CN221041162U - LED encapsulation support with high temperature resistant coating - Google Patents
LED encapsulation support with high temperature resistant coating Download PDFInfo
- Publication number
- CN221041162U CN221041162U CN202322487164.9U CN202322487164U CN221041162U CN 221041162 U CN221041162 U CN 221041162U CN 202322487164 U CN202322487164 U CN 202322487164U CN 221041162 U CN221041162 U CN 221041162U
- Authority
- CN
- China
- Prior art keywords
- resistant coating
- side wall
- temperature
- high temperature
- temperature resistant
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000000576 coating method Methods 0.000 title claims abstract description 93
- 239000011248 coating agent Substances 0.000 title claims abstract description 92
- 238000005538 encapsulation Methods 0.000 title claims description 11
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 11
- 238000007789 sealing Methods 0.000 claims description 11
- 239000000741 silica gel Substances 0.000 claims description 7
- 229910002027 silica gel Inorganic materials 0.000 claims description 7
- 230000007704 transition Effects 0.000 claims description 3
- 239000000377 silicon dioxide Substances 0.000 claims description 2
- 238000004806 packaging method and process Methods 0.000 abstract description 32
- 238000009825 accumulation Methods 0.000 abstract description 2
- 239000010410 layer Substances 0.000 description 10
- 239000000853 adhesive Substances 0.000 description 9
- 230000001070 adhesive effect Effects 0.000 description 9
- 239000011247 coating layer Substances 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000003344 environmental pollutant Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 231100000719 pollutant Toxicity 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000004227 thermal cracking Methods 0.000 description 1
Landscapes
- Packaging Frangible Articles (AREA)
Abstract
The utility model discloses an LED packaging support with a high-temperature-resistant coating, which relates to the technical field of LED packaging and comprises a packaging shell, a lamp groove arranged in the packaging shell and used for accommodating an LED wafer, and an electrode layer arranged at the bottom of the lamp groove, wherein the side wall of the lamp groove is divided into an upper side wall and a lower side wall, the upper side wall is provided with a first high-temperature-resistant coating, the lower side wall is provided with a second high-temperature-resistant coating, and the heat resistance coefficient of the first high-temperature-resistant coating is lower than that of the second high-temperature-resistant coating. According to the LED packaging shell, the first high-temperature-resistant coating is arranged on the upper side wall of the lamp groove, and the second high-temperature-resistant coating with the heat resistance coefficient higher than that of the first high-temperature-resistant coating is arranged on the lower side wall of the lamp groove, so that the influence of heat accumulation of the LED wafer on the packaging shell can be effectively avoided, and the reliability of the packaging shell is improved.
Description
Technical Field
The utility model relates to the technical field of LED packaging, in particular to an LED packaging support with a high-temperature-resistant coating.
Background
The LED mainly comprises an LED wafer, an LED packaging shell, an electrode layer and the like, wherein the LED wafer is a main raw material of the LED, and generates light by exciting a semiconductor material through current, and part of electric energy can be converted into heat energy in the photoelectric conversion process, so that the LED wafer emits light and generates certain heat. At present, an LED packaging shell is usually formed by injection molding of an epoxy resin material, an LED wafer is sealed in the LED packaging shell through packaging glue, when heat generated by the LED wafer is accumulated in the LED packaging shell, the temperature inside the LED packaging shell is increased, and the physical property of the epoxy resin is changed, so that the LED packaging shell is deformed or broken; while also potentially affecting the reliability of the LED package and the performance of the LED die.
Disclosure of Invention
The utility model provides an LED packaging support with a high-temperature-resistant coating, and mainly aims to solve the problems in the prior art.
The utility model adopts the following technical scheme:
The utility model provides a LED encapsulation support with high temperature resistant coating, includes the encapsulation shell, locates the lamp groove that is used for holding the LED wafer in the encapsulation shell and locates the electrode layer of lamp groove bottom, the lamp groove lateral wall divide into lateral wall and lower lateral wall, the lateral wall is equipped with first high temperature resistant coating, the lateral wall is equipped with the high temperature resistant coating of second down, the coefficient of heat resistance of first high temperature resistant coating is less than the coefficient of heat resistance of high temperature resistant coating of second.
Further, the surface connection part of the first high-temperature-resistant coating and the second high-temperature-resistant coating is in a step shape.
Further, the surface connection part of the upper side wall and the lower side wall is in a step shape, and the thickness of the first high-temperature-resistant coating is the same as that of the second high-temperature-resistant coating.
