JP2005251900A - Jig for manufacturing electronic device, jig set for manufacturing electronic device, method of manufacturing electronic device using the jig set, and apparatus of manufacturing electronic device using the jig set - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a jig for manufacturing an electronic device which can be used to divide a batch sealer into individual electronic devices while correcting large warpage generated at the batch sealer and a method of manufacturing the electronic device using the jig, and to provide an apparatus of manufacturing the electronic device for manufacturing the electronic device by using the jig. <P>SOLUTION: An assembly 50 is mounted on the stage 61 of a cutting device 60, and the batch sealer in the assembly 50 is cut along the slot formed at one jig. A cutting blade 62 is inserted from one side face slit 21, and passed to the other side face slit while cutting the back sealer 1 along the slit. It can cut continuously from the one end e1 to the other end e2 of the back sealer 1. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a jig used when manufacturing an electronic device, an electronic device manufacturing method using the jig, and an electronic device manufacturing apparatus using the jig.

  Conventionally, when manufacturing an electronic device, particularly an electronic device including a semiconductor chip, a plurality of electronic devices and semiconductor chips mounted on a circuit board are collectively sealed with a resin for the purpose of improving production efficiency. A batch resin sealing technique has been used. First, this technique will be described.

  A plurality of semiconductor chip mounting regions 101 are provided on a circuit board 100 for mounting a plurality of semiconductor chips (FIG. 11). A pad 102 is provided on one surface of the circuit board 100 for each semiconductor chip mounting region 101. On the other surface, solder ball pads (not shown) are provided for the respective semiconductor chip mounting regions 101. The pad 102 and the solder ball pad are electrically connected by wiring in the circuit board 100 (not shown).

  First, the semiconductor chip 200 is mounted on each of the semiconductor chip mounting regions 101 on the circuit board 100 via an adhesive or the like, and then an electrode (not shown) on the semiconductor chip 200 and the pad 102 are connected to the Au wire 300. Wire bonding is performed by such as (FIG. 11).

  Next, the entire surface on which the semiconductor chip 200 of the circuit board 100 on which the plurality of semiconductor chips 200 are mounted is sealed with a resin by a molding method using a mold or the like to form the collective sealing body 1. FIG. 12 shows an AA cross section in FIG. 11 after resin sealing. In addition, 2 in FIG. 12 is sealing resin.

  Next, the batch sealing body 1 is heated to about 170 ° C. using a heating furnace, and the sealing resin 2 is cured.

  Next, a solder ball is attached on the solder ball pad, and heat treatment is performed using a reflow furnace to form an external electrode.

  Next, the sealing resin 2 and the circuit board 100 are cut along the boundary line b of each semiconductor chip mounting region 101 and divided into individual electronic devices. The boundary lines are virtual and need not be actually drawn on a circuit board or the like. Hereinafter, in the present specification, the process of cutting the batch sealing body and dividing it into individual electronic devices is referred to as “dicing”.

  With the collective sealing technique described above, a plurality of electronic devices can be efficiently produced.

  However, when this technique is used, there is a problem that the sealing resin 2 contracts when it is cured, and the collective sealing body 1 is warped. The collective sealing body in a state where warpage has occurred is shown in FIG.

  Conventionally, dicing can be performed by, for example, the following conventional technique if the warpage generated in the collective sealing body is slight.

  The first prior art is a method of dicing after correcting a warp by adhering a collective sealing body that has warped to an adhesive film.

  The second prior art is a method of correcting a warp by dicing a batch sealing body placed on a stage provided with a vacuum suction port from the back and fixing it along the surface of the stage. It is.

  The third conventional technique is a technique for ensuring vacuum suction in the second conventional technique, and is disclosed in Japanese Patent Laid-Open No. 2003-218141. This technique will be described with reference to FIGS. First, the collective sealing body 1 is placed on the stage 400 of the cutting device as in the second prior art. The stage 400 is provided with a vacuum suction port 401.

