CN220823625U - Heat dissipation shielding assembly and display device - Google Patents
Heat dissipation shielding assembly and display device Download PDFInfo
- Publication number
- CN220823625U CN220823625U CN202322523372.XU CN202322523372U CN220823625U CN 220823625 U CN220823625 U CN 220823625U CN 202322523372 U CN202322523372 U CN 202322523372U CN 220823625 U CN220823625 U CN 220823625U
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- circuit board
- conductive
- heat
- radiator
- shielding
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 34
- 230000005855 radiation Effects 0.000 claims description 15
- 230000000149 penetrating effect Effects 0.000 claims description 4
- 230000000694 effects Effects 0.000 abstract description 11
- 238000007789 sealing Methods 0.000 abstract description 3
- 238000010586 diagram Methods 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- 239000000463 material Substances 0.000 description 5
- 230000009286 beneficial effect Effects 0.000 description 3
- 238000009825 accumulation Methods 0.000 description 2
- 230000002349 favourable effect Effects 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910001335 Galvanized steel Inorganic materials 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 239000008397 galvanized steel Substances 0.000 description 1
- 239000000499 gel Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Abstract
The utility model provides a heat dissipation shielding assembly and a display device, wherein the heat dissipation shielding assembly comprises: circuit board, radiator and support; the radiator and the support are respectively arranged on two sides of the circuit board and form an electromagnetic shielding cavity together in a surrounding mode, at least one radio frequency device and a conductive structure are arranged on the circuit board, the radio frequency device is located in the electromagnetic shielding cavity, and the conductive structure is arranged around the electromagnetic shielding cavity and is electrically connected with the radiator and the support. The radiating shielding component is wrapped on two sides of the circuit board through the radiator and the bracket, so that an electromagnetic shielding cavity with high sealing degree is formed, and an effective shielding effect is achieved on a radio frequency device; the radiator can also have a good radiating effect on the radio frequency device, and the conductive part on the circuit board also assists in playing an effective shielding role; the radiator and the bracket can form a complete grounding loop through the conductive part, so that the anti-interference capability and reliability of the electromagnetic shielding cavity are improved.
Description
Technical Field
The utility model relates to the technical field of electromagnetic shielding, in particular to a heat dissipation shielding assembly and display equipment.
Background
The radio frequency device is a component capable of generating high-frequency alternating current variable electromagnetic waves, has very wide application, and is indispensable in smart phones, handheld devices, GPS (global positioning system) and displays.
The outside of the current radio frequency device is usually provided with a metal shielding cover, the metal shielding cover is welded on a circuit board through soldering tin, and a radiating hole is usually designed on the metal shielding cover, so that heat is conducted outside the metal shielding cover, but an electromagnetic interference source can cause interference to the radio frequency device through the radiating hole, and the electromagnetic shielding effect is reduced.
Disclosure of utility model
The utility model aims to overcome the defects and shortcomings in the prior art and provides a heat dissipation shielding assembly and display equipment.
One embodiment of the present utility model provides a heat radiation shield assembly including: circuit board, radiator and support;
The radiator and the support are respectively arranged on two sides of the circuit board and form an electromagnetic shielding cavity together in a surrounding mode, at least one radio frequency device and a conductive structure are arranged on the circuit board, the radio frequency device is located in the electromagnetic shielding cavity, and the conductive structure is arranged around the electromagnetic shielding cavity and is electrically connected with the radiator and the support.
Compared with the prior art, the heat dissipation shielding assembly is wrapped on two sides of the circuit board through the radiator and the support, so that an electromagnetic shielding cavity with high sealing degree is formed, an effective shielding effect is achieved on the radio frequency device, the radiator can also achieve a good heat dissipation effect on the radio frequency device, the conductive part on the circuit board also assists in achieving the effective shielding effect, in addition, the radiator and the support can form a complete grounding loop through the conductive part, and the anti-interference capability and reliability of the electromagnetic shielding cavity are improved.
In some optional embodiments, the conductive structure includes a first conductive portion and a second conductive portion disposed on two sides of the circuit board, the first conductive portion and the second conductive portion are electrically connected to each other, the first conductive portion and the second conductive portion are all disposed around the electromagnetic shielding cavity, the heat sink is abutted with the first conductive portion, and the support is abutted with the second conductive portion.
In some alternative embodiments, a plurality of radio frequency devices are arranged on the circuit board, a plurality of shielding grooves are arranged on one side of the radiator facing the circuit board, and the shielding grooves cover the outer side of at least one radio frequency device.
In some alternative embodiments, a side of the circuit board facing the heat sink is further provided with a plurality of auxiliary conductive portions, the auxiliary conductive portions being correspondingly arranged around the shielding groove, and the heat sink being electrically connected with the auxiliary conductive portions.
In some optional embodiments, the radio frequency device is a heat source device, or at least one heat source device is further disposed on the circuit board;
And one side of the radiator, which faces the circuit board, is also provided with at least one heat conduction boss, and the heat conduction boss is abutted against the heat source device.
In some alternative embodiments, a thermally conductive member is coupled between the thermally conductive boss and the heat source device.
In some optional embodiments, at least one heat dissipating structure is further disposed on a side of the heat sink away from the circuit board, the heat dissipating structure corresponds to a position of the heat conducting boss, the heat dissipating structure includes a plurality of heat dissipating fins, and the plurality of heat dissipating fins of the same heat dissipating structure are disposed side by side on a side away from the circuit board.
Another embodiment of the present utility model provides a display apparatus including: the panel shell, the display assembly and the heat dissipation shielding assembly are arranged on the panel shell, and a circuit board of the heat dissipation shielding assembly is in signal connection with the display assembly.
In some alternative embodiments, the display device further includes: a plurality of conductive locking members;
The display component and the heat dissipation shielding component are respectively arranged on two sides of the face shell, the conductive locking piece sequentially penetrates through the circuit board, the support and the face shell and then is connected with the display component, and the conductive locking piece is respectively and electrically connected with the conductive structure, the support and the display component.
In some optional embodiments, a plurality of through holes are formed in the face shell, a plurality of fixing bosses are formed on one side, away from the circuit board, of the support, and a plurality of protruding conductive connecting parts are formed on the display component; the part of the fixing boss and/or the part of the conductive connecting part is/are arranged in the through hole in a penetrating way, the conductive connecting part is correspondingly abutted with the fixing boss, and the conductive locking piece correspondingly penetrates through the fixing boss on the bracket and is correspondingly connected with the conductive connecting part of the display assembly.
In order that the utility model may be more clearly understood, specific embodiments thereof will be described below with reference to the accompanying drawings.
Drawings
FIG. 1 is a schematic diagram of a heat dissipation shield assembly according to one embodiment of the present utility model;
FIG. 2 is an exploded view of a heat sink shield assembly according to one embodiment of the present utility model;
FIG. 3 is a cross-sectional view of a heat dissipation shield assembly in accordance with one embodiment of the utility model;
FIG. 4 is a schematic diagram of a circuit board on one side of an embodiment of the present utility model;
FIG. 5 is a schematic diagram of another side of a circuit board according to one embodiment of the utility model;
FIG. 6 is a schematic diagram of a heat sink according to an embodiment of the present utility model;
FIG. 7 is an exploded view of a display device of one embodiment of the present utility model;
fig. 8 is a cross-sectional view of a display device according to an embodiment of the present utility model;
fig. 9 is an enlarged view at a shown in fig. 8.
Reference numerals illustrate:
10. A circuit board; 11. a radio frequency device; 12. a conductive structure; 121. a first conductive portion; 122. a second conductive portion; 13. an auxiliary conductive part; 20. a heat sink; 21. a shielding groove; 22. a thermally conductive boss; 23. a heat radiation fin; 30. a bracket; 31. a fixing boss; 40. an electromagnetic shielding cavity; 50. a face shell; 60. a display assembly; 61. a conductive connection portion; 70. conductive locking piece.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model. In the description of the present utility model, unless otherwise indicated, the meaning of "plurality" is 2 or more, and the meaning of "several" is 1 or more. Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated unless otherwise indicated.
Referring to fig. 1, a schematic structural diagram of a heat dissipation shielding assembly according to an embodiment of the utility model is shown, the heat dissipation shielding assembly includes: a circuit board 10, a heat sink 20 and a bracket 30.
Referring to fig. 2 and 3, fig. 2 is an exploded view of a heat dissipation shielding assembly according to an embodiment of the present utility model, and fig. 3 is a cross-sectional view of a heat dissipation shielding assembly according to an embodiment of the present utility model, wherein a radiator 20 and a bracket 30 are respectively disposed at two sides of a circuit board 10 and together form an electromagnetic shielding cavity 40, and the radiator 20 and the bracket 30 are wrapped at two sides of the circuit board 10 to form an electromagnetic shielding cavity 40 with high sealing degree, so that an effective shielding effect is achieved on a radio frequency device 11 in the electromagnetic shielding cavity 40, and the radio frequency device 11 can be closer to or directly abutted against the radiator 20, so that the heat dissipation effect of the radiator 20 on the radio frequency device 11 is better. In addition, the bracket 30 can also play a role in uniformly spreading heat on the circuit board 10, so that the heat dissipation effect of the circuit board 10 is improved, and the heat on the circuit board 10 is prevented from being locally accumulated.
The circuit board 10 is provided with at least one radio frequency device 11 and a conductive structure 12, the radio frequency device 11 is positioned in the electromagnetic shielding cavity 40, the conductive structure 12 is arranged around the electromagnetic shielding cavity 40, and the conductive part on the circuit board 10 also assists in playing an effective shielding role; in addition, the conductive structure 12 is electrically connected with the radiator 20 and the support 30, so that the conductive part, the radiator 20 and the support 30 can form a complete grounding loop, the anti-interference capability and reliability of the electromagnetic shielding cavity 40 are improved, and the grounding connection is convenient.
Referring to fig. 4 and 5, fig. 4 is a schematic structural view of one side of a circuit board according to an embodiment of the present utility model, fig. 5 is a schematic structural view of the other side of the circuit board according to an embodiment of the present utility model, a specific structure of a conductive portion may be designed according to actual needs, in this embodiment, the conductive structure 12 includes a first conductive portion 121 and a second conductive portion 122 respectively disposed on two sides of the circuit board 10, the first conductive portion 121 and the second conductive portion 122 are electrically connected to each other, the first conductive portion 121 and the second conductive portion 122 are all disposed around the electromagnetic shielding cavity 40, the heat sink 20 abuts against the first conductive portion 121, and the support 30 abuts against the second conductive portion 122. Of course, in other alternative embodiments, the conductive structure 12 may be disposed inside the circuit board 10, and both sides thereof are exposed at both sides of the circuit board 10, so that the heat spreader 20 and the bracket 30 can abut against both sides of the conductive structure 12, respectively; or the conductive structures 12 may be disposed around the edge of the circuit board 10. In addition, it is preferable that the conductive structure 12 is the conductive structure 12 made of copper material, which is not limited to this example.
Preferably, the radiator 20 is made of aluminum alloy or other material which is favorable for heat dissipation, and the bracket 30 can be made of SECC galvanized steel plate or other material which is favorable for heat dissipation and has high strength.
Referring to fig. 6, which is a schematic structural diagram of a radiator according to an embodiment of the present utility model, in some alternative embodiments, a plurality of rf devices 11 are disposed on a circuit board 10, a plurality of shielding slots 21 are disposed on a side of the radiator 20 facing the circuit board 10, the shielding slots 21 are covered on an outer side of at least one rf device 11, and the shielding slots 21 can form separate sub-shielding cavities in an electromagnetic shielding cavity 40, so that the plurality of rf devices 11 can be isolated from each other, and degradation of communication efficiency caused by mutual interference between the rf devices 11 is effectively avoided. The shielding groove 21 and the radio frequency devices 11 are properly arranged according to actual needs, a single radio frequency device 11 can be arranged in the same shielding groove 21, a plurality of radio frequency devices 11 can be arranged at the same time, or part of radio frequency devices 11 can be arranged outside the shielding groove 21. In addition, the rf device 11 is often a high-power heat source device, which generates a large amount of heat, and separating the rf device 11 is also beneficial to the heat dissipation of the heat sink 20, avoiding heat accumulation and improving the heat dissipation efficiency.
In some alternative embodiments, a plurality of auxiliary conductive parts 13 are further disposed on a side of the circuit board 10 facing the radiator 20, the auxiliary conductive parts 13 are correspondingly disposed around the shielding groove 21, the radiator 20 is electrically connected with the auxiliary conductive parts 13, the auxiliary conductive parts 13 can also play a role in shielding to improve anti-interference performance, in this embodiment, the auxiliary conductive parts 13 are abutted against a part of the radiator 20 located around an opening of the shielding groove 21, and part of the auxiliary conductive parts 13 are connected with the first conductive parts 121.
In some alternative embodiments, the rf device 11 is often a high-power heat source device, and generates a large amount of heat, so the rf device 11 is sometimes also a heat source device, and of course, the high-power heat source device is not necessarily the rf device 11, and other types of heat source devices besides the rf device 11 may be disposed on the circuit board 10 according to actual circuit design requirements. In addition, the rf device 11 and other types of heat source devices other than the rf device 11 on the circuit board 10 may exist at the same time.
The radiator 20 is provided with at least one heat conduction boss 22 towards one side of the circuit board 10, the heat conduction boss 22 is abutted against the heat source device, and the heat conduction boss 22 is beneficial to enabling heat generated by the heat source device to be directly conducted onto the radiator 20, so that thermal resistance is reduced, and heat dissipation performance is improved. In the present embodiment, the heat sink 20 is provided with a plurality of heat conduction bosses 22, and the same heat conduction boss 22 abuts against at least one heat source device.
In order to increase the heat transfer efficiency between the heat sink 20 and the heat source device, in some alternative embodiments, a heat transfer member is connected between the heat transfer boss 22 and the heat source device. The heat conducting piece can be made of materials with good heat conducting performance, such as heat conducting gel, heat conducting silica gel and the like.
Because the heat of radiator 20 in heat conduction boss 22 department is more, pile up easily, in order to improve the radiating effect, in some optional embodiments, the side that radiator 20 kept away from circuit board 10 still is provided with at least one heat radiation structure, heat radiation structure corresponds with heat conduction boss 22's position, come to heat radiation structure department after heat source device advances heat conduction boss 22, heat accumulation is avoided through heat radiation structure, heat radiation structure includes a plurality of radiating fins 23, a plurality of radiating fins 23 of same heat radiation structure arrange side by side in the side of keeping away from circuit board 10, radiating fins 23 can improve the area of contact of radiator 20 and air, improve the radiating effect.
Referring to fig. 7, which is an exploded view of a display device according to an embodiment of the present utility model, the heat dissipation shielding assembly described above may be applied to a display device, the display device includes: the panel shell 50, the display assembly 60 and the heat dissipation shielding assembly as described above are arranged on the panel shell 50, and the circuit board 10 of the heat dissipation shielding assembly is in signal connection with the display assembly 60.
Referring to fig. 8 and 9, fig. 8 is a cross-sectional view of a display device according to an embodiment of the present utility model, and fig. 9 is an enlarged view at a shown in fig. 8, in some alternative implementations, the display device further includes a plurality of conductive locking members 70; the display assembly 60 and the heat radiation shielding assembly are respectively disposed at both sides of the panel case 50, the conductive locking member 70 sequentially passes through the circuit board 10, the bracket 30 and the panel case 50 and then is connected with the display assembly 60, and the conductive locking member 70 is electrically connected with the heat sink 20, the conductive structure 12, the bracket 30 and the display assembly 60, respectively. The display assembly 60, the face shell 50, the bracket 30 and the circuit board 10 are locked and fixed in series through the conductive locking piece 70, so that the structure is stable, the overall strength of the display device is higher, good grounding connection is formed, a complete grounding loop is formed, and the anti-interference capability and reliability of a circuit in the electromagnetic shielding cavity 40 are improved. In addition, the surface shell 50 can also separate the heat generated by the circuit board 10 from the heat generated by the display assembly 60, so that the heat generated by the heat source device on the circuit board 10 is prevented from being transmitted to the display assembly 60 or the heat generated by the display assembly 60 is prevented from being transmitted to the circuit board 10, and the heat dissipation is prevented from being influenced. The face shell 50 is generally made of a material with a low thermal conductivity, such as plastic, so as to be beneficial to heat insulation.
In some alternative embodiments, the face shell 50 is provided with a plurality of through holes, the side of the bracket 30 away from the circuit board 10 is provided with a plurality of fixing bosses 31, and the display assembly 60 is provided with a plurality of protruding conductive connecting parts 61; the part of the fixing boss 31 and/or the part of the conductive connecting portion 61 are/is arranged in the through hole in a penetrating manner, so that the positioning bracket 30 and/or the display assembly 60 are facilitated, and in the embodiment, the part of the fixing boss 31 and the part of the conductive connecting portion 61 are/is arranged in the through hole in a penetrating manner. The conductive connecting portion 61 is correspondingly abutted with the fixing boss 31, and the conductive locking member 70 correspondingly penetrates through the fixing boss 31 on the bracket 30 and is correspondingly connected with the conductive connecting portion 61 of the display assembly 60, so that the electrical connection stability of the display assembly 60 and the bracket 30 is improved. The specific structures of the conductive locking member 70 and the conductive connecting portion 61 can be designed according to actual needs, in this embodiment, the conductive locking member 70 is a metal screw, and the conductive connecting portion 61 is a metal stud with a threaded hole.
Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.
Claims (10)
1. A heat dissipation shield assembly, comprising: circuit board, radiator and support;
The radiator and the support are respectively arranged on two sides of the circuit board and form an electromagnetic shielding cavity together in a surrounding mode, at least one radio frequency device and a conductive structure are arranged on the circuit board, the radio frequency device is located in the electromagnetic shielding cavity, and the conductive structure is arranged around the electromagnetic shielding cavity and is electrically connected with the radiator and the support.
2. A heat sink shield assembly as recited in claim 1, wherein: the conductive structure comprises a first conductive part and a second conductive part which are respectively arranged on two sides of the circuit board, the first conductive part and the second conductive part are electrically connected with each other, the first conductive part and the second conductive part are all arranged around the electromagnetic shielding cavity, the radiator is abutted with the first conductive part, and the support is abutted with the second conductive part.
3. A heat sink shield assembly as recited in claim 1, wherein: the circuit board is provided with a plurality of radio frequency devices, one side of the radiator, facing the circuit board, is provided with a plurality of shielding grooves, and the shielding grooves are covered on the outer side of at least one radio frequency device.
4. A heat sink shield assembly according to claim 3, wherein: the side of the circuit board facing the radiator is also provided with a plurality of auxiliary conductive parts, the auxiliary conductive parts are correspondingly arranged around the shielding grooves, and the radiator is electrically connected with the auxiliary conductive parts.
5. A heat sink shielding assembly according to any of claims 1 to 4, wherein: the radio frequency device is a heat source device, or at least one heat source device is arranged on the circuit board;
And one side of the radiator, which faces the circuit board, is also provided with at least one heat conduction boss, and the heat conduction boss is abutted against the heat source device.
6. A heat sink shield assembly as recited in claim 5, wherein: and a heat conducting piece is connected between the heat conducting boss and the heat source device.
7. A heat sink shield assembly as recited in claim 5, wherein: the heat radiator is far away from one side of the circuit board is also provided with at least one heat radiation structure, the heat radiation structure corresponds to the position of the heat conduction boss, the heat radiation structure comprises a plurality of heat radiation fins, and the plurality of heat radiation fins of the same heat radiation structure are arranged side by side at one side far away from the circuit board.
8. A display device, characterized by comprising: a panel housing, a display assembly and a heat dissipation shielding assembly as claimed in any one of claims 1 to 7, said display assembly and said heat dissipation shielding assembly being arranged on said panel housing, a circuit board of said heat dissipation shielding assembly being in signal connection with said display assembly.
9. A display device according to claim 8, further comprising: a plurality of conductive locking members;
The display component and the heat dissipation shielding component are respectively arranged on two sides of the face shell, the conductive locking piece sequentially penetrates through the radiator, the circuit board, the support and the face shell of the heat dissipation shielding component and then is connected with the display component, and the conductive locking piece is respectively and electrically connected with the radiator, the conductive structure, the support and the display component.
10. A display device according to claim 9, characterized in that: the panel shell is provided with a plurality of through holes, one side of the bracket, which is far away from the circuit board, is provided with a plurality of fixing bosses, and the display component is provided with a plurality of protruding conductive connecting parts; the part of the fixing boss and/or the part of the conductive connecting part is/are arranged in the through hole in a penetrating way, the conductive connecting part is correspondingly abutted with the fixing boss, and the conductive locking piece correspondingly penetrates through the fixing boss on the bracket and is correspondingly connected with the conductive connecting part of the display assembly.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322523372.XU CN220823625U (en) | 2023-09-15 | 2023-09-15 | Heat dissipation shielding assembly and display device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322523372.XU CN220823625U (en) | 2023-09-15 | 2023-09-15 | Heat dissipation shielding assembly and display device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220823625U true CN220823625U (en) | 2024-04-19 |
Family
ID=90678776
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322523372.XU Active CN220823625U (en) | 2023-09-15 | 2023-09-15 | Heat dissipation shielding assembly and display device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220823625U (en) |
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2023
- 2023-09-15 CN CN202322523372.XU patent/CN220823625U/en active Active
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| GR01 | Patent grant |