CN218520541U - Semiconductor component loading attachment - Google Patents

Abstract

The utility model relates to the field of semiconductor performance detection equipment, and provides a semiconductor component feeding device which comprises a frame, a pipe supporting platform, a material pipe transfer mechanism, a feeding track, a turning platform, a pipe pressing assembly and a pipe pushing mechanism; the automatic material loading device has the advantages that multiple material pipes can be automatically loaded one by one, the material pipes are automatically conveyed one by one to the tilting platform and the material supporting platform through the material pipe conveying mechanism, then the material pipes are pressed on the tilting platform through the pressure pipe assembly, the tilting driving mechanism drives the tilting platform and the material pipes to swing and incline, the head ends of the material pipes are in butt joint with the feeding rails, semiconductor elements in the material pipes automatically slide out of the material pipes under the action of gravity, and finally the semiconductor elements enter the high-pressure testing device under the guiding of the feeding rails.

Description

Semiconductor component feeding device

Technical Field

The utility model relates to a semiconductor performance check out test set field, in particular to semiconductor components and parts loading attachment.

Background

After the semiconductor element finished product is produced by the automatic semiconductor production line, the semiconductor element is stored in the material pipe, and then the material pipe is conveyed to high-voltage testing equipment to carry out high-voltage testing on the semiconductor element. In the prior art, the semiconductor element is generally taken out from the material pipe firstly, the semiconductor element is carried to high-voltage testing equipment one by one in a vacuum suction mode through the gripper, the carrying efficiency is low, the vacuum suction is required to be cut off during high-voltage testing, and the gripping precision is influenced, so that research and development personnel conceive that the conventional gripper structure is abandoned and the high-voltage testing equipment is improved, a feeding device capable of being matched with the high-voltage testing equipment is designed, the semiconductor element in the material pipe is automatically inclined and poured out, and the semiconductor element slides into the high-voltage testing equipment along a feeding track.

SUMMERY OF THE UTILITY MODEL

In view of the foregoing disadvantages of the prior art, an object of the present invention is to provide a semiconductor component feeding device, which aims to switch a horizontally placed material tube to an inclined state, so that a semiconductor component in the material tube can be automatically poured out under the action of gravity.

In order to achieve the purpose, the utility model adopts the following technical proposal:

a semiconductor component feeding device comprises a rack, a supporting pipe platform fixedly arranged on the rack, a material pipe transfer mechanism arranged beside the supporting pipe platform, a feeding track fixedly arranged in front of the rack and inclined downwards, a turning platform rotationally connected with the feeding track, a pipe pressing assembly arranged on the turning platform and a pipe pushing mechanism arranged on the supporting pipe platform; the pipe transfer mechanism comprises a top plate arranged on the rack, a pipe storage assembly vertically arranged on the top plate, a sliding frame in sliding connection with the top plate, a pipe transfer support arm arranged on the sliding frame, and a sliding frame driving mechanism used for driving the sliding frame and the pipe transfer support arm to be close to or far away from the pipe supporting platform, wherein a plurality of vertically stacked pipes are stored on the pipe storage assembly; a pipe dropping gap is formed between the pipe supporting platform and the top plate, and an empty pipe bin is arranged below the pipe dropping gap.

As a further improvement of the above technical scheme, the tilt driving mechanism comprises a cylinder support fixed below the tube supporting platform, a tilt driving cylinder, and a joint fixedly arranged on the tilt platform, wherein the end of a piston rod of the tilt driving cylinder is connected with the joint through a pivot, and the end of a cylinder body of the tilt driving cylinder is hinged with the cylinder support.

As a further improvement of the technical scheme, a support plate is arranged outside the pipe storage assembly, and a knocking cylinder for knocking the pipe body of the material pipe is arranged on the support plate.

As a further improvement of the technical scheme, the support plate is provided with a material pipe limiting clamp, and the material pipe limiting clamp is provided with a blowing head used for blowing the interior of the material pipe.

