CN218450059U

CN218450059U - Filter with heat dissipation function

Info

Publication number: CN218450059U
Application number: CN202222579681.4U
Authority: CN
Inventors: 杨栓平
Original assignee: Xi'an Ict Electromagnetic Technology Co ltd
Current assignee: Xi'an Ict Electromagnetic Technology Co ltd
Priority date: 2022-09-28
Filing date: 2022-09-28
Publication date: 2023-02-03
Anticipated expiration: 2032-09-28

Abstract

The utility model discloses a wave filter with heat dissipation function, include: the filter comprises a filter body and a main shell, wherein the lower part of the main shell is connected with a bottom plate through a bolt, and the left side and the right side of the main shell are respectively provided with a pole piece; the semiconductor refrigeration device comprises a refrigeration piece, a through hole is formed in the right side wall of the main shell, the refrigeration piece is arranged inside the through hole, a first copper plate and a second copper plate are respectively arranged on the left side and the right side of the refrigeration piece, and the first copper plate and the second copper plate are respectively welded with the right side wall of the main shell; through having the refrigeration piece, seted up the through-hole on the right side wall of the main casing body, the refrigeration piece sets up in the inside of through-hole for can distribute away cold energy through first copper and first radiating fin during the refrigeration of left side, make the cooling of inside filter circuit board, the radiating effect is good.

Description

Filter with heat dissipation function

Technical Field

The utility model relates to a wave filter technical field, in particular to wave filter with heat dissipation function.

Background

A filter in the prior art, for example, chinese utility model publication No. CN203386871U discloses a cavity filter, a low-pass filter, and a signal transceiver, wherein the cavity filter includes a band-pass filter cavity, a band-pass filter cover plate, a low-pass filter cavity, a low-pass filter cover plate, and a metal rod; the band-pass filter cover plate covers the band-pass filter cavity to form a resonant cavity, the low-pass filter cover plate covers the low-pass filter cavity to form a low-pass cavity, the band-pass filter cavity and the low-pass filter cavity are integrally formed, and the band-pass filter cover plate and the low-pass filter cover plate are integrally formed; the interior of the low-pass cavity is separated into at least 3 closed sub-cavities by a partition wall, and low through holes for the metal rod to pass through the at least 3 closed sub-cavities are formed in the cavity wall of the low-pass cavity and the partition wall;

although the above patent can be through the passive heat dissipation of shell, its radiating effect is not good, causes the overheated burnout of internal circuit easily, consequently, this application has provided a wave filter with heat dissipation function.

SUMMERY OF THE UTILITY MODEL

The utility model aims at providing a wave filter with heat dissipation function through having the refrigeration piece for the cooling of inside circuit board, the radiating effect is good.

In order to achieve the above object, the utility model discloses a main technical scheme include:

a filter having a heat dissipation function, comprising: the filter comprises a filter body, a filter circuit board and a filter module, wherein the filter body comprises a main shell and the filter circuit board arranged in the main shell, the lower part of the main shell is connected with a bottom plate through a bolt, and the left side and the right side of the main shell are respectively provided with a pole piece; semiconductor refrigerating plant, semiconductor refrigerating plant includes the refrigeration piece, the through-hole has been seted up on the right side wall of the main casing body, the refrigeration piece sets up in the inside of through-hole, the side is equipped with first copper and second copper respectively about the refrigeration piece, first copper and second copper respectively with the right side wall welding of the main casing body.

Preferably, one side of the pole piece is fixedly connected with an insulating plate, and the insulating plate is fixedly connected with the main shell.

Preferably, the lower part of the main housing is fixedly connected with a connecting lug, and the connecting lug is provided with a mounting hole.

Preferably, the semiconductor refrigeration device comprises a mounting frame, and a fan is mounted on the mounting frame.

Preferably, a first heat dissipation fin is fixedly connected to the left side of the first copper plate.

Preferably, the upper side of the interior of the main shell is fixedly connected with a heat insulation rubber pad, the lower portion of the heat insulation rubber pad is provided with a second heat dissipation fin, and a heat conduction pipe is welded between the second heat dissipation fin and the first heat dissipation fin.

Preferably, the upper portion of the second heat dissipating fin is coupled to the upper portion of the main housing by a bolt.

Preferably, the upper portion of bottom plate passes through bolted connection with the filter circuit board, install the compound shield plate of plastic-aluminum on the filter circuit board.

The utility model discloses possess following beneficial effect at least:

the utility model discloses in, through having the refrigeration piece, seted up the through-hole on the right side wall of the main casing body, the refrigeration piece sets up in the inside of through-hole for can distribute away cold energy through first copper and first radiating fin during the refrigeration of left side, make the cooling of inside filter circuit board, the radiating effect is good.

Drawings

The accompanying drawings, which are included to provide a further understanding of the application and are incorporated in and constitute a part of this application, illustrate embodiment(s) of the application and together with the description serve to explain the application and not to limit the application. In the drawings:

fig. 1 is a schematic structural view of the present invention;

FIG. 2 is a schematic view of the internal structure of the present invention;

fig. 3 is a schematic structural view of the semiconductor refrigeration device of the present invention.

The reference numbers illustrate:

1. a main housing; 2. a base plate; 3. an aluminum-plastic composite shielding plate; 4. connecting lugs; 5. pole pieces; 6. an insulating plate; 7. a heat insulation rubber pad; 8. a second heat radiation fin; 9. a semiconductor refrigeration device; 91. a mounting frame; 92. a fan; 93. a first copper plate; 94. a second copper plate; 95. refrigerating plates; 96. a first heat radiation fin; 10. a filter circuit board; 11. a heat conducting pipe.

Detailed Description

Embodiments of the present application will be described in detail with reference to the drawings and examples, so that how to implement technical means to solve technical problems and achieve technical effects of the present application can be fully understood and implemented.

Referring to fig. 1 to 3, an embodiment of the present invention provides a filter with a heat dissipation function, including: the filter body comprises a main shell body 1, a filter circuit board 10 arranged in the main shell body 1 and a semiconductor refrigerating device 9, wherein the lower part of the main shell body 1 is connected with a bottom plate 2 through a bolt, and the left side and the right side of the main shell body 1 are respectively provided with a pole piece 5; wherein semiconductor refrigerating plant 9 includes refrigeration piece 95, has seted up the through-hole on main casing body 1's the right side wall, and refrigeration piece 95 sets up in the inside of through-hole, and the side is equipped with first copper 93 and second copper 94 respectively about refrigeration piece 95, and first copper 93 and second copper 94 weld with main casing body 1's right side wall respectively.

Wherein, one side fixedly connected with insulation board 6 of pole piece 5, insulation board 6 and main casing body 1 fixed connection for it is insulating between main casing body 1 and the pole piece 5.

The lower part of the main shell 1 is fixedly connected with a connecting lug 4, and the connecting lug 4 is provided with a mounting hole for fixing with a mounting surface through a bolt.

The semiconductor cooling device 9 includes a mounting frame 91, and a fan 92 is mounted on the mounting frame 91 for the purpose of dissipating heat from the right side of the cooling fins 95.

The left side of the first copper plate 93 is fixedly connected with a first heat radiation fin 96, so that cold energy can be radiated.

The inside upside fixedly connected with heat-insulating rubber pad 7 of main casing body 1, the lower part of heat-insulating rubber pad 7 is equipped with second radiating fin 8, and the welding has heat pipe 11 between second radiating fin 8 and the first radiating fin 96, has increased heat radiating area for the cooling is more even.

The upper portion of the second heat dissipating fin 8 is connected to the upper portion of the main casing 1 by a bolt.

The upper part of the bottom plate 2 is connected with the filter circuit board 10 through bolts, and the filter circuit board 10 is provided with the aluminum-plastic composite shielding plate 3, so that the effects of isolation and electromagnetic interference prevention are achieved.

The utility model discloses a theory of operation is: refrigeration piece 95 is refrigeration in left side, the right side heat dissipation after the circular telegram, has seted up the through-hole on the right side wall of main casing body 1, and refrigeration piece 95 sets up in the inside of through-hole for can distribute away cold energy through first copper 93 and first radiating fin 96 during the refrigeration of left side, make the cooling of inside filter circuit board 10.

When the heat pipe is used, the lower end of the heat pipe 11 penetrates through and is welded with the first radiating fin 96, and the upper part of the heat pipe 11 penetrates through and is welded with the upper part of the second radiating fin 8, so that the radiating area is increased, and cold energy is more uniformly radiated.

The foregoing description shows and describes several preferred embodiments of the present invention, but as before, it is to be understood that the invention is not limited to the forms disclosed herein, but is not to be construed as excluding other embodiments and is capable of use in various other combinations, modifications, and environments and is capable of changes within the scope of the inventive concept as expressed herein, either in the above teachings or as applied to the relevant art or knowledge. But that modifications and variations may be effected by those skilled in the art without departing from the spirit and scope of the invention, which is to be limited only by the claims appended hereto.

Claims

1. A filter having a heat dissipation function, comprising: the filter body, the filter body includes main casing body (1) and sets up in the inside filter circuit board (10) of main casing body (1), its characterized in that:

the lower part of the main shell (1) is connected with a bottom plate (2) through a bolt, and the left side and the right side of the main shell (1) are respectively provided with a pole piece (5);

semiconductor refrigerating plant (9), semiconductor refrigerating plant (9) are including refrigeration piece (95), the through-hole has been seted up on the right side wall of the main casing body (1), refrigeration piece (95) set up in the inside of through-hole, the side is equipped with first copper (93) and second copper (94) respectively about refrigeration piece (95), first copper (93) and second copper (94) respectively with the right side wall welding of the main casing body (1).

2. The filter with heat dissipation function according to claim 1, wherein: one side fixedly connected with insulation board (6) of pole piece (5), insulation board (6) and main casing body (1) fixed connection.

3. The filter with heat dissipation function according to claim 1, wherein: the lower part fixedly connected with engaging lug (4) of main casing body (1), the mounting hole has been seted up on engaging lug (4).

4. The filter with heat dissipation function according to claim 1, wherein: the semiconductor refrigerating device (9) comprises a mounting frame (91), and a fan (92) is mounted on the mounting frame (91).

5. The filter with heat dissipation function according to claim 1, wherein: and a first radiating fin (96) is fixedly connected to the left side of the first copper plate (93).

6. The filter with heat dissipation function according to claim 4, wherein: the inside upside fixedly connected with of main casing body (1) separates heat rubber pad (7), the lower part that separates heat rubber pad (7) is equipped with second radiating fin (8), the welding has heat pipe (11) between second radiating fin (8) and first radiating fin (96).

7. The filter with heat dissipation function according to claim 6, wherein: the upper part of the second radiating fin (8) is connected with the upper part of the main shell (1) through a bolt.

8. The filter with heat dissipation function according to claim 1, wherein: the upper portion of bottom plate (2) passes through bolted connection with wave filter circuit board (10), install plastic-aluminum composite shield board (3) on wave filter circuit board (10).