CN218498068U - High-binding-force aluminum nitride copper-clad ceramic substrate - Google Patents
High-binding-force aluminum nitride copper-clad ceramic substrate Download PDFInfo
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- CN218498068U CN218498068U CN202222273081.5U CN202222273081U CN218498068U CN 218498068 U CN218498068 U CN 218498068U CN 202222273081 U CN202222273081 U CN 202222273081U CN 218498068 U CN218498068 U CN 218498068U
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Abstract
The utility model discloses a high-bonding-force aluminum nitride copper-clad ceramic substrate, which comprises a ceramic base layer and a metal dam; the ceramic base layer is made of aluminum nitride, a front bonding pad is formed on the upper surface of the ceramic base layer in a copper-clad mode, a back bonding pad is formed on the lower surface of the ceramic base layer in a copper-clad mode, and a through hole is formed in the ceramic base layer and connected between the front bonding pad and the back bonding pad; this ceramic substrate's upper surface is first frosting, this front pad shaping is on first frosting, ceramic substrate's lower surface is the second frosting, this back pad shaping is on the second frosting, through the upper and lower surface formation frosting at ceramic substrate, the anchor coat and each pad shaping respectively are on the frosting that corresponds, effectively improve the cohesion, the cooperation is provided with the groove of falling T simultaneously, the groove of falling T is filled to the anchor coat, thereby make metal box dam and ceramic substrate combine together firmly, avoid the metal box dam to appear droing more effectively, thereby prolong the life of product greatly.
Description
Technical Field
The utility model relates to a ceramic substrate field technique especially indicates a high cohesion aluminium nitride covers copper ceramic substrate.
Background
Along with the fact that the modularization degree of the power semiconductor device is higher and higher, the current capacity and the power density of a power semiconductor module are continuously improved, the power consumption of a unit area is greatly increased, and heat dissipation becomes a key problem of a high-power module. Although alumina ceramics, which is a traditional basic key material for module manufacturing, has excellent mechanical properties, high insulating strength and low price, the alumina ceramics have low thermal conductivity (20-30W/m.K) and large difference between linear expansion coefficient and silicon, and can not meet the requirements of high-power semiconductor modules.
The insulating property and the mechanical property of the aluminum nitride ceramic are not much different from those of aluminum oxide, but the thermal conductivity is about 7 times that of the aluminum oxide ceramic, and the linear expansion coefficient of the aluminum nitride ceramic is closer to that of silicon, so that the aluminum nitride ceramic can replace the traditional aluminum oxide ceramic substrate to be used as a basic key material of a high-power and high-integration module.
However, the wettability of the aluminum nitride ceramic and the metal layer is poor, so that the bonding force between the surface metal layer and the ceramic is poorer than that between the aluminum oxide (ceramic) and the metal layer, and after the semiconductor module works for a long time, the aluminum nitride ceramic and the metal layer are easily separated, so that the performance of the semiconductor module is greatly reduced and even fails.
At present, the method for solving the bonding force between the aluminum nitride ceramic substrate and the copper is to perform chemical roughening or laser etching roughening on the aluminum nitride ceramic substrate under certain conditions, so that the roughness of the surface of the aluminum nitride ceramic substrate is increased, an aluminum oxide thin layer is formed on the surface, the wettability of aluminum oxide and metal is good, the roughness of the surface of the substrate is increased, the wettability of the aluminum nitride ceramic substrate and the metal layer can be enhanced, and the bonding force between the aluminum nitride ceramic substrate and the metal layer is improved. However, by means of this method alone, the bonding force between the aluminum nitride ceramic substrate and the metal layer is still insufficient, and especially for the ceramic substrate with the metal dam, the risk of the metal dam falling off is still high. Therefore, there is a need for an improvement of the conventional aluminum nitride copper clad ceramic substrate.
