CN216161760U - LED packaging support, LED makeup structure and display - Google Patents

Abstract

The utility model discloses an LED packaging support, an LED makeup structure and a display, wherein the LED packaging support comprises: a conductive support; the plastic frame is combined on the conductive bracket; the conductive support comprises a conductive terminal, a plurality of reinforcing pits are formed in the surface of the conductive terminal, and part of the plastic frame is sunk into the reinforcing pits; the conductive terminal is also provided with an anti-loosening through hole in a penetrating mode, the plastic frame comprises a first plastic part combined with one side of the conductive terminal, a second plastic part combined with the other side of the conductive terminal and a connecting part penetrating through the anti-loosening through hole, and two ends of the connecting part are connected with the first plastic part and the second plastic part respectively.

Description

LED packaging support, LED makeup structure and display

Technical Field

The utility model relates to the technical field of LED display, in particular to an LED packaging support, an LED makeup structure and a display.

Background

A light-emitting diode (LED) is a commonly used light-emitting device, and is widely used in various displays. The encapsulation of the LED is an important process for the production of the LED, the sealing performance of the LED encapsulation support is an important index related to the LED encapsulation effect, and the sealing performance of the traditional LED encapsulation support is generally poor.

SUMMERY OF THE UTILITY MODEL

The present invention is directed to solving at least one of the problems of the prior art. Therefore, the utility model provides the LED packaging support with high sealing performance.

The utility model also provides an LED makeup structure with the LED packaging support and a display.

An LED package support according to an embodiment of the first aspect of the utility model comprises: a conductive support; the plastic frame is combined on the conductive bracket; the conductive support comprises a conductive terminal, a plurality of reinforcing pits are formed in the surface of the conductive terminal, and part of the plastic frame is sunk into the reinforcing pits; the conductive terminal is further provided with a locking through hole in a penetrating mode, the plastic frame comprises a first plastic portion, a second plastic portion and a connecting portion, the first plastic portion is combined with one side of the conductive terminal, the second plastic portion is combined with the other side of the conductive terminal, the connecting portion penetrates through the connecting portion in the locking through hole, and two ends of the connecting portion are connected with the first plastic portion and the second plastic portion respectively.

According to some embodiments of the utility model, at least a portion of the reinforcing depressions is distributed around the anti-loosening through hole.

According to some embodiments of the present invention, the conductive terminal includes a first conductive portion, a second conductive portion, and a third conductive portion, which are connected in sequence, the second conductive portion and the first conductive portion are disposed at an included angle, the third conductive portion and the second conductive portion are disposed at an included angle, and the reinforcing recess and the anti-loosening through hole are disposed on the first conductive portion.

According to some embodiments of the present invention, the conductive terminal is further provided with a reinforcing groove, and at least a portion of the plastic frame is sunk into the reinforcing groove.

According to some embodiments of the utility model, the reinforcing groove is a strip, and at least part of the reinforcing pits are distributed on two sides of the reinforcing groove.

According to some embodiments of the present invention, the conductive terminal is further formed with an anti-loose corner at a side thereof, and the portion of the plastic frame is sunk into the anti-loose corner.

According to some embodiments of the utility model, the plastic frame is formed with an encapsulation cavity having a filling opening, a sidewall of the filling opening being formed with a protective step.

According to some embodiments of the utility model, a wall of the enclosure is a sloped structure, and a cross-sectional area of the enclosure decreases gradually from the filling opening to a bottom of the enclosure.

According to a second aspect of the utility model, an LED imposition structure comprises a plurality of LED package supports as described above, wherein the LED package supports are arranged in an array.

A display according to an embodiment of the third aspect of the utility model comprises an LED package support as described above.

The LED packaging support, the LED makeup structure and the display at least have the following beneficial effects:

in the display, after the PPA is injected on the conductive support, the PPA can flow into the reinforcing concave pit, so that the plastic frame formed by the PPA is better combined with the conductive terminal, the sealing performance is ensured, and the phenomenon that the gap between the plastic frame and the conductive terminal is enlarged in the subsequent process is avoided.

