CN217890643U - Vacuum chuck for polishing processed silicon wafer - Google Patents
Vacuum chuck for polishing processed silicon wafer Download PDFInfo
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- CN217890643U CN217890643U CN202221796960.XU CN202221796960U CN217890643U CN 217890643 U CN217890643 U CN 217890643U CN 202221796960 U CN202221796960 U CN 202221796960U CN 217890643 U CN217890643 U CN 217890643U
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- adsorption disc
- adsorption
- silicon wafer
- sealing ring
- polishing
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Abstract
The utility model discloses a vacuum chuck for polishing a processed silicon wafer, which comprises an adsorption disc, a sealing ring positioned outside the adsorption disc and a fixing device for fixing the adsorption disc and the sealing ring; the adsorption disc is provided with a vacuum connecting port, and the lower surface of the adsorption disc is provided with a plurality of breathable adsorption holes communicated with the vacuum connecting port; the lower surface of the sealing ring is consistent with the lower surface of the adsorption disc in height or slightly lower than the lower surface of the adsorption disc, and is used for sealing the vacuum of the adsorption disc; the adsorption disc can adsorb articles through the breathable adsorption holes under the action of the sealing ring.
Description
Technical Field
The utility model belongs to the technical field of silicon chip processing, concretely relates to vacuum chuck of processing silicon chip polishing usefulness.
Background
In the process of processing and manufacturing the polished silicon wafer, after the unpolished silicon wafer is attached to a carrier, the polished silicon wafer needs to be taken out by a manipulator and transported to an 8-inch single wafer type polishing machine for polishing, the quality of a vacuum chuck on the manipulator is particularly important at the moment, and the carrier (ceramic plate) attached with the silicon wafer needs to be adsorbed and transported from a chip mounting area to a polishing area by the vacuum chuck by the manipulator, so the reliability of the vacuum chuck directly influences the productivity and the quality.
In the prior art, a vacuum sucker generally comprises an inner fixed disk and an outer inverted V-shaped outer disk, the inverted V-shaped outer disk and the inner fixed disk are generally bonded together, and after the vacuum sucker is used for a period of time, glue is easily broken, degummed or damaged, so that vacuum sealing cannot be effectively maintained, carriers cannot be well adsorbed, mechanical arms can alarm, and normal production is affected.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing a vacuum chuck for processing silicon chip polishing for solving the deficiency of the prior art.
The purpose of the utility model is realized by the following technical scheme:
a vacuum chuck for polishing a processed silicon wafer comprises an adsorption disc, a sealing ring positioned on the outer side of the adsorption disc and a fixing device for fixing the adsorption disc and the sealing ring;
the adsorption disc is provided with a vacuum connecting port, and the lower surface of the adsorption disc is provided with a plurality of breathable adsorption holes communicated with the vacuum connecting port;
the lower surface of the sealing ring is consistent with the lower surface of the adsorption disc in height or slightly lower than the lower surface of the adsorption disc, and is used for sealing the vacuum of the adsorption disc; the adsorption disc can adsorb articles through the breathable adsorption holes under the action of the sealing ring.
Preferably, the peripheral surface of the adsorption disc is provided with an annular clamping groove, and an upper side wall and a lower side wall which are positioned at the upper side and the lower side of the clamping groove;
the sealing ring sequentially comprises a connecting part and a sealing part from top to bottom, and axial through holes are formed in the connecting part and the sealing part, so that the connecting part and the sealing part can be respectively sleeved on the outer sides of the clamping groove and the lower side wall;
the fixing device is a U-shaped fixing buckle;
when the clamping groove is matched with the connecting part, two ends of the U-shaped fixing buckle are respectively abutted against the upper surface of the upper side wall and the lower surface of the connecting part, and the adsorption disc and the sealing ring are clamped and fixed.
Preferably, the U-shaped fixing buckles are a plurality of and are evenly distributed along the circumferential direction of the adsorption disc.
Preferably, the upper side wall is fixedly connected with one end of the U-shaped fixing buckle through a screw.
Preferably, the outer section of the sealing part is in an inverted V shape, and the diameter of the axial through hole inside the sealing part is gradually increased from top to bottom.
Preferably, the U-shaped fixing buckle is made of stainless steel.