Further, the surfaces of the upper side wall and the lower side wall are mutually connected to form a smooth transition plane; the thickness of the first high temperature resistant coating is smaller than that of the second high temperature resistant coating.
Further, the surfaces of the upper side wall and the lower side wall are in a horn shape which gradually expands from bottom to top.
Further, a concave part is arranged at the top end of the upper side wall, the first high-temperature-resistant coating is arranged below the concave part, and the joint of the first high-temperature-resistant coating and the concave part is in a step shape.
Further, the upper side wall and the lower side wall are both provided with at least one concave hole, and the first high-temperature-resistant coating and the second high-temperature-resistant coating are both provided with protrusions matched with the concave holes.
Further, each concave hole is a vertical hole extending from top to bottom.
Further, the bottom edge of the lower side wall is provided with sealing silica gel which is abutted to the electrode layer, and the second high-temperature-resistant coating is provided with a yielding concave part for avoiding the sealing silica strip.
Compared with the prior art, the utility model has the beneficial effects that:
1. According to the LED packaging shell, the first high-temperature-resistant coating is arranged on the upper side wall of the lamp groove, and the second high-temperature-resistant coating with the heat resistance coefficient higher than that of the first high-temperature-resistant coating is arranged on the lower side wall of the lamp groove, so that the influence of heat accumulation of the LED wafer on the packaging shell can be effectively avoided, and the reliability of the packaging shell is improved.
2. According to the utility model, the surface connection part of the first high-temperature-resistant coating and the second high-temperature-resistant coating is in a step shape, so that the packaging adhesive can be better attached to the first high-temperature-resistant coating and the second high-temperature-resistant coating, and the phenomenon that impurities enter a lamp groove due to the fact that the packaging adhesive is not tightly attached can be avoided.
3. According to the utility model, the sealing silicon strip abutted against the electrode layer is arranged at the bottom edge of the lower side wall, so that looseness and cracks between the packaging shell and the electrode layer are prevented, and the air tightness of the LED packaging is enhanced.
Drawings
Fig. 1 is a schematic diagram of a package carrier according to a first embodiment of the present utility model.
Fig. 2 is a schematic diagram of a package carrier according to a second embodiment of the present utility model.
In the figure: 1-packaging a shell; 11-upper sidewalls; 12-lower side walls; 13-a recess; 14-concave holes; 15-sealing silica gel; 2-electrode layers; 3-a first high temperature resistant coating; 4-a second high temperature resistant coating.
Detailed Description
Specific embodiments of the present utility model will be described below with reference to the accompanying drawings. Numerous details are set forth in the following description in order to provide a thorough understanding of the present utility model, but it will be apparent to one skilled in the art that the present utility model may be practiced without these details.
Embodiment one:
referring to fig. 1, an LED package support with a high temperature resistant coating layer includes a package shell 1, a lamp groove disposed in the package shell 1 for accommodating an LED chip, and an electrode layer 2 disposed at the bottom of the lamp groove, wherein the side wall of the lamp groove is divided into an upper side wall 11 and a lower side wall 12, the upper side wall 11 is provided with a first high temperature resistant coating layer 3, the lower side wall 12 is provided with a second high temperature resistant coating layer 4, and the heat resistance coefficient of the first high temperature resistant coating layer 3 is lower than that of the second high temperature resistant coating layer 4. The high-temperature-resistant coating provided by the utility model can provide good heat insulation protection for the packaging shell 1, and reduce the risk of the thermal cracking of the packaging shell 1, thereby improving the reliability of the packaging shell 1 and prolonging the service life of the LED wafer. Since the heat in the package 1 is mainly concentrated at the bottom of the lamp groove, the embodiment sets the heat resistance coefficient of the second high temperature resistant coating 4 to be higher, so that the heat resistant capability is stronger.
Referring to fig. 1, the surface connection of the first high temperature resistant coating 3 and the second high temperature resistant coating 4 is in a step shape, so that the connection tightness of the encapsulation adhesive, the first high temperature resistant coating 3 and the second high temperature resistant coating 4 can be enhanced, the peeling of the encapsulation adhesive is avoided, and the probability of entering the encapsulation shell 1 by pollutants is reduced. Specifically, the surface connection of the upper sidewall 11 and the lower sidewall 12 is stepped, and the thickness of the first high temperature resistant coating 3 is the same as the thickness of the second high temperature resistant coating 4, so that the surface connection of the first high temperature resistant coating 3 and the second high temperature resistant coating 4 can be stepped in an ideal manner.
