CN206605177U - A kind of jig device on semiconductor packages aluminum steel or aluminium strip bonder - Google Patents
A kind of jig device on semiconductor packages aluminum steel or aluminium strip bonder Download PDFInfo
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- CN206605177U CN206605177U CN201720241697.0U CN201720241697U CN206605177U CN 206605177 U CN206605177 U CN 206605177U CN 201720241697 U CN201720241697 U CN 201720241697U CN 206605177 U CN206605177 U CN 206605177U
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- copper framework
- copper
- framework
- workbench
- pin
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Abstract
A kind of jig device on semiconductor packages aluminum steel or aluminium strip bonder involved by the utility model, it includes workbench main body, a plurality of alignment pins；The alignment pin that identical quantity is installed in a plurality of positioning hole grooves, positioning hole groove is provided with workbench main body, alignment pin is fixed together to positioning hole groove inside through positioning towed hole on copper framework.In solder bonds, pressure grabs compression copper framework, and plumb joint is moved to pad specified location with soldered aluminum steel or aluminium strip and welded, the pin welding on chip and copper framework together.In the process, cooperated by alignment pin and positioning hole groove and a plurality of pressures grab collective effect and push down copper framework on workbench, make copper framework in the external force by different directions without producing displacement, technical phenomena described in the prior art is avoided to occur, so as to have using the surface quality for being soldered copper framework is improved, the qualification rate of product is improved.
Description
【Technical field】
The present invention relates to a kind of being used on semiconductor packages aluminum steel or aluminium strip bonder for semiconductor die package industry
Jig device.
【Background technology】
With continuing to develop and progressive for society, the demand of terminal electronic product is increasingly popularized along with people,
The requirement more and more higher of quality and volume especially to portable terminal electronic product, power device is compositing terminal electronic product
Indispensable component.In order to the quality that improves portable type electronic product quality requirement and reduce the portable terminal
The volume of electronic product, necessarily the high-performance to the encapsulation technology performance to the power device and described power device is high-precision
More advanced require more is increased in degree, proposition.It is particularly evident in IT trade and portable terminal electronics market,
To so far, silicon technology always is the most important factor for improving power-supply management system performance.Improved to break through silicon technology
Improved and limited by encapsulation performance, it is necessary to improve power semiconductor package technology, corresponding sealed in unit, and it is supporting with encapsulating
Accessory.High-current equipment application in, as voltage regulator module DC/DC converters, notebook computer and circuit board on
Power-supply system installed and used etc..The high-current equipment is to be assembled together structure by the mode of plurality of devices in parallel or series
Into.Packed each resistance and each thermal resistance are minimized, to pass for improving the electric current that individual devices can be born
Important, i.e. the current carrying capability of individual devices is the most important figure of merit.With portable type electronic product current density and size
Raising so that common encapsulation and integrated increasingly become essential in terms of systematic function is improved.Most successful platform
Minimum every Ampere currents cost will be provided, while ensureing the form-factor needed for user, this just matches somebody with somebody to sealed in unit and encapsulation
Part proposes new requirement.However, the bonding techniques of aluminum steel, aluminium strip are essential processes in semiconductor packaging process.It is existing
Traditional aluminum steel, the bonding machines major part of aluminium strip gold thread are all to use conventional table, are coordinated paw to carry out fixed frame.Work
When making, because active force when aluminum steel or aluminium strip are welded by fixed frame Impact direction and plumb joint is inconsistent, copper framework is driven
Often the mobile active force for counteracting soldering tip, causes the surface for being soldered copper framework rosin joint, strain at connection, chip quilt often occur
The technological deficiencies such as breakage, and reduce the surface quality for being soldered copper framework.
【The content of the invention】
In view of this, the technical problems to be solved by the invention are to provide a kind of for semiconductor packages aluminum steel or aluminium strip key
The jig device on machine is closed, the jig device can avoid what is occurred because being soldered copper framework surface in welding
Rosin joint, strain at connection, the impaired technical problem of soldered chip, and the phenomenon for reducing copper framework surface quality occurs.
