CN220774409U - Novel LED packaging shell - Google Patents
Novel LED packaging shell Download PDFInfo
- Publication number
- CN220774409U CN220774409U CN202322487163.4U CN202322487163U CN220774409U CN 220774409 U CN220774409 U CN 220774409U CN 202322487163 U CN202322487163 U CN 202322487163U CN 220774409 U CN220774409 U CN 220774409U
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- insulation layer
- heat insulation
- heat
- groove body
- novel led
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- 238000004806 packaging method and process Methods 0.000 title abstract description 34
- 238000009413 insulation Methods 0.000 claims abstract description 73
- 238000005538 encapsulation Methods 0.000 claims description 6
- 238000002347 injection Methods 0.000 claims description 5
- 239000007924 injection Substances 0.000 claims description 5
- 238000001746 injection moulding Methods 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 abstract description 6
- 230000000694 effects Effects 0.000 abstract description 5
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000002708 enhancing effect Effects 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 230000002349 favourable effect Effects 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
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- Packaging Frangible Articles (AREA)
Abstract
The utility model discloses a novel LED packaging shell, which relates to the technical field of LED packaging and comprises a packaging shell, a lamp groove arranged in the packaging shell and used for accommodating an LED wafer, and an electrode layer arranged at the bottom of the lamp groove, wherein a first heat insulation layer and a second heat insulation layer are arranged on the side wall of the lamp groove, the second heat insulation layer is arranged on the outer surface of the first heat insulation layer, and the heat resistance coefficient of the second heat insulation layer is higher than that of the first heat insulation layer. The first heat insulation layer and the second heat insulation layer are arranged in the lamp groove, so that heat generated during operation of the LED wafer can be isolated, and the reliability of the packaging shell is further improved. Meanwhile, by arranging two heat-insulating layers with different heat-resistant coefficients and arranging the second heat-insulating layer with higher heat-resistant coefficient on the outer surface of the first heat-insulating layer with lower heat-resistant coefficient, the heat-insulating effect is ensured, and the production cost is reduced.
Description
Technical Field
The utility model relates to the technical field of LED packaging, in particular to a novel LED packaging shell.
Background
The patch type LED mainly comprises an LED wafer, an LED packaging shell, an electrode layer and the like, wherein the LED wafer is sealed in the LED packaging shell through packaging glue and reliably and stably operates in the LED packaging shell. The conventional patch type LED is mainly applied to an electronic integrated screen, an LED display screen and the like, and an LED wafer generally generates certain heat under long-time operation, if the high temperature resistance of an LED packaging shell is poor, the LED packaging shell can be deformed or broken, the reliability of LED packaging and the performance of the LED wafer are further affected, and finally, the visual effect of the electronic screen can be greatly affected.
Disclosure of Invention
The utility model provides a novel LED packaging shell, which mainly aims to solve the problems existing in the prior art.
The utility model adopts the following technical scheme:
the utility model provides a novel LED encapsulation shell, includes the encapsulation shell, locates the lamp groove that is used for holding the LED wafer in the encapsulation shell and locates the electrode layer of lamp groove bottom, the lamp groove lateral wall is equipped with first insulating layer and second insulating layer, the second insulating layer is located the surface of first insulating layer, just the coefficient of heat resistance of second insulating layer is higher than the coefficient of heat resistance of first insulating layer.
Further, the lamp groove comprises an upper groove body and a lower groove body, wherein the groove bottom width of the upper groove body is smaller than the groove opening width of the lower groove body; the side wall of the upper groove body is provided with the first heat insulation layer and the second heat insulation layer.
Further, the outer surface of the second heat insulation layer and the side wall of the lower groove body are mutually flush.
Further, the notch of the lower groove body horizontally extends from the bottom of the upper groove body to the outer surface of the second heat insulation layer, or the notch of the lower groove body obliquely extends downwards from the bottom of the upper groove body to the outer surface of the second heat insulation layer.
Further, the upper groove body is of a horn-shaped structure which gradually contracts from top to bottom.
Further, the height of the upper groove body is larger than that of the lower groove body.
Further, the outer surfaces of the first heat insulation layer and the second heat insulation layer are saw-tooth-shaped.
Furthermore, the first heat insulation layer and the second heat insulation layer are both formed by injection molding, and the serrated tooth wing direction is formed by extending vertically upwards from the bottom of the lamp groove, so that the demolding of the injection mold is facilitated.
Further, the side wall of the lamp slot is provided with at least one annular groove, and the first heat insulation layer is provided with a boss matched with the annular groove.
Further, the groove cavity of the annular groove is of a structure extending from top to bottom.