As a further improvement of the technical scheme, the pipe pushing mechanism comprises a pipe pushing cylinder, a push plate connected with the end part of a piston rod of the pipe pushing cylinder, and a push rod arranged on the push plate.

As the further improvement of above-mentioned technical scheme, be equipped with horizontal extension's linear bearing in the push pedal, push rod and linear bearing sliding connection, the one end of push rod is equipped with the ejector sleeve piece, and the other end of push rod is equipped with card pipe response piece, the top of push pedal is equipped with card pipe regulating plate, is equipped with card pipe inductor on the card pipe regulating plate, the cover has the spring on the push rod, the spring is located between ejector sleeve piece and the linear bearing, card pipe response piece can trigger card pipe inductor.

As a further improvement of the technical scheme, the pipe moving support arm comprises a cushion seat arranged on the sliding frame, a pipe moving strip arranged on the cushion seat and a positioning notch arranged on the pipe moving strip, and an adjusting block is arranged in the positioning notch.

As a further improvement of the above technical solution, the carriage is slidably connected to the bottom surface of the top plate through a guide rail and a slider, the carriage driving mechanism includes a carriage driving cylinder and a carriage pushing block, and an end of a piston rod of the carriage driving cylinder is connected to the carriage through the carriage pushing block.

As a further improvement of the technical scheme, the pipe storage assembly comprises a first supporting block, a first pipe clamp vertically arranged on the first supporting block, a second supporting block and a second pipe clamp vertically arranged on the second supporting block.

As a further improvement of the technical scheme, the number of the material pipe transfer mechanisms is two, and the two material pipe transfer mechanisms are symmetrically arranged on the left side and the right side of the trusteeship platform respectively.

Has the advantages that:

the utility model provides a semiconductor components and parts loading attachment can carry out the material loading to the high-pressure testing arrangement that the slope set up, automatically, carry out material loading one by one to many material pipes, convey the material pipe one by one to turning over pendulum platform and trusteeship platform through material pipe transfer mechanism is automatic, then utilize and press the pipe subassembly to compress tightly the material pipe behind the pendulum platform, the pendulum platform is turned over in the drive of the pendulum actuating mechanism and material pipe swing slope, make the head end and the feeding track formation butt joint of material pipe, the automatic roll-off material pipe of semiconductor element under the action of gravity in the material pipe, at last get into under the orbital guide of feeding in the high-pressure testing arrangement.

Drawings

Fig. 1 is a first perspective view of the semiconductor component feeding device provided by the present invention.

Fig. 2 is a partially enlarged view of the area a in fig. 1.

Fig. 3 is a perspective view of the tilting driving mechanism driving the tilting platform to be switched to a tilting state.

Fig. 4 is a perspective view of the material pipe transfer mechanism.

Fig. 5 is a second perspective view of the semiconductor component feeding device provided by the present invention.

Description of the main element symbols: the device comprises a 1-rack, an 11-pipe falling gap, a 2-pipe supporting platform, a 3-pipe transferring mechanism, a 31-top plate, a 32-pipe storage assembly, a 321-first supporting block, a 322-first pipe clamp, a 323-second supporting block, a 324-second pipe clamp, a 33-sliding frame, a 34-pipe moving supporting arm, a 341-cushion seat, a 342-pipe moving strip, a 343-positioning notch, a 344-adjusting block, a 35-sliding frame driving mechanism, a 351-sliding frame driving cylinder, a 352-pushing frame block, a 36-pipe outlet, a 37-pipe inlet, a 38-guide rail, a 39-sliding block, a 4-feeding track, a 5-swinging platform, a 6-pipe assembly, a 61-pipe pressing cylinder, a 62-cylinder bracket, a 63-pressing block, a 7-pipe pushing mechanism, a 71-pipe pushing cylinder, a 72-pushing plate 73-pushing rod, a 74-linear bearing, a 75-pipe pushing block, a 76-pipe clamping sensing block, a 77-pipe clamping adjusting plate, a 78-pipe clamping sensor, a 79-spring, an 8-swinging driving mechanism, a 81-supporting seat, a 91-supporting plate, a 91-82-air cylinder, a knocking pipe head, a limiting cylinder, a knocking pipe clamp head, a knocking head and a knocking limiting driving head.

