CN218167579U

CN218167579U - Cantilever dispensing equipment

Info

Publication number: CN218167579U
Application number: CN202221629060.6U
Authority: CN
Inventors: 佘奕
Original assignee: JIAXING JINGYAN INTELLIGENT EQUIPMENT TECHNOLOGY CO LTD
Current assignee: JIAXING JINGYAN INTELLIGENT EQUIPMENT TECHNOLOGY CO LTD
Priority date: 2022-06-28
Filing date: 2022-06-28
Publication date: 2022-12-30
Anticipated expiration: 2032-06-28

Abstract

The utility model relates to a chip detects and handles technical field and equips, discloses a cantilever point dispensing equipment, including X axle drive platform set up Y axle cantilever unit on the X axle drive platform the front end of Y axle cantilever unit sets up Z axle lift unit, Z axle lift unit connects the point and glues the unit, Y axle cantilever unit sets up Y axle slide rail and Y axle linear electric motor on the sliding plate including setting up the sliding plate on X axle drive platform, sets up Y axle cantilever on Y axle slide rail, Z axle lift unit sets up the front end at Y axle cantilever, the anterior position of Y axle cantilever sets up the lightening hole, the point is glued the unit and is connected on Z axle lift unit. The utility model discloses optimize the structure, promoted the operating efficiency, duplex position point is glued and can is reduced the working distance, improves the repeated positioning accuracy.

Description

Cantilever dispensing equipment

Technical Field

The utility model relates to a chip detection handles and equips technical field, especially relates to a cantilever dispensing equipment.

Background

In the chip detection process, in the wafer dispensing and mounting process, the wafer is dispensed on a lead frame or a substrate, and then the wafer is mounted on a mechanism.

Most mechanisms of the traditional glue dispensing mechanism at present have overlong glue dispensing cantilevers and large self mass, so that the overall structure of the mechanism is large. Referring to the chinese patent "double-point glue mechanism and chip packaging machine" (application number: 201820870500), a double-point glue mechanism is disclosed, which overcomes the problem of the conventional glue mechanism that the length of the equipment is increased in the transverse direction, but because the Z-axis drive is arranged at the rear, a larger driving force needs to be provided to drive the cantilever. In the dispensing process, the camera position and the dispensing position are not on the same straight line, so that 2 steps are required for image recognition and dispensing, and the dispensing efficiency is reduced.

SUMMERY OF THE UTILITY MODEL

The utility model aims at solving the above problem, a cantilever point dispensing equipment is provided, optimizes the structure, has promoted the operating efficiency, and the duplex position point is glued and can be reduced the working distance, improves the repeated positioning accuracy.

The utility model adopts the technical proposal that:

a cantilever dispensing device is characterized by comprising an X-axis driving platform, wherein a Y-axis cantilever unit is arranged on the X-axis driving platform, a Z-axis lifting unit is arranged at the front end of the Y-axis cantilever unit and connected with a dispensing unit, the Y-axis cantilever unit comprises a sliding plate arranged on the X-axis driving platform, a Y-axis sliding rail and a Y-axis linear motor are arranged on the sliding plate, a Y-axis cantilever is arranged on the Y-axis sliding rail, the Z-axis lifting unit is arranged at the front end of the Y-axis cantilever, a lightening hole is arranged at the front part of the Y-axis cantilever and is of a trapezoidal structure with a wide front part and a narrow back part, through holes are arranged at the side edges of the lightening hole towards the two sides of the Y-axis cantilever, a longitudinal groove is formed backwards along the bottom of the Y-axis cantilever below the rear end of the lightening hole, the dispensing unit is connected to the Z-axis lifting unit, the Y-axis cantilever unit performs X-direction displacement on the X-axis driving platform, the Z-axis lifting unit performs Y-direction displacement along with the Y-axis cantilever, and the lifting unit performs Y-direction displacement on a wafer dispensing substrate.

