CN217721863U - Composite radiating fin and electronic product - Google Patents

Abstract

The utility model belongs to the technical field of the heat dissipation material, more specifically say, relate to a composite cooling fin and electronic product. The composite radiating fin comprises a surface insulating layer, a conductive radiating layer, a conductive adhesive layer and a bottom surface insulating layer, wherein the surface insulating layer and the conductive adhesive layer are respectively attached to cover two surfaces of the conductive radiating layer, the conductive adhesive layer is used for being attached to a radiating surface of an electronic component, the bottom surface insulating layer is attached to the surface of the conductive adhesive layer, which deviates from the conductive radiating layer, and the bottom surface insulating layer does not completely cover the conductive adhesive layer. The utility model provides a composite heat sink, through setting up bottom surface insulating layer part and pasting in the surface on electrically conductive heat dissipation layer, realize composite heat sink's bottom surface local insulation to can satisfy the electrically conductive requirement of electronic components's radiating surface's different positions department simultaneously at the heat dissipation, it is nimble convenient to use, and the practicality is strong.

Description

Composite radiating fin and electronic product

Technical Field

The application belongs to the technical field of heat dissipation materials, and particularly relates to a composite heat dissipation sheet and an electronic product.

Background

In recent years, with the continuous development of living standard and technology level, people have higher and higher requirements on electronic products, the electronic products such as mobile phones, tablets, computers and the like have more and more functions and more complex internal structures of the products, and various electronic components inside the electronic products have more and more types, sizes and quantities.

In the related art, a composite heat sink formed by combining a copper foil layer and a surface insulating layer is usually adhered to an insulating position, so that heat dissipation is realized by heat conduction of the copper foil while surface insulation is performed. However, the existing composite copper foil is generally made of a copper foil layer composite insulating layer, and for some electronic components with special functions, for example, if the conductivity requirements of different positions on the heat dissipation surface of some electronic components are different, if the composite heat sink is completely covered, the position needing to be conductive cannot meet the conductivity requirements, so that the traditional composite heat sink cannot meet the use requirements.

SUMMERY OF THE UTILITY MODEL

An object of the embodiment of the application is to provide a composite heat sink and an electronic product, so as to solve the technical problem that the composite heat sink made of a copper foil layer and an insulating layer in the prior art cannot meet the conductive requirements of different heat dissipation surfaces of an electronic component.

In order to achieve the above object, the utility model adopts the following technical scheme: the utility model provides a composite heat sink, includes surface insulation layer, electrically conductive heat dissipation layer, conductive adhesive layer and bottom surface insulating layer, surface insulation layer electrically conductive heat dissipation layer reaches conductive adhesive layer three shape and size are the same, surface insulation layer with conductive adhesive layer laminate respectively cover in the relative two surfaces on electrically conductive heat dissipation layer, conductive adhesive layer is used for pasting to electronic components's radiating surface, bottom surface insulating layer pastes and locates conductive adhesive layer deviates from the surface on electrically conductive heat dissipation layer, bottom surface insulating layer incompletely covers conductive adhesive layer.

In some embodiments, the bottom insulating layer is an insulating mylar layer.

In some embodiments, the conductive heat spreading layer is a copper foil layer or a graphene layer.

In some embodiments, the composite heat sink further includes an anti-sticking conductive layer attached to a surface of the conductive adhesive layer facing away from the conductive heat sink layer, the anti-sticking conductive layer does not completely cover the conductive adhesive layer, and the anti-sticking conductive layer does not overlap with the bottom insulating layer.

In some embodiments, the anti-sticking conductive layer is a metal mylar layer.

In some embodiments, the total thickness of the surface insulating layer, the conductive heat dissipation layer, the conductive glue layer and the bottom surface insulating layer is 0.08mm ± 0.005mm;

or the total thickness of the surface insulating layer, the conductive heat dissipation layer, the conductive adhesive layer and the anti-sticking conductive layer is 0.08mm +/-0.005 mm.

In some embodiments, the bottom insulating layer has a thickness of 0.03mm.

In some embodiments, the surface insulating layer has a thickness of 0.02mm.

In some embodiments, the release conductive layer has a thickness of 0.03mm.

The utility model provides an above-mentioned one or more technical scheme of composite heat sink have one of following technological effect at least: the application discloses composite heat sink establishes the bottom surface insulating layer through pasting in the part of conductive adhesive layer, and when electronic components's radiating surface had the electrically conductive requirement of difference, can distinguish through pasting and establishing this bottom surface insulating layer. Specifically, electrically conductive heat dissipation layer itself has electric conductive property, and when it located electronic components's heat dissipation surface through the adhesive layer subsides, electronic components can be electrically conductive through electrically conductive heat dissipation layer, to the position that the heat dissipation surface needs electrically conductive, can directly be covered by electrically conductive heat dissipation layer, and need not electrically conductive position to heat dissipation surface part, then can paste in the adhesive layer corresponding to this position that need not electrically conductive department and establish the bottom surface insulating layer, and like this, the position that the heat dissipation surface need not electrically conductive is covered by the bottom surface insulating layer to realize insulating. So, paste in the surface on electrically conductive heat dissipation layer through setting up bottom surface insulating layer part, the bottom surface (attached in electronic components's one side) local insulation that realizes composite heat sink, thereby satisfy the electrically conductive requirement of electronic components heat dissipation surface's different positions department, the whole bottom surfaces that cover electrically conductive heat dissipation layer of conductive adhesive layer simultaneously, the bottom surface insulating layer that the part set up can not influence this application composite heat sink paste the effect, composite heat sink can be through the reliable and stable adhesion in electronic components's heat dissipation surface of conductive adhesive layer, conduction to electrically conductive heat dissipation layer that the heat that electronic components produced can be smooth, thereby realize the heat dissipation.

The utility model provides another kind of technical scheme is: an electronic product comprises a plurality of electronic components and the composite radiating fin, wherein the composite radiating fin is attached to the radiating surface of the electronic components.

The utility model provides an electronic product, through the attached foretell composite heat sink of the radiating surface at electronic components, composite heat sink heat dissipation is simultaneously, can also satisfy the electrically conductive requirement of the different positions departments of electronic components's radiating surface, and it is nimble convenient to use, and the practicality is strong.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required to be used in the embodiments or the prior art description will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and for those skilled in the art, other drawings may be obtained according to these drawings without inventive labor.

Fig. 1 is a schematic structural diagram of a composite heat sink according to an embodiment of the present invention;

FIG. 2 is a schematic structural view of the composite heat sink shown in FIG. 1 without a surface insulating layer;

FIG. 3 is a side view of the composite heat sink shown in FIG. 1 in the direction indicated by arrow F;

FIG. 4 isbase:Sub>A partial cross-sectional structural view taken along line A-A of FIG. 1;

fig. 5 is a partial sectional structural view taken along line B-B in fig. 1.

Wherein, in the figures, the respective reference numerals:

10. a surface insulating layer; 20. a conductive heat dissipation layer; 30. a conductive adhesive layer; 40. a bottom surface insulating layer; 50. an anti-sticking conductive layer; 60. and a release film layer.

Detailed Description

In order to make the technical problems, technical solutions and advantageous effects to be solved by the present application more clearly apparent, the present application is further described in detail below with reference to fig. 1 to 5 and the embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application.

It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or be indirectly connected to the other element.

It will be understood that the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like, as used herein, refer to an orientation or positional relationship indicated in the drawings that is solely for the purpose of facilitating the description and simplifying the description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be considered as limiting the present application.

In addition, in the description of the present application, "a plurality" means one or more, and the meaning of "a plurality" is two or more unless specifically limited otherwise.

An embodiment of the utility model provides a composite cooling fin is applicable to the subsides and locates the electronic components's in the electronic product surface (generally for electronic components's radiating surface) for the heat that conduction electronic components produced, thereby realize the heat dissipation. The composite heat sink of the present application will be described in detail below with reference to the accompanying drawings and specific embodiments.

Referring to fig. 1 to 5, in which fig. 1 isbase:Sub>A schematic structural diagram ofbase:Sub>A composite heat sink according to an embodiment of the present invention, fig. 2 isbase:Sub>A schematic structural diagram of the composite heat sink shown in fig. 1 withoutbase:Sub>A surface insulating layer, fig. 3 isbase:Sub>A side view of the composite heat sink shown in fig. 1 alongbase:Sub>A direction indicated by an arrow F, fig. 4 isbase:Sub>A structural diagram ofbase:Sub>A partial cross-section alongbase:Sub>A linebase:Sub>A-base:Sub>A in fig. 1, and fig. 5 isbase:Sub>A structural diagram ofbase:Sub>A partial cross-section alongbase:Sub>A line B-B in fig. 1.

As shown in fig. 1 to fig. 3, in some embodiments of the present invention, the composite heat sink includes a surface insulating layer 10, a heat dissipation layer 20 and an adhesive layer 30, wherein the surface insulating layer 10 is attached to cover a side surface of the heat dissipation layer 20, the adhesive layer 30 is attached to cover the opposite side surface of the heat dissipation layer 20, and the three of the surface insulating layer 10, the adhesive layer 30 and the heat dissipation layer 20 have the same shape and size, that is, the surface insulating layer 10 and the adhesive layer 30 cover opposite side surfaces of the heat dissipation layer 20, respectively, the adhesive layer 30 is used for adhering to a heat dissipation surface of an electronic component, and the surface insulating layer 10 is used for surface insulation of the heat dissipation layer 20.

In a specific embodiment, the composite heat sink of the present application further includes a release film layer 60, the release film layer 60 is attached to the surface of the conductive adhesive layer 30 away from the conductive heat sink layer 20, and the release film layer 60 can be peeled off from the conductive adhesive layer 30, when the composite heat sink is not used, the release film layer 60 is used for protecting the conductive adhesive layer 30, and when the composite heat sink is used, the release film layer 60 is peeled off to expose the conductive adhesive layer 30, and then the composite heat sink is attached to the heat sink surface of the electronic product. In this embodiment, in order to guarantee to peel off the adhesion in electrically conductive heat dissipation layer 20 that type rete 60 can be stable, peel off required peeling force when leaving type rete 60 and generally require more than or equal to 1300g/25mm, peel off the back from type rete 60, reuse pressurize tool to paste to the composite heat dissipation piece of heat dissipation surface and carry out the pressurize and paste, general pressurize pressure can be more than or equal to 0.15Mpa, in order to guarantee can be with stable firm pasting to electronic product of composite heat dissipation piece, avoid droing, provide the guarantee for the heat dissipation.

In this embodiment, as shown in fig. 2, fig. 3 and fig. 4, the composite heat sink of this embodiment further includes a bottom surface insulating layer 40, the bottom surface insulating layer 40 is attached to the surface of the conductive adhesive layer 30 away from the conductive heat dissipation layer 20, and the size of the bottom surface insulating layer 40 is smaller than the size of the conductive heat dissipation layer 20, and the bottom surface insulating layer 40 does not completely cover the conductive adhesive layer 30, that is, when the composite heat sink of this embodiment is not used, the bottom surface insulating layer 40 is sandwiched between the release film layer 60 and the conductive adhesive layer 30, and when the composite heat sink of this embodiment is used, the bottom surface insulating layer 40 is sandwiched between the heat dissipation surface of the electronic product and the conductive adhesive layer 30 after the release film layer 60 is peeled off. Thus, the bottom insulating layer 40 partially insulates the bottom surface of the conductive heat dissipation layer 20 facing the heat dissipation surface, the position of the heat dissipation surface covered by the bottom insulating layer 40 cannot be conducted through the conductive heat dissipation layer 20, and the other position of the heat dissipation surface not covered by the bottom insulating layer 40 can be conducted through the conductive heat dissipation layer 20.