Detailed Description

The utility model provides a semiconductor components and parts loading attachment, for making the utility model discloses a purpose, technical scheme and effect are clearer, clear and definite, and it is right that the embodiment is lifted to follow with reference to the attached drawing the utility model discloses further detailed description. It should be understood that the specific embodiments described herein are merely illustrative of the present invention and are not intended to limit the scope of the invention.

Referring to fig. 1 to 5, the present invention provides a semiconductor device feeding apparatus, which includes a frame 1, a tube supporting platform 2 fixedly disposed on the frame 1, a tube transferring mechanism 3 disposed beside the tube supporting platform 2, a feeding rail 4 fixedly disposed in front of the frame 1 and inclined downward, a tilting platform 5 rotatably connected to the feeding rail 4, a tube pressing assembly 6 disposed on the tilting platform 5, and a tube pushing mechanism 7 disposed on the tube supporting platform 2; the material pipe transfer mechanism 3 comprises a top plate 31 arranged on the rack 1, a material pipe assembly 32 vertically arranged on the top plate 31, a carriage 33 connected with the top plate 31 in a sliding manner, a pipe moving support arm 34 arranged on the carriage 33, and a carriage driving mechanism 35 used for driving the carriage 33 and the pipe moving support arm 34 to be close to or far away from the hosting platform 2, wherein a plurality of vertically stacked material pipes 96 are stored on the material pipe assembly 32, an outlet pipe 36 is arranged at the bottom of the material pipe assembly 32, the pipe moving support arm 34 is used for receiving the material pipes and transferring the material pipes from the outlet pipe 36 to the tilting platform 5 and the hosting platform 2, the pressure pipe assembly 6 is used for pressing the material pipes on the tilting platform 5, the pipe pushing mechanism 7 is used for pushing the material pipes on the hosting platform 2 to move forwards to a set position, and the tilting platform 5 is driven by the tilting driving mechanism 8 to enable the material pipes on the tilting platform 5 to be converted from a horizontally extending state to a state of being butted with the feeding track 4; a pipe falling gap 11 is arranged between the pipe supporting platform 2 and the top plate 31, and an empty pipe bin 91 is arranged below the pipe falling gap 11.

In practical application, the top of the storage tube assembly 32 is provided with the inlet pipe 37, a worker places a plurality of tubes 96 filled with semiconductor elements into the inlet pipe 37 of the storage tube assembly 32, all the tubes 96 extend horizontally and are stacked vertically, and the worker only needs to supplement the tubes periodically according to the number of the remaining tubes, so that the worker can take other work into consideration. It should be understood that the tube 96 is not shown in FIG. 1 as being disposed on the storage tube assembly 32.

When feeding, the tilting platform 5 is in a horizontal state, the carriage driving mechanism 35 drives the carriage 33 to move towards the supporting platform 2, the pipe moving support arm 34 on the carriage 33 bears the pipe positioned at the bottommost layer and moves the pipe out of the pipe outlet 36 of the pipe storage assembly 32, so that the pipe is translated to the tilting platform 5 and the supporting platform 2, and then the pipe pushing mechanism 7 drives the tail end of the pipe, so that the pipe moves forwards to a set position; then the material pipe assembly 6 presses the material pipe on the tilting platform 5, the tilting driving mechanism 8 drives the tilting platform 5 to tilt, so that the material pipe on the tilting platform 5 is converted into a tilting state from a horizontal extending state, the tail end of the material pipe is higher than the head end of the material pipe, and the head end of the material pipe is in butt joint with the feeding track 4; the semiconductor components in the tube slide out of the tube automatically under the influence of gravity and then are guided by the feeding rail 4 into the high-pressure testing device 10. When all semiconductors in the material pipe are poured out, the material pipe becomes an empty material pipe, at the moment, the pipe moving support arm 34 resets and is far away from the material supporting platform 2, the swing driving mechanism 8 drives the swing platform 5 to reset, the empty material pipe on the swing platform 5 is switched to a horizontal extending state from an inclined state, the pipe pressing assembly 6 loosens the empty material pipe, when the pipe moving support arm 34 transfers the next material pipe with the semiconductor element to the swing platform 5 and the material supporting platform 2, the position of the empty material pipe is replaced by the material pipe with the semiconductor element, and the empty material pipe is pushed into the pipe falling gap 11 by the pipe moving support arm 34 to fall into the empty pipe bin 91 to be recovered.