Further, Z axle lift unit is including setting up Z axle linear electric motor perpendicularly, Z axle linear electric motor's active cell is fixed at the front end of Y axle cantilever, Z axle linear electric motor's stator is connected to on moving the base plate, it is fixed with moving the base plate to glue the unit, and when Z axle linear electric motor drive active cell moved, the stator produced relative motion, and the drive moves the base plate and goes up and down, makes the unit of gluing produce elevating movement.

Furthermore, the dispensing unit is connected to the movable substrate through a buffer mechanism, the buffer mechanism comprises a pressure spring seat mounted on the movable substrate, the pressure spring seat is connected to the lower buffer substrate through a pressure spring, a magnet is connected to the lower portion of the buffer substrate, the magnet is fixed to the movable substrate, and the dispensing unit is fixed to the side edge of the buffer substrate.

Further, the buffer substrate is of a hollow structure, the rear side of the buffer substrate is connected to the moving substrate through the roller guide rail, the magnet seat is arranged below the buffer substrate and is arranged on the moving substrate, and the corresponding magnet is arranged between the magnet seat and the buffer substrate.

Furthermore, the X-axis driving platform comprises an X-axis guide rail and an X-axis linear motor, a sliding plate of the Y-axis cantilever unit is arranged on the X-axis guide rail, and a rotor of the X-axis linear motor is fixed with the sliding plate.

Furthermore, two sets of symmetrical Y-axis cantilever units are arranged on the X-axis driving platform, the two sets of Y-axis cantilever units are respectively arranged on the Z-axis lifting units, the two Z-axis lifting units are respectively connected with one set of glue dispensing units, and the two sets of glue dispensing units are arranged in a mirror image manner to form the duplex glue dispensing mechanism.

Furthermore, a height measuring unit is arranged on the outer side of the dispensing unit and is arranged below the movable substrate of the Z-axis lifting unit.

Further, a camera unit is arranged on the rear side of the dispensing unit, and the camera unit is arranged below the moving substrate of the Z-axis lifting unit.

A dispensing process is characterized by comprising the following steps:

firstly, a height measuring unit measures the height of a substrate;

secondly, determining the position of the substrate on the substrate through camera flying shooting;

thirdly, the glue dispensing mechanisms of the two stations are reset to the two sides of the substrate;

and fourthly, synchronously dispensing the glue from the positions at the two sides to the middle position by the glue dispensing mechanisms at the two sides.

Further, in the second step, the flying shooting process of the camera is performed from two sides of the substrate to the middle position.

The utility model has the advantages that:

(1) The camera position and the glue dispensing position are positioned on the same straight line, and in a row of substrate positions in the Y-axis direction of the flying camera, glue dispensing can be simultaneously performed on a row of lead frames or matrixes, so that the running time is saved, and the efficiency is improved;

(2) The dispensing cantilever is optimized to form a weight reduction structure through topology optimization, 50% of weight is reduced under the condition that the strength requirement is guaranteed, and the operation efficiency is improved;

(3) Two point gum stations, a station is glued to a substrate half and is glued, and another station is glued to another half of base, can reduce the working distance, improves repeated positioning accuracy.

Drawings

FIG. 1 is a schematic view of the overall structure of the present invention;

FIG. 2 is a schematic diagram of a double station front view;

FIG. 3 is a schematic diagram of the structure of the X-axis drive platform;

FIG. 4 is an enlarged partial view of one perspective of a single station dispensing apparatus;

FIG. 5 is a partial enlarged view from another perspective relative to FIG. 4;

FIG. 6 is a schematic structural view of a Y-axis cantilever unit;

FIG. 7 is a perspective view of the Y-axis cantilever;

FIG. 8 is a perspective view of another perspective of the Y-axis cantilever;

FIG. 9 is a perspective view of the Z-axis lifting unit and the dispensing unit;

FIG. 10 is a perspective view of the Z-axis lifting unit and the dispensing unit from another view angle;

fig. 11 is a reference diagram of the dispensing process.