Next, the collective sealing body 1 is vacuum-sucked from the back using the vacuum suction port 401 and fixed on the stage 400 of the cutting apparatus. Further, the collective sealing body 1 is pressed against the stage 400 by the pressing means 500 in which the slits 501 are formed, and the fixing by vacuum suction is ensured. Next, using a cutting tool (not shown), the package 1 is cut along the slit 501 in the direction of the arrow d1 in FIG. Next, the pressing means 500 is once removed, rotated 90 degrees, and attached again on the collective sealing body 1 (shown by a broken line in FIG. 15 is a slit 502 after being rotated 90 degrees. The slits 501 and 502 are oriented. It is the same, only 90 degrees different). Next, the package 1 is cut along the slit 502 in a direction perpendicular to the direction of the arrow d1 (direction of the arrow d2). The collective sealing body is diced by the above procedure.
JP 2003-218141 A

  If the number of chips to be sealed at one time is increased in order to improve productivity and the area of the collectively sealed body is increased, the amount of warpage (the size of s1 in FIG. 13) increases. In recent years, circuit boards have become thinner in response to demands for downsizing electronic devices. This thinning reduces the bending strength of the circuit board and increases the amount of warping that occurs.

  When dicing while correcting a large amount of warp of a certain amount or more using the above-described first to third conventional techniques, the following problems occur.

  When the first prior art is used, there is a limit to the adhesive strength of the film used for correcting the warpage of the encapsulated sealed body. Therefore, when trying to correct more than a certain amount of warpage, the force to return the warpage to its original state. The film will lose its adhesive strength. As a result, since the collective sealing body and the film are peeled off, dicing cannot be performed while correcting the warpage.

  Similarly, in the case of using the second conventional technique, if the vacuum suction force loses the force to return the warp, the batch sealing body is not fixed to the stage, so dicing while correcting the warp. I can't.

  Furthermore, also in the case of using the third prior art, since it is necessary to remove the pressing means once after making a cut in one direction and before making a cut in the other direction, the same as in the second prior art described above. Problem arises.

  In order to solve the above-described problems of the prior art, the present invention is an electronic device that can be used to divide a batch sealing body into individual electronic devices while correcting a large warp generated in the batch sealing body. It is an object to provide a manufacturing jig, an electronic device manufacturing method using the jig, and an electronic device manufacturing apparatus for manufacturing an electronic device using the jig.

  In order to achieve the above object, the electronic device manufacturing jig of the present invention comprises a plate, and the plate has a plurality of slits penetrating in the plate thickness direction arranged so as to be parallel to each other at a predetermined interval, A plurality of grooves arranged at a predetermined interval and perpendicular to the longitudinal direction of the slit are formed on at least one surface of the plate.

  Two jigs for manufacturing the electronic device are prepared, the slits formed in both are arranged so that the slits are orthogonal to each other, and the surfaces on which the grooves are formed are opposed to each other. Warping can be corrected by surface pressure by sandwiching and fixing the assembly. Then, using a cutting device such as a cutting blade, the batch sealing body is cut along the slit of one electronic device manufacturing jig, and then collectively sealed along the slit of the other electronic device manufacturing jig. By cutting the stop body, the batch sealing body can be diced while correcting the warp. At this time, a position where the groove is formed is set to a position where the blade hits when the cutting blade cuts and penetrates the collective sealing body. Thereby, the groove becomes a relief groove of the blade, and the collective sealing body can be completely cut without the blade contacting the plate.

  Further, the electronic device manufacturing jig of the present invention is the above-described electronic device manufacturing jig, wherein a portion in the vicinity of the slit end of the plate is a groove along a fold line perpendicular to the slit on the plate. It is characterized by having a structure bent on the surface side on which is formed.

  According to the present invention, there is provided the electronic device manufacturing jig described above, wherein an opening that penetrates the plate is provided in a region surrounded by the slit and the groove.

  With this feature, it is possible to check the positioning marks attached to the collective sealing body and to perform the solder ball mounting operation in the state where the collective sealing body is sandwiched between jigs to form an assembly.

  The present invention also relates to an electronic device manufacturing jig set comprising two sets of the aforementioned electronic device manufacturing jigs, wherein the interval between one slit is equal to the interval between the other grooves, and the combination. In this state, the slits formed in each electronic device manufacturing jig are orthogonal to each other, and the surfaces on which the grooves are formed face each other.