SUMMERY OF THE UTILITY MODEL
In view of the above, the present invention provides a copper-clad aluminum nitride ceramic substrate with high bonding force, which can further improve the bonding force between the aluminum nitride ceramic substrate and the metal layer, and especially can effectively prevent the metal dam from falling off.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
a high-bonding-force aluminum nitride copper-clad ceramic substrate comprises a ceramic base layer and a metal dam; the ceramic base layer is made of aluminum nitride, a front bonding pad is formed by coating copper on the upper surface of the ceramic base layer, a back bonding pad is formed by coating copper on the lower surface of the ceramic base layer, and a via hole is formed in the ceramic base layer and connected between the front bonding pad and the back bonding pad; the metal dam is formed on the upper surface of the ceramic substrate and forms a packaging cavity in a surrounding mode, and the front bonding pad is located in the packaging cavity; this ceramic-based layer's upper surface is first frosted surface, this front pad shaping is on first frosted surface, ceramic-based layer's lower surface is the second frosted surface, this back pad shaping is on the second frosted surface, and, ceramic-based layer's upper surface is concave to be equipped with the groove of falling T-shaped, this metal box dam is including anchor coat and main part copper layer, this anchor coat shaping is on first frosted surface and fill the groove of falling T-shaped, the upper surface of anchor coat is the third frosted surface, this main part copper layer shaping is on the third frosted surface.
Preferably, the bonding layer is titanium metal, and is formed by sputtering.
As a preferred scheme, the packaging cavity is sealed by a packaging cover plate, an annular caulking groove is concavely arranged on the opening edge of the packaging cavity, the lower part of the packaging cover plate is embedded in the annular caulking groove, the peripheral bottom surface of the packaging cover plate and the annular caulking groove are fixed in a sealing mode through sealant, an annular space is formed between the outer side surface of the upper part of the packaging cover plate and the top surface of the metal dam, glass cement and waterproof materials are sequentially filled in the annular space from inside to outside, and the waterproof materials cover the glass cement.
Preferably, the inner edge of the annular caulking groove is upwards protruded to form a baffle ring.
As a preferred scheme, the bottom surface of the annular caulking groove is concavely provided with a plurality of first annular grooves which are arranged at intervals from inside to outside, the peripheral bottom surface of the packaging cover plate is concavely provided with a plurality of second annular grooves which are arranged at intervals from inside to outside, and the sealant is filled in the first annular grooves and the second annular grooves.
Preferably, the waterproof material is ultraviolet glue, and the waterproof material is coated in a range larger than that of the glass glue and completely covers the outer surface of the glass glue.
Preferably, the ultraviolet glue is acrylate.
Compared with the prior art, the utility model obvious advantage and beneficial effect have, particularly, can know by above-mentioned technical scheme:
through the frosting surface that forms at ceramic basic unit's upper and lower surface, the anchor coat and each pad shaping respectively on the frosting surface that corresponds, effectively improve the cohesion, the cooperation is provided with the inverted T-shaped groove simultaneously, and the inverted T-shaped groove is filled to the anchor coat to make metal box dam and ceramic basic unit combine together firmly, avoid the metal box dam to appear droing more effectively, thereby prolong the life of product greatly.
To illustrate the structural features and functions of the present invention more clearly, the present invention will be described in detail with reference to the accompanying drawings and specific embodiments.
Drawings
Fig. 1 is a cross-sectional view of a preferred embodiment of the present invention.
Description of the figures:
10. ceramic substrate 11, first frosted surface
12. Second frosted surface 13, inverted T-shaped groove
101. Packaging cavity 20 and metal dam
21. Bonding layer 22, bulk copper layer
201. Third frosting surface 202, annular caulking groove
203. Annular space 204, baffle ring
205. First annular groove 31, front side pad
32. Back pad 33, via hole
40. Package cover 41, second annular groove
51. Sealing glue 52 and glass glue
53. Water-repellent material 60, wafer.
Detailed Description
Referring to fig. 1, a specific structure of a preferred embodiment of the present invention is shown, which includes a ceramic substrate 10 and a metal dam 20.