The technical scheme in above-mentioned technical problem, the present invention is solved for this uses one kind to be used for semiconductor packages aluminum steel
Or the jig device on aluminium strip bonding machines, it includes copper framework, the workbench below copper framework；For welding
A plurality of alignment pins are installed, the alignment pin is positioned on copper framework jointly with workbench on the workbench connect；The work
Making platform includes being used to support copper framework and with the work that limit copper framework is not moved in the case where being acted on by the external force of different directions
Make platform main body；It is provided with a plurality of positioning hole grooves arranged in yi word pattern, the copper framework and sets in described workbench main body
It is equipped with and positioning hole groove mutually corresponding positioning towed hole；The alignment pin is through the positioning towed hole on copper framework, to positioning
Inside hole slot, copper framework is set to be fixed together with workbench；The alignment pin includes pin body, is arranged at pin body one end
Protuberance for protruding copper frame upper surface, the protuberance is shaped as cone or round estrade or ball-crown body；Described is prominent
Go out the height in portion between 1 millimeter to 3 millimeters；The pin body diameter of the alignment pin, arrangement spacing and determining on copper framework
The diameter of position towing pad, arrangement spacing is consistent.
, should according to described in above-mentioned technical characteristics, in addition to for the bonding subsidiary body to copper framework auxiliary positioning
Being bonded subsidiary body includes the guide rail that left and right directions is positioned that is used for installed in copper framework both sides, the welding for welding copper framework
Head, at copper framework top position and grabbed to a plurality of pressures of copper framework stationary positioned.
According to described in above-mentioned technical characteristics, the workbench main body includes one long boss body, is arranged at long boss
The short boss body of body both sides, is respectively arranged at the groove between long boss body both sides and short boss body；The length of the short boss body
Degree is less than the length of long boss body, and the back side of the long boss body two sides and short boss body is formed at lacking for long boss body both sides
Mouthful；At least three positioning hole groove is respectively arranged with above described long boss body and short boss body, the positioning hole groove is located at same
Side, and in yi word pattern arrangement design；The groove is unclosed shape, groove and the long boss body bottom of described long boss body both sides
Portion forms stepped.
According to described in above-mentioned technical characteristics, the copper framework includes copper chassis body, is welded in copper chassis body
The chip in face, for by the signal wire that pin is connected on chip and copper chassis body, the signal wire to include aluminum steel or aluminium strip.
The advantageous effects of the present invention：Because being used for being provided with a plurality of alignment pins on the workbench of welding, the positioning
Pin is positioned on copper framework jointly with workbench；The workbench includes being used to support copper framework and with by not Tongfang
To external force effect is lower and workbench main body that limit copper framework is not moved；It is provided with described workbench main body and a plurality of is in
It is provided with the positioning hole groove of yi word pattern arrangement, the copper framework and positioning hole groove mutually corresponding positioning towed hole；It is described fixed
Position pin to positioning hole groove, makes copper framework be fixed together with workbench through the positioning towed hole on copper framework；It is described
Alignment pin includes pin body, is arranged at the protuberance for being used to protrude copper frame upper surface of pin body one end, the shape of the protuberance
Shape is cone or round estrade or ball-crown body；The height of described protuberance is between 1 millimeter to 3 millimeters；The pin of the alignment pin
Column diameter size, arrangement spacing and the diameter in the positioning towed hole on copper framework, arrangement spacing is consistent.In welding key
During conjunction, the workbench is lifted to the position of setting, and the pressure grabs compression copper framework, plumb joint with soldered aluminum steel or
Aluminium strip is moved to pad specified location and welded, pin welding on chip and copper framework together.In the process, pass through
Alignment pin and the positioning hole groove being arranged on workbench are cooperated, and the copper framework is fixed on into workbench specified location
Place, and a plurality of pressures are grabbed and push down copper framework on workbench, and both are jointly to copper framework stationary positioned so that positioned in work
Make on platform copper framework under by the effect of the external force of different directions without producing displacement, it is to avoid in the prior art in welding
Power is acted when fixing Impact direction with plumb joint welding aluminum steel or aluminium strip because of copper framework inconsistent, and cause copper framework to offset
Or negative function power, and so that the rosin joint that copper framework surface occurs in welding, strain at connection, soldered chip is impaired
Technical phenomena occurs, so as to there is the surface quality for being soldered copper framework using improving, improves the qualification rate of product.In addition, this hair
It is bright that also there is the qualification rate for improving copper framework, cost is reduced, is increased the service life.
With reference to the accompanying drawings and examples, technical scheme is described in further detail.
【Brief description of the drawings】
Fig. 1 is the schematic diagram with the semiconductor encapsulation device for being bonded auxiliary device in the present invention；
Fig. 2 is the schematic diagram in the present invention not with the semiconductor encapsulation device for being bonded auxiliary device；
Fig. 3 for the present invention in be provided with alignment pin workbench main body schematic diagram；
Fig. 4 for the present invention in be not installed with alignment pin workbench main body schematic diagram；
Fig. 5 is the schematic diagram of alignment pin in the present invention.
【Embodiment】
In order that technical problems, technical solutions and advantages to be solved are clearer, clear, tie below
Drawings and examples are closed, the present invention will be described in further detail.It should be appreciated that specific embodiment described herein is only used
To explain the present invention, it is not intended to limit the present invention.
It refer to shown in Fig. 1 to Fig. 5, illustrate a kind of weldering on aluminum steel or aluminium strip bonding machines with reference to embodiment
Stage apparatus is connect, it includes soldered copper framework 1, used bonding subsidiary body during welding, installed in the bottom of copper framework 1
Workbench 2, and the alignment pin 3 on workbench 2.
The workbench 2 include be used for support copper framework 1 and with by the external force of different directions effect under and limit
A plurality of positioning hole grooves 4, the workbench are provided with the workbench main body that copper framework 1 is not moved, described workbench main body
Main body include one long boss body, be arranged at the short boss body of long boss body both sides, be respectively arranged at long boss body both sides with it is short
Groove between boss body.The length of the short boss body be less than long boss body length, the long boss body two sides with it is short
The back side of boss body is formed at the breach of long boss body both sides；It is respectively arranged with above described long boss body and short boss body
At least three positioning hole groove 4, the positioning hole groove 4 is located at the same side, and in yi word pattern arrangement design.The groove is unclosed shape,
The groove of described long boss body both sides forms stepped with long boss body bottom.
The copper framework 1 includes copper chassis body, is welded on the chip 6 above copper chassis body, for by chip 6 and copper
The signal wire 7 that pin is connected in the main body of framework 1, the signal wire 7 includes aluminum steel or aluminium strip.Set in the copper chassis body
There are the diameter dimension size with positioning hole groove 4, arrangement mode, a plurality of positioning towed holes 5 of the mutual Corresponding matching of spacing.It is described
Being bonded subsidiary body includes the guide rail 10 installed in copper framework both sides, the plumb joint 8 for welding copper framework 1, for being placed in copper
At the top position of framework 1 and to the stationary positioned of copper framework 1 a plurality of pressures grab 9.The alignment pin 3 includes pin body, sets
In pin body one end be used for protrude the protuberance of copper frame upper surface, the protuberance is shaped as cone or round estrade or ball
It is preced with body；The height of described protuberance is between 1 millimeter to 3 millimeters.The pin body diameter of the alignment pin 3, arranges spacing
With the diameter in the positioning towed hole 5 on copper framework 1, arrangement spacing is consistent.
Above the described installment work platform 2 of copper framework 1, described alignment pin 3 passes through the positioning towed hole on copper framework 1
5, to workbench 2 on positioning hole groove 4 inside, the copper framework 1 is fixed on above workbench 2.On the alignment pin 3
The protuberance of end part protrudes from a part of distance in the upper surface of copper framework 1.Described chip 6 is welded on the appointed part of copper framework 1,
And aluminum steel or aluminium strip one end are connected with chip 6, aluminum steel or the aluminium strip other end are connected with copper framework 1.The guide rail 10 is placed in work
Make above platform 2, and positioned at the both sides of copper framework 1, the positioning that the guide rail 10 is mainly used for the left and right directions of copper framework 1 is fixed.
One end that described pressure grabs 9 is directly contacted with the surface of copper framework 1, and presses the other end for grabbing 9 to be placed in the top of copper framework 1.Institute
The plumb joint 8 stated is moved to specified location, welded according to soldered position needs.
When copper framework 1 is moved to above the position of workbench 2, workbench 2 rises, and workbench 2 rises to specified
Position, the alignment pin 3 passes through the positioning towed hole 5 of copper framework 1, is inserted into inside described detent 4, in spacing pressure
Pawl 9 and guide rail 10 are used cooperatively down, and copper framework 1 is just connected with whole board.In the present embodiment, the workbench 2
Itself there is limit copper framework 1 under the active force of different directions, copper framework 1 will not be moved, and be coordinated the auxiliary of paw 9 to make
With copper framework 1 does not have any skew under the ul-trasonic irradiation power of plumb joint 8.Being designed with workbench 2 is used for
The positioning hole groove 4 and alignment pin 3 of fixed copper framework 1, the positioning having using the copper framework 1 of different IC specifications itself are led
Draw hole 5 to position.In the process, by being bonded subsidiary body, and workbench 2 and the positioning that is arranged on workbench 2
Pin 3 cooperates, and is positioned at jointly on copper framework 1 so that copper framework 1 forms one with machine.When copper framework 1 and machine are linked to be
When integral, no matter extraneous additional active force is acted on copper framework 1 in that direction from top to bottom, left and right, front and rear, all without making copper
Framework 1 is moved, fundamentally, is solved because being acted in the active force of different directions on copper framework 1, is moved copper framework 1
The problems such as caused rosin joint of copper framework 1, strain at connection, damaged chip.
In summary, because being provided with a plurality of alignment pins 3 on the workbench 2 for welding, the alignment pin is flat with work
Platform 2 is positioned on copper framework 1 jointly；The workbench 2 includes being used to support copper framework 1 and with by the outer of different directions
Power acts on workbench main body lower and that limit copper framework 1 is not moved；It is in a word to be provided with described workbench main body a plurality of
It is provided with the positioning hole groove 4 of type arrangement, the copper framework 1 and the mutually corresponding positioning towed hole 5 of positioning hole groove 4；It is described fixed
Position pin 3 is through the positioning towed hole 5 on copper framework 1, to positioning hole groove 4, copper framework 1 is fixed on one with workbench 2
Rise；The alignment pin 3 includes pin body, is arranged at the protuberance for being used to protrude copper frame upper surface of pin body one end, this is dashed forward
Go out portion is shaped as cone or round estrade or ball-crown body；The height of described protuberance is between 1 millimeter to 3 millimeters；It is described fixed
The pin body diameter of position pin 3, arrangement spacing and the diameter in the positioning towed hole 5 on copper framework 1, arrangement spacing is one
Cause.In solder bonds, the workbench 2 is lifted to the position of setting, and the pressure grabs 9 compression copper frameworks 1, plumb joint 8
Pad specified location is moved to soldered aluminum steel or aluminium strip to be welded, pin welding one on chip 6 and copper framework 7
Rise.In the process, cooperated by alignment pin 3 and the positioning hole groove 4 that is arranged on workbench 2, by the copper framework 1
The specified location of workbench 2 is fixed on, and a plurality of pressures grab 9 and push down copper framework 1 on workbench, both are jointly to copper
The stationary positioned of framework 1 so that positioned on workbench 2 copper framework 1 by the external force of different directions effect under without produce
Displacement, it is to avoid produced when fixing Impact direction with the welding aluminum steel of plumb joint 8 or aluminium strip because of copper framework 1 in welding in the prior art
Raw active force is inconsistent, and causes copper framework 1 to offset or negative function power, and causes what the surface of copper framework 1 occurred in welding
Rosin joint, strain at connection, the impaired technical phenomena of soldered chip occurs, and copper framework 1 is soldered using raising so as to have
Surface quality, improves the qualification rate of product.In addition, the present invention also has the qualification rate for improving copper framework 1, cost is reduced, is prolonged
Long life.
Above by reference to the preferred embodiments of the present invention have been illustrated, not thereby limit to the interest field of the present invention.This
Art personnel do not depart from any modifications, equivalent substitutions and improvements made in the scope of the present invention and essence, all should be at this
Within the interest field of invention.
Claims (4)
1. a kind of jig device on semiconductor packages aluminum steel or aluminium strip bonding machines, it includes copper framework, installs
Workbench below copper framework；It is characterized in that：A plurality of alignment pins are installed on the workbench of welding, this is determined
Position pin is positioned on copper framework jointly with workbench；The workbench includes being used to support copper framework and with by difference
The external force in direction acts on workbench main body lower and that limit copper framework is not moved；It is provided with described workbench main body a plurality of
It is provided with the positioning hole groove arranged in yi word pattern, the copper framework and positioning hole groove mutually corresponding positioning towed hole；It is described
Alignment pin to positioning hole groove, makes copper framework be fixed together with workbench through the positioning towed hole on copper framework；Institute
Stating alignment pin includes pin body, is arranged at the protuberance for being used to protrude copper frame upper surface of pin body one end, the protuberance
It is shaped as cone or round estrade or ball-crown body；The height of described protuberance is between 1 millimeter to 3 millimeters；The alignment pin
Pin body diameter, arrangement spacing and the diameter in the positioning towed hole on copper framework, arrangement spacing is consistent.
2. a kind of jig device on semiconductor packages aluminum steel or aluminium strip bonding machines according to claim 1,
It is characterized in that：Also include being used for the bonding subsidiary body to copper framework auxiliary positioning, the bonding subsidiary body includes being arranged on
The guide rail positioned for left and right directions of copper framework both sides, the plumb joint for welding copper framework, for installed in copper framework
Orientation the place of putting and is grabbed to a plurality of pressures of copper framework stationary positioned.
3. a kind of jig device on semiconductor packages aluminum steel or aluminium strip bonding machines according to claim 1,
It is characterized in that：The workbench main body includes one long boss body, is arranged at the short boss body of long boss body both sides, sets respectively
The groove being placed between long boss body both sides and short boss body；The length of the short boss body is less than the length of long boss body, institute
The back side for stating long boss body two sides and short boss body is formed at the breach of long boss body both sides；Described long boss body and short convex
At least three positioning hole groove is respectively arranged with above stage body, the positioning hole groove is located at the same side, and in yi word pattern arrangement design；
The groove is unclosed shape, and the groove of described long boss body both sides forms stepped with long boss body bottom.
4. a kind of jig device on semiconductor packages aluminum steel or aluminium strip bonding machines according to claim 1,
It is characterized in that：The copper framework includes copper chassis body, is welded on the chip above copper chassis body, for by chip and copper
The signal wire that pin is connected in chassis body, the signal wire includes aluminum steel or aluminium strip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720241697.0U CN206605177U (en) | 2017-03-13 | 2017-03-13 | A kind of jig device on semiconductor packages aluminum steel or aluminium strip bonder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720241697.0U CN206605177U (en) | 2017-03-13 | 2017-03-13 | A kind of jig device on semiconductor packages aluminum steel or aluminium strip bonder |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206605177U true CN206605177U (en) | 2017-11-03 |
Family
ID=60165351
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720241697.0U Withdrawn - After Issue CN206605177U (en) | 2017-03-13 | 2017-03-13 | A kind of jig device on semiconductor packages aluminum steel or aluminium strip bonder |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206605177U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106695197A (en) * | 2017-03-13 | 2017-05-24 | 深圳市鹏程翔实业有限公司 | Welding platform device for semiconductor encapsulation aluminum wire or on aluminum strip bonding machine |
-
2017
- 2017-03-13 CN CN201720241697.0U patent/CN206605177U/en not_active Withdrawn - After Issue
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106695197A (en) * | 2017-03-13 | 2017-05-24 | 深圳市鹏程翔实业有限公司 | Welding platform device for semiconductor encapsulation aluminum wire or on aluminum strip bonding machine |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| AV01 | Patent right actively abandoned |
Granted publication date: 20171103 Effective date of abandoning: 20180814 |
|
| AV01 | Patent right actively abandoned |