Referring to fig. 1, the surfaces of the upper sidewall 11 and the lower sidewall 12 are each in a horn shape that gradually expands from bottom to top, so that the first refractory coating 3 coated on the upper sidewall 11 and the second refractory coating 4 coated on the lower sidewall 12 are also in a horn shape that gradually expands from bottom to top. This gradually expanding horn-like structure helps to spread the light evenly out when the LED chip emits light.
Referring to fig. 1, a recess 13 is formed at the top end of the upper sidewall 11, the first high temperature resistant coating 3 is disposed below the recess 13, and a connection portion between the first high temperature resistant coating 3 and the recess 13 is stepped. The contact area of the packaging adhesive and the lamp groove is further increased by the design, so that the adhesive force of the packaging adhesive is increased, and the packaging adhesive is more tightly attached.
Referring to fig. 1, the upper side wall 11 and the lower side wall 12 are provided with at least one concave hole 14, and the first high temperature resistant coating 3 and the second high temperature resistant coating 4 are provided with protrusions matched with the concave holes 14. Through the cooperation of shrinkage pool 14 and arch, can effectively strengthen the connection compactness between first high temperature resistant coating 3 and the upper sidewall 11, between second high temperature resistant coating 4 and the lower sidewall 12, avoid appearing first high temperature resistant coating 3 and the phenomenon that second high temperature resistant coating 4 drops.
Referring to fig. 1, each recess 14 is a vertical hole extending from top to bottom. Specifically, the package 1 is injection molded on the electrode layer 2, and in order to prevent deformation of the package 1 caused by difficulty in demolding, the concave holes are arranged as vertical holes extending from top to bottom, so that the demolding process is easier and quicker, and the production efficiency is improved.
Referring to fig. 1, the bottom edge of the lower sidewall 12 is provided with a sealing silica gel 15 abutting against the electrode layer 2, and the second high temperature resistant coating 4 is provided with a relief recess for avoiding the sealing silica gel 15. Specifically, since the package shell 1 is injection molded on the electrode layer 2, the package shell 1 may be loosened under the action of external force, and gaps appear, which finally affect the air tightness of the LED package, the sealing silica gel 15 provided by the utility model can effectively avoid the phenomenon, and the design of the sealing silica gel 15 is beneficial to the reliability and the sealing performance of the LED package, thereby ensuring the long-term reliable and stable operation of the LED chip.
Embodiment two:
Referring to fig. 2, unlike the first embodiment, the surfaces of the upper sidewall 11 and the lower sidewall 12 in the present embodiment are joined to each other to form a smooth transition plane, and the thickness of the first high temperature resistant coating 3 is smaller than that of the second high temperature resistant coating 4, so that the junction of the surfaces of the first high temperature resistant coating 3 and the second high temperature resistant coating 4 may have a desired step shape. Specifically, the surfaces of the upper side wall 11 and the lower side wall 12 in the embodiment are mutually connected to form a flat inner side wall, so that the manufacturing process of the package shell 1 is effectively simplified, and the complexity and cost of production are reduced; the thickness of the first high temperature resistant coating 3 is smaller than that of the second high temperature resistant coating 4, so that the joint of the first high temperature resistant coating and the second high temperature resistant coating is stepped, and the bonding performance of the packaging adhesive is improved.
The first high temperature resistant coating 3 and the second high temperature resistant coating 4 in the first embodiment and the second embodiment of the present utility model are both high temperature resistant coatings made of materials such as heat conductive silicone grease.
The foregoing is merely illustrative of specific embodiments of the present utility model, but the design concept of the present utility model is not limited thereto, and any insubstantial modification of the present utility model by using the design concept shall fall within the scope of the present utility model.
Claims (9)
1. The utility model provides a LED encapsulation support with high temperature resistant coating, includes the encapsulation shell, locates the lamp groove that is used for holding the LED wafer in the encapsulation shell and locates the electrode layer of lamp groove bottom, its characterized in that: the side wall of the lamp slot is divided into an upper side wall and a lower side wall, the upper side wall is provided with a first high-temperature-resistant coating, the lower side wall is provided with a second high-temperature-resistant coating, and the heat resistance coefficient of the first high-temperature-resistant coating is lower than that of the second high-temperature-resistant coating.
2. An LED package support with a high temperature resistant coating as set forth in claim 1, wherein: the surface connection part of the first high-temperature-resistant coating and the second high-temperature-resistant coating is in a step shape.