The utility model provides a semiconductor components and parts loading attachment can adaptation high pressure test device 10, automatically, carry out material loading one by one to many material pipes, convey the material pipe one by one to tilting platform 5 and trusteeship platform 2 through material pipe transfer mechanism 3 is automatic, then utilize and press pipe subassembly 6 to compress tightly the material pipe behind tilting platform 5, 8 drive tilting platform 5 and the slope of material pipe swing of tilting drive mechanism, make the head end and the feeding track 4 formation butt joint of material pipe 96, semiconductor element in the material pipe 96 is automatic roll-off material pipe 96 under the action of gravity, get into in the high pressure test device under the guide of feeding track 4 at last.

Specifically, referring to fig. 3, the tilting driving mechanism 8 includes a cylinder support 81 fixed below the supporting platform 2, a tilting driving cylinder 82, and a joint 83 fixedly disposed on the tilting platform 5, wherein a piston rod end of the tilting driving cylinder 82 is pivotally connected to the joint 83, and a cylinder body end of the tilting driving cylinder 82 is hinged to the cylinder support 81. In this embodiment, when the piston rod of the tilting driving cylinder 82 extends out, the tilting platform 5 is driven to swing to a horizontal state by the transmission of the joint 83, and the bottom surface of the tilting platform 5 is flatly pressed on the supporting platform 2. When the piston rod of the tilting driving cylinder 82 retracts, the tilting platform 5 is pulled to tilt through the transmission of the joint 83, so that the head end of the material pipe is in butt joint with the feeding track 4. For the sake of structural compactness, the tilting platform 5 includes a support portion 51 and two swing arms 52 disposed in front of the support portion, the feeding track 4 is disposed between the two swing arms 52, and the two swing arms 52 are rotatably connected with the feeding track 4 through rotating shafts.

Because the semiconductor elements are mutually abutted, the semiconductor elements are easy to dislocate, the material clamping condition occurs in the material pipe, namely the material pipe is swung to be inclined, the semiconductor elements cannot automatically slide out of the material pipe under the action of gravity, and at the moment, external force is needed to assist the semiconductor to pour out. Therefore, a support plate 92 is arranged outside the pipe storage assembly 32, a knocking cylinder 95 for knocking the pipe body of the material pipe is arranged on the support plate 92, and the pipe body of the material pipe is knocked for a plurality of times through the knocking cylinder 95, so that the clamped semiconductor element can be loosened under the vibration action to correct the position and smoothly slide downwards.

Furthermore, a material pipe limiting clamp 93 is arranged on the support plate 92, and a blowing head 94 for blowing the interior of the material pipe is arranged on the material pipe limiting clamp 93. The blowing head 94 blows air to the tail end of the material tube, and the air flow enters the interior of the material tube to assist the semiconductor element and better pour the semiconductor element out.

Preferably, referring to fig. 2, the pipe pushing mechanism 7 includes a pipe pushing cylinder 71, a pushing plate 72 connected to an end of a piston rod of the pipe pushing cylinder 71, and a pushing rod 73 disposed on the pushing plate 72. The pipe pushing cylinder 71 drives the pushing plate 72 and the pushing rod 73 to move transversely, the pushing rod 73 drives the material pipe to move forwards, and when the head of the material pipe accurately moves to a set position, the pipe pressing assembly 6 presses the material pipe on the tilting platform 5.

