CN117222133A

CN117222133A - Circuit board and manufacturing method thereof, head end assembly and assembling method thereof and endoscope

Info

Publication number: CN117222133A
Application number: CN202311487180.6A
Authority: CN
Inventors: 陈东; 李华东; 王苏伟; 王伟
Original assignee: Xinguangwei Medical Technology Suzhou Co ltd
Current assignee: Xinguangwei Medical Technology Suzhou Co ltd
Priority date: 2023-11-09
Filing date: 2023-11-09
Publication date: 2023-12-12
Anticipated expiration: 2043-11-09
Also published as: CN117222133B

Abstract

The invention discloses a circuit board, a manufacturing method thereof, a head end assembly, an assembling method thereof and an endoscope.

Description

Circuit board and manufacturing method thereof, head end assembly and assembling method thereof and endoscope

Technical Field

The invention belongs to the technical field of endoscopes, and particularly relates to a circuit board and a manufacturing method thereof, a head end assembly and an assembly method thereof, and an endoscope.

Background

Electronic endoscopes are widely used in the medical field for diagnosing and/or treating diseased tissue in the body. An electronic endoscope used for diagnosis and treatment of urinary tract, biliary tract, bronchus and the like has a small outer diameter at a head end part, and an imaging element, an illumination element and a circuit board are generally arranged in the head end part. The volume of camera component, lighting element and circuit board is less to lead to the solder joint size on the circuit board to be tiny, the arrangement mode of solder joint on the current base plate is unfavorable for the automatic weld of pencil simultaneously, leads to can only adopt manual welded mode to weld the pencil to the base plate, this leads to production inefficiency, and welding quality can't obtain guaranteeing simultaneously.

Disclosure of Invention

Therefore, the technical problem to be solved by the invention is to provide a circuit board capable of improving welding efficiency and finished product quality, a manufacturing method thereof, a head end assembly, an assembling method thereof and an endoscope.

In order to solve the above technical problems, the present invention provides a method for manufacturing a circuit board, including:

providing a substrate, wherein the substrate is provided with a first partition and a second partition which are sequentially arranged in a first direction, the first direction is parallel to the extending direction of the substrate, the first partition is provided with input points, the second partition is provided with a plurality of output points, the input points are electrically connected with the output points, the output points are positioned on one side of the substrate in the thickness direction, and projections of the output points in the first direction are mutually spaced;

the cable extending along the first direction is provided, the cable comprises a plurality of wire filaments, the cable extending along the first direction is provided by the self-supply cable, the cable comprises a plurality of wire filaments, and the connecting ends of the wire filaments are welded to a plurality of output points in a one-to-one correspondence manner by using an automatic welding device.

The step of providing a cable extending along a first direction, the cable including a plurality of wires, and welding connection ends of the wires to a plurality of output points in a one-to-one correspondence manner by using an automatic welding device includes:

applying solder paste at each of the output points;

providing a cable extending along a first direction, wherein the cable comprises a plurality of wire leads, and providing a positioning jig, and positioning the plurality of wire leads by using the positioning jig, so that the connecting ends of the plurality of wire leads are positioned at a plurality of output points in a one-to-one correspondence manner;

and carrying out laser spot welding on each output point so that each connecting end is welded on each output point in a one-to-one correspondence manner.

In an embodiment, the step of providing a cable extending along a first direction, the cable including a plurality of wires, and welding connection ends of the plurality of wires to a plurality of output points in a one-to-one correspondence manner by using an automatic welding device includes:

and sequentially spraying solder balls melted by laser to a plurality of output points, so that the connecting ends are welded to the output points in a one-to-one correspondence.

