CN208336178U - The contactless draw frame machine of large-sized silicon wafers - Google Patents
The contactless draw frame machine of large-sized silicon wafers Download PDFInfo
- Publication number
- CN208336178U CN208336178U CN201820758747.7U CN201820758747U CN208336178U CN 208336178 U CN208336178 U CN 208336178U CN 201820758747 U CN201820758747 U CN 201820758747U CN 208336178 U CN208336178 U CN 208336178U
- Authority
- CN
- China
- Prior art keywords
- plectane
- centre bore
- sucker
- panel
- sucker panel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 37
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 37
- 239000010703 silicon Substances 0.000 title claims abstract description 37
- 235000012431 wafers Nutrition 0.000 title claims abstract description 36
- 230000006698 induction Effects 0.000 claims description 4
- 230000009102 absorption Effects 0.000 abstract description 6
- 238000010521 absorption reaction Methods 0.000 abstract description 6
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 241001331845 Equus asinus x caballus Species 0.000 abstract 1
- 238000001179 sorption measurement Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 2
- 229910021529 ammonia Inorganic materials 0.000 description 1
- QGZKDVFQNNGYKY-UHFFFAOYSA-N ammonia Natural products N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- -1 poly- ammonia Ester Chemical class 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The utility model discloses a kind of contactless draw frame machine of large-sized silicon wafers, solve the problems, such as that existing sucker is easy to lead to silicon wafer rupture when drawing silicon wafer and do not adapt to more specification silicon wafer absorptions to require.It is provided with centre bore immediately below sucker panel (1) centre bore and blocks plectane (7), it blocks the fixed mule silk (6) of plectane and sequentially passes through centre bore closure plectane from bottom to top, sucker panel (1) is spirally connected with the screw hole (5) being arranged on cylindric gas chamber (2) bottom plate afterwards, it is blocked in sucker panel and centre bore and is socketed with annular gasket (11) on the closure plectane fixed screw between plectane, it is blocked in sucker panel and centre bore and is formed with ring jet mouth (8) between plectane, there are three elastic cushion cup (9) for setting on the bottom surface that centre bore blocks the sucker panel on the outside of plectane, snap ring (10) are provided between elastic cushion cup and sucker panel.Particularly suitable for being used in photovoltaic automatic production line.
Description
Technical field
The present invention relates to a kind of draw frame machines, for carrying the fragile sheet workpiece that thickness is thin, precision is high, it can also be used to
One pile thin slice of separation, in particular to a kind of silicon wafer draw frame machine applied in photovoltaic solar industry automation equipment.
Background technique
Thin slice draw frame machine is the critical component applied in photovoltaic automation equipment, carries silicon wafer being sucked away from original position
Task, matched with conveying robot complete silicon wafer different station between carrying transmission work.Existing silicon wafer sucking disc has
Contact sucker and two kinds of Contactless sucking disk, in silicon wafer carrying, pollution in order to avoid sucker to transfer silicon wafer is usually adopted
With Contactless sucking disk, and the contact area of sucker and silicon wafer is the smaller the better.Existing Contactless sucking disk is band step
Cylindric box body structure, gas outlet is laid on the side of the top bar of cylindric box body structure, in cylindric box body knot
The center of top of structure is provided with air inlet, after compressed air enters in cylindric box body from air inlet, from the column side of step
Radioactivity sprays around for gas outlet on face, negative pressure can be generated immediately below jet port, which is adsorbed onto cylinder for silicon wafer
On the bottom surface of shape box body structure, it is provided with several contact projection points on the bottom surface of cylindric box body structure, makes to be inhaled
Attached silicon wafer is only directly contacted with contact projection point, to achieve the effect that avoid pollution as far as possible.Each contact projection point is poly- ammonia
Ester material is rigidly connected with the bottom surface of cylindric sucker step, if the highest salient point of each contact projection point does not exist
When in same level, it is easy to cause the silicon wafer being adsorbed stress distortion under the action of suction broken, especially work as absorption
When power is uneven or is mutated, it is easier to cause the silicon wafer being adsorbed broken.In addition, the step column of existing suctorial cylindric box body
The size of gas outlet on shape side immobilizes, and when the silicon wafer specification to be adsorbed varies widely, is produced from gas outlet
Raw negative pressure is mismatched with adsorption capacity required by the silicon wafer adsorbed in advance, is not available former sucker, is needed replacing new sucker, make
Forming apparatus investment increases.