Preferably, be equipped with the linear bearing 74 of horizontal extension on the push pedal 72, push rod 73 and linear bearing 74 sliding connection, the one end of push rod 73 is equipped with ejector sleeve piece 75, and the other end of push rod 73 is equipped with card pipe response piece 76, the top of push pedal 72 is equipped with card pipe regulating plate 77, is equipped with card pipe inductor 78 on the card pipe regulating plate 77, the cover has spring 79 on the push rod 73, spring 79 is located between ejector sleeve piece 75 and the linear bearing 74, card pipe response piece 76 can trigger card pipe inductor 78. Under normal conditions, the tube clamping sensing block 76 on the push rod 73 keeps triggering the tube clamping sensor 78 due to the elastic force of the spring 79. When a pipe clamping problem occurs, the push rod 73 cannot push the pipe to move, one end of the push rod 73 presses the pipe and slides relative to the push plate 72, the push rod 73 compresses the buffer spring 79 to buffer impact force, the push rod 73 and the pipe pushing cylinder 71 are prevented from being damaged, meanwhile, the pipe clamping sensing block 76 on the push rod 73 moves towards the direction far away from the pipe clamping sensor 78, the pipe clamping sensing block 76 cannot trigger the pipe clamping sensor 78, the pipe clamping sensor 78 feeds back a signal to a control system at the moment, and the control system triggers an alarm to remind a worker to handle the pipe clamping problem.

Preferably, the bayonet tube sensor 78 may be a slot type correlation sensor.

Preferably, the tube moving arm 34 includes a base 341 disposed on the carriage 33, a tube moving bar 342 disposed on the base 341, and a positioning recess 343 opened on the tube moving bar 342, and an adjusting block 344 is disposed in the positioning recess 343. The size of the tube accommodating space of the positioning notch 343 can be adjusted by the adjusting block 344, so that the width of the tube accommodating space is adapted to the width of the tube, and then the tube positioned at the bottom of the tube storage assembly 32 just falls into the tube accommodating space and cannot move left and right, and the tube moving support arm 34 accurately moves the tube to the position right above the tube supporting platform 2.

Preferably, the carriage 33 is slidably connected to the bottom surface of the top plate 31 via a guide rail 38 and a slider 39, the carriage drive mechanism 35 includes a carriage drive cylinder 351 and a carriage block 352, and a piston rod end of the carriage drive cylinder 351 is connected to the carriage 33 via the carriage block 352. The piston rod of the carriage driving cylinder 351 extends or retracts, and the carriage 33 and the parts on the carriage 33 are driven to move away from or close to the supporting platform 2 under the driving of the carriage pushing block 352.

Preferably, the tube storage assembly 32 includes a first pallet 321, a first tube clamp 322 vertically disposed on the first pallet 321, a second pallet 323, and a second tube clamp 324 vertically disposed on the second pallet 323. A plurality of material pipes filled with semiconductor elements are arranged between the first pipe clamp 322 and the second pipe clamp 324, each material pipe is horizontally arranged and vertically stacked one by one to form a material pipe stack, and the material pipes pressed on the first supporting plate 321 and the second supporting plate 323 are the current material pipes. When the lowermost tube is pushed out of the outlet opening 36, the stack will automatically descend, waiting for the loading.

Preferably, the pressure pipe assembly 6 comprises a pressure pipe cylinder 61 fixed on the cylinder support 62 and arranged on the cylinder support 62, and a pressing block 63 arranged on the end of the piston of the pressure pipe cylinder 61, wherein the pressure pipe cylinder 61 drives the pressing block 63 to move towards the tilting platform 5, so as to press the material pipe on the tilting platform 5.

In order to increase the number of stored tubes and reduce the tube supplementing frequency, the number of the tube transfer mechanisms 3 is two, and the two tube transfer mechanisms 3 are respectively and symmetrically arranged on the left side and the right side of the tube supporting platform 2. The two material pipe transfer mechanisms 3 work alternately to form a good production beat.

In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and to simplify the description, but do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the present invention.

In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; may be mechanically connected, may be electrically connected or may be in communication with each other; they may be directly connected or indirectly connected through intervening media, or may be in communication within two elements or in interactive relationship between two elements. The specific meaning of the above terms in the present invention can be understood according to specific situations by those of ordinary skill in the art.

It is understood that equivalent substitutions or changes can be made by those skilled in the art according to the technical solution of the present invention and the inventive concept thereof, and all such changes or substitutions shall fall within the scope of the present invention.

Claims (10)

1. A semiconductor component feeding device is characterized by comprising a rack, a supporting pipe platform fixedly arranged on the rack, a material pipe transfer mechanism arranged beside the supporting pipe platform, a feeding track fixedly arranged in front of the rack and inclined downwards, a turning platform rotationally connected with the feeding track, a pipe pressing assembly arranged on the turning platform, and a pipe pushing mechanism arranged on the supporting pipe platform; the pipe transfer mechanism comprises a top plate arranged on the rack, a pipe storage assembly vertically arranged on the top plate, a sliding frame in sliding connection with the top plate, a pipe transfer support arm arranged on the sliding frame, and a sliding frame driving mechanism used for driving the sliding frame and the pipe transfer support arm to be close to or far away from the pipe supporting platform, wherein a plurality of vertically stacked pipes are stored on the pipe storage assembly; a pipe dropping gap is formed between the pipe supporting platform and the top plate, and an empty pipe bin is arranged below the pipe dropping gap.

2. The semiconductor component feeding device according to claim 1, wherein the tilting driving mechanism comprises a cylinder support fixed below the supporting tube platform, a tilting driving cylinder and a joint fixedly arranged on the tilting platform, the end of a piston rod of the tilting driving cylinder is connected with the joint through a pivot, and the end of a cylinder body of the tilting driving cylinder is hinged to the cylinder support.

3. The semiconductor component feeding device according to claim 1, wherein a support plate is arranged outside the tube storage assembly, and a knocking cylinder for knocking a tube body of the tube is arranged on the support plate.

4. A semiconductor component feeding device as claimed in claim 3, wherein the support plate is provided with a material tube limiting clamp, and the material tube limiting clamp is provided with a blowing head for blowing the inside of the material tube.

5. A semiconductor component feeding device according to claim 1, wherein the tube pushing mechanism includes a tube pushing cylinder, a push plate connected to an end of a piston rod of the tube pushing cylinder, and a push rod disposed on the push plate.

6. A semiconductor component feeding device as claimed in claim 5, wherein the push plate is provided with a transversely extending linear bearing, the push rod is slidably connected with the linear bearing, one end of the push rod is provided with a push rod block, the other end of the push rod is provided with a tube clamping sensing block, a tube clamping adjusting plate is arranged at the top of the push plate, a tube clamping sensor is arranged on the tube clamping adjusting plate, the push rod is sleeved with a spring, the spring is located between the push rod block and the linear bearing, and the tube clamping sensing block can trigger the tube clamping sensor.

7. The semiconductor component feeding device according to claim 1, wherein the tube moving support arm comprises a pad arranged on the carriage, a tube moving strip arranged on the pad, and a positioning notch formed in the tube moving strip, and an adjusting block is arranged in the positioning notch.

8. The semiconductor component feeding device according to claim 1, wherein the carriage is slidably connected to the bottom surface of the top plate through a guide rail and a slider, the carriage driving mechanism includes a carriage driving cylinder and a carriage block, and an end of a piston rod of the carriage driving cylinder is connected to the carriage through the carriage block.

9. A semiconductor component loading device as claimed in claim 1, wherein the tube storage assembly comprises a first tray, a first tube clamp vertically disposed on the first tray, a second tray, and a second tube clamp vertically disposed on the second tray.

10. A semiconductor component feeding device as claimed in any one of claims 1 to 9, wherein there are two tube transfer mechanisms, and the two tube transfer mechanisms are respectively and symmetrically disposed at left and right sides of the supporting platform.

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