The ceramic base layer 10 is made of aluminum nitride, a front pad 31 is formed on the upper surface of the ceramic base layer 10 by copper coating, a back pad 32 is formed on the lower surface of the ceramic base layer 10 by copper coating, a via hole 33 is arranged in the ceramic base layer 10, and the via hole 33 is connected between the front pad 31 and the back pad 32. In this embodiment, the upper surface of the ceramic base layer 10 is a first frosted surface 11, the front pad 31 is formed on the first frosted surface 11, the lower surface of the ceramic base layer 10 is a second frosted surface 12, the back pad 32 is formed on the second frosted surface 12, and the upper surface of the ceramic base layer 10 is concavely provided with inverted T-shaped grooves 13, and the inverted T-shaped grooves 13 are bilaterally symmetrical.
The metal dam 20 is formed on the upper surface of the ceramic substrate 10 and forms a packaging cavity 101, and the front surface pad is located in the packaging cavity; the metal dam 20 comprises a bonding layer 21 and a main copper layer 22, wherein the bonding layer 21 is formed on the first frosted surface 11 and fills the inverted T-shaped groove 13 to effectively enhance the bonding force between the metal dam 20 and the ceramic substrate 10, the upper surface of the bonding layer 21 is a third frosted surface 201, and the main copper layer 22 is formed on the third frosted surface 201, and in the embodiment, the bonding layer 21 is titanium metal and is formed by sputtering.
And the package cavity 101 is covered by the package cover plate 40, an annular caulking groove 202 is concavely arranged on the opening edge of the package cavity 101, the lower part of the package cover plate 40 is embedded in the annular caulking groove 202, the peripheral bottom surface of the package cover plate 40 and the annular caulking groove 202 are sealed and fixed through a sealant 51, an annular space 203 is formed between the outer side surface of the upper part of the package cover plate 40 and the top surface of the metal dam 20, the annular space 203 is filled with glass cement 52 and a waterproof material 53 from inside to outside in sequence, and the glass cement 52 is covered by the waterproof material 53. In addition, the inner edge of the annular groove 202 is protruded upward to form a stop ring 204 to stop the sealant 51 and prevent the sealant 51 from flowing into the package cavity 101. In addition, the bottom surface of the annular caulking groove 202 is concavely provided with a plurality of first annular grooves 205, the plurality of first annular grooves 205 are arranged at intervals from inside to outside, the peripheral bottom surface of the encapsulation cover plate 40 is concavely provided with a plurality of second annular grooves 41, the plurality of second annular grooves 41 are arranged at intervals from inside to outside, and the sealant 51 is filled with the plurality of first annular grooves 205 and the plurality of second annular grooves 41, so as to realize better waterproof sealing effect. The waterproof material 53 is ultraviolet glue, the coating range of the waterproof material 53 is larger than that of the glass glue 52, the outer surface of the glass glue 52 is completely covered, and the ultraviolet glue is acrylate so as to achieve a better waterproof packaging effect.
During packaging, firstly, the wafer 60 is placed in the packaging cavity 101 and is fixed against the front surface bonding pad 31, and then the wafer 60 is welded and conducted with the corresponding front surface bonding pad 31; then, the sealing glue 51 is injected into the annular caulking groove 202, then the packaging cover plate 40 is embedded into the annular caulking groove 202 from top to bottom, after the packaging cover plate is embedded in place, the glass glue 52 and the waterproof material 53 are sequentially filled into the annular space 203 from inside to outside, and the sealing glue 51, the glass glue 52 and the waterproof material 53 which are arranged in a matched mode realize multiple waterproof sealing fixation, so that the product structure is more stable, and the waterproof effect is more ideal.
The utility model discloses a design focus lies in: through the frosting surface that forms at ceramic basic unit's upper and lower surface, the anchor coat and each pad shaping respectively on the frosting surface that corresponds, effectively improve the cohesion, the cooperation is provided with the inverted T-shaped groove simultaneously, and the inverted T-shaped groove is filled to the anchor coat to make metal box dam and ceramic basic unit combine together firmly, avoid the metal box dam to appear droing more effectively, thereby prolong the life of product greatly.