Compared with the prior art, the utility model has the beneficial effects that:
1. the first heat insulation layer and the second heat insulation layer are arranged in the lamp groove, so that heat generated during operation of the LED wafer can be isolated, and the reliability of the packaging shell is further improved. Meanwhile, by arranging two heat-insulating layers with different heat-resistant coefficients and arranging the second heat-insulating layer with higher heat-resistant coefficient on the outer surface of the first heat-insulating layer with lower heat-resistant coefficient, the heat-insulating effect is ensured, and the production cost is reduced.
2. According to the utility model, the bottom width of the upper groove body is smaller than the width of the notch of the lower groove body, the first heat insulation layer and the second heat insulation layer are arranged on the side wall of the upper groove body, the outer surface of the second heat insulation layer is flush with the side wall of the lower groove body, namely, the first heat insulation layer and the second heat insulation layer replace part of the packaging shell, so that the packaging shell has a heat insulation effect, and meanwhile, the manufacturing cost of the packaging shell is reduced.
3. The outer surface of the first heat insulation layer is in a zigzag shape, so that the second heat insulation layer can be effectively attached to the outer surface of the first heat insulation layer more closely, and the second heat insulation layer is prevented from falling off; the outer surface of the second heat insulation layer is in a sawtooth shape, so that the second heat insulation layer can be ensured to be more tightly connected with the packaging adhesive, and impurities are prevented from entering the packaging shell due to gaps between the second heat insulation layer and the packaging adhesive.
Drawings
Fig. 1 is a schematic diagram of a package structure according to a first embodiment of the present utility model.
Fig. 2 is a schematic diagram of a package structure according to a second embodiment of the present utility model.
In the figure: 1-packaging a shell; 11-an upper groove body; 12-a lower groove body; 13-a relief recess; 14-an annular groove; 2-electrode layers; 3-a first insulating layer; 4-a second insulating layer.
Detailed Description
Specific embodiments of the present utility model will be described below with reference to the accompanying drawings. Numerous details are set forth in the following description in order to provide a thorough understanding of the present utility model, but it will be apparent to one skilled in the art that the present utility model may be practiced without these details.
Embodiment one:
referring to fig. 1, a novel LED package includes a package case 1, a lamp socket disposed in the package case 1 for accommodating an LED chip, and an electrode layer 2 disposed at the bottom of the lamp socket, wherein a first heat insulation layer 3 and a second heat insulation layer 4 are disposed on a side wall of the lamp socket, the second heat insulation layer 4 is disposed on an outer surface of the first heat insulation layer 3, and a heat resistance coefficient of the second heat insulation layer 4 is higher than that of the first heat insulation layer 3. Through set up first insulating layer 3 and second insulating layer 4 in the light trough, and the higher second insulating layer 4 of coefficient of heat resistance locates outermost to play the effect of isolated heat, effectively ensured the long-term reliable steady operation of LED wafer.
Referring to fig. 1, the lamp trough includes an upper trough body 11 and a lower trough body 12, the trough bottom width of the upper trough body 11 is smaller than the trough opening width of the lower trough body 12, and the side wall of the upper trough body 11 is provided with a first heat insulation layer 3 and a second heat insulation layer 4. Most of the packaging shells 1 are made of epoxy resin materials at present, and high-quality epoxy resin materials are generally expensive, so that the first heat insulation layer 3 and the second heat insulation layer 4 are used for replacing a part of the packaging shells 1, the epoxy resin materials required for manufacturing the packaging shells 1 can be effectively reduced, and the manufacturing cost of the packaging shells 1 is reduced while the packaging shells 1 have heat insulation effects. Further, if the outer surface of the second insulating layer 4 extends out of the side wall of the lower tank body 12, a dead angle may be formed between the portion of the second insulating layer 4 extending out of the side wall of the lower tank body 12 and the side wall of the lower tank body 12, so that the packaging glue cannot be filled, and therefore, in the present utility model, the outer surface of the second insulating layer 4 and the side wall of the lower tank body 12 are flush with each other.
Referring to fig. 1, the notch of the lower tank body 12 horizontally extends from the bottom of the upper tank body 11 to the outer surface of the second heat insulation layer 4, so that a yielding concave portion 13 is formed at the junction of the surfaces of the upper tank body 11 and the lower tank body 12, and the first heat insulation layer 3 and the second heat insulation layer 4 are arranged in the yielding concave portion 13, so that the heat insulation layer is better embedded with the inner wall of the lamp groove into a whole.
Referring to fig. 1, the upper tank 11 has a horn-like structure gradually shrinking from top to bottom; and the height of the upper tank 11 is greater than that of the lower tank 12. The lamp groove is in a horn shape with the upper part wide and the lower part narrow, so that the whole lamp groove can be effectively filled with the packaging adhesive, and meanwhile, the LED chip light guiding device can also play a role in guiding the LED chip light, and the LED chip light is uniformly diffused outwards.
Referring to fig. 1, the outer surfaces of the first and second insulation layers 3 and 4 are serrated. The zigzag outer surface of the first heat insulation layer 3 is beneficial to enhancing the connection tightness between the first heat insulation layer 3 and the second heat insulation layer 4, and the zigzag outer surface of the second heat insulation layer 4 is beneficial to enhancing the connection tightness between the second heat insulation layer 4 and the packaging adhesive.
Referring to fig. 1, the first heat insulating layer 3 and the second heat insulating layer 4 are both injection molded, so that the zigzag tooth wing direction extends vertically upwards from the bottom of the lamp slot, thereby facilitating the demolding of the injection mold.
Referring to fig. 1, the side wall of the lamp groove is provided with at least one annular groove 14, and the first heat insulation layer 3 is provided with a boss matched with the annular groove 14. Through the cooperation of annular groove 14 and boss, increased the area of contact of first insulating layer 3 and light trough lateral wall, be favorable to strengthening the laminating degree of first insulating layer 3 and light trough lateral wall. Further, the groove cavity of the annular groove 14 has a structure extending from top to bottom. In the utility model, the packaging shell 1 is injection-molded on the electrode layer 2, so that the groove cavity of the annular groove 14 is arranged to be of a structure extending from top to bottom, the demolding difficulty of an injection mold can be reduced, and the production is facilitated.
Embodiment two:
referring to fig. 2, unlike the first embodiment, the notch of the lower groove body 12 in this embodiment extends obliquely downward from the bottom of the upper groove body 11 to the outer surface of the second heat insulation layer 4, so that the outer surface of the second heat insulation layer 4 may extend to the bottom of the lamp groove, and better plays a role in protecting the package shell 1.
The first insulating layer 3 and the second insulating layer 4 in the first embodiment and the second embodiment of the present utility model are made of a material such as heat conductive silicone grease.
The foregoing is merely illustrative of specific embodiments of the present utility model, but the design concept of the present utility model is not limited thereto, and any insubstantial modification of the present utility model by using the design concept shall fall within the scope of the present utility model.
Claims (10)
1. The utility model provides a novel LED encapsulation shell, includes the encapsulation shell, locates the lamp groove that is used for holding the LED wafer in the encapsulation shell and locates the electrode layer of lamp groove bottom, its characterized in that: the side wall of the lamp slot is provided with a first heat insulation layer and a second heat insulation layer, the second heat insulation layer is arranged on the outer surface of the first heat insulation layer, and the heat resistance coefficient of the second heat insulation layer is higher than that of the first heat insulation layer.
2. The novel LED package of claim 1, wherein: the lamp groove comprises an upper groove body and a lower groove body, and the groove bottom width of the upper groove body is smaller than the groove opening width of the lower groove body; the side wall of the upper groove body is provided with the first heat insulation layer and the second heat insulation layer.
3. The novel LED package of claim 2, wherein: the outer surface of the second heat insulation layer is flush with the side wall of the lower groove body.
4. A novel LED package as set forth in claim 3, wherein: the notch of the lower groove body horizontally extends to the outer surface of the second heat insulation layer from the bottom of the upper groove body, or the notch of the lower groove body obliquely extends downwards to the outer surface of the second heat insulation layer from the bottom of the upper groove body.
5. The novel LED package of claim 2, wherein: the upper groove body is of a horn-shaped structure which gradually contracts from top to bottom.
6. The novel LED package of claim 2, wherein: the height of the upper groove body is larger than that of the lower groove body.
7. The novel LED package of claim 1, wherein: the outer surfaces of the first heat insulation layer and the second heat insulation layer are saw-tooth-shaped.
8. The novel LED package of claim 7, wherein: the first heat insulation layer and the second heat insulation layer are both formed by injection molding, and the serrated tooth wing direction is formed by extending vertically upwards from the bottom of the lamp trough, so that the demolding of the injection mold is facilitated.
9. The novel LED package of claim 1, wherein: the side wall of the lamp slot is provided with at least one annular groove, and the first heat insulation layer is provided with a boss matched with the annular groove.
10. The novel LED package of claim 9, wherein: the groove cavity of the annular groove is of a structure extending from top to bottom.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322487163.4U CN220774409U (en) | 2023-09-13 | 2023-09-13 | Novel LED packaging shell |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322487163.4U CN220774409U (en) | 2023-09-13 | 2023-09-13 | Novel LED packaging shell |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220774409U true CN220774409U (en) | 2024-04-12 |
Family
ID=90605667
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322487163.4U Active CN220774409U (en) | 2023-09-13 | 2023-09-13 | Novel LED packaging shell |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220774409U (en) |
-
2023
- 2023-09-13 CN CN202322487163.4U patent/CN220774409U/en active Active
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