In an embodiment, the step of providing a cable extending along a first direction, the cable including a plurality of wires, providing a positioning jig, and positioning the plurality of wires by using the positioning jig, so that connection ends of the plurality of wires are positioned at a plurality of output points in a one-to-one correspondence manner includes:

the cable extending along the first direction is provided, the cable comprises a plurality of wire rods, a positioning jig is provided, a plurality of guide grooves extending along the first direction are arranged on the positioning jig, the plurality of guide grooves are distributed at intervals in the second direction, the second direction is parallel to the extending direction of the substrate and perpendicular to the first direction, the wire rods are embedded into the guide grooves in a one-to-one correspondence manner, so that the connecting ends of the wire rods are distributed and positioned at a plurality of output points in a one-to-one correspondence manner.

In order to solve the above technical problems, the present invention provides a circuit board manufactured by the above manufacturing method, the circuit board further includes an electronic device welded to the input point, and the circuit board is at least partially made of a flexible material.

In an embodiment, the first and second partitions are disposed on the same side of the substrate in the thickness direction.

In an embodiment, the first partition and the second partition are disposed on both sides of the substrate in a thickness direction.

In order to solve the above technical problems, the present invention provides an assembling method of a head end assembly, for assembling a circuit board as described above to a head end structure, the head end structure including a head end housing and an outer tube, the assembling method comprising:

providing the head end shell, wherein the head end shell is provided with a first opening and a second opening which are oppositely arranged in a first direction, and an installation cavity which is communicated with the first opening and the second opening is formed in the head end shell;

the first partition is positioned outside the second opening;

shaping the circuit board so that the second partition can be inserted into the outer tube;

the second partition is inserted into the outer tube such that the cable passes through the outer tube and connects the outer tube to the head end housing.

In an embodiment, the substrate has a first side and a second side disposed opposite to each other in a thickness direction, the first partition is disposed on the first side, and the step of shaping the circuit board so that the second partition can be inserted into the outer tube includes:

bending a region of the substrate between the first partition and the second partition so that the second partition bends toward the second side face relative to the first partition in a first direction;

and bending the second partition so that two ends of the second partition, which are oppositely arranged in the second direction, are respectively bent towards the second side surface.

In an embodiment, after the step of inserting the second partition into the outer tube such that the cable passes through the outer tube and connects the outer tube to the head end housing, the method comprises:

injecting sealant into the gaps between the outer tube and the circuit board and in the mounting cavity, and curing the sealant.

To solve the above technical problem, the present invention provides a head end assembly assembled by the assembly method as described above.

In order to solve the above technical problems, the present invention provides an endoscope, comprising:

a headend assembly as hereinbefore described.

The technical scheme provided by the invention has the following advantages:

in the embodiment provided by the invention, the input points for welding the electronic devices and the output points for welding the cables on the substrate of the circuit board are arranged separately, so that a plurality of wire leads of the cables can be welded on the substrate with larger surface area for welding operation, the plurality of output points are positioned on the same side of the substrate, and projections in the first direction are distributed at intervals to weld the plurality of wire leads in a one-to-one correspondence manner, thus, the plurality of wire leads are not staggered with each other during welding, the contact area between each wire lead and the substrate is larger, and the automatic welding device is convenient to realize automatic welding, thereby improving the production efficiency and the product quality.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings that are needed in the description of the embodiments or the prior art will be briefly described, and it is obvious that the drawings in the description below are some embodiments of the present invention, and other drawings can be obtained according to the drawings without inventive effort for a person skilled in the art.

Fig. 1 is a schematic perspective view of a headend assembly according to the present invention;

fig. 2 is an exploded view of the headend assembly of fig. 1;

fig. 3 is an assembled schematic view of the head end housing and the circuit board in fig. 2;

FIG. 4 is an assembled view of the header housing and circuit board of FIG. 3 from another perspective;

FIG. 5 is a schematic perspective view of the circuit board in FIG. 4, wherein the circuit board has been molded;

fig. 6 is a schematic perspective view of the circuit board in fig. 4, wherein the circuit board has not been molded;

FIG. 7 is a schematic perspective view of the substrate in FIG. 6;

fig. 8 is a schematic working diagram of a positioning jig in the method for manufacturing a circuit board according to the present invention;

fig. 9 is a process flow chart of an embodiment of a method for manufacturing a circuit board according to the present invention;

fig. 10 is a process flow diagram of an embodiment of a method for assembling a headend assembly according to the present invention.

Reference numerals illustrate:

100-headend assembly; 101-a head end housing; 102-an outer tube; 103-an inner tube; 10-a circuit board; 11-a substrate; 12-input points; 13-output point; 111-first partition; 112-a second partition; 113-a first side; 114-a second side; 20-a cable; 21-a wire; 30-positioning jig; 31-a guide groove; 40-an electronic device; 41-an image pickup element; 42-an illumination element; 50-mounting cavity; 51-a first opening; 52-second opening.

Detailed Description

The following description of the embodiments of the present invention will be made apparent and fully in view of the accompanying drawings, in which some, but not all embodiments of the invention are shown. The invention will be described in detail hereinafter with reference to the drawings in conjunction with embodiments. It should be noted that, without conflict, the embodiments of the present invention and features of the embodiments may be combined with each other.

It should be noted that the terms "first," "second," and the like in the description and the claims of the present invention and the above figures are used for distinguishing between similar objects and not necessarily for describing a particular sequential or chronological order.

In the present invention, unless otherwise indicated, terms of orientation such as "upper, lower, top, bottom" are used generally with respect to the orientation shown in the drawings or with respect to the component itself in the vertical, upright or gravitational direction; also, for ease of understanding and description, "inner and outer" refers to inner and outer relative to the profile of each component itself, but the above-mentioned orientation terms are not intended to limit the present invention.

Referring to fig. 1 to 9, the present invention provides a method for manufacturing a circuit board 10 and the circuit board 10 manufactured by the method.

Specifically, referring to fig. 1 to 7, the circuit board 10 is used for an endoscope, the endoscope includes a head end structure, an insertion tube with a connector end structure, and an operation portion disposed at a rear end of the insertion tube, wherein the circuit board 10 is assembled in the head end structure and is connected with an electronic device 40 and a cable 20, the electronic device 40 may include an image capturing element 41 and/or an illumination element 42, etc. for illuminating and/or acquiring an image of an interior of a human body, and the cable 20 realizes an electrical connection of the electronic device 40 to an external device so as to realize signal transmission and power supply to the electronic device 40. In the prior art, due to the overall size limitation of the endoscope, the size of the welding spots on the circuit board 10 is tiny, and the arrangement mode of the welding spots on the existing circuit board 10 is unfavorable for automatic welding of the cable 20, so that the production efficiency is low, and meanwhile, the consistency and reliability of welding quality cannot be ensured.

In order to solve the above-mentioned problems, referring to fig. 9, in an embodiment, the method for manufacturing a circuit board 10 according to the present invention includes the following steps:

in step S1, a substrate 11 is provided, where the substrate 11 has a first partition 111 and a second partition 112 sequentially arranged in a first direction, the first direction is parallel to an extending direction of the substrate 11, an input point 12 is disposed on the first partition 111, a plurality of output points 13 are disposed on the second partition 112, the input point 12 is electrically connected to the plurality of output points 13, and projections of the plurality of output points 13 in the first direction are spaced from each other.

In this embodiment, referring to fig. 6 and 7, the substrate 11 is in a sheet structure, the material of the substrate 11 may be selected according to needs, preferably, the substrate 11 may be partially made of a flexible material, for example, a flexible material is used in the second partition 112 and the area between the first partition 111 and the second partition 112, so that the substrate 11 is bent and shaped to be easily assembled in the header assembly 100.

The first direction is parallel to the extending direction of the board surface of the substrate 11 and is also the extending direction of the cable 20. The first and second partitions 111 and 112 may be disposed adjacent to each other in the first direction or may be spaced apart from each other, and preferably, the first and second partitions 111 and 112 are spaced apart from each other in the first direction, and the width dimension of the substrate 11 between the first and second partitions 111 and 112 is smaller than that of the first and second partitions 111 and 112 so as to facilitate shaping for processing and to save costs. The first partition 111 is provided with an input point 12, the second partition 112 is provided with an output point 13, and the input point 12 and the output point 13 are correspondingly electrically connected through a circuit printed on the substrate 11.