  With this feature, the collective sealing body can be diced into electronic devices having different dimensions in the length direction and in the width direction.

  The present invention is also an electronic device manufacturing method using the above-described electronic device manufacturing jig set, wherein slits formed in two electronic device manufacturing jigs of the electronic device manufacturing jig set are orthogonal to each other. In a state where the surfaces where the grooves are formed face each other, an assembly is obtained by sandwiching a collective sealing body in which a plurality of electronic components are collectively sealed between two electronic device manufacturing jigs. The first step, the second step of cutting the batch sealing body along the slit of one electronic device manufacturing jig, and the batch sealing body cutting along the slit of the other electronic device manufacturing jig The third step is performed.

  By this method, the collective sealing body can be diced while correcting the warp generated in the collective sealing body.

  Further, according to the present invention, in the electronic device manufacturing method described above, between the second step and the third step, the assembly is rotated about the axis perpendicular to the surface where the slit of the electronic device manufacturing jig is open. The electronic device manufacturing method is characterized by further performing a fourth step of rotating at a predetermined degree.

  By this method, after the collective sealing body is cut along the slit of one electronic device manufacturing jig, the cutting blade is not rotated by 90 degrees in accordance with the slit of the other electronic device manufacturing jig. The batch sealing body can be cut along the slit of the other electronic device manufacturing jig. For this reason, a cutting device can be simplified.

  According to the present invention, in the electronic device manufacturing method described above, in addition to the fourth step described above, the assembly is an axis parallel to the longitudinal direction of the slit formed in one of the two electronic device manufacturing jigs. The electronic device manufacturing method is characterized by further performing a fifth step of rotating 180 degrees around the axis.

  By this method, after cutting the batch sealing body along the slit of one electronic device manufacturing jig, the cutting blade is rotated 90 degrees in accordance with the slit of the other electronic device manufacturing jig. In addition, the batch sealing body can be cut along the slit of the other electronic device manufacturing jig without being moved to the other electronic device manufacturing jig side. For this reason, the cutting device can be further simplified.

  Further, according to the present invention, instead of the fourth step and the fifth step described above, the assembly is placed on the surface where the slit of the jig for manufacturing the electronic device is opened between the second step and the third step. An electronic device manufacturing method comprising performing a step of rotating 180 degrees around an axis that is parallel to the slit and forms 45 degrees with the slit.

  By this method, the aforementioned fourth step and fifth step can be performed in one step. For this reason, the cutting device and the cutting process can be simplified.

  Further, the present invention is an electronic device manufacturing apparatus for manufacturing an electronic device using the above-described electronic device manufacturing jig set, and is formed on two electronic device manufacturing jigs of the electronic device manufacturing jig. In a state where the slits are orthogonal to each other and the surfaces where the grooves are formed face each other, a batch sealing body in which a plurality of chips are collectively sealed is sandwiched between the two electronic device manufacturing jigs. It has the holding | maintenance part which hold | maintains an assembly, the arrangement | positioning change part which changes the direction of an assembly, and the cutting part for cut | disconnecting a package sealing body along a slit, It is characterized by the above-mentioned.

  With this feature, the electronic device manufacturing apparatus according to the present invention can cut the collective sealing body while correcting the warp generated in the collective sealing body.

  Further, in the electronic device manufacturing apparatus of the present invention, the arrangement changing unit of the electronic device manufacturing apparatus described above is configured so that the assembly is rotated 90 degrees around an axis perpendicular to the surface where the slit of the electronic device manufacturing jig is open. It is a device that rotates.

  With this feature, after cutting the encapsulated sealing body along the slit of one electronic device manufacturing jig, the cutting portion is rotated by 90 degrees in accordance with the slit of the other electronic device manufacturing jig. It is possible to cut the batch sealing body along the slits of the electronic device manufacturing jig, and to simplify the cutting portion.

  In the electronic device manufacturing apparatus according to the present invention, in the electronic device manufacturing apparatus described above, the arrangement changing unit may be configured so that the assembly is positioned about the axis perpendicular to the surface where the slit of the electronic device manufacturing jig is open. The device is characterized in that the device rotates 180 degrees around an axis parallel to the longitudinal direction of the slit formed in one of the two electronic device manufacturing jigs.

  With this feature, after cutting the batch sealing body along the slit of one electronic device manufacturing jig, the cutting part can be rotated 90 degrees in accordance with the slit of the other electronic device manufacturing jig. Since the collective sealing body can be cut along the slit of the other electronic device manufacturing jig without being moved to the other electronic device manufacturing jig side, the cutting portion can be further simplified. be able to.

  Moreover, the electronic device manufacturing apparatus of the present invention is the above-described electronic device manufacturing apparatus, wherein the arrangement changing unit is parallel to the surface where the slit of the electronic device manufacturing jig is open and the longitudinal direction of the slit. And a device that rotates 180 degrees around an axis that forms 45 degrees.

  Due to this feature, the assembly is 90 degrees around the axis perpendicular to the surface where the slit of the electronic device manufacturing jig is open, and the length of the slit formed in one of the two electronic device manufacturing jigs. Since the operation of rotating 180 degrees about the axis parallel to the direction can be performed by one operation, the process of manufacturing the electronic device can be simplified. In addition, the arrangement changing unit itself can be simplified.

  According to the electronic device manufacturing jig and the electronic device manufacturing jig set of the present invention, the surface pressure of the jig can be obtained by forming an assembly in which the batch sealing body is sandwiched and fixed between two plate-shaped jigs. Thus, it is possible to correct a large warp generated in the collective sealing body.

  Further, according to the electronic device manufacturing method of the present invention, the assembly itself can be collectively sealed without changing the movable direction, movable range, and movable amount of the cutting blade of the cutting device by appropriately changing the orientation and front and back of the assembly itself. Dicing of a stationary body becomes possible and simplification of a cutting device and a cutting process can be achieved.

  Further, according to the electronic device manufacturing apparatus of the present invention, the same effects as those of the electronic device manufacturing method of the present invention described above can be obtained.

  A set of electronic device manufacturing jig 10 (hereinafter, abbreviated as a jig) used in the best mode for carrying out the present invention is shown in FIG. Moreover, the BB cross section of the jig | tool 10 is shown in FIG. The jig 10 of this embodiment is made of a plate and has a U-shaped cross section as shown in FIG. (Hereinafter, among the three surfaces forming the U-shape, the surface 11 sandwiched between two surfaces is referred to as a pressing surface, and the two surfaces 12 sandwiching the pressing surface are referred to as side surfaces.) The metal, ceramic, or resin can be used.

  The jig 10 is provided with a plurality of slits 20 at predetermined intervals and in parallel. The interval between the slits 20 is determined according to the dimensions of the individual electronic devices that are cut and divided from the collective sealing body. Each slit 20 penetrates the plate constituting the jig 10 in the plate pressure direction. Further, each slit 20 crosses the pressing surface 11 and both end portions reach the side surface 12. Hereinafter, a part 21 of the slit 20 formed on the side surface 12 is referred to as a side surface slit.

  Further, the pressing surface 11 is provided with a plurality of grooves 30 in parallel with each other at a predetermined interval. Further, the formation direction of the groove 30 is orthogonal to the longitudinal direction of the slit 20.

  Further, openings 40 are respectively provided in regions of the pressing surface 11 surrounded by the slits 20 and the grooves 30. The opening 40 penetrates in the plate pressure direction of the jig. Further, in FIG. 1, only one opening 40 is provided, but the number provided can be changed as appropriate according to the use of the opening.

  A procedure for manufacturing an electronic device using the jig 10 will be described below.

  First, a collective sealing body is manufactured by the above-mentioned method. It is assumed that the collective sealing body is warped.

  Next, as shown in FIG. 3, the collective sealing body 1 in which warpage occurs (shown flat in FIG. 3 for convenience) is arranged between the two jigs 10. The assembly 50 is sandwiched and fixed (FIG. 4).

  At this time, the warpage of the collective sealing body 1 is corrected by the pressure of the pressing surfaces 11 of both jigs.

  Further, the groove 30 provided in one of the two jigs allows a cutting tool (for example, a cutting blade) to be used when the collective sealing body is cut along the slit 20 of the other jig. This is a clearance groove for preventing direct contact with the jig. Therefore, the two jigs are combined in a state where the surfaces on which the grooves 30 are formed face each other. Further, in the state where the two jigs are combined, the forming direction of the slit of one jig and the groove of the other jig is parallel, and the positions of both are opposed to each other.

  Further, a positioning hole 3 is provided in the collective sealing body 1, and the positioning pin 14 provided in the jig 1 is inserted into the positioning hole 3 and fixed. Thereby, the collective sealing body 1 can be fixed to a predetermined position of the jig 10. Although FIG. 3 shows an example in which two positioning pins 14 are provided, the number of pins may be changed as appropriate.

  Furthermore, a positioning pin may be provided on one jig, and a pin receiver into which the positioning pin is inserted may be provided at a position opposite to the other jig.

  In addition, a fixing claw 13 is provided on the side surface 12 of the jig. By hooking the fixing claw 13 on the pressing surface of the other jig, the fixing claw 13 can be fixed in a combined state (FIG. 4).

  Next, as shown in FIG. 5, the assembly 50 is mounted on the stage 61 of the cutting device 60, and the batch sealing body in the assembly 50 is cut along a slit formed in one jig. In this embodiment, a method of cutting using the cutting blade 62 will be described.

  Since the jig 10 is provided with a side slit, the cutting blade 62 is inserted from one side slit 21 (FIG. 5A), and the collective sealing body 1 is cut along the slit (FIG. 5 (b)), the other side slit can be passed (FIG. 5C). Therefore, the collective sealing body 1 can be continuously cut from one end e1 to the other end e2. At this time, it is not necessary to move the cutting blade 62 in the vertical direction.

  FIG. 6 is a view of FIG. 5B as seen from the traveling direction of the cutting blade 62. As shown in FIG. 6, the cutting blade 62 cuts the batch sealing body 1, and the cutting edge reaches the inside of the groove 30. Thereby, the package body 1 can be completely cut in the thickness direction. Further, in order to prevent the cutting blade from coming into contact with the jig, the length of the side slit 21 (s2 in FIG. 6) is set to at least the plate thickness of the jig 10, the thickness of the collective sealing body 1, and the groove. It is set larger than the total of 30 depths.

  Next, in order to perform cutting along the plurality of slits, the assembly 50 is moved while the cutting blade 62 is sequentially moved parallel to the surface of the stage 61 and in the direction perpendicular to the longitudinal direction of the slit 20 by a driving mechanism (not shown). Is reciprocated on the stage 61 in the longitudinal direction of the slit 20 (FIG. 7). In this manner, the collective sealing body 1 can be sequentially cut along a plurality of adjacent slits.

  After cutting the collective sealing body 1 along all the slits formed in one jig, the assembly 50 is rotated 90 degrees about an axis a1 perpendicular to the pressing surface 11 (FIG. 8). Further, it is rotated 180 degrees around an axis a2 parallel to the longitudinal direction of the slit of one jig (FIG. 9).

  In this way, by changing the direction and the front and back of the assembly 50, it is possible to match the slit and the direction and position of the cutting blade of the other jig without moving the direction and position of the cutting blade.

  The 90-degree rotation described above can be realized by providing the cutting device with a turntable or the like. The 180-degree rotation described above can be realized by grasping the assembly with a manipulator and turning it over.

  Further, as shown in FIG. 10, the assembly is rotated 180 degrees around the axis a3 that is 45 degrees with the longitudinal direction of the slit 20 and is parallel to the pressing surface 11, thereby rotating the 90 degrees and 180 degrees as described above. Both can be performed with one operation.

  This operation can be realized by providing two protrusions 15 on the axis a3 of the assembly, holding the protrusions 15 with a manipulator, and rotating the axis a3 as a center. The position where the protrusion 15 is provided is preferably selected so that the axis a <b> 3 when rotating passes through the center of gravity of the assembly 50.

  After aligning the slit of the other jig with the direction and position of the cutting blade as described above, cut the batch sealing body along all the slits of the other jig in the same manner as described above. By doing so, the batch sealing body can be diced. By carrying out the assembly from the cutting device after dicing, it is possible to carry out a plurality of divided electronic devices in a lump.

  In the above-described embodiment, the example of the single-sided resin sealed package is shown, but the double-sided resin sealed package can be diced by the same jig, method, and procedure.

  In the above-described embodiment, the procedure of sandwiching the resin of the collectively encapsulated body with heat and then holding it with a jig is shown. However, after sealing with resin and before heat curing of the resin, the resin is sandwiched with a jig as an assembly. Also good. In this case, the resin can be heated and cured in the state of the assembly, and warpage can be prevented in advance. In this case, the material of the plate constituting the jig is preferably a heat resistant material.

  In the above-described embodiment, the method of using the fixing claw provided on the side surface of the jig is shown as a method of fixing the two jigs in combination, but they may be fixed with bolts or the like.

  Furthermore, in the above-described embodiment, the cutting blade is shown as the cutting tool. However, the cutting blade may be cut by laser light. In this case, by performing processing (for example, surface roughening) in which the light is irregularly reflected inside the groove, the laser light that penetrates the collective sealing body and is reflected by the jig on the back surface side of the collective sealing body. It is possible to prevent the back surface from being damaged.

  Further, in addition to the above-described method, the following method is used as a method of aligning the direction and position of the cutting blade with the slit of the other jig after cutting the collective sealing body along the slit of one jig. Can be used.

  First, the assembly is rotated 90 degrees about an axis perpendicular to the pressing surface. Next, the cutting blade is moved in a direction perpendicular to the pressing surface and is placed on the other jig side. By this procedure, the direction and position of the slit of the other jig and the cutting blade can be matched.

  Moreover, in the above-mentioned embodiment, although the use of the opening provided in the jig was not mentioned, it can be used for the following uses.

  A solder ball can be mounted from the opening. By mounting the solder balls in the state of the assembly in which the warp is corrected, the mounting of the solder balls to a plurality of electronic devices can be performed collectively with high accuracy. In particular, it is desirable to mount the solder balls before dicing the collective sealing body.

  Furthermore, it can cut | disconnect, confirming the marker attached | subjected to the package body from the opening part. Thereby, a cutting position can be determined correctly.

  Furthermore, when performing the cutting, a suction pad or the like can be inserted from the opening to fix the collective sealing body itself. Thereby, it is possible to sufficiently prevent the collective sealing body from being shaken at the time of cutting.

  The present invention is not limited to the above-described embodiments, and may be modified or changed within a range that does not deviate from the object and idea of the invention.

It is the figure which showed one set of the jig | tool for electronic device manufacture used by the best form for inventing. It is the figure which showed the BB cross section of FIG. In the best mode for carrying out the invention, it is a diagram showing an arrangement when a batch sealing body is sandwiched between jigs for manufacturing an electronic device. It is the figure which showed the assembly in the best form for inventing. In the best mode for carrying out the invention, it is a diagram showing a state of cutting a batch sealing body. In the best mode for carrying out the invention, it is a diagram showing a state of cutting a batch sealing body. In the best mode for carrying out the invention, it is a diagram showing a procedure for cutting a batch sealing body along a plurality of adjacent slits. It is the figure which showed a part of the procedure which matches the arrangement | positioning of the slit of the other jig | tool with the blade for cutting after cut | disconnecting a package sealing body along the slit of one jig | tool of an assembly. It is the figure which showed a part of the procedure which matches the arrangement | positioning of the slit of the other jig | tool with the blade for cutting after cut | disconnecting a package sealing body along the slit of one jig | tool of an assembly. It is the figure which showed the procedure which matches the arrangement | positioning of the slit of the other jig | tool with the blade for cutting after cut | disconnecting a package sealing body along the slit of one jig | tool of an assembly. It is a figure for demonstrating the manufacturing procedure of a package body. It is a figure which shows the AA cross section of FIG. It is a figure which shows the state which the curvature produced in the collective sealing body. It is a figure for demonstrating a prior art. It is a figure for demonstrating a prior art.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1; Collective sealing body 2; Sealing resin 3; Positioning hole 10; Jig for electronic device manufacture 11; Press surface 12 of the jig for electronic device manufacture; 14; positioning pin 15; projection 20; slit 21; side slit 30; groove 40; opening 50; assembly 60; cutting device 61 of the present invention; stage 62 of the cutting device of the present invention; Circuit board 101; Semiconductor chip mounting region 102; Pad 200; Semiconductor chip 300; Au wire 400; Stage 401 of cutting device of prior art; Vacuum suction port 500; Pressing means 501, 502;

Claims (12)

A plurality of slits penetrating in the thickness direction arranged so as to be parallel to each other at a predetermined interval, and at least one surface of the plate at a predetermined interval and of the slits. A jig for manufacturing an electronic device, comprising: a plurality of grooves arranged so as to be orthogonal to the longitudinal direction. A structure in which a portion of the plate in the vicinity of the end portion of the slit and including the end portion is bent on the surface side on which the groove is formed, along a fold line perpendicular to the slit on the plate. The jig for manufacturing an electronic device according to claim 1, comprising: The electronic device manufacturing jig according to claim 1, wherein an opening penetrating the plate is provided in a region surrounded by the slit and the groove. The electronic device manufacturing jig according to any one of claims 1 to 3 is a set of two, and the interval between the slits of one of the electronic device manufacturing jigs is for manufacturing the other electronic device. A jig set for manufacturing an electronic device, characterized by being equal to the interval between the grooves of the jig. An electronic device manufacturing method using the electronic device manufacturing jig set according to claim 4,
For manufacturing the two electronic devices in a state where the slits formed in the two electronic device manufacturing jigs of the electronic device manufacturing jig set are orthogonal to each other and the surfaces on which the grooves are formed face each other. A first step in which a batch sealing body in which a plurality of electronic components are collectively sealed between jigs is sandwiched, and the batch sealing along the slit of one of the electronic device manufacturing jigs; An electronic device manufacturing method comprising: performing a second step of cutting a stationary body and a third step of cutting the collective sealing body along a slit of the other electronic device manufacturing jig. Further, a fourth step of rotating the assembly by 90 degrees about an axis perpendicular to a surface where the slit of the electronic device manufacturing jig is opened is performed between the second step and the third step. An electronic device manufacturing method according to claim 5, Between the second step and the third step, the assembly is rotated 180 degrees about an axis parallel to the longitudinal direction of the slit formed in one of the two electronic device manufacturing jigs. The electronic device manufacturing method according to claim 6, wherein five steps are further performed. Between the second step and the third step, the assembly is centered on an axis that is parallel to the surface of the electronic device manufacturing jig where the slit is open and forms 45 degrees with the longitudinal direction of the slit. The electronic device manufacturing method according to claim 5, further comprising a fourth step of rotating 180 degrees. An electronic device manufacturing apparatus for manufacturing an electronic device using the electronic device manufacturing jig set according to claim 4, wherein the electronic device manufacturing jig set is formed on two electronic device manufacturing jigs of the electronic device manufacturing jig set. A collective sealing body in which a plurality of electronic components are collectively sealed between the two electronic device manufacturing jigs in a state in which the slits are orthogonal to each other and the surfaces on which the grooves are formed are opposed to each other. A holding portion for holding the assembly sandwiching the assembly, an arrangement changing portion for changing the orientation of the assembly, and a cutting portion for cutting the collective sealing body along the slit. Electronic device manufacturing equipment. 10. The apparatus according to claim 9, wherein the arrangement changing unit is a device that rotates the assembly by 90 degrees about an axis perpendicular to a surface in which a slit of the electronic device manufacturing jig is opened. Electronic device manufacturing equipment. The arrangement changing unit moves the assembly to one of the two electronic device manufacturing jigs by 90 degrees about an axis perpendicular to the surface of the electronic device manufacturing jig where the slits are open. The electronic device manufacturing apparatus according to claim 9, wherein the electronic device manufacturing apparatus is a device that rotates 180 degrees about an axis parallel to a longitudinal direction of the formed slit. The arrangement changing unit is an apparatus for rotating the assembly by 180 degrees around an axis that is parallel to a surface of the electronic device manufacturing jig where the slit is open and forms 45 degrees with the longitudinal direction of the slit. The electronic device manufacturing apparatus according to claim 9, wherein the electronic device manufacturing apparatus is provided.

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