CN217847913U

CN217847913U - Single-hole adsorption wafer taking device

Info

Publication number: CN217847913U
Application number: CN202221706332.8U
Authority: CN
Inventors: 王光英
Original assignee: Zibo Lvnengxinchuang Electronic Technology Co ltd
Current assignee: Zibo Lvnengxinchuang Electronic Technology Co ltd
Priority date: 2022-07-04
Filing date: 2022-07-04
Publication date: 2022-11-18
Anticipated expiration: 2032-07-04

Abstract

The utility model provides a single-hole adsorption wafer taking device relating to the field of wafer taking and placing, which comprises a vacuum adsorption hole, a contact ring and a ROBOT arm, wherein one end of the ROBOT arm is provided with the vacuum adsorption hole, the contact ring is connected to the outer side of the vacuum adsorption hole, and the contact ring is connected to the ROBOT arm; the vacuum adsorption hole is positioned in the middle of the contact ring, and the upper surface of the contact ring is protruded out of the upper surface of the vacuum adsorption hole. The utility model discloses the salient design of well contact ring makes wafer and contact surface contact to reduce the area of contact of wafer and arm, changed the looks and increased the vacuum adsorption capacity of processing procedure, solved when getting the wafer because the problem of the processing procedure vacuum disconnection that wafer deformation leads to, thereby reduced the alarm rate.

Description

Single-hole adsorption wafer taking device

Technical Field

The utility model relates to a wafer is got and is put the field, specifically, relates to the adsorbed wafer device of getting of haplopore.

Background

When the wafer is placed in the chamber for processing, the wafer can generate deformation with different degrees after being heated in the chamber. Particularly, the deformation of a thin wafer generated after heating is large, and when an arm of the ROBOT takes a wafer from the chamber after the process is finished, the arm and the wafer are not in tight contact due to the deformation of the wafer, a gap is generated, the vacuum of the process is disconnected, and an alarm is caused.

The patent literature search of the prior art finds that the Chinese utility model has a patent publication number of CN216528821U, discloses a movable wafer taking and placing device, and belongs to the field of wafer taking and placing. Comprises a sucker body, an adhesive layer, a grid layer and an elastic adsorption layer; the center of the sucker body is provided with an air suction hole, and the adhesion layer is arranged on the sucker body at the periphery of the air suction hole and is used for adhering to the fixing part of the elastic adsorption layer; the wafer adsorption part of the elastic adsorption layer is suspended above the air suction hole, and the grid layer is arranged between the wafer adsorption part of the elastic adsorption layer and the sucker body; the size of the grid layer is smaller than the area of the contact surface of the wafer. In the utility model, when the wafer needs to be moved, taken and placed, the elastic adsorption layer is contacted with the wafer, a large number of independent negative pressure regions can be formed between the wafer and the elastic adsorption layer, and the wafer is firmly adsorbed; when the wafer is unloaded, air between the elastic adsorption layer and the sucker body is pumped away only through the air suction holes in the sucker body, the elastic adsorption layer can be adsorbed into grids of the grid layer, surface contact is changed into point contact, and the wafer can be unloaded stably. Therefore, the method disclosed in the document and the present invention belong to different inventive concepts.

SUMMERY OF THE UTILITY MODEL

To the defect among the prior art, the utility model aims at providing a wafer device is got to single-hole absorption.

According to the utility model provides a single-hole adsorption get wafer device, including vacuum adsorption hole, contact ring and ROBOT arm, ROBOT arm one end is equipped with the vacuum adsorption hole, the contact ring is connected in the vacuum adsorption hole outside, and the contact ring is connected on ROBOT arm;

the vacuum adsorption hole is positioned in the middle of the contact ring, and the upper surface of the contact ring is protruded out of the upper surface of the vacuum adsorption hole.

In some embodiments, the inner side of the contact ring is in an inward concave structure.

In some embodiments, the vacuum chucking holes are concentric with the contact ring.

In some embodiments, the ROBOT arm is provided with a contact surface between the vacuum chucking hole and the contact ring.

In some embodiments, the upper surface of the vacuum suction hole and the upper surface of the contact surface are located on the same horizontal line, and the upper surface of the contact ring is protruded from the upper surface of the contact surface.

In some embodiments, the number of vacuum suction holes is one.

In some embodiments, both ends of the ROBOT arm are rounded.

In some embodiments, the ROBOT arm includes a first section and a second section, the first section having a diameter less than a diameter of the second section, and the contact ring is located at the first section.

Compared with the prior art, the utility model discloses following beneficial effect has:

the utility model discloses the salient design of well contact ring makes wafer and contact surface contact to reduce the area of contact of wafer and arm, changed the looks and increased the vacuum adsorption efficiency of processing procedure, solved when getting the wafer because the problem of the processing procedure vacuum disconnection that wafer deformation leads to, thereby reduce the alarm rate.

Drawings

Other features, objects and advantages of the invention will become more apparent upon reading of the detailed description of non-limiting embodiments with reference to the following drawings:

fig. 1 is a schematic structural view of the present invention;

fig. 2 is a side view of the present invention;

fig. 3 is a top view of the present invention.

The reference numbers in the figures:

vacuum adsorption hole 1, contact ring 2, ROBOT arm 3, contact surface 31.

Detailed Description

The present invention will be described in detail with reference to specific embodiments. The following examples will assist those skilled in the art in further understanding the present invention, but are not intended to limit the invention in any way. It should be noted that various changes and modifications can be made by one skilled in the art without departing from the spirit of the invention. These all belong to the protection scope of the present invention.

Example 1

The utility model provides a wafer device is got to adsorbed of haplopore, including vacuum adsorption hole 1, contact ring 2 and ROBOT arm 3, ROBOT arm 3 serves and is equipped with a vacuum adsorption hole 1, and corresponding contact ring 2 is connected in the 1 outside in vacuum adsorption hole, and contact ring 2 is connected on ROBOT arm 3.

A contact surface 31 on the ROBOT arm 3 is arranged between the vacuum adsorption hole 1 and the contact ring 2, and the wafer is connected with the contact surface 3 in the adsorption process. Preferably, both ends of the ROBOT arm 3 are arc-shaped; the ROBOT arm 3 comprises a first section and a second section, the first section having a smaller diameter than the second section, the contact ring 2 being located at the first section. The vacuum adsorption hole 1 is positioned in the middle of the contact ring 2, and the inner side of the contact ring 2 is of an inward concave structure. Preferably, the vacuum adsorption hole 1 is concentric with the contact ring 2.

Principle of operation: under the condition that the vacuum negative pressure of the manufacturing process is not changed, the contact area between the wafer and the ROBOT arm 3 is reduced, namely the contact surfaces 3 are all adsorbed parts, so that the area of the adsorbed parts is increased; therefore, if the process vacuum pressure is maintained, the force during the adsorption is also increased, and the adsorption capacity of the single-hole adsorption structure is increased after the adsorption force is increased.

Example 2

This embodiment 2 is completed based on embodiment 1, and the contact ring 2 and the vacuum absorption hole 1 have a certain height difference, so that the wafer is in the contact surface 3, thereby reducing the contact area between the wafer and the ROBOT arm 3, specifically:

the upper surface of the vacuum adsorption hole 1 and the upper surface of the contact surface 31 are located on the same horizontal line, and the upper surface of the contact ring 2 protrudes from the horizontal plane of the contact surface 31, so that the upper surface of the contact ring 2 protrudes from the upper surface of the vacuum adsorption hole 1, thereby causing a certain height difference. During the adsorption process, the wafer is only contacted in the contact surface 3, thereby reducing the contact area between the wafer and the ROBOT arm 3.

In the description of the present application, it is to be understood that the terms "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience in describing the present application and simplifying the description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present application.

The foregoing description of the specific embodiments of the invention has been presented. It is to be understood that the present invention is not limited to the specific embodiments described above, and that various changes or modifications may be made by one skilled in the art within the scope of the appended claims without departing from the essential spirit of the invention. The embodiments and features of the embodiments of the present application may be combined with each other arbitrarily without conflict.

Claims

1. The single-hole adsorption wafer taking device is characterized by comprising a vacuum adsorption hole (1), a contact ring (2) and a ROBOT arm (3), wherein the vacuum adsorption hole (1) is formed in one end of the ROBOT arm (3), the contact ring (2) is connected to the outer side of the vacuum adsorption hole (1), and the contact ring (2) is connected to the ROBOT arm (3);

the vacuum adsorption hole (1) is located in the middle of the contact ring (2), and the upper surface of the contact ring (2) is protruded from the upper surface of the vacuum adsorption hole (1).

2. The single-hole adsorption wafer taking device as claimed in claim 1, wherein the contact ring (2) is inwardly concave.

3. The single-hole adsorption wafer taking device according to claim 1, wherein the vacuum adsorption hole (1) is concentric with the contact ring (2).

4. The single-hole adsorption wafer taking device according to claim 1, wherein the ROBOT arm (3) is provided with a contact surface (31), and the contact surface (31) is located between the vacuum adsorption hole (1) and the contact ring (2).

5. The single-hole adsorption wafer taking device according to claim 4, wherein the upper surface of the vacuum adsorption hole (1) and the upper surface of the contact surface (31) are located on the same horizontal line, and the upper surface of the contact ring (2) is convex to the upper surface of the contact surface (31).

6. The single-hole adsorption wafer taking device as claimed in claim 1, wherein the number of the vacuum adsorption holes (1) is one.

7. The single-hole adsorption wafer taking device as claimed in claim 1, wherein both ends of the ROBOT arm (3) are arc-shaped.

8. The single-hole adsorption wafer fetching device of claim 1, wherein the ROBOT arm (3) comprises a first section and a second section, the diameter of the first section is smaller than that of the second section, and the contact ring (2) is located at the first section.