CN218385211U - TO-263 double-core copper sheet welding packaging structure - Google Patents
TO-263 double-core copper sheet welding packaging structure Download PDFInfo
- Publication number
- CN218385211U CN218385211U CN202222123199.XU CN202222123199U CN218385211U CN 218385211 U CN218385211 U CN 218385211U CN 202222123199 U CN202222123199 U CN 202222123199U CN 218385211 U CN218385211 U CN 218385211U
- Authority
- CN
- China
- Prior art keywords
- copper sheet
- frame
- packaging structure
- chip
- heat dissipation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Abstract
The utility model relates TO a semiconductor package field, concretely relates TO TO-263 twin-core copper sheet welding packaging structure, including packaging structure frame and PAD heat dissipation base island, PAD heat dissipation base island sets up on the packaging structure frame, packaging structure frame upside is provided with the waterproof in a wretched state of frame fin, the waterproof in a wretched state's of frame fin upper end is provided with frame fin head, the symmetry is provided with two chips on the PAD heat dissipation base island, and the first half of chip with state and be provided with the copper sheet between the PAD heat dissipation base island, the upper end of chip is provided with copper sheet jumper wire row tin hole, the upper end surface of chip is provided with bilateral copper sheet jumper wire. The bilateral copper sheet wire jumper welded technology of this application can make the on-resistance of product little, and the parasitic capacitance of product is little, can improve electric current and heavy current impact through heavy current and heavy current impact than normal aluminium wire ultrasonic bonding, also can improve the UPH of production simultaneously, can improve the productivity, also can improve the quality of product.
Description
Technical Field
The utility model relates TO a semiconductor package field specifically is a TO-263 two-core copper sheet welding packaging structure.
Background
The semiconductor packaging refers to a process of processing a wafer passing a test according to a product model and a functional requirement to obtain an independent chip. The packaging process comprises the following steps: the wafer from the previous process of the wafer is cut into small chips (Die) after the scribing process, then the cut chips are pasted on the corresponding small islands of the substrate (Lead frame) frame by using tin paste, and the bonding pads (Bond Pad) of the chips are connected to the corresponding pins (Lead) of the substrate by using superfine metal (copper sheet) wires or conductive resin to form a required circuit; and then packaging and protecting the independent wafer by using a plastic shell, carrying out a series of operations after plastic packaging, and carrying out finished product testing after packaging is finished.
The existing packaging structure has large on-resistance after being welded, large parasitic capacitance of a product, and cannot bear large current impact, and the product quality is influenced, so that a person skilled in the art provides a TO-263 dual-core copper sheet welding packaging structure TO solve the problems provided in the background technology.
Disclosure of Invention
An object of the utility model is TO provide a TO-263 two-core copper sheet welding packaging structure TO solve the problem that proposes among the above-mentioned background art.
In order to achieve the above object, the utility model provides a following technical scheme:
the utility model provides a TO-263 twin-core copper sheet welding packaging structure, includes packaging structure frame and PAD heat dissipation base island, PAD heat dissipation base island sets up on the packaging structure frame, packaging structure frame upside is provided with the waterproof in a wretched state of frame fin, the waterproof in a wretched state's of frame fin upper end is provided with frame fin head, the symmetry is provided with two chips on the PAD heat dissipation base island, and the first half of chip with state and be provided with the copper sheet between the PAD heat dissipation base island, the upper end of chip is provided with copper sheet jumper wire and arranges the tin hole, the upper end surface of chip is provided with bilateral copper sheet jumper wire.
As a further aspect of the present invention: the lower end of the chip is provided with a PAD surface of a jumper pin of a copper sheet.
As a further aspect of the present invention: an epoxy material lock hole is arranged in the waterproof tank of the frame radiating fin.
As the utility model discloses further scheme again: the lower end of the chip is symmetrically provided with two chip pins.
As the utility model discloses further scheme again: the contact points of the copper sheet and the pins of the packaging structure frame are designed with fixed grips.
Compared with the prior art, the beneficial effects of the utility model are that:
the bilateral copper sheet wire jumper welded technology can make the on-resistance of the product small, the parasitic capacitance of the product small, and can improve the current and the large current impact compared with normal aluminum wire ultrasonic welding through the large current and the large current impact, and simultaneously can also improve the UPH of production, can improve the productivity, and also can improve the quality of the product.
Drawings
FIG. 1 is a schematic structural diagram of a TO-263 dual-core copper sheet soldering packaging structure.
FIG. 2 is a side view of a TO-263 dual core copper sheet solder package structure.
FIG. 3 is a schematic structural diagram of a chip in a TO-263 dual-core copper sheet soldering package structure.