In a specific implementation, the input point 12 is used for soldering the electronic device 40, and the soldering manner is not limited, and for example, soldering may be performed by using a chip mounting process. In particular, the input points 12 may be provided in a plurality of arrangements and sizes that may be designed based on the type of electronic device 40 to be soldered and the installation in the headend assembly 100. The output point 13 is used for welding a plurality of wires 21 of the cable 20, and the number and shape of the wires are designed according to actual transmission requirements.

Further, the substrate 11 has two sides disposed opposite to each other in the thickness direction, and the second partition 112 is disposed on one side of the substrate 11 in the thickness direction, so as to ensure that the plurality of output points 13 are located on the same side of the substrate 11, so that the welding direction does not need to be changed during the welding process, and the welding device is adapted to a common automatic welding device, thereby being beneficial to improving the welding efficiency. In addition, the projections of the plurality of output points 13 in the first direction are spaced from each other, so that the plurality of wires 21 do not need to be staggered in the welding process, and the working mode of the automatic welding device is favorably adapted. Regarding the distribution form of the plurality of output points 13, in one case, the plurality of output points 13 are arranged at intervals along a second direction, which is perpendicular to the first direction and parallel to the extending direction of the substrate 11; in another case, the plurality of output points 13 are distributed offset from each other in the second direction; in yet another case, the plurality of output points 13 are distributed on the same curve.

Further, the first and second partitions 111 and 112 may be disposed on the same side of the substrate 11 in the thickness direction. Thus, during the welding process, the overturning action of the substrate 11 can be avoided, and the welding efficiency can be improved. In other embodiments, the first partition 111 and the second partition 112 may be disposed on two sides of the substrate 11 in the thickness direction, so that the first partition 111 and the second partition 112 are disposed on different sides of the substrate 11, which is beneficial to avoiding the situation that the wire 21 falls off due to the contact of the outer tube 102 with the solder points in the subsequent mounting process of the circuit board 10.

In step S2, a cable 20 extending along the first direction is provided, the cable 20 includes a plurality of first wires 21, and the connection ends of the wires 21 are soldered to the plurality of output points 13 in a one-to-one correspondence manner by using an automatic soldering device.

In this step, the type of the automatic soldering apparatus is not limited, for example, the automatic soldering apparatus is a laser soldering apparatus, so as to achieve precise soldering of the cable 20, and at the same time, avoid an excessively large heating area, which adversely affects other areas on the circuit board 10 of a minute size. In this step, the wire 20 needs to be stripped first, and part of the outer skin of the end of the wire 20 is removed, so that the wire 21 is exposed for the subsequent welding operation.

In this embodiment, the input points 12 for soldering the electronic device 40 and the output points 13 for soldering the cable 20 on the substrate 11 of the circuit board are separately arranged, so that a larger area can be provided on the substrate 11 to solder the plurality of wires 21 of the cable 20, so as to perform soldering operation, and the plurality of output points 13 are located on the same side of the substrate 11, and the projections in the first direction are distributed at intervals to each other, so that the plurality of wires 21 are soldered in a one-to-one correspondence manner, thus, the plurality of wires 21 are not staggered with each other during soldering, the contact area between each wire 21 and the substrate 11 is larger, and automatic soldering is facilitated by using an automatic soldering device, thereby improving the production efficiency and the product quality.

On the basis of the above embodiment, further, the step S2 includes:

and applying solder paste at each output point 13.

In this step, the automatic tin-plating equipment may be used for tin plating, or the tin-plating mechanism of the automatic welding device may be used for tin plating. When the first and second partitions 111 and 112 are located on the same side of the substrate 11 in the thickness direction, tin may be applied at the same time. Specifically, a steel mesh can be covered on the substrate 11, corresponding hole sites are formed in the positions of the steel mesh corresponding to the input points 12 and the output points 13, and tin can be applied only by pouring tin paste on the steel mesh and scraping off the excessive tin paste.

Step, providing a cable 20 extending along a first direction, wherein the cable 20 comprises a plurality of wires 21, providing a positioning jig 30, and positioning the wires 21 by using the positioning jig 30, so that the connection ends of the wires 21 are positioned at the output points 13 in a one-to-one correspondence.

In this step, the specific structure of the positioning jig 30 is not limited as long as the separate positioning of the wire 21 can be achieved. After the wire 21 is positioned by the positioning jig 30, the wire 21 can be ensured not to shift in the welding process, so that the welding quality is ensured.

In a preferred embodiment, referring to fig. 8, the positioning jig 30 is provided with a plurality of guide grooves 31 extending along a first direction, and the plurality of guide grooves 31 are arranged at intervals in a second direction, wherein the second direction is parallel to the extending direction of the substrate 11 and perpendicular to the first direction. In this step, a cable 20 extending in the first direction is provided, and the cable 20 includes a plurality of wires 21, and each wire 21 is embedded in each guide groove 31 in a one-to-one correspondence manner, so that connection ends of the plurality of wires 21 are distributed at intervals and positioned in a one-to-one correspondence manner at a plurality of output points 13. Therefore, the reliable positioning jig 30 is utilized to position the plurality of wire rods 21 of the cable 20 in advance, the situation that the wire rods 21 are shifted in the welding process to cause missing welding and misplacement welding is avoided, the welding quality is improved, meanwhile, the wire rods 21 are not required to be positioned manually for multiple times, and the production efficiency is improved.

And performing laser spot welding on each output point 13 so that each connecting end is welded to each output point 13 in a one-to-one correspondence.

In this step, each of the output points 13 is spot-welded by the laser welder, so that each of the connection ends is welded to each of the output points 13 in one-to-one correspondence. Thus, accurate and efficient soldering of the cable 20 is achieved while avoiding the adverse effect of the oversized heating area on other areas on the micro-sized circuit board 10.

In the present embodiment, automatic welding of the cable 20 and the plurality of output points 13 is achieved by using an automatic welding device, thereby improving production efficiency and product quality. And the operation is simple and convenient, and the cost of the automatic welding device is lower.

In another embodiment, the step S2 includes:

step, providing a cable 20 extending along a first direction, wherein the cable 20 comprises a plurality of wires 21, providing a positioning jig 30, and positioning the wires 21 by using the positioning jig 30, so that the connection ends of the wires 21 are positioned at the output points 13 in a one-to-one correspondence. .

The specific implementation of this step is similar to that of the previous embodiment, and is not repeated here.

And sequentially spraying solder balls melted by laser to the plurality of output points 13, so that the connecting ends are welded to the output points 13 in a one-to-one correspondence.

In particular, the solder ball particles may be transported to the nozzle by a ball feeding mechanism, and then the solder ball is accommodated by laser irradiation, and the liquid tin is sprayed to the output point by an inert gas, so that the wire 31 is soldered to the substrate 11.

In this embodiment, the solder balls are pure tin particles without dispersion, so that the tin amount can be accurately controlled, splashing can not be caused after the solder balls are heated and melted by laser, and the surfaces of the solidified solder balls are full and smooth. Compared with the previous embodiment, the welding efficiency is higher, no soldering flux is required to be added, the condition of cold joint is avoided, the consistency of the welded outer tube is high, the stability is good, and the heat influence is small.

The present invention also provides a circuit board 10, wherein the circuit board 10 is manufactured by the manufacturing method, the circuit board 10 further comprises an electronic device 40 welded to the input point 12, and the circuit board 10 is made of flexible materials at least in the area except the first area.