3. An LED package support with a high temperature resistant coating as set forth in claim 2, wherein: the surface connection part of the upper side wall and the lower side wall is in a step shape, and the thickness of the first high-temperature-resistant coating is the same as that of the second high-temperature-resistant coating.
4. An LED package support with a high temperature resistant coating as set forth in claim 2, wherein: the surfaces of the upper side wall and the lower side wall are mutually connected to form a smooth transition plane; the thickness of the first high temperature resistant coating is smaller than that of the second high temperature resistant coating.
5. An LED package support with a high temperature resistant coating as claimed in claim 3 or 4, wherein: the surfaces of the upper side wall and the lower side wall are in a horn shape which gradually expands from bottom to top.
6. An LED package support with a high temperature resistant coating as set forth in claim 1, wherein: the top end of the upper side wall is provided with a concave part, the first high-temperature-resistant coating is arranged below the concave part, and the joint of the first high-temperature-resistant coating and the concave part is in a step shape.
7. An LED package support with a high temperature resistant coating as set forth in claim 1, wherein: the upper side wall and the lower side wall are both provided with at least one concave hole, and the first high-temperature-resistant coating and the second high-temperature-resistant coating are both provided with protrusions matched with the concave holes.
8. An LED package support with a high temperature resistant coating as recited in claim 7, wherein: each concave hole is a vertical hole extending from top to bottom.
9. An LED package support with a high temperature resistant coating as set forth in claim 1, wherein: the bottom edge of the lower side wall is provided with sealing silica gel which is abutted to the electrode layer, and the second high-temperature-resistant coating is provided with a yielding concave part for avoiding the sealing silica strip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322487164.9U CN221041162U (en) | 2023-09-13 | 2023-09-13 | LED encapsulation support with high temperature resistant coating |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322487164.9U CN221041162U (en) | 2023-09-13 | 2023-09-13 | LED encapsulation support with high temperature resistant coating |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN221041162U true CN221041162U (en) | 2024-05-28 |
Family
ID=91177518
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322487164.9U Active CN221041162U (en) | 2023-09-13 | 2023-09-13 | LED encapsulation support with high temperature resistant coating |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN221041162U (en) |
-
2023
- 2023-09-13 CN CN202322487164.9U patent/CN221041162U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US7737463B2 (en) | Light emitting diode package with a heat sink support ring and having multiple molding resins, wherein secondary molding resin with higher hardness than primary molding resin and which covers primary molding resin that covers LED die | |
| KR100998233B1 (en) | Slim led package | |
| US8399902B2 (en) | Light emitting device and method of manufacturing light emitting device | |
| CN108054254B (en) | Semiconductor light emitting structure and semiconductor packaging structure | |
| KR20090075354A (en) | Metal substrate, method of making the substrate, and smd type led package using the substrate | |
| CN104425399A (en) | Semiconductor module | |
| CN104064662A (en) | Light-emitting-diode packaging structure | |
| CN221041162U (en) | LED encapsulation support with high temperature resistant coating | |
| CN101546737B (en) | Package structure of compound semiconductor component and manufacturing method thereof | |
| CN104103734A (en) | Light-emitting diode packaging structure | |
| TWI425676B (en) | Structure of the semiconductir package | |
| CN107785475B (en) | Light-emitting device composite substrate and LED module with same | |
| CN103427007A (en) | Light emitting diode and method for packaging light emitting diode | |
| TW201403893A (en) | Light-emitting diode and manufacturing method thereof | |
| CN220774409U (en) | Novel LED packaging shell | |
| CN218498068U (en) | High-binding-force aluminum nitride copper-clad ceramic substrate | |
| TWI395314B (en) | Chip lead frame and photoelectric energy transducing module | |
| CN218788374U (en) | Semiconductor packaging shell and semiconductor packaging structure | |
| KR100621743B1 (en) | Light emitting diode package employing a heat-sinking body and method of fabricating the same | |
| CN217641388U (en) | Anti-permeation LED support structure | |
| CN216597627U (en) | Dam buckle formula packaging structure | |
| CN218277264U (en) | Embedded heat dissipation type ceramic substrate | |
| CN220272478U (en) | Antistatic LED light source processing device and antistatic LED light source device | |
| CN221304722U (en) | Packaging structure capable of avoiding wire arc deformation | |
| TWI415307B (en) | Method for manufacturing led package structure |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |