CN218473509U

CN218473509U - Flattening mechanism for preventing substrate from warping and chip packaging machine

Info

Publication number: CN218473509U
Application number: CN202222449393.7U
Authority: CN
Inventors: 王刚; 张君
Original assignee: Ningxia Core Technology Co ltd
Current assignee: Ningxia Core Technology Co ltd
Priority date: 2022-09-15
Filing date: 2022-09-15
Publication date: 2023-02-10
Anticipated expiration: 2032-09-15

Abstract

The application discloses a mechanism and chip packaging machine flatten for preventing base plate warpage belongs to chip packaging equipment technical field. The flattening mechanism comprises a frame body (100), wherein the frame body (100) is provided with a first inner edge (101) and a first outer edge (102), the first inner edge (101) and the first outer edge (102) are opposite, and under the condition that the flattening mechanism presses the substrate, the outer edge of the substrate is positioned between the first inner edge (101) and the first outer edge (102). According to the scheme, the problem that the packaged substrate is damaged easily and the reject ratio of the packaged chip is high due to the fact that the packaged substrate is easy to damage due to the fact that the packaged substrate is pressed by the waste substrate can be solved.

Description

Flattening mechanism for preventing substrate from warping and chip packaging machine

Technical Field

This application belongs to chip package equipment technical field, concretely relates to a mechanism and chip package machine of flattening for preventing base plate warpage.

Background

The substrate is a basic material for manufacturing a PCB, and generally, the substrate is a copper clad laminate, on which hole processing, electroless copper plating, electrolytic copper plating, etching, etc. may be selectively performed to obtain a desired circuit pattern, thereby enabling electrical connection of chips.

During chip packaging, the substrate is adsorbed on the vacuum platform, then the packaging machine heats the vacuum platform, and in the heating process, the substrate is warped and deformed due to high temperature, so that the substrate cannot be adsorbed on the vacuum platform, and the chip packaging machine cannot normally produce. In order to solve the problem, an operator presses a substrate to be packaged through the waste substrate so that the substrate can be adsorbed on the vacuum platform.

However, in the pressing process, the above method is prone to generate excessive friction on the substrate to be packaged, so that the substrate to be packaged is prone to be damaged, and the packaged chip has a high defective rate.

SUMMERY OF THE UTILITY MODEL

The embodiment of the application aims to provide a flattening mechanism for preventing a substrate from warping and a chip packaging machine, and the flattening mechanism can solve the problem that excessive friction is generated on a substrate to be packaged easily due to pressing of a waste substrate, so that the substrate to be packaged is damaged easily, and the defect rate of the packaged chip is high.

In order to solve the technical problem, the present application is implemented as follows:

in a first aspect, an embodiment of the present application provides a flattening mechanism for preventing a substrate from warping, the flattening mechanism includes a frame body, the frame body has a first inner edge and a first outer edge, the first inner edge and the first outer edge are opposite to each other, and in a case where the flattening mechanism presses the substrate, the outer edge of the substrate is located between the first inner edge and the first outer edge.

In a second aspect, an embodiment of the present application provides a chip packaging machine, where the chip packaging mechanism includes the foregoing flattening mechanism.

In this application embodiment, can place the base plate on the vacuum adsorption platform earlier to make the vacuum adsorption platform adsorb the base plate, then place the mechanism that flattens on the base plate, make the edge of base plate be located between first inward flange and the first outward flange. That is, the frame presses the edge of the substrate, so that the substrate can be prevented from warping at high temperature, and the substrate can be kept on the vacuum adsorption platform. In addition, because the flattening mechanism is of a frame structure, the middle part of the flattening mechanism cannot contact the substrate, so that the substrate cannot be damaged due to friction, and the yield of chips is improved.

Drawings

FIG. 1 is a top view of a flattening mechanism disclosed in an embodiment of the present application;

FIG. 2 is a side view of a flattening mechanism disclosed in an embodiment of the present application;

FIG. 3 is a top view of a flattening mechanism disclosed in another embodiment of the present application;

FIG. 4 is a side view of a flattening mechanism disclosed in another embodiment of the present application.

Description of the reference numerals:

100-frame, 101-first inner edge, 102-first outer edge, 103-through hole;

200-operating element, 210-first operating part, 220-second operating part;

300-fastener.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some, but not all, of the embodiments of the present application. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

The terms first, second and the like in the description and in the claims of the present application are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It will be appreciated that the data so used may be interchanged under appropriate circumstances such that embodiments of the application are capable of operation in sequences other than those illustrated or described herein, and that the terms "first," "second," etc. are generally used in a generic sense and do not limit the number of terms, e.g., a first term can be one or more than one. In addition, "and/or" in the specification and claims means at least one of connected objects, a character "/" generally means that a preceding and succeeding related objects are in an "or" relationship.

The flattening mechanism provided by the embodiment of the present application is described in detail below with reference to the accompanying drawings by specific embodiments and application scenarios thereof.

As shown in fig. 1 to 4, an embodiment of the present application provides a pressing mechanism, which may be used in a chip packaging machine and may include a frame 100.

The frame body 100 may have a rectangular structure, and a surface of the frame body 100 facing the substrate may be a flat surface. The frame body 100 may include a plurality of connection sections, which are connected in sequence. The frame body 100 has a first inner edge 101 and a first outer edge 102, the first inner edge 101 and the first outer edge 102 being opposed to each other, and the outer edge of the substrate is located between the first inner edge 101 and the first outer edge 102 in a state where the flattening mechanism presses the substrate.

In this embodiment, the substrate may be placed on the vacuum adsorption platform first, so that the vacuum adsorption platform adsorbs the substrate, and then the flattening mechanism is placed on the substrate, so that the edge of the substrate is located between the first inner edge 101 and the first outer edge 102. That is, the frame body 100 presses the edge of the substrate, so that the substrate may be prevented from warping at a high temperature, thereby being advantageous to maintain the substrate on the vacuum adsorption stage. In addition, because the flattening mechanism is of a frame structure, the middle part of the flattening mechanism cannot contact with the substrate, so that the substrate cannot be damaged due to friction, and the yield of chips is improved.

In an alternative embodiment, the substrate is provided with positioning holes so that the substrate can be placed at a predetermined position of the vacuum adsorption platform, and in order to make the size of the frame 100 larger and thus more stably press the edge of the substrate, the frame 100 is provided with through holes 103, and the through holes 103 correspond to the positioning holes of the substrate one to one. In this case, since the through holes 103 formed in the frame body 100 can correspond to the positioning holes one by one, the size of the frame body 100 can be made larger, which is more advantageous for pressing the substrate through the frame body 100.

In order to facilitate the operator to operate the flattening mechanism, the flattening mechanism further includes an operating member 200, and the operating member 200 is connected to the frame 100. The operator's manipulation of the flattening mechanism may be facilitated by the manipulation member 200.

In a further alternative embodiment, the operation member 200 includes a first operation portion 210 and a second operation portion 220, the first operation portion 210 is connected to the frame 100 through the second operation portion 220, and an extending direction of the first operation portion 210 is parallel to an extending direction of the frame 100. When the operator performs the operation, since the extending direction of the first operating portion 210 is parallel to the extending direction of the frame 100, the operator can easily operate the first operating portion 210. In an alternative embodiment, the first operating portion 210 is perpendicular to the second operating portion 220, and the second operating portion 220 is perpendicular to the frame 100.

The chip packaging machine is provided with two operation windows which are positioned at two sides of the chip packaging machine and are oppositely arranged. In an alternative embodiment, the number of the operation members 200 is two, and the two operation members 200 are disposed opposite to each other in the longitudinal direction of the frame 100. The two operating members 200 can facilitate the operation of the operator in different operation windows.

In an alternative embodiment, the flattening mechanism may further include a fastener 300, and the operating element 200 is connected to the frame 100 through the fastener 300, so that the reliability of the connection between the operating element 200 and the frame 100 may be enhanced. The number of the fastening members 300 may be at least two, so that the firmness of the connection may be improved. The fastener 300 may be a screw.

The embodiment of the application also provides a chip packaging machine which comprises the flattening mechanism in any embodiment.

While the present embodiments have been described with reference to the accompanying drawings, it is to be understood that the present embodiments are not limited to those precise embodiments, which are intended to be illustrative rather than restrictive, and that various changes and modifications may be effected therein by one skilled in the art without departing from the scope of the appended claims.

Claims

1. A flattening mechanism for preventing a substrate from warping, comprising a frame body (100), wherein the frame body (100) has a first inner edge (101) and a first outer edge (102), the first inner edge (101) and the first outer edge (102) are opposite to each other, and the outer edge of the substrate is located between the first inner edge (101) and the first outer edge (102) with the flattening mechanism pressing the substrate.

2. The flattening mechanism according to claim 1, characterized in that the frame (100) is provided with through holes (103), and the through holes (103) correspond to the positioning holes of the substrate one to one.

3. The flattening mechanism of claim 1, characterized in that the flattening mechanism further includes an operating member (200), and the operating member (200) is connected to the frame (100).

4. The flattening mechanism according to claim 3, characterized in that the operating member (200) includes a first operating portion (210) and a second operating portion (220), the first operating portion (210) is connected to the frame (100) through the second operating portion (220), and an extending direction of the first operating portion (210) is parallel to an extending direction of the frame (100).

5. The flattening mechanism according to claim 3, characterized in that the number of the operation members (200) is two, and the two operation members (200) are disposed opposite to each other in a longitudinal direction of the frame body (100).

6. The flattening mechanism according to claim 3, characterized in that the flattening mechanism further includes a fastening member (300), and the operating member (200) is connected to the frame body (100) through the fastening member (300).

7. A chip packaging machine comprising the flattening mechanism of any one of claims 1-6.