Referring to fig. 10, the present invention further provides a method for assembling the head-end assembly 100. Referring specifically to fig. 1 and 2, the headend assembly 100 includes a headend structure and the circuit board 10, the headend structure includes at least a headend housing 101 and an outer tube 102, and the circuit board 10 is assembled in the headend housing 101 and the outer tube 102, and specifically, the assembling method includes:

in step S10, the head end housing 101 is provided, the head end housing 101 has a first opening 51 and a second opening 52 disposed opposite to each other in a first direction, and a mounting cavity 50 communicating the first opening 51 and the second opening 52 is formed in the head end housing 101.

Referring to fig. 2 to 4, in the present embodiment, a head end housing 101 is a housing structure disposed at the forefront of an endoscope, and is used to accommodate electronic devices 40 such as an image pickup element 41 and/or an illumination element 42. As shown, the image pickup element 41 and the illumination element 42 may be inserted into the mounting cavity 50 through the second opening 52, the first opening 51 is located at the front end of the head end housing 101, the second opening 52 is located at the rear end of the head end housing 101, the image pickup element 41 may be framed through the first opening 51, and the illumination element 42 may be illuminated through the first opening 51. Optionally, the head end structure may further be inserted into the inner tube 103, and a working channel is formed in the inner tube 103, where the working channel may be used for an operation device to enter the human body from the working channel to operate, and the working channel may also be used as a surgical perfusion channel to deliver gas or liquid into the human body.

In step S20, the electronic device 40 is inserted into the mounting cavity 50 from the second opening 52 such that the first partition 111 is located outside the second opening 52.

In particular implementations, the electronic device 40 may be inserted entirely within the mounting cavity 50 or may be partially inserted within the mounting cavity 50. When the electronic device 40 is inserted in place, the first section 111 preferably abuts against the header structure to act as a stop. And when the sealant is injected for sealing, the sealant can play a good sealing role, and the human tissue fluid is prevented from penetrating into the endoscope from the first opening 51.

Step S30, shaping the circuit board 10 to enable the second partition 112 to be inserted into the outer tube 102.

In this step, the circuit board 10 is mainly subjected to bending operation, and the size thereof in the endoscope radial direction is reduced so that a structure in which the circuit board 10 is exposed to the rear side of the head end housing 101 can be inserted into the outer tube 102 in the rear portion thereof later. The outer tube 102 serves to connect the head end housing 101 and the rear operation portion, and in one embodiment, the outer tube 102 serves as an insertion tube to connect the operation portion and the head end housing 101, and in another embodiment, the outer tube 102 serves as a connection sleeve to connect the head end housing 101 at the front end and the rear insertion tube and operation portion. It should be noted that, the specific shaping manner of the circuit board 10 is related to the installation requirement thereof, and in particular, it is required to achieve the effect that the external tube 102 can be inserted without affecting the electronic device 40 or the cable 20 soldered thereon.

In a preferred embodiment, referring to fig. 5 and 6 in combination, the substrate 11 has a first side 113 and a second side 114 opposite to each other in a thickness direction, the first partition 111 is disposed on the first side 113, and the step S30 includes:

and bending the region of the substrate 11 between the first partition 111 and the second partition 112 so that the second partition 112 is bent toward the second side 114 in the first direction with respect to the first partition 111.

In a specific implementation, the included angle between the substrate 11 where the first partition 111 is located and the substrate 11 where the second partition 112 is located is smaller than 90 degrees. The included angle between the two is preferably greater than 45 degrees and less than 90 degrees, so that the two components can not touch other components such as the inner tube 103 in the outer tube 102 after being inserted into the outer tube 102, and the output point 13 is not easy to touch and fall off in the inserting process.

And bending the second partition 112 so that two ends of the second partition 112, which are oppositely arranged in the second direction, are respectively bent towards the second side surface 114.

In this step, the curvature of the second section 112 preferably conforms to the inside of the outer tube 102, so that the circuit board 10 can be positioned more securely and reliably.

In step S40, the second partition 112 is inserted into the outer tube 102, such that the cable 20 passes through the outer tube 102, and the outer tube 102 is connected to the head end housing 101.

In this step, the outer tube 102 is further fixed, so that the circuit board 10 is assembled in the head end structure to form the head end assembly 100, which is convenient for subsequent assembly procedures with components such as the operation part, and improves production efficiency.

Preferably, after the step S40, the method further includes:

and injecting sealant into the gaps between the outer tube 102 and the circuit board 10 and in the mounting cavity 50, and curing the sealant.

In a specific implementation, the sealant may be a UV glue. In this step, the circuit board 10 and the head end structure are fixed by the sealant, which on the one hand plays a role in connecting the components of the head end assembly 100, so that the components are firmly connected with each other. On the other hand, the sealant plays a sealing role, so that the front end of the head end structure is sealed, and tissue fluid and the like are prevented from penetrating into the head end structure in the working process of the endoscope to influence the working of the endoscope. Finally, the sealant also plays a role in coating each welding spot, protects the welding spot and enhances the reliability and durability of the welding spot.

In this embodiment, the flexible circuit board 10 and the special structure of the circuit board 10 are utilized, so that the overall structure of the head end assembly 100 is more reasonable and compact, the welding efficiency of the cable 20 is improved by utilizing the automatic welding device, and meanwhile, the endoscope is reasonable in structure, easy to assemble and good in sealing performance, and the quality of the endoscope is improved.

The invention also provides the head end assembly 100 assembled by the assembly method and an endoscope comprising the head end assembly 100. The endoscope also includes an operating portion connected to the rear end of the head end assembly 100. The above products have the advantages mentioned in the above embodiments and are not described here again.

It will be apparent that the embodiments described above are merely some, but not all, embodiments of the invention. Based on the embodiments of the present invention, those skilled in the art may make other different changes or modifications without making any creative effort, which shall fall within the protection scope of the present invention.

Claims

1. A method of manufacturing a wiring board, comprising:

a cable extending along a first direction is provided, the cable comprises a plurality of wire leads, and connecting ends of the wire leads are welded to a plurality of output points in a one-to-one correspondence manner by utilizing an automatic welding device.

2. The method of manufacturing a circuit board according to claim 1, wherein the step of providing a cable extending in the first direction, the cable including a plurality of wires, and soldering connection ends of the plurality of wires to the plurality of output points in a one-to-one correspondence using an automatic soldering device includes:

applying solder paste at each of the output points;

3. The method of manufacturing a circuit board according to claim 1, wherein the step of providing a cable extending in the first direction, the cable including a plurality of wires, and soldering connection ends of the plurality of wires to the plurality of output points in a one-to-one correspondence using an automatic soldering device includes:

4. The method for manufacturing a circuit board according to claim 2 or 3, wherein the step of providing a cable extending in the first direction, the cable including a plurality of wires, providing a positioning jig, positioning the plurality of wires with the positioning jig so that connection ends of the plurality of wires are positioned at the plurality of output points in one-to-one correspondence includes:

5. A circuit board manufactured by the manufacturing method according to any one of claims 1 to 4, further comprising an electronic device soldered to the input point, the circuit board being at least partially of flexible material.

6. The wiring board of claim 5, wherein the first and second partitions are disposed on the same side of the substrate in a thickness direction.

7. The wiring board of claim 5, wherein the first and second partitions are provided on both sides of the substrate in a thickness direction.

8. A method of assembling a header assembly for assembling the circuit board of any one of claims 5 to 7 to a header structure, the header structure including a header housing and an outer tube, the method comprising:

the first partition is positioned outside the second opening;

9. The method of assembling a header assembly of claim 8, wherein the base plate has a first side and a second side disposed opposite each other in a thickness direction, the first partition being disposed on the first side, the step of shaping the wiring board so that the second partition can be inserted into the outer tube comprising:

10. The method of assembling a headend assembly of claim 8, wherein said inserting the second section into the outer tube such that the cable passes through the outer tube and connecting the outer tube to the headend housing includes:

11. A head end assembly, wherein the head end assembly is assembled by the assembly method of any one of claims 8 to 10.

12. An endoscope, comprising:

the headend assembly of claim 11.