Furthermore, in the process of injecting the PPA onto the conductive support, the PPA flows to the two sides of the conductive terminal and into the anti-loose through hole, the PPA flowing to the two sides of the conductive terminal forms a first plastic part and a second plastic part respectively, the PPA flowing into the anti-loose through hole forms a connecting part, the first plastic part on one side of the conductive terminal and the second plastic part on the other side of the conductive terminal are connected together through the connecting part, so that the first plastic part and the second plastic part can be better combined with the conductive terminal, the sealing performance is further ensured, and the gap between the plastic frame and the conductive terminal is further prevented from being enlarged in the subsequent process.

Drawings

The above and/or additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:

fig. 1 is a schematic front view of an LED package support according to an embodiment of the utility model;

fig. 2 is a schematic diagram of a back side structure of an LED package support according to an embodiment of the utility model;

FIG. 3 is a schematic cross-sectional view of an LED package support according to an embodiment of the utility model;

FIG. 4 is a schematic view of a partially enlarged structure of the graph shown in FIG. 3;

FIG. 5 is a schematic structural diagram of a conductive support according to an embodiment of the present invention;

fig. 6 is a schematic structural diagram of an LED imposition structure according to an embodiment of the present invention.

Reference numerals:

10. an LED package support; 100. a conductive support; 110. a conductive terminal; 111. a first conductive portion; 1111. a die bond wire area; 112. a second conductive portion; 1121. reinforcing the pits; 1122. a locking through hole; 1123. a reinforcing groove; 1124. anti-loosening corners; 113. a third conductive portion; 200. a plastic frame; 210. a packaging cavity; 211. a protection step; 20. a substrate.

Detailed Description

Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the accompanying drawings are illustrative only for the purpose of explaining the present invention, and are not to be construed as limiting the present invention.

In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "axial", "radial", "circumferential", and the like, indicate orientations and positional relationships based on the orientations and positional relationships shown in the drawings, and are used merely for convenience in describing the present invention and for simplicity in description, and do not indicate or imply that the device or element so referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention. Furthermore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless otherwise specified.

In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.

As shown in fig. 1 to fig. 3, an embodiment of an LED package support 10 includes a conductive support 100 and a plastic frame 200, wherein the plastic frame 200 is combined on the conductive support 100.

Specifically, the plastic frame 200 is made of PPA (Polyphthalamide), and the PPA is combined with the conductive bracket 100 by high-temperature high-pressure injection molding to form the plastic frame 200.

As shown in fig. 5, the conductive bracket 100 includes a plurality of conductive terminals 110, the conductive terminals 110 are formed by stamping on the substrate 20, and in combination with fig. 3, after completing the injection molding of the PPA on the conductive bracket 100, the conductive terminals 110 are cut off from the substrate 20 and bent to the back of the plastic frame 200.

Optionally, the substrate 20 is made of red copper, which has good electrical and thermal conductivity.

Furthermore, the surface of the conductive terminal 110 is plated with a silver layer with a thickness of 60 microns, and the silver layer is plated on the surface of the conductive terminal 110, so that the light reflection effect can be improved, and the brightness of the product is improved.

With reference to fig. 4 and 5, the surface of the conductive terminal 110 is provided with a plurality of reinforcing recesses 1121, and a portion of the plastic frame 200 is recessed into the plurality of reinforcing recesses 1121, so that the plastic frame 200 and the conductive terminal 110 can be better combined.

Specifically, a plurality of reinforcing recesses 1121 are stamped on the conductive terminal 110 through a stamping method in a combining area of the conductive terminal 110 and the plastic frame 200, and after the PPA is injected onto the conductive bracket 100, the PPA flows into the reinforcing recesses 1121, so that the plastic frame 200 and the conductive terminal 110 are better combined, and a gap between the plastic frame 200 and the conductive terminal 110 is prevented from being enlarged in a subsequent process.

Furthermore, the conductive terminal 110 further has a through hole 1122, the plastic frame 200 includes a first plastic portion combined with one side of the conductive terminal 110, a second plastic portion combined with the other side of the conductive terminal 110, and a connecting portion passing through the through hole 1122, and two ends of the connecting portion are respectively connected to the first plastic portion and the second plastic portion. In the process of injection molding the PPA onto the conductive bracket 100, the PPA flows to both sides of the conductive terminal 110 and into the anti-loosening through hole 1122, the PPA flowing to both sides of the conductive terminal 110 forms a first plastic part and a second plastic part respectively, the PPA flowing into the anti-loosening through hole 1122 forms a connecting part, and the first plastic part located on one side of the conductive terminal 110 and the second plastic part located on the other side of the conductive terminal 110 are connected together through the connecting part, so that the first plastic part and the second plastic part can be better combined with the conductive terminal 110, and the gap between the plastic frame 200 and the conductive terminal 110 is prevented from being enlarged in the subsequent process.