The embodiment of the utility model provides a composite heat sink establishes bottom surface insulating layer 40 through pasting in the part of conductive adhesive layer 30, when electronic components's cooling surface has different electrically conductive requirements, can distinguish through pasting and establishing this bottom surface insulating layer 40. Specifically, the conductive heat dissipation layer 20 itself has a conductive property, and when it is attached to the heat dissipation surface of the electronic component through the conductive adhesive layer 30, the electronic component can be conductive through the conductive heat dissipation layer 20, and for the position where the heat dissipation surface needs to be conductive, the position can be directly covered by the conductive heat dissipation layer 20, and for the position where the heat dissipation surface needs no conductive, the bottom surface insulating layer 40 can be attached to the position where the conductive adhesive layer 30 needs no conductive position, so that the position where the heat dissipation surface does not need to be conductive is covered by the bottom surface insulating layer 40, thereby realizing insulation.

So, paste in the surface of electrically conductive heat dissipation layer 20 through setting up bottom surface insulating layer 40 part, the bottom surface (attached in the one side of electronic components) local insulation that realizes composite heat sink, thereby satisfy the electrically conductive requirement of electronic components heat dissipation surface's different positions department, simultaneously the whole bottom surfaces that cover electrically conductive heat dissipation layer 20 of conductive adhesive layer 30, the bottom surface insulating layer 40 that the part set up can not influence this application composite heat sink paste the effect, composite heat sink can be through the stable and reliable adhesion of conductive adhesive layer 30 to electronic components's radiating surface, conduction to electrically conductive heat dissipation layer 20 that the heat that electronic components produced can be smooth, thereby realize the heat dissipation.

Thus, in the specific design, the shape and size of the bottom insulating layer 40 are designed according to the conductive requirements of different positions of the heat dissipation surface of the electronic component, and the bottom insulating layer 40 is attached to the conductive heat dissipation layer 20 corresponding to the position where the heat dissipation surface does not need to be conductive.

For example, in the composite heat sink of the present embodiment, as shown in fig. 2, the positions of the heat dissipation surface of the electronic product corresponding to the region a, the region B and the region C of the composite heat sink have no requirement for electrical conduction, so the bottom insulating layer 40 is disposed at the positions of the region a, the region B and the region C on the composite heat sink, when the composite heat sink of the present embodiment is attached to the heat dissipation surface of the corresponding electronic product, the bottom insulating layer 40 disposed at the positions of the region a, the region B and the region C covers the corresponding positions of the heat dissipation surface, so that the three positions of the heat dissipation surface corresponding to the region a, the region B and the region C cannot be electrically conducted through the conductive heat dissipation layer 20.

It is understood that in other embodiments, the arrangement position of the bottom insulating layer 40 may be designed according to specific needs, and the above arrangement is only exemplary and should not be construed as limiting.

In some embodiments of the present invention, as shown in fig. 2, fig. 3 and fig. 4, the bottom insulating layer 40 is an insulating mylar layer, such as a Polycarbonate (PC) mylar layer or a Polyethylene terephthalate (PET) mylar layer, and the insulating mylar material has low cost, is easy to obtain materials, and has good flexibility, so as to meet the use requirement of the composite heat sink.

Of course, in other embodiments, the bottom insulating layer 40 may also be made of other insulating materials, so as to meet the insulating requirement and the adhering requirement (can be adhered to the conductive heat dissipation layer 20 through the conductive adhesive layer 30).

In some embodiments, as shown in fig. 2, 3 and 4, the conductive heat dissipation layer 20 is a copper foil layer or a graphene layer, and both the copper foil and the graphene have good electrical conductivity and thermal conductivity, so that heat generated by the corresponding electronic component can be absorbed while the electrical conductivity requirement is met, thereby achieving heat dissipation.

In some embodiments, as shown in fig. 2 and 3, the surface insulating layer 10 is a mylar insulating layer, and may be a sub-black mylar insulating layer, and the conductive adhesive layer 30 may be an intermediate adhesive layer of a double-sided adhesive tape.

In the embodiment, the surface insulating layer 10, the conductive adhesive layer 30 and the bottom insulating layer 40 of the composite heat sink have good heat resistance, and will not melt or deform at high temperature, so as to meet the heat resistance requirement of the composite heat sink.

In other embodiments of the present invention, as shown in fig. 1, fig. 2 and fig. 5, the composite heat sink further includes an anti-adhesion conductive layer 50, the anti-adhesion conductive layer 50 is attached to the surface of the conductive adhesive layer 30 away from the conductive heat dissipation layer 20, the size of the anti-adhesion conductive layer 50 is smaller than the size of the conductive heat dissipation layer 20, the anti-adhesion conductive layer 50 does not completely cover the conductive adhesive layer 30, and the anti-adhesion conductive layer 50 does not coincide with the bottom surface insulating layer 40.

That is, when the composite heat sink of the present embodiment is not used, the anti-sticking conductive layer 50 is sandwiched between the release film layer 60 and the conductive adhesive layer 30, and when the composite heat sink of the present embodiment is used, the anti-sticking conductive layer 50 is sandwiched between the heat dissipation surface of the electronic product and the conductive adhesive layer 30 after the release film layer 60 is peeled off. Thus, the anti-sticking conductive layer 50 forms partial anti-sticking to the bottom surface of the conductive heat dissipation layer 20 facing the heat dissipation surface, the position of the heat dissipation surface covered by the anti-sticking conductive layer 50 is not adhered by the conductive adhesive layer 30, and other positions of the heat dissipation surface not covered by the anti-sticking conductive layer 50 can be adhered by the conductive adhesive layer 30. When some positions of the heat dissipation surface of the electronic product cannot be covered by the composite heat sink, the anti-sticking conductive layer 50 can be arranged at the positions of the composite heat sink corresponding to the positions to isolate the stickiness of the conductive adhesive layer 30.

So, paste in conductive adhesive layer 30 through setting up antiseized conducting layer 50 part, it is local antiseized to realize the bottom surface of composite heat sink (attached in the one side of electronic components), thereby satisfy the requirement of pasting of electronic components cooling surface's different positions department, conductive adhesive layer 30 covers the bottom surface on conductive heat dissipation layer 20 entirely simultaneously, the antiseized conducting layer 50 of local setting can not influence composite heat sink's the effect of pasting, composite heat sink can through the reliable and stable adhesion of conductive adhesive layer 30 to electronic components's cooling surface, the heat that electronic components produced still can be smooth conduction to conductive heat dissipation layer 20 and realize the heat dissipation. In addition, the anti-sticking conductive layer 50 is not overlapped with the bottom surface insulating layer 40, the anti-sticking conductive layer 50 can conduct electricity, and the sticking position of the anti-sticking conductive layer 50 still meets the conducting requirement.

When the design is concrete, the shape and size of the anti-sticking conducting layer 50 are designed only according to whether the different positions of the radiating surface of the electronic component can be stuck and covered, and the position where the radiating surface can not be stuck and covered corresponds to the anti-sticking conducting layer 50 stuck on the conducting adhesive layer 30.

For example, in the composite heat sink of the present embodiment, as shown in fig. 2, the position of the heat dissipation surface of the electronic product corresponding to the region D of the composite heat sink cannot be covered by the adhesive, so the anti-adhesion conductive layer 50 is disposed at the position of the region D on the composite heat sink, when the composite heat sink of the present embodiment is attached to the heat dissipation surface of the corresponding electronic product, the anti-adhesion conductive layer 50 disposed at the region D covers the corresponding position of the heat dissipation surface, so that the position of the heat dissipation surface corresponding to the region D is not adhered by the conductive adhesive layer 30.

It is understood that, in the embodiment, in order to ensure that the composite heat sink can be firmly adhered to the heat dissipation surface of the electronic component, the sum of the sizes of the anti-adhesion conductive layer 50 and the bottom surface insulating layer 40 is smaller than the area of the conductive adhesive layer 30, i.e. the conductive adhesive layer 30 is not completely covered by the anti-adhesion conductive layer 50 and the bottom surface insulating layer 40.

In a specific embodiment, the anti-adhesion conductive layer 50 is a metal mylar layer, which is anti-adhesion and conductive.

In the embodiment of the present invention, as shown in fig. 1, 4 and 5, the total thickness of the surface insulating layer 10, the conductive heat dissipation layer 20, the conductive adhesive layer 30 and the bottom insulating layer 40 of the composite heat sink is 0.08mm ± 0.005mm; alternatively, the total thickness of the surface insulating layer 10, the conductive heat dissipation layer 20, the conductive adhesive layer 30 and the anti-sticking conductive layer 50 is 0.08mm ± 0.005mm. That is, the total thickness at the position where the bottom surface insulating layer 40 is provided is 0.08mm ± 0.005mm, or the total thickness at the position where the anti-sticking conductive layer 50 is provided is 0.08mm ± 0.005mm.

In a specific embodiment, the thickness of the bottom surface insulating layer 40 may be 0.03mm, the thickness of the surface insulating layer 10 may be 0.02mm, the thickness of the anti-sticking conducting layer 50 may be 0.03mm, and the positions of the composite heat sink where the bottom surface insulating layer 40 and the anti-sticking conducting layer 50 are provided have the same thickness.

Of course, in other embodiments, other thickness dimensions can be selected for the thicknesses of the bottom insulating layer 40, the surface insulating layer 10 and the anti-adhesion conductive layer 50 on the premise of meeting the requirement of the total thickness.

Another embodiment of the utility model provides an electronic product has a plurality of electronic components, and electronic product still includes foretell composite heat sink, and each radiating surface of each electronic components is located in composite heat sink subsides.

The embodiment of the utility model provides an electronic product, through the attached foretell composite cooling fin of the cooling surface at electronic components, composite cooling fin dispels the heat simultaneously, can also satisfy the electrically conductive requirement of electronic components's cooling surface's different positions department, and it is nimble convenient to use, and the practicality is strong.

In addition, the electronic product of the present application also has other technical effects of the composite heat sink of the above embodiments, and details are not described here.

The above description is only a preferred embodiment of the present application and should not be taken as limiting the present application, and any modifications, equivalents, improvements, etc. made within the spirit and principle of the present application should be included in the protection scope of the present application.

Claims (10)

1. A composite heat sink is characterized in that: including surface insulation layer, conductive heat dissipation layer, conductive adhesive layer and bottom surface insulating layer, surface insulation layer conductive heat dissipation layer reaches conductive adhesive layer three shape and size are the same, surface insulation layer with conductive adhesive layer laminate respectively cover in the relative two surfaces on conductive heat dissipation layer, conductive adhesive layer is used for pasting the radiating surface to electronic components, bottom surface insulating layer pastes and locates conductive adhesive layer deviates from the surface on conductive heat dissipation layer, the bottom surface insulating layer incompletely covers conductive adhesive layer.

2. The composite fin of claim 1, wherein: the bottom surface insulating layer is an insulating mylar layer.

3. The composite fin of claim 1, wherein: the conductive heat dissipation layer is a copper foil layer or a graphene layer.

4. The composite fin according to any one of claims 1 to 3, wherein: the composite heat sink further comprises an anti-sticking conducting layer, wherein the anti-sticking conducting layer is pasted on the surface of the conductive adhesive layer deviated from the conductive heat dissipation layer, and the anti-sticking conducting layer does not completely cover the conductive adhesive layer and does not coincide with the bottom surface insulating layer.

5. The composite fin of claim 4, wherein: the anti-sticking conducting layer is a metal Mylar layer.

6. The composite fin of claim 4, wherein: the total thickness of the surface insulating layer, the conductive heat dissipation layer, the conductive adhesive layer and the bottom surface insulating layer is 0.08mm +/-0.005 mm;

or the total thickness of the surface insulating layer, the conductive heat dissipation layer, the conductive adhesive layer and the anti-sticking conductive layer is 0.08mm +/-0.005 mm.

7. The composite fin of claim 6, wherein: the thickness of bottom surface insulating layer is 0.03mm.

8. The composite fin of claim 6, wherein: the thickness of the surface insulating layer is 0.02mm.

9. The composite fin of claim 6, wherein: the thickness of antiseized conducting layer is 0.03mm.

10. An electronic product, includes a plurality of electronic components, its characterized in that: the electronic product also comprises the composite cooling fin as claimed in any one of claims 1 to 9, wherein the composite cooling fin is attached to the cooling surface of the electronic component.

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