The reference numbers in the drawings are respectively:

1. a base platform; 2, supporting the base;

3. a hoisting ring; 4.X shaft drive platform;

5.Y axle suspension unit; a 6.Z shaft lifting unit;

7. a dispensing unit; 8.X axle guide;

9.X shaft linear motor; 10, a sliding plate;

11. Y-axis slide rails; 12.y-axis linear motor;

13. Y-axis cantilever; a lightening hole;

15. through holes are formed; 16, longitudinal grooves;

17. a long groove; 18.z axis linear motor;

19. moving the substrate; 20, a buffer mechanism;

21. a pressure spring seat; 22. A buffer substrate;

23. a magnet; a roller guide rail;

25. a magnet base; 26, a height measuring unit;

27. dispensing a glue head; a camera unit.

Detailed Description

The following describes in detail a specific embodiment of the cantilever dispensing apparatus of the present invention with reference to the accompanying drawings.

Referring to the attached drawing 1, the cantilever dispensing equipment comprises a base platform 1, two sides of the base platform 1 are supported by supporting seats 2, and lifting rings 3 are arranged above two sides of the platform and used for lifting and installing the equipment.

An X-axis driving platform 4 is installed on a base platform 1, a Y-axis cantilever unit 5 is arranged on the X-axis driving platform 4, a Z-axis lifting unit 6,Z is arranged at the front end of the Y-axis cantilever unit 5, an axis lifting unit 6 is connected with a glue dispensing unit 7,Y, the axis cantilever unit 5 carries out X-direction displacement on the X-axis driving platform 4, the Z-axis lifting unit 6 carries out Y-direction displacement along with the Y-axis cantilever unit 5, and a glue dispensing unit 7 is lifted on the Z-axis lifting unit 6 to carry out glue dispensing on a wafer substrate.

Referring to the attached drawing 2,X, two sets of Y-axis suspension arm units 5,Y are arranged on an axis suspension arm unit 5 on an axis driving platform 4, a Z-axis lifting unit 6 and a glue dispensing unit 7,Y are respectively arranged on the axis suspension arm unit 5, the Z-axis lifting unit 6 and the glue dispensing unit 7 are symmetrically arranged in opposite directions, the glue dispensing positions are located on the inner sides of the two, a double-station glue dispensing device is formed, and the double-station glue dispensing can improve the efficiency of point dispensing.

Referring to the attached drawing 3,X, the shaft driving platform 4 is formed by two sliding plates 10 including an X-axis guide rail 8 and an X-axis linear motor 9,Y shaft cantilever unit 5, wherein the two sliding plates 10 are arranged on the X-axis guide rail 8, and a rotor of the X-axis linear motor 9 is fixed with the Y-axis cantilever unit 5. Corresponding to the double-station glue dispensing device, the X-axis linear motors 9 and the X-axis guide rails 8 are provided with two sets of sliding blocks, the two linear motors can share one stator, and the two rotors drive the sliding blocks to perform X-axis direction displacement.

Referring to fig. 4, 5 and 6,Y an axis suspension arm unit 5 includes a sliding plate 10 disposed on an X-axis driving platform 4, a Y-axis sliding rail 11 and a Y-axis linear motor 12 are disposed on the sliding plate 10, a Y-axis suspension arm 13 is disposed on the Y-axis sliding rail 11, a z-axis lifting unit 6 is disposed at a front end of the Y-axis suspension arm 13, a stator of the Y-axis linear motor 12 is mounted inside the sliding plate 10, a mover is connected to a slider on the Y-axis sliding rail 11, the Y-axis suspension arm 13 is mounted on the slider in a matching manner, and the slider is located at a position close to a rear end of the Y-axis suspension arm 13, so that the Y-axis suspension arm 13 extends out by a set length.

Referring to fig. 7 and 8,Y, a lightening hole 14 is arranged at the front part of the axle cantilever 13, the lightening hole 14 is in a trapezoidal structure with a wide front part and a narrow rear part, through holes 15 are arranged at the side edges of the lightening hole 14 towards the two sides of the Y-axis cantilever 13, and a longitudinal groove 16 is formed at the rear part of the bottom of the Y-axis cantilever 13 below the rear end of the lightening hole 14. Elongated slots 17 are also provided on both sides of the Y-axis suspension arm 13 to reduce stress concentration and enhance stiffness. The lightening holes 14 are obtained through topological optimization calculation design, and equipment and weight are greatly reduced under the condition that functions are not reduced.

Referring to fig. 9 and 10, the Z-axis lifting unit 6 includes a Z-axis linear motor 18 vertically disposed, a mover of the Z-axis linear motor 18 is fixed at the front end of the Y-axis suspension arm 13, a stator of the Z-axis linear motor 18 is connected to a movable substrate 19, the dispensing unit 7 is fixed to the movable substrate 19, and when the Z-axis linear motor 18 drives the mover to move, the stator generates relative motion to drive the movable substrate 19 to lift, so that the dispensing unit 7 generates lifting motion. The moving mode can directly reduce the volume of the equipment, and the movement of the stator is converted into the up-and-down lifting of the movable substrate 19, so that the Z-axis lifting unit 6 is driven to lift.

The dispensing unit 7 is connected to the moving substrate 19 through a buffer mechanism 20, the buffer mechanism 20 includes a pressure spring seat 21 mounted on the moving substrate 19, the pressure spring seat 21 is connected to a lower buffer substrate 22 through a pressure spring, a magnet 23 is connected below the buffer substrate 22, the magnet 23 is fixed with the moving substrate 19, and the dispensing unit 7 is fixed on the side of the buffer substrate 22.

The buffer substrate 22 is a hollow structure, the corners inside the hollow structure are rounded, the rear side is connected to the moving substrate 19 through roller guide rails 24, a magnet base 25 is arranged below the buffer substrate 22, the magnet base 25 is mounted on the moving substrate 19, and corresponding magnets 23 are mounted between the magnet base 25 and the buffer substrate 22. When the dispensing unit 7 moves up and down, the dispensing unit 7 is quickly reset by the attraction of the magnet 23 and the pressure spring on the buffer substrate 22, so as to prevent the substrate from being damaged.

A height measuring unit 26 is provided outside the dispensing unit 7, and the height measuring unit 26 is provided below the movable base plate 19 of the Z-axis lifting unit 6. The height measuring unit 26 is used for detecting the flatness of the substrate and confirming the position of the dispensing head 27 in the dispensing process of the dispensing unit 7.

On the rear side of the dispensing unit 7, a camera unit 28 is provided, and the camera unit 28 is provided below the moving substrate 19 of the Z-axis elevating unit 6. In the Y-axis direction, the camera unit 28 and the glue dispensing unit 7 are in the same straight line, so that after the camera takes a row of substrate positions in the Y-axis direction in a flying manner, glue dispensing can be simultaneously performed on a row of lead frames or substrates, the operation time is saved, and the efficiency is improved.

Referring to fig. 11, the substrates are arranged on the base plate, the positions of the substrates are arranged in the X direction, one side is a label AB side, the other side is a CD side, and two dispensing stations are respectively located on both sides of the base plate. The process comprises the following steps:

firstly, the height measuring unit 26 measures the height of the substrate;

secondly, confirming the position of the substrate on the substrate through the flying shooting of the camera, wherein the flying shooting process of the camera is carried out towards two sides in the middle;

thirdly, the glue dispensing mechanisms of the two stations are respectively reset to the AB and CD sides of the substrate;

and fourthly, synchronously dispensing from the two side positions to the middle position by the two side dispensing mechanisms respectively.

The above is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, a plurality of improvements and decorations can be made without departing from the principle of the present invention, and these improvements and decorations should also be regarded as the protection scope of the present invention.

Claims

1. The utility model provides a cantilever adhesive deposite equipment which characterized in that: the wafer dispensing device comprises an X-axis driving platform, wherein a Y-axis cantilever unit is arranged on the X-axis driving platform, a Z-axis lifting unit is arranged at the front end of the Y-axis cantilever unit and connected with a dispensing unit, the Y-axis cantilever unit comprises a sliding plate arranged on the X-axis driving platform, a Y-axis sliding rail and a Y-axis linear motor are arranged on the sliding plate, a Y-axis cantilever is arranged on the Y-axis sliding rail, the Z-axis lifting unit is arranged at the front end of the Y-axis cantilever, a lightening hole is arranged at the front part of the Y-axis cantilever and is of a trapezoidal structure with a wide front part and a narrow back part, through holes are arranged at the two sides of the lightening hole towards the Y-axis cantilever, a longitudinal groove is formed backwards along the bottom of the Y-axis cantilever below the rear end of the lightening hole, the dispensing unit is connected on the Z-axis lifting unit, the Y-axis cantilever unit performs X-direction displacement on the X-axis driving platform, the Z-axis lifting unit performs Y-direction displacement along with the Y-axis cantilever, and the lifting unit performs Y-direction displacement on the Z-axis lifting unit to perform dispensing on the wafer substrate.

2. The cantilever dispensing apparatus of claim 1, wherein: z axle lift unit is including setting up Z axle linear electric motor perpendicularly, Z axle linear electric motor's active cell is fixed at the front end of Y axle cantilever, Z axle linear electric motor's stator is connected to on the removal base plate, the unit is fixed with the removal base plate to some glue, and when Z axle linear electric motor drive active cell moved, the stator produced relative motion, and the drive removes the base plate and goes up and down, makes some glue the unit and produce elevating movement.

3. The cantilever dispensing apparatus of claim 2, wherein: the dispensing unit is connected to the movable substrate through a buffer mechanism, the buffer mechanism comprises a pressure spring seat mounted on the movable substrate, the pressure spring seat is connected to the lower buffer substrate through a pressure spring, a magnet is connected to the lower portion of the buffer substrate, the magnet is fixed to the movable substrate, and the dispensing unit is fixed to the side edge of the buffer substrate.

4. The cantilever dispensing apparatus of claim 3, wherein: the buffer substrate is of a hollow structure, the rear side of the buffer substrate is connected to the movable substrate through the roller guide rail, the magnet seat is arranged below the buffer substrate and is arranged on the movable substrate, and the corresponding magnet is arranged between the magnet seat and the buffer substrate.

5. The cantilever dispensing apparatus of claim 1, wherein: the X-axis driving platform comprises an X-axis guide rail and an X-axis linear motor, a sliding plate of the Y-axis cantilever unit is arranged on the X-axis guide rail, and a rotor of the X-axis linear motor is fixed with the sliding plate.

6. The cantilever dispensing apparatus of claim 5, wherein: the X-axis driving platform is provided with two sets of symmetrical Y-axis suspension arm units, the two sets of Y-axis suspension arm units are respectively provided with the Z-axis lifting units, the two Z-axis lifting units are respectively connected with one set of glue dispensing unit, and the two sets of glue dispensing units are arranged in a mirror image mode to form the duplex point glue dispensing mechanism.

7. The cantilever spot-dispensing apparatus according to any one of claims 1 to 6, wherein: and a height measuring unit is arranged at the outer side of the dispensing unit and is arranged below the movable substrate of the Z-axis lifting unit.

8. The cantilever dispensing apparatus of claim 7, wherein: and a camera unit is arranged at the rear side of the dispensing unit and is arranged below the movable substrate of the Z-axis lifting unit.