Optionally, the aperture of the anti-loosening through-hole 1122 is 0.2 mm.

Further, at least a portion of the reinforcement recesses 1121 are disposed around the anti-loosening through holes 1122. Thus, around the connecting portion, the plastic frame 200 will sink into the reinforced recess 1121, so that the plastic frame 200 and the conductive terminal 110 are combined more tightly, and a gap between the plastic frame 200 and the conductive terminal 110 is reduced (a gap is inevitably formed at the joint of the two materials), thereby reducing the distance between the first plastic portion and the second plastic portion, so that the length of the connecting portion is shorter, thereby making the distance between the first plastic portion and the second plastic portion smaller under the action of the connecting portion in the subsequent process, and further preventing the gaps between the first plastic portion and the conductive terminal 110 and the second plastic portion from becoming larger.

As shown in fig. 3 and fig. 4, in the present embodiment, the conductive terminal 110 includes a first conductive portion 111, a second conductive portion 112, and a third conductive portion 113 connected in sequence, the second conductive portion 112 is disposed at an angle to the first conductive portion 111, the third conductive portion 113 is disposed at an angle to the second conductive portion 112, and the reinforcing recess 1121 and the anti-loosening through hole 1122 are disposed on the first conductive portion 111.

Specifically, the second conductive portion 112 is connected to one end of the first conductive portion 111, the second conductive portion 112 is bent such that an included angle between the second conductive portion 112 and the first conductive portion 111 is 90 °, the third conductive portion 113 is connected to one end of the second conductive portion 112 away from the first conductive portion 111, the third conductive portion 113 is bent such that an included angle between the third conductive portion 113 and the second conductive portion 112 is 90 °, and the reinforcing recess 1121 and the anti-loosening through hole 1122 are both located on the first conductive portion 111. When the PPA is injection molded onto the conductive bracket 100, the PPA flows into the upper and lower surfaces of the first conductive portion 111, the anti-loosening through hole 1122, and the reinforcing recess 1121.

With reference to fig. 4 and fig. 5, further, a reinforcing groove 1123 is disposed on the conductive terminal 110, and at least a portion of the plastic frame 200 is sunk into the reinforcing groove 1123. After the PPA is injection-molded onto the conductive bracket 100, the PPA flows into the reinforcing groove 1123, so that the plastic frame 200 and the conductive terminal 110 are better combined, and the gap between the plastic frame 200 and the conductive terminal 110 is prevented from being enlarged in the subsequent process.

Specifically, the reinforcing groove 1123 is bar-shaped.

Further, at least a portion of the reinforcement recesses 1121 are disposed at both sides of the reinforcement groove 1123. Therefore, the combination effect of the plastic frame 200 and the conductive terminals 110 can be further improved, and the gap between the plastic frame 200 and the conductive terminals 110 is prevented from being enlarged in the subsequent process.

Specifically, in the present embodiment, the reinforcing groove 1123 is also opened in the first conductive portion 111.

In one embodiment, the conductive terminal 110 is further formed with an anti-loose corner 1124 at a side thereof, and a portion of the plastic frame 200 is sunk into the anti-loose corner 1124. Thus, the plastic frame 200 can buckle the conductive terminal 110 through the anti-loose corner 1124, so as to prevent the gap between the plastic frame 200 and the conductive terminal 110 from becoming larger when the conductive terminal 110 is under tension.

As shown in fig. 3, in one embodiment, the plastic frame 200 is formed with an encapsulation cavity 210 having a filling opening through which the silicone gel can be filled into the encapsulation cavity 210.

Referring to fig. 1, a die bond pad 1111 is disposed on the conductive terminal 110 and at a bottom portion of the package cavity 210. Specifically, in the present embodiment, the die bond wire region 1111 is formed on the first conductive portion 111, and the second conductive portion 112 and the third conductive portion 113 cooperate to form a lead structure.