The above description is only a preferred embodiment of the present invention, and is not intended to limit the technical scope of the present invention, so that any slight modifications, equivalent changes and modifications made by the technical spirit of the present invention to the above embodiments are all within the scope of the technical solution of the present invention.
Claims (7)
1. A high-bonding-force aluminum nitride copper-clad ceramic substrate comprises a ceramic base layer and a metal dam; the ceramic base layer is made of aluminum nitride, a front bonding pad is formed on the upper surface of the ceramic base layer in a copper-clad mode, a back bonding pad is formed on the lower surface of the ceramic base layer in a copper-clad mode, and a through hole is formed in the ceramic base layer and connected between the front bonding pad and the back bonding pad; the metal dam is formed on the upper surface of the ceramic substrate and forms a packaging cavity in a surrounding mode, and the front bonding pad is located in the packaging cavity; the method is characterized in that: the upper surface of this ceramic-based layer is first frosted surface, this front pad shaping is on first frosted surface, ceramic-based layer's lower surface is the second frosted surface, this back pad shaping is on the second frosted surface, and, ceramic-based layer's upper surface is concave to be equipped with the groove of falling T-slot, this metal box dam is including anchor coat and main part copper layer, this anchor coat shaping is on first frosted surface and fill the groove of falling T-slot, the upper surface of anchor coat is the third frosted surface, the shaping of this main part copper layer is on the third frosted surface.
2. The high-bonding-force aluminum nitride copper-clad ceramic substrate according to claim 1, wherein: the bonding layer is titanium metal and is formed by sputtering.
3. The high-bonding-force aluminum nitride copper-clad ceramic substrate according to claim 1, wherein: the encapsulation cavity is sealed by the encapsulation apron and is covered, and the opening edge of this encapsulation cavity is concave to be equipped with the annular caulking groove, and the lower part of this encapsulation apron inlays in the annular caulking groove, seals through sealed glue between the peripheral bottom surface of encapsulation apron and the annular caulking groove and fixes, is formed with annular space between the upper portion lateral surface of this encapsulation apron and the top surface of metal box dam, has glass glue and waterproof material by inside to outside packing in proper order in this annular space, and this waterproof material covers glass and glues.
4. The high-bonding-force aluminum nitride copper-clad ceramic substrate according to claim 3, wherein: the edge of the inner side edge of the annular caulking groove protrudes upwards to form a retaining ring.
5. The high-bonding-force aluminum nitride copper-clad ceramic substrate according to claim 3, wherein: the concave a plurality of first annular grooves that are equipped with in bottom surface of annular caulking groove, these a plurality of first annular grooves are by interior toward outer interval setting, the concave a plurality of second annular grooves that are equipped with in the periphery bottom surface of this encapsulation apron, these a plurality of second annular grooves are by interior toward outer interval setting, a plurality of first annular grooves and a plurality of second annular grooves of filling of aforementioned sealed glue.
6. The high-bonding-force aluminum nitride copper-clad ceramic substrate according to claim 3, wherein: the waterproof material is ultraviolet glue, the coating range of the waterproof material is larger than that of the glass glue, and the waterproof material completely covers the outer surface of the glass glue.
7. The high-bonding-force aluminum nitride copper-clad ceramic substrate according to claim 6, wherein: the ultraviolet glue is acrylate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222273081.5U CN218498068U (en) | 2022-08-29 | 2022-08-29 | High-binding-force aluminum nitride copper-clad ceramic substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222273081.5U CN218498068U (en) | 2022-08-29 | 2022-08-29 | High-binding-force aluminum nitride copper-clad ceramic substrate |
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| Publication Number | Publication Date |
|---|---|
| CN218498068U true CN218498068U (en) | 2023-02-17 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202222273081.5U Active CN218498068U (en) | 2022-08-29 | 2022-08-29 | High-binding-force aluminum nitride copper-clad ceramic substrate |
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| Country | Link |
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| CN (1) | CN218498068U (en) |
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- 2022-08-29 CN CN202222273081.5U patent/CN218498068U/en active Active
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