Summary of the invention
The present invention provides a kind of contactless draw frame machines of large-sized silicon wafers, solve existing sucker and are easy drawing silicon
Lead to silicon wafer rupture when piece and does not adapt to the technical issues of more specification silicon wafer absorptions require.
The present invention is to solve the above technical problem by the following technical programs:
A kind of contactless draw frame machine of large-sized silicon wafers, it is solid on sucker panel including the sucker panel with centre bore
Surely it is snapped with cylindric gas chamber, cylindric gas chamber is connected together with the centre bore on sucker panel, on the top of cylindric gas chamber
End center is provided with central air induction mouth, and centre bore is provided with immediately below sucker face plate center hole and blocks plectane, blocks plectane
Fixed screw sequentially pass through from bottom to top centre bore block plectane, after sucker panel with the spiral shell that is arranged on cylindric gas chamber bottom plate
Nail hole is screwed together, and is blocked in sucker panel and centre bore and is socketed with air ring on the closure plectane fixed screw between plectane
Piece blocks in sucker panel and centre bore and is formed with ring jet mouth between plectane, blocks the sucker on the outside of plectane in centre bore
There are three elastic cushion cups for setting on the bottom surface of panel, and three elastic cushion cups are laying triangular in shape, the bottom of elastic cushion cup
Face is less than the bottom surface of centre bore closure plectane, is provided with snap ring between elastic cushion cup and sucker panel.
Lateral air inlet is provided on the side end face of cylindric gas chamber；Silicon wafer is adsorbed on three elastic cushion cups.
The present invention is suitble to adsorb the silicon wafer of various specifications size, and adsorption capacity is big, and production is simple, and adsorption effect is stable, reliable,
Only need replacing the gasket of different-thickness, so that it may the adsorption entails for meeting different specification size silicon wafer, particularly suitable in photovoltaic
It is used in automatic production line.
Detailed description of the invention
Fig. 1 is structural schematic diagram of the invention；
Fig. 2 is schematic perspective view of the present invention in overlook direction；
Fig. 3 is that sucker panel 1 of the invention is looking up the structural schematic diagram on direction.
Specific embodiment
The present invention is described in detail with reference to the accompanying drawing:
A kind of contactless draw frame machine of large-sized silicon wafers, including the sucker panel 1 with centre bore, on sucker panel 1
Fixation is snapped with cylindric gas chamber 2, and cylindric gas chamber 2 is connected together with the centre bore on sucker panel 1, in cylindric gas chamber
2 top center is provided with central air induction mouth 3, and centre bore is provided with immediately below 1 centre bore of sucker panel and blocks plectane 7,
Block plectane fixed screw 6 sequentially pass through from bottom to top centre bore block plectane 7, after sucker panel 1 be arranged in cylindric gas
Screw hole 5 on 2 bottom plate of room is screwed together, and blocks the fixed spiral shell of the closure plectane between plectane 7 in sucker panel 1 and centre bore
It is socketed with annular gasket 11 on silk 6, is blocked in sucker panel 1 and centre bore and is formed with ring jet mouth 8 between plectane 7, in
Heart hole blocks setting on the bottom surface of the sucker panel 1 in 7 outside of plectane, and, there are three elastic cushion cup 9, three elastic cushion cups 9 are in three
Angular laying, the bottom surface of elastic cushion cup 9 is less than the bottom surface of centre bore closure plectane 7, in elastic cushion cup 9 and sucker
Snap ring 10 is provided between panel 1.
Lateral air inlet 4 is provided on the side end face of cylindric gas chamber 2；Silicon wafer is adsorbed on three elastic cushion cups 9
12。
The course of work of the contactless draw frame machine of large-sized silicon wafers of the invention is as follows:
The first step connects 0.4MPa's on the central air induction mouth 3 or lateral air inlet 4 of the cylindric gas chamber 2 of draw frame machine
Large-sized silicon wafer 12 is placed in immediately below draw frame machine by compressed air, and distance is at 30 millimeters or so；
Second step connects compressed air, and compressed air can be entered in cylindric gas chamber 2, and be sprayed from ring jet mouth 8
Out, Bernoulli effect can be generated in the lower section that centre bore blocks plectane 7, the absorption of silicon wafer 12 of underface is come up, when absorption
When silicon wafer 12 and elastic cushion cup 9 contact, the meeting elasticity of compression snap ring 10 of elastic cushion cup 9 makes its deformation, thus realize Elastic Contact,
Buffer distance can be adjusted on elastic cushion cup 9, realize the silicon wafer 12 and 9 flexible contact of elastic cushion cup of absorption, protect it
It is not damaged.
Claims (2)
1. a kind of contactless draw frame machine of large-sized silicon wafers, including the sucker panel (1) with centre bore, in sucker panel (1)
Upper fixation is snapped with cylindric gas chamber (2), and cylindric gas chamber (2) is connected together with the centre bore on sucker panel (1), in circle
The top center of column gas chamber (2) is provided with central air induction mouth (3), which is characterized in that sucker panel (1) centre bore just under
Side is provided with centre bore and blocks plectane (7), blocks plectane fixed screw (6) and sequentially passes through centre bore closure plectane from bottom to top
(7), sucker panel (1) is screwed together with the screw hole (5) being arranged on cylindric gas chamber (2) bottom plate afterwards, in sucker panel
(1) it blocks with centre bore and is socketed with annular gasket (11) on the closure plectane fixed screw (6) between plectane (7), in sucker face
Plate (1) and centre bore block and are formed with ring jet mouth (8) between plectane (7), block the sucker on the outside of plectane (7) in centre bore
There are three elastic cushion cup (9) for setting on the bottom surface of panel (1), and three elastic cushion cups (9) are laying triangular in shape, elastic cushion
The bottom surface of cup (9) is less than the bottom surface of centre bore closure plectane (7), between elastic cushion cup (9) and sucker panel (1)
It is provided with snap ring (10).
2. the contactless draw frame machine of a kind of large-sized silicon wafers according to claim 1, which is characterized in that in cylindric gas
Lateral air inlet (4) are provided on the side end face of room (2)；Silicon wafer (12) are adsorbed on three elastic cushion cups (9).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820758747.7U CN208336178U (en) | 2018-05-22 | 2018-05-22 | The contactless draw frame machine of large-sized silicon wafers |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820758747.7U CN208336178U (en) | 2018-05-22 | 2018-05-22 | The contactless draw frame machine of large-sized silicon wafers |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208336178U true CN208336178U (en) | 2019-01-04 |
Family
ID=64774598
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820758747.7U Expired - Fee Related CN208336178U (en) | 2018-05-22 | 2018-05-22 | The contactless draw frame machine of large-sized silicon wafers |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208336178U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108598034A (en) * | 2018-05-22 | 2018-09-28 | 中国电子科技集团公司第二研究所 | The contactless draw frame machine of large-sized silicon wafers |
-
2018
- 2018-05-22 CN CN201820758747.7U patent/CN208336178U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108598034A (en) * | 2018-05-22 | 2018-09-28 | 中国电子科技集团公司第二研究所 | The contactless draw frame machine of large-sized silicon wafers |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20190104 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |