CN216250678U - Four-row copper frame single-row bonding mechanism of bonding machine - Google Patents
Four-row copper frame single-row bonding mechanism of bonding machine Download PDFInfo
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- CN216250678U CN216250678U CN202122603449.5U CN202122603449U CN216250678U CN 216250678 U CN216250678 U CN 216250678U CN 202122603449 U CN202122603449 U CN 202122603449U CN 216250678 U CN216250678 U CN 216250678U
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Abstract
The utility model relates to a four-row copper frame single-row bonding mechanism of a bonding machine, which structurally comprises a mounting plate positioned above the middle part of a copper frame material channel, wherein the front end and the rear end of the mounting plate extend to the outer sides of two side surfaces of the copper frame material channel and are respectively connected with an output end of a lifting driving device, a rectangular opening is formed in the middle part of the mounting plate, a plurality of pairs of screw holes are uniformly formed in two sides of the rectangular opening, and four positioning claws are respectively arranged on the mounting plate through a pair of auxiliary screws connected with the screw holes. The utility model has the advantages that: the position that can conveniently adjust whole positioning mechanism, or finely tune each chip and correspond location structure, when the bonding, positioning mechanism goes up and down stably, and each positioning mechanism location is accurate, can effectively improve the bonding quality, and each structure is changed and is overhauld conveniently, and the suitability is high, can effectively satisfy various production needs.
Description
Technical Field
The utility model relates to a four-row copper frame single-row bonding mechanism of a bonding machine, belonging to the technical field of manufacturing of discrete semiconductor devices.
Background
Electronic products are classified into conductors and insulators according to their conductive properties, semiconductors are interposed between the conductors and the insulators, and semiconductor components are classified into discrete and integrated components in a packaging form.
In the manufacturing of semiconductor discrete devices, after a copper frame is bonded, bonding, also called wire bonding, is required to physically connect a chip and a pin, and generally, an aluminum wire or a copper wire is used.
One of the semiconductor discrete device copper frames is of a four-row chip interconnection type, and a positioning mechanism of the copper frame in the prior art has the problem of unstable positioning, so that chip position deviation possibly exists during bonding, and the bonding quality is influenced; and positioning mechanism needs whole change to different model copper frames, and the suitability is relatively poor.
SUMMERY OF THE UTILITY MODEL
The utility model provides a four-row copper frame single-row bonding mechanism of a bonding machine, aiming at overcoming the defects in the prior art, improving the positioning stability, facilitating the replacement of parts of the positioning mechanism and improving the applicability.
The technical solution of the utility model is as follows: four formula copper frame list keying mechanisms of bonder, its structure is including being located the mounting panel in copper frame material way middle part top, and both ends extend to copper frame material way both sides face outside and connect a lift drive device's output respectively around the mounting panel, and open at the mounting panel middle part has the rectangle mouth, and rectangle mouth both sides are evenly opened has a plurality ofly to the screw, and four positioning claws are installed on the mounting panel through a pair of vice screw of connecting the screw respectively.
Preferably, the front end and the rear end of the mounting plate are respectively provided with a main slot hole, a main screw is arranged in each main slot hole, and the mounting plate is detachably connected with the output end of the lifting driving device through the main screw.
Preferably, the positioning claw comprises a positioning claw block and a positioning claw body which are connected with each other, an auxiliary slotted hole is formed in the positioning claw block, a pressing block is arranged above the positioning claw block in a pressing mode, and an auxiliary screw penetrates through a screw hole in the pressing block and the auxiliary slotted hole in the positioning claw block and is connected with the screw hole.
The utility model has the advantages that: the position that can conveniently adjust whole positioning mechanism, or finely tune each chip and correspond location structure, when the bonding, positioning mechanism goes up and down stably, and each positioning mechanism location is accurate, can effectively improve the bonding quality, and each structure is changed and is overhauld conveniently, and the suitability is high, can effectively satisfy various production needs.
Drawings
Fig. 1 is a schematic structural diagram of a four-row copper frame single-row bonding mechanism of a bonding machine according to the present invention.
In the figure, 1 is a copper frame material channel, 2 is a mounting plate, 3 is a rectangular opening, 4 is a main groove hole, 5 is a main screw, 6 is a screw hole, 7 is a positioning claw block, 8 is a positioning claw body, 9 is a pressing block, 10 is a secondary groove hole, and 11 is a secondary screw.
Detailed Description
The present invention will be described in further detail with reference to examples and specific embodiments.
As shown in fig. 1, the four-row copper frame single-row bonding mechanism of the bonding machine structurally comprises a mounting plate 2 located above the middle of a copper frame material channel 1, the front end and the rear end of the mounting plate 2 extend to the outer sides of two side faces of the copper frame material channel 1 and are respectively connected with an output end of a lifting driving device, a rectangular opening 3 is formed in the middle of the mounting plate 2, a plurality of pairs of screw holes 6 are uniformly formed in two sides of the rectangular opening 3, and four positioning claws are respectively mounted on the mounting plate 2 through a pair of auxiliary screws 11 connected with the screw holes 6.
The front end and the rear end of the mounting plate 2 are respectively provided with a main slot hole 4, a main screw 5 is arranged in each main slot hole 4, and the mounting plate 2 is detachably connected with the output end of the lifting driving device through the main screw 5. When the mounting plate needs to be integrally replaced, the main screw 5 is unscrewed, and during mounting, the mounting plate can slide along the main slot hole 4, so that the accuracy of the mounting position is ensured.
The positioning claw comprises a positioning claw block 7 and a positioning claw body 8 which are connected with each other, an auxiliary groove hole 10 is formed in the positioning claw block 7, a pressing block 9 is pressed above the positioning claw block 7, and an auxiliary screw 11 penetrates through a screw hole in the pressing block 9 and the auxiliary groove hole 10 in the positioning claw block 7 and is connected with the screw hole 6.
According to the structure, the position of the mounting plate 2 is determined by connecting the position of the main screw 5 relative to the main slot hole 4 with the output end of the lifting driving device, the position of the positioning claw selects a proper screw hole 6, the positioning claw block 7 is placed to the corresponding position of the mounting plate 2, the pressing block 9 is pressed on the positioning claw block 7 through the auxiliary screw 11, the mounting of the positioning claw is further completed, after the mounting is completed, the lifting driving device drives the whole mounting plate 2 to lift, the positioning claw contacts each chip to perform positioning, then the external bonding mechanism bonds a row of 4 chips, after the external side is bonded, the mounting plate 2 rises, the external conveying mechanism conveys the copper frame forward for a row of chip distance, and the actions are continuously repeated; when the positioning claw needs to be replaced or adjusted, the auxiliary screw 11 is unscrewed.
All the above components are prior art, and those skilled in the art can use any model and existing design that can implement their corresponding functions.
The foregoing is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, various changes and modifications can be made without departing from the inventive concept of the present invention, and these changes and modifications are all within the scope of the present invention.
Claims (3)
1. Four-row type copper frame single-row bonding mechanism of a bonding machine is characterized by comprising a mounting plate (2) located above the middle of a copper frame material channel (1), the front end and the rear end of the mounting plate (2) extend to the outer sides of two side faces of the copper frame material channel (1) and are respectively connected with an output end of a lifting driving device, a rectangular opening (3) is formed in the middle of the mounting plate (2), a plurality of pairs of screw holes (6) are uniformly formed in two sides of the rectangular opening (3), and four positioning claws are respectively installed on the mounting plate (2) through a pair of auxiliary screws (11) connected with the screw holes (6).
2. The four-row copper frame single-row bonding mechanism of the bonding machine as claimed in claim 1, wherein the front end and the rear end of the mounting plate (2) are respectively provided with a main slot hole (4), each main slot hole (4) is internally provided with a main screw (5), and the mounting plate (2) is detachably connected with the output end of the lifting driving device through the main screw (5).
3. The four-row copper frame single-row bonding mechanism of the bonding machine as claimed in claim 1 or 2, wherein the positioning claw comprises a positioning claw block (7) and a positioning claw body (8) which are connected with each other, a secondary slot hole (10) is formed in the positioning claw block (7), a pressing block (9) is pressed above the positioning claw block (7), and a secondary screw (11) penetrates through a screw hole in the pressing block (9) and the secondary slot hole (10) in the positioning claw block (7) and is connected with the screw hole (6).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122603449.5U CN216250678U (en) | 2021-10-27 | 2021-10-27 | Four-row copper frame single-row bonding mechanism of bonding machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122603449.5U CN216250678U (en) | 2021-10-27 | 2021-10-27 | Four-row copper frame single-row bonding mechanism of bonding machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216250678U true CN216250678U (en) | 2022-04-08 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122603449.5U Active CN216250678U (en) | 2021-10-27 | 2021-10-27 | Four-row copper frame single-row bonding mechanism of bonding machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216250678U (en) |
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2021
- 2021-10-27 CN CN202122603449.5U patent/CN216250678U/en active Active
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