Preferably, the height of the lower surface of the sealing ring is slightly lower than that of the lower surface of the adsorption disc, and when an article is adsorbed, the lower surface of the sealing ring contracts upwards under the pressing action and is positioned on the same horizontal plane with the lower surface of the adsorption disc.
Preferably, the adsorption disc is made of plastic, and the sealing ring is made of rubber.
The utility model provides a vacuum chuck can effectively reduce equipment failure rate, and then promotes the burnishing machine productivity and improves product quality, has better practical popularization and application and worth.
Drawings
Fig. 1 is a schematic structural diagram of an adsorption plate in a vacuum chuck provided by the present invention;
fig. 2 is a schematic structural diagram of a sealing ring in a vacuum chuck according to the present invention;
fig. 3 is a schematic perspective view of the vacuum chuck provided by the present invention;
fig. 4 is a schematic front view of the vacuum chuck according to the present invention;
fig. 5 is a schematic perspective view of the vacuum chuck at another viewing angle according to the present invention;
wherein, 1-an adsorption disc; 2, sealing rings; 3-U-shaped fixing buckles; 4-a connecting, guiding assembly; 5-upper side wall; 6-lower side wall; 7-a clamping groove; 8-a connecting part; 9-a sealing part; 10-air permeable adsorption holes; 11-screw.
Detailed Description
The utility model provides a vacuum chuck for polishing a processed silicon wafer, which comprises an adsorption disc 1, a sealing ring 2 positioned outside the adsorption disc and a fixing device for fixing the adsorption disc 1 and the sealing ring, as shown in figures 1-5;
the adsorption disc 1 is provided with a vacuum connecting port, and the lower surface of the adsorption disc is provided with a plurality of air-permeable adsorption holes 10 communicated with the vacuum connecting port;
the lower surface of the sealing ring 2 is consistent with the lower surface of the adsorption disc 1 in height or slightly lower than the lower surface of the adsorption disc 1, and is used for sealing the vacuum of the adsorption disc 1; the adsorption disc 1 can adsorb articles through the air-permeable adsorption holes under the action of the sealing ring 2.
The utility model discloses during the use, with adsorbing the dish upper end with be connected, current parts such as direction subassembly are connected, install on the manipulator, and make vacuum connector and vacuum apparatus intercommunication, under the sealing effect of outside sealing washer, through the evacuation, distribute in the ventilative absorption hole of adsorbing the dish lower surface and enlarge the vacuum action scope in whole sucking disc, thereby can make the adsorption dish firmly snatch silicon chip carrier (ceramic dish), and fixing device can be in the same place sealing washer 2 and 1 zonulae occludens of adsorption dish, guarantee that sealing washer 2 can not break away from adsorption dish 1, the difficult leakage in vacuum, thereby the sucking disc reliability has been strengthened.
As one preferred embodiment, the peripheral surface of the adsorption disc 2 is provided with an annular clamping groove 7, and an upper side wall 5 and a lower side wall 6 which are positioned at the upper side and the lower side of the clamping groove;
the sealing ring sequentially comprises a connecting part 8 and a sealing part 9 from top to bottom, and axial through holes are formed in the connecting part and the sealing part, so that the connecting part 8 and the sealing part 9 can be respectively sleeved on the outer sides of the clamping groove and the lower side wall; the fixing device is a U-shaped fixing buckle 3;
when the draw-in groove and connecting portion cooperate, the both ends of the fixed buckle of U type butt respectively in last lateral wall upper surface and connecting portion lower surface, will adsorb dish and sealing washer clamp tightly fixed.
Of course, other fixing devices can be used to fix the sealing ring and the adsorption disc, for example, connecting threads are arranged on the inner side wall of the upper part of the sealing ring and the outer peripheral surface of the adsorption disc, and the sealing ring and the adsorption disc are connected through threads.
Further preferably, the U-shaped fixing buckles 3 are uniformly distributed along the circumferential direction of the adsorption disc.
Preferably, the upper side wall is fixedly connected with one end of the U-shaped fixing buckle through a screw 11, so that the U-shaped fixing buckle can be prevented from falling off.
Preferably, the outer section of the sealing part is in an inverted V shape, and the diameter of the axial through hole inside the sealing part is gradually increased from top to bottom.
Preferably, the lower surface of the sealing ring is slightly lower than the lower surface of the adsorption disc, when an article is adsorbed, the lower surface of the sealing ring can contract upwards under the pressing action, is in close contact with the article and is positioned on the same horizontal plane with the lower surface of the adsorption disc, and therefore the adsorption disc and the article are well sealed.
Preferably, the adsorption disc material is plastics, and the sealing washer material is rubber, and the fixed buckle of U type adopts stainless steel.
While the preferred embodiments of the present invention have been described, additional variations and modifications in those embodiments may occur to those skilled in the art once they learn of the basic inventive concepts. It is therefore intended that the appended claims be interpreted as including the preferred embodiment and all such alterations and modifications as fall within the scope of the invention. It will be apparent to those skilled in the art that various changes and modifications may be made without departing from the spirit and scope of the invention. Thus, if such modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include such modifications and variations.
Claims (8)
1. A vacuum chuck for polishing a processed silicon wafer is characterized by comprising an adsorption disc, a sealing ring positioned on the outer side of the adsorption disc and a fixing device for fixing the adsorption disc and the sealing ring;
the adsorption disc is provided with a vacuum connecting port, and the lower surface of the adsorption disc is provided with a plurality of breathable adsorption holes communicated with the vacuum connecting port;
the lower surface of the sealing ring is consistent with the lower surface of the adsorption disc in height or slightly lower than the lower surface of the adsorption disc, and is used for sealing the vacuum of the adsorption disc; the adsorption disc can adsorb articles through the breathable adsorption holes under the action of the sealing ring.
2. The vacuum chuck for polishing a processed silicon wafer as claimed in claim 1,
the peripheral surface of the adsorption disc is provided with an annular clamping groove, and an upper side wall and a lower side wall which are positioned at the upper side and the lower side of the clamping groove;
the sealing ring sequentially comprises a connecting part and a sealing part from top to bottom, and axial through holes are formed in the connecting part and the sealing part, so that the connecting part and the sealing part can be respectively sleeved on the outer sides of the clamping groove and the lower side wall;
the fixing device is a U-shaped fixing buckle;
when the clamping groove is matched with the connecting part, two ends of the U-shaped fixing buckle are respectively abutted against the upper surface of the upper side wall and the lower surface of the connecting part, so that the adsorption disc and the sealing ring are clamped and fixed.
3. The vacuum chuck for polishing a processed silicon wafer as claimed in claim 2,
the U-shaped fixing buckles are multiple and are evenly distributed along the circumferential direction of the adsorption disc.
4. The vacuum chuck for polishing a processed silicon wafer as claimed in claim 2,
the upper side wall is fixedly connected with one end of the U-shaped fixing buckle through a screw.
5. The vacuum chuck for polishing a processed silicon wafer as claimed in claim 2,
the outer cross-section of sealing portion is the type of falling V, and its inside axial through-hole's aperture from top to bottom also increases gradually.
6. The vacuum chuck for polishing a processed silicon wafer as claimed in claim 2,
the U-shaped fixing buckle is made of stainless steel.
7. The vacuum chuck for polishing a processed silicon wafer as claimed in claim 1,
the lower surface height of sealing washer slightly is less than the lower surface of adsorption disc, when adsorbing article, the lower surface of sealing washer upwards contracts under the pressure effect, with the lower surface of adsorption disc is in same horizontal plane.
8. The vacuum chuck for polishing a processed silicon wafer as claimed in claim 1,
the material of the adsorption disc is plastic, and the material of the sealing ring is rubber.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221796960.XU CN217890643U (en) | 2022-07-13 | 2022-07-13 | Vacuum chuck for polishing processed silicon wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221796960.XU CN217890643U (en) | 2022-07-13 | 2022-07-13 | Vacuum chuck for polishing processed silicon wafer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217890643U true CN217890643U (en) | 2022-11-25 |
Family
ID=84134353
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202221796960.XU Active CN217890643U (en) | 2022-07-13 | 2022-07-13 | Vacuum chuck for polishing processed silicon wafer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217890643U (en) |
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2022
- 2022-07-13 CN CN202221796960.XU patent/CN217890643U/en active Active
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