In the figure: the heat dissipation structure comprises a 1-PAD heat dissipation base island, 2-epoxy material lock holes, 3-chips, 4-copper sheet jumper wire tin-removing holes, 5-jumper wire glue-locking holes, 6-double-side copper sheet jumper wires, 7-copper sheet jumper wire pin PAD surfaces, 8-frame heat dissipation fin waterproof grooves, 9-frame heat dissipation fin heads, 10-lock glue grooves and 11-chip pins.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring TO fig. 1 TO 3, in an embodiment of the present invention, a TO-263 dual-core copper sheet welding package structure includes a package structure frame and a PAD heat dissipation base 1, the PAD heat dissipation base 1 is disposed on the package structure frame, a frame heat dissipation waterproof groove 8 is disposed on an upper side of the package structure frame, a frame heat dissipation head 9 is disposed on an upper end of the frame heat dissipation waterproof groove 8, two chips 3 are symmetrically disposed on the PAD heat dissipation base 1, a copper sheet is disposed between an upper portion of the chip 3 and the PAD heat dissipation base 1, a copper sheet wire jumper wire tin arranging hole 4 is disposed on an upper end of the chip 3, a dual-side copper sheet jumper wire 6 is disposed on an upper end surface of the chip 3,
the lower end of the chip 3 is provided with a PAD surface 7 of a copper sheet jumper pin;
an epoxy material lock hole 2 is arranged in the frame radiating fin waterproof tank 8;
the lower end of the chip 3 is symmetrically provided with two chip pins 11.
The contact point of the copper sheet and the pin of the packaging structure frame is provided with a fixing claw, so that the fixing fastness of the pin can be enhanced.
The chip 3 is arranged on the PAD heat dissipation base island 1, and the two chips 3 and the PAD heat dissipation base island 1 are completely sintered by means of high-temperature solder, so that all PAD electrodes are completely welded; the bonding area of any point in each bonding PAD is completely covered by or overlapped with the bonding PAD area, the chip 3 and the PAD heat dissipation base island 1 are completely combined through high-temperature sintering, meanwhile, the epoxy material lock hole can play a role in exhausting, and the void ratio of the product is reduced through exhausting.
The front surface of the chip 3 is combined with the bilateral copper sheet jumper 6, the back surface of the PAD surface of the copper sheet jumper pin is combined with the PAD of the packaging structure frame pin, and the copper sheet jumper pin and the PAD are connected together after the solder paste is sintered at high temperature to form an electrode. The copper sheet jumper wire tin-arranging hole 4 and the double-side copper sheet jumper wire 6 can improve the melting of tin of the chip and the double-side copper sheet jumper wire, so that the double-side copper sheet jumper wire 6 and the chip 3 are completely melted, the voidage is reduced, the contact area is improved, the copper sheet jumper wire tin-arranging hole 4 mainly leads redundant tin to flow back from the copper sheet jumper wire tin-arranging hole 4, and redundant tin paste of the double-side copper sheet jumper wire 6 and the chip 3 can be reduced.
The copper sheet jumper wire tin-removing hole 4 and the sheet jumper wire glue-locking hole 5 mainly allow an epoxy material to penetrate through the two holes, so that the epoxy material and the double-side copper sheet jumper wire 6 are completely connected together, the bonding force of the epoxy material can be enhanced, and meanwhile, partial stress of the copper sheet can be released.
The epoxy material locking hole can enable the packaging structure frame and the epoxy material to be locked in a reinforcing mode, stress of the epoxy material to the packaging structure frame can be reduced, stress of external force to the chip can be strengthened, and the chip is poor.
The waterproof groove 8 of the frame radiating fin can intercept water, can prevent water from permeating from the head of the frame of the packaging structure, and can improve the reliability of products.
The glue locking groove 10 can strengthen and reduce the stress of the epoxy material to the frame of the packaging structure, and improve the combination degree of the epoxy material to the frame.
The back of the frame radiating fin head 9 is provided with a plurality of round holes with the diameter of 0.6mm, the main purpose of the round holes is to punch grooves corresponding to the round holes on the surface of a copper sheet, when solder paste is melted at high temperature to generate tin water, tin flows through the grooves to flow redundant tin in the middle part out of the round holes, and redundant tin on two sides flows out of the two sides, so that the tin between the copper sheet and a chip is thinner, and the resistance and the capacitance generated by the thickness of the tin are reduced.
The copper sheet jumper wire pin PAD surface 7 and the copper sheet jumper wire tin-discharging hole 4 are provided with 8 grooves on the left side and the right side respectively, tin paste on the copper sheet can be melted at high temperature to generate molten tin, the tin flows through the grooves to flow out the redundant tin in the middle part from the copper sheet jumper wire tin-discharging hole 4, and the redundant tin on the two sides flows out from the two sides, so that the tin between the copper sheet and the chip is thinner, and the resistance and the capacitance generated by the thick tin are reduced.
The bilateral copper sheet wire jumper welded technology can make the on-resistance of the product small, the parasitic capacitance of the product small, and can improve the current and the large current impact compared with normal aluminum wire ultrasonic welding through the large current and the large current impact, and simultaneously can also improve the UPH of production, can improve the productivity, and also can improve the quality of the product.
The above, only be the concrete implementation of the preferred embodiment of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art is in the technical scope of the present invention, according to the technical solution of the present invention and the utility model, the concept of which is equivalent to replace or change, should be covered within the protection scope of the present invention.
Claims (5)
1. A TO-263 dual-core copper sheet welding packaging structure comprises a packaging structure frame and a PAD heat dissipation base island (1),
the PAD heat dissipation base island (1) is arranged on the packaging structure frame,
a frame radiating fin waterproof groove (8) is arranged on the upper side of the frame of the packaging structure, a frame radiating fin head (9) is arranged at the upper end of the frame radiating fin waterproof groove (8),
two chips (3) are symmetrically arranged on the PAD heat dissipation base island (1),
and a copper sheet is arranged between the upper half part of the chip (3) and the PAD heat dissipation base island (1),
the upper end of the chip (3) is provided with a copper sheet jumper wire tin-removing hole (4), and the surface of the upper end of the chip (3) is provided with a bilateral copper sheet jumper wire (6).
2. The TO-263 twin-core copper sheet soldering packaging structure as claimed in claim 1, wherein the lower end of the chip (3) is provided with a copper sheet jumper pin PAD surface (7).
3. The TO-263 two-core copper sheet welding package structure as claimed in claim 1, wherein an epoxy material locking hole (2) is arranged in the frame heat sink waterproof groove (8).
4. The TO-263 twin-core copper sheet soldering packaging structure as claimed in claim 1, wherein the lower end of the chip (3) is symmetrically provided with two chip pins (11).
5. The TO-263 dual core copper sheet solder package structure as claimed in claim 1, wherein the pin contact points of the copper sheet and the frame of the package structure are designed with fixing grips.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222123199.XU CN218385211U (en) | 2022-08-12 | 2022-08-12 | TO-263 double-core copper sheet welding packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222123199.XU CN218385211U (en) | 2022-08-12 | 2022-08-12 | TO-263 double-core copper sheet welding packaging structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218385211U true CN218385211U (en) | 2023-01-24 |
Family
ID=84966775
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222123199.XU Active CN218385211U (en) | 2022-08-12 | 2022-08-12 | TO-263 double-core copper sheet welding packaging structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218385211U (en) |
-
2022
- 2022-08-12 CN CN202222123199.XU patent/CN218385211U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US9087827B2 (en) | Mixed wire semiconductor lead frame package | |
| KR100285664B1 (en) | Stack package and method for fabricating the same | |
| US20110073999A1 (en) | Mixed alloy lead frame for packaging power semiconductor devices and its fabrication method | |
| JPH10275827A (en) | Lead frame for facedown bonding | |
| CN101673790A (en) | Light-emitting diode and manufacturing method thereof | |
| CN208796987U (en) | A kind of lead frame and its ultrathin small shape flip-chip packaged part | |
| CN218385211U (en) | TO-263 double-core copper sheet welding packaging structure | |
| KR100343150B1 (en) | Power semiconductor module with metal terminal, metal terminal manufacturing method of power semiconductor module, and power semiconductor module manufacturing method | |
| CN115172174A (en) | Packaging structure for realizing bonding wires in bare copper area and manufacturing method thereof | |
| CN212848373U (en) | Wafer packaging heat dissipation mechanism | |
| CN103887183B (en) | Gold/gold/silicon eutectic die welding method and transistor | |
| CN106695197A (en) | Welding platform device for semiconductor encapsulation aluminum wire or on aluminum strip bonding machine | |
| CN214588813U (en) | Packaging structure of reverse-bending internal insulation product | |
| CN102142421B (en) | Metal-column chip connecting structure and method without solders | |
| CN206789535U (en) | A kind of fan-out package structure of power electronic devices | |
| CN212991089U (en) | T0-263 frame | |
| CN206605177U (en) | A kind of jig device on semiconductor packages aluminum steel or aluminium strip bonder | |
| CN201345361Y (en) | Lead wire frame | |
| CN110164832A (en) | High-current semiconductor power device | |
| CN110379720A (en) | A kind of production method and IGBT module of DCB liner plate | |
| CN206259343U (en) | The welding structure of sensitive integrated circuits lead is manufactured with plating alloy gold wire | |
| CN211428145U (en) | Laminated chip packaging structure | |
| CN216015357U (en) | Packaging structure of low-internal-resistance ultra-thin power device | |
| CN206921811U (en) | Plate the structure of gold-palladium copper cash encapsulation silicon wheat circuit bonding line | |
| CN219778887U (en) | Heat dissipation plastic package body packaging structure |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |