CN213531154U

CN213531154U - Vacuum chuck clamp for performing soldering lug

Info

Publication number: CN213531154U
Application number: CN202022426958.0U
Authority: CN
Inventors: 顾欣奕
Original assignee: Suzhou Qiweixin Electronic Technology Co ltd
Current assignee: Suzhou Qiweixin Electronic Technology Co ltd
Priority date: 2020-10-28
Filing date: 2020-10-28
Publication date: 2021-06-25
Anticipated expiration: 2030-10-28

Abstract

The utility model discloses a vacuum chuck clamp for preforming soldering lugs, which comprises a bottom shell, wherein an adsorption mechanism is arranged inside the bottom shell; the adsorption mechanism comprises a circular hole, a square hole, a circular sucker, a square sucker, a vacuum pump, a first vacuum tube and a second vacuum tube; four groups of round holes are formed in the front side of the bottom shell, four round holes are formed in each group, circular suckers are fixedly connected inside the round holes, four square holes are formed between the round holes, and square suckers are fixedly connected inside the square holes. The utility model discloses a circular sucking disc and square sucking disc and four vacuum pumps on the drain pan can divide into four groups with adsorption equipment to every group divide into a plurality of circular sucking discs and a plurality of square sucking disc, moreover, adopt four vacuum pumps, be four groups of circular sucking discs and square sucking disc respectively and produce the adsorption affinity, can effectively promote the adsorption affinity of every group sucking disc, can adsorb a plurality of preforming soldering lugs simultaneously.

Description

Vacuum chuck clamp for performing soldering lug

Technical Field

The utility model relates to a soldering lug technical field in advance specifically is a vacuum chuck anchor clamps for preforming soldering lug.

Background

The preformed soldering lug is formed by manufacturing solder into a certain shape such as a sheet shape, a ring shape and the like, and melting the solder in the soldering process to fill gaps of workpieces to form metallurgical bonding. The preformed soldering lug has wide application in the field of electronic packaging, and is an important connecting material in the industries of power electronics, microelectronics, photoelectronics and the like.

Patent No. CN201821411370.4, discloses a vacuum chuck clamp for pre-forming soldering lug, comprising: the sealing device comprises an upper plate, a bottom plate and a sealing ring arranged between the upper plate and the bottom plate; the upper plate is contacted with a material to be processed; the upper plate and the bottom plate are both correspondingly provided with a plurality of positioning holes; the positioning hole is provided with a screw to fix the upper plate and the bottom plate into a whole, and the bottom plate is fixed on a workbench; the upper plate is provided with a plurality of main adsorption holes and a plurality of local adsorption holes; the bottom plate is provided with an air inlet valve and an air extraction valve. The vacuum chuck of the utility model has simple structure, easy manufacture and low processing cost; the method is convenient to operate, is particularly suitable for rapid proofing of the small-size or special-shaped preformed soldering lug, and can remarkably reduce proofing cost and time; the material to be processed is firmly adsorbed and is suitable for cutting processing.

Currently, there are some deficiencies with existing vacuum chuck clamps for solder pre-forming tabs, such as; the existing vacuum chuck clamp for pre-forming soldering lug can not adsorb a plurality of pre-forming soldering lugs simultaneously and can not fix two ends of the pre-forming soldering lug.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a vacuum chuck anchor clamps for preforming soldering lug has solved the problem that proposes among the background art.

In order to achieve the above object, the utility model provides a following technical scheme: a vacuum chuck clamp for preforming soldering lugs comprises a bottom shell, wherein an adsorption mechanism is arranged inside the bottom shell;

the adsorption mechanism comprises a circular hole, a square hole, a circular sucker, a square sucker, a vacuum pump, a first vacuum tube and a second vacuum tube; four groups of round holes are formed in the front side of the bottom shell, each group of round holes is four, a round sucker is fixedly connected inside each round hole, a square hole is formed between every two round holes, and a square sucker is fixedly connected inside each square hole;

bottom shell bottom left side equidistance bolted connection has four vacuum pumps, and four vacuum pump right sides intercommunication have first vacuum tube, first vacuum tube top equidistance intercommunication has a plurality of second vacuum tubes, and a plurality of second vacuum tube tops communicate circular sucking disc and square sucking disc respectively.

As an embodiment of the present invention, the winding frame is welded at both ends and upper and lower ends about the front side of the bottom case.

As a preferred embodiment of the present invention, the front side of the bottom casing is an open structure.

As a preferred embodiment of the present invention, the first vacuum tube, the second vacuum tube and the winding frame are made of stainless metal.

Compared with the prior art, the beneficial effects of the utility model are as follows:

1. the utility model discloses a circular sucking disc and square sucking disc and four vacuum pumps on the drain pan can divide into four groups with adsorption equipment to every group divide into a plurality of circular sucking discs and a plurality of square sucking disc, moreover, adopt four vacuum pumps, be four groups of circular sucking discs and square sucking disc production adsorption affinity respectively, can effectively promote the adsorption affinity of every group sucking disc, can adsorb a plurality of preforming soldering lugs simultaneously, be favorable to more practical use a vacuum chuck anchor clamps for preforming the soldering lug.

2. The utility model discloses a winding frame on the drain pan sets up winding frame in a plurality of positions of drain pan, adsorbs the completion back to the soldering lug that takes shape, can twine the soldering lug both ends that take shape on winding frame surface, fixes the soldering lug both ends that take shape, has avoided the soldering lug both ends that take shape to rock, is favorable to the more practical use a vacuum chuck anchor clamps that is used for the soldering lug that takes shape in advance.

Drawings

Other features, objects and advantages of the invention will become more apparent upon reading of the detailed description of non-limiting embodiments with reference to the following drawings:

fig. 1 is a top view of a vacuum chuck fixture for pre-forming solder fillets in accordance with the present invention;

fig. 2 is a front and interior view of a vacuum chuck fixture for preforming solder tabs in accordance with the present invention.

In the figure: the vacuum pump comprises a bottom shell 2, a round hole 3, a circular sucker 4, a square hole 5, a square sucker 6, a winding frame 7, a vacuum pump 8, a first vacuum tube 9 and a second vacuum tube.

Detailed Description

In order to make the technical means, creation features, achievement purposes and functions of the present invention easy to understand, the present invention is further described below with reference to the following embodiments.

In the description of the present invention, it is to be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention.

In the description of the present invention, it should be noted that unless otherwise explicitly stated or limited, the terms "mounted," "connected" and "disposed" are to be construed broadly, and may for example be fixedly connected, disposed, detachably connected, disposed, or integrally connected and disposed. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

Referring to fig. 1-2, the present invention provides a technical solution: a vacuum chuck clamp for preforming soldering lugs comprises a bottom shell 1, wherein an adsorption mechanism is arranged inside the bottom shell 1;

the adsorption mechanism comprises a round hole 2, a square hole 4, a round sucker 3, a square sucker 5, a vacuum pump 7, a first vacuum tube 8 and a second vacuum tube 9; four groups of round holes 2 are formed in the front side of the bottom shell 1, each group of round holes 2 is four, a round sucker 3 is fixedly connected inside each round hole 2, a square hole 4 is formed between every two round holes 2, and a square sucker 5 is fixedly connected inside each square hole 4;

bottom shell 1 bottom left side equidistance bolted connection has four vacuum pumps 7, and four vacuum pump 7 right sides intercommunication have first vacuum tube 8, 8 equidistance intercommunications in top of first vacuum tube have a plurality of second vacuum tubes 9, and communicate circular sucking disc 3 and square sucking disc 5 respectively at a plurality of second vacuum tube 9 tops.

Please refer to fig. 1 in this embodiment, through circular sucking disc 3 and square sucking disc 5 and four vacuum pumps 7 on the drain pan 1, can divide into four groups with adsorption equipment, and every group divide into a plurality of circular sucking discs 3 and a plurality of square sucking discs 5, moreover, adopt four vacuum pumps 7, produce the adsorption affinity for four groups of circular sucking discs 3 and square sucking discs 5 respectively, can effectively promote the adsorption affinity of every group sucking disc, can adsorb a plurality of preforming soldering lugs simultaneously, be favorable to more practical use a vacuum chuck anchor clamps for preforming soldering lug.

Wherein, both ends and upper and lower both ends all weld winding frame 6 about drain pan 1 front side.

In this embodiment, please refer to fig. 1, through winding frame 6 on drain pan 1, set up winding frame 6 in drain pan 1 a plurality of positions, after adsorbing the completion to the preforming soldering lug, can twine preforming soldering lug both ends on winding frame 6 surfaces, fix preforming soldering lug both ends, avoided preforming soldering lug both ends to rock, be favorable to more practical use a vacuum chuck anchor clamps for preforming soldering lug.

Wherein, the front side of the bottom shell 1 is an open structure.

The first vacuum tube 8, the second vacuum tube 9 and the winding frame 6 are all made of stainless metal.

When the vacuum chuck clamp for pre-forming soldering lugs is used, the vacuum pump 7 is electrically connected with an external power supply, then the vacuum pump 7 is in signal connection with an external control switch, the circular chucks 3 and the square chucks 5 on the bottom shell 1 and the four vacuum pumps 7 can divide the adsorption device into four groups, each group is divided into a plurality of circular chucks 3 and a plurality of square chucks 5, not only is the four vacuum pumps 7 opened, the four groups of circular chucks 3 and the four groups of square chucks 5 generate adsorption force through the first vacuum tubes 8 and the second vacuum tubes 9 respectively, the adsorption force of each group of chucks can be effectively improved, a plurality of pre-forming soldering lugs can be adsorbed, the winding frames 6 are arranged at a plurality of positions of the bottom shell 1, after the pre-forming soldering lugs are adsorbed, two ends of the pre-forming soldering lugs can be wound on the surfaces of the winding frames 6 to fix the two ends of the pre-forming soldering lugs, the shaking of the two ends of the preformed soldering lug is avoided.

The basic principles and the main features of the invention and the advantages of the invention have been shown and described above, it will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, but that the invention may be embodied in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.

Claims

1. A vacuum chuck clamp for preforming solder lugs, comprising a bottom shell (1), characterized in that: an adsorption mechanism is arranged inside the bottom shell (1);

the adsorption mechanism comprises a round hole (2), a square hole (4), a round sucker (3), a square sucker (5), a vacuum pump (7), a first vacuum tube (8) and a second vacuum tube (9); four groups of round holes (2) are formed in the front side of the bottom shell (1), four round holes (2) are formed in each group, a round sucking disc (3) is fixedly connected inside each round hole (2), square holes (4) are formed among the four round holes (2), and square sucking discs (5) are fixedly connected inside the square holes (4);

bottom shell (1) bottom left side equidistance bolted connection has four vacuum pumps (7), and four vacuum pump (7) right side intercommunication have first vacuum tube (8), first vacuum tube (8) top equidistance intercommunication has a plurality of second vacuum tubes (9), and communicates circular sucking disc (3) and square sucking disc (5) respectively at a plurality of second vacuum tube (9) tops.

2. A vacuum chuck jig for preforming solder wafers as recited in claim 1, wherein: and winding frames (6) are welded at the left end, the right end, the upper end and the lower end of the front side of the bottom shell (1).

3. A vacuum chuck jig for preforming solder wafers as recited in claim 1, wherein: the front side of the bottom shell (1) is of an open structure.

4. A vacuum chuck jig for preforming solder wafers as claimed in claim 2, wherein: the first vacuum tube (8), the second vacuum tube (9) and the winding frame (6) are all made of stainless metal materials.