221, and soldering paste is respectively coated on the first connecting point 211 and the second connecting point 2221.

Specifically, the steel mesh is used for applying solder paste, for example, a thin steel plate is used for forming holes in the place where the solder paste is required to be applied on the flexible circuit board 2, so that the solder paste is poured onto the steel mesh and scraped off, the solder paste leaks from the holes to the FPC, and the steel mesh needs to be removed after the solder paste is applied.

(3) Placing the flexible circuit board 2 processed in (2) into a chip mounter to perform chip mounting (i.e., the CMOS camera 31 is attached to the first connection point 211 and the led lamp 41 is attached to the second connection point 2221)

Namely, the first electronic component 3 and the second electronic component 4 are respectively installed at the corresponding positions of the first connection point 211 and the second connection point 2221 of the flexible circuit board 2, and the welding points of the first electronic component 3 and the second electronic component 4 are respectively butted with the first connection point 211 and the second connection point 2221 to realize electrical connection, so as to form a circuit board assembly.

Specifically, the CMOS camera 31 and the LED lamp 41 are sucked by the manipulator of the chip mounter, and the solder joints of the CMOS camera 31 and the LED lamp 41 are aligned to the first connection point 211 and the second connection point 2221 on the flexible circuit board 2, respectively, that is, are attached to the corresponding solder joint positions of the flexible circuit board 2.

(4) And (3) placing the assembly processed in the step (3) into a high-temperature furnace, and dissolving and solidifying the solder paste to finish the patch.

(5) Dispensing is performed in the area of the CMOS camera 31 and the LED lamp 41 on the flexible circuit board 2.

Specifically, dispensing may be performed at the outer periphery of the junction of the CMOS camera 31 and the LED lamp 41 with the flexible circuit board 2, wherein the glue may be, but is not limited to, AB glue.

(6) After dispensing, the flexible circuit board 2 is bent.

(7) And integrally placing the bent flexible circuit board into the mounting cavity 11 of the mounting seat 1.

Specifically, the bent flexible circuit board is integrally mounted in the mounting chamber 11 from the front opening 111, the connection portion 23 is protruded from the rear opening 112 and protruded from the mounting chamber 11, and a glue (e.g., UV glue) is dispensed between the flexible circuit board 2 and the inner wall of the mounting chamber 11 to cure and seal.

(8) And welding the signal wire with an output point of the flexible circuit board.

In addition, after the whole is mounted to the mounting chamber 11, a transparent cover may be provided on the outward facing portion of the CMOS camera 31 and the LED lamp 41.

Furthermore, taking the first electronic element as a CMOS camera, and taking the second electronic element as an example, the structure of the utility model is adopted, and the signal transmission requirement can be met by only 1 signal wire, so that the cost is saved; the CMOS camera and the 2 LED lamps can be assembled at one time, the assembly process is simple, and the working hours are shortened; the welding spots of the CMOS camera and the 2 LED lamps are LED out (output points) through the flexible circuit board, so that the welding spots can be increased, the welding difficulty is reduced, the assembly time is greatly shortened, the fiber stripping difficulty of the signal wire is reduced (because the CMOS camera and the 2 LED lamps share one signal wire, the diameter of the signal wire is increased), and the assembly time is shortened; in addition, the requirement on the mounting seat is simple, and the material cost is saved.

It will be apparent that the embodiments described above are merely some, but not all, embodiments of the utility model. Based on the embodiments of the present utility model, those skilled in the art may make other different changes or modifications without making any creative effort, which shall fall within the protection scope of the present utility model.

Claims

1. A headend structure comprising:

the mounting seat is provided with a mounting cavity;

2. The headend structure of claim 1 wherein the flexible circuit board comprises:

3. The head end structure of claim 2, wherein the bending portion includes a first section extending from the mounting portion and bending toward the vicinity of the first electronic component, and a second section extending from the first section toward a direction away from the first electronic component, the first section being disposed against the first electronic component, the second section being provided with the second connection point and mounting the second electronic component, the second section being bendable with respect to the first section;

4. The headend structure of claim 2 wherein the number of second electronic components is two; the number of the bending parts is two, the two bending parts are respectively arranged on two sides of the mounting part, and the two second electronic components are respectively mounted on the two bending parts.

5. The headend structure of claim 1 wherein the first electronic component is an image capture device; and/or, the second electronic element is a lighting device.

6. The headend structure of claim 5 wherein the camera device is a CMOS camera and the illumination device is an LED lamp.

7. The headend structure of claim 1 further comprising a transparent cover over the first electronic component and the second electronic component and mounted to the mount.

8. A head end structure according to claim 3, wherein the mounting cavity is provided with a first step surface and a second step surface, the first step surface being provided at a corresponding position of the mounting portion, the mounting portion being supported on the first step surface, the second step surface being provided at a corresponding position of the second section, the second section being supported on the second step surface.

9. An insertion structure comprising a headend structure according to any of claims 1 to 8.

10. An endoscope comprising the insertion structure of claim 9.