As shown in fig. 3 and 4, further, the cavity wall of the encapsulation cavity 210 is an inclined plane structure, the cross-sectional area of the encapsulation cavity 210 gradually decreases from the filling opening to the bottom of the encapsulation cavity 210, a protection step 211 is formed on the sidewall of the filling opening, and the protection step 211 can protect the plastic frame 200. Particularly, when the silica gel in the packaging cavity 210 is impacted by external force, the protection step 211 can bear the impact force of the silica gel, so that the inclined plane structure is not damaged, and if the protection step 211 is not arranged, the inclined plane structure is more easily separated after being stressed.

As shown in fig. 6, an embodiment further relates to an LED imposition structure, which includes a plurality of LED package supports 10 as described above, and the plurality of LED package supports 10 are arranged in an array. The makeup can improve the production efficiency and reduce the production cost.

An embodiment also relates to a display comprising an LED package support 10 as described above.

In the display, after the PPA is injection molded onto the conductive bracket 100, the PPA flows into the reinforcing recess 1121, so that the plastic frame 200 formed by the PPA is better combined with the conductive terminal 110, the sealing performance is ensured, and the gap between the plastic frame 200 and the conductive terminal 110 is prevented from being enlarged in the subsequent process.

Further, in the process of injecting the PPA onto the conductive bracket 100, the PPA flows to both sides of the conductive terminal 110 and the anti-loosening through hole 1122, the PPA flowing to both sides of the conductive terminal 110 forms a first plastic part and a second plastic part respectively, the PPA flowing into the anti-loosening through hole 1122 forms a connecting part, and the first plastic part located on one side of the conductive terminal 110 and the second plastic part located on the other side of the conductive terminal 110 are connected together through the connecting part, so that the first plastic part and the second plastic part can be better combined with the conductive terminal 110, and the sealing property is further ensured, thereby further avoiding the increase of the gap between the plastic frame 200 and the conductive terminal 110 in the subsequent process.

In the description herein, references to the description of the term "one embodiment," "some embodiments," "an illustrative embodiment," "an example," "a specific example," or "some examples" or the like mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the utility model. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

While embodiments of the utility model have been shown and described, it will be understood by those of ordinary skill in the art that: various changes, modifications, substitutions and alterations can be made to the embodiments without departing from the principles and spirit of the utility model, the scope of which is defined by the claims and their equivalents.

Claims (10)

1. An LED package support, comprising:

a conductive support; and

the plastic frame is combined on the conductive bracket;

the conductive support comprises a conductive terminal, a plurality of reinforcing pits are formed in the surface of the conductive terminal, and part of the plastic frame is sunk into the reinforcing pits;

the conductive terminal is further provided with a locking through hole in a penetrating mode, the plastic frame comprises a first plastic portion, a second plastic portion and a connecting portion, the first plastic portion is combined with one side of the conductive terminal, the second plastic portion is combined with the other side of the conductive terminal, the connecting portion penetrates through the connecting portion in the locking through hole, and two ends of the connecting portion are connected with the first plastic portion and the second plastic portion respectively.

2. The LED package support according to claim 1, wherein at least a portion of the reinforcement dimples are distributed around the anti-loose through hole.

3. The LED package support according to claim 1, wherein the conductive terminal comprises a first conductive part, a second conductive part and a third conductive part which are connected in sequence, the second conductive part and the first conductive part are arranged at an included angle, the third conductive part and the second conductive part are arranged at an included angle, and the reinforcing pit and the anti-loosening through hole are arranged on the first conductive part.

4. The LED package support according to claim 1, wherein the conductive terminals further comprise reinforcing grooves, and at least a portion of the plastic frame is recessed in the reinforcing grooves.

5. The LED package support according to claim 4, wherein the reinforcing groove is a strip, and at least a portion of the reinforcing pits are disposed on two sides of the reinforcing groove.

6. The LED package support according to claim 1, wherein the conductive terminals are further formed with anti-loose corners at sides thereof, and portions of the plastic frame are recessed into the anti-loose corners.

7. The LED package support according to claim 1, wherein the plastic frame forms a package cavity with a filling opening, and a sidewall of the filling opening forms a protection step.

8. The LED package support according to claim 7, wherein the wall of the package cavity is a slope structure, and the cross-sectional area of the package cavity decreases gradually from the filling opening to the bottom of the package cavity.

9. An LED imposition structure comprising a plurality of LED package supports according to any one of claims 1 to 8, arranged in an array.

10. A display comprising the LED package support of any one of claims 1 to 8.

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