CN217283569U

CN217283569U - Thermal-insulated PCB board convenient to welding

Info

Publication number: CN217283569U
Application number: CN202220808526.2U
Authority: CN
Inventors: 刘伟; 刘辉
Original assignee: Shenzhen Haoda Circuit Co ltd
Current assignee: Shenzhen Haoda Circuit Co ltd
Priority date: 2022-04-08
Filing date: 2022-04-08
Publication date: 2022-08-23
Anticipated expiration: 2032-04-08

Abstract

The utility model relates to the technical field of PCB boards, in particular to a thermal insulation PCB board convenient for welding, which comprises a PCB board body, wherein the PCB board body is provided with a limiting component, the PCB board body comprises a phenolic aldehyde layer, the thickness of the phenolic aldehyde layer is three millimeters, the upper surface of the phenolic aldehyde layer is provided with a glass fiber layer, the thickness of the glass fiber layer is two millimeters, and the upper surface of the glass fiber layer is provided with an epoxy glass layer, a second positioning block is arranged at the upper end of a first positioning block, a limiting column can be arranged in a limiting hole at the moment, so that the situation that the second positioning block moves back and forth left and right after being arranged on the first positioning block can be prevented, a fixed pressing plate is rotated at the moment, the fixed pressing plate is pressed at the upper end of the second positioning block, the first positioning block can be preliminarily connected with the second positioning block at the moment, the situation that looseness can not occur, can prevent that the not hard up condition influence welded efficiency and quality from appearing in the position of welded in-process PCB board body.

Description

Thermal-insulated PCB board convenient to welding

Technical Field

The utility model relates to a PCB board technical field particularly, relates to a thermal-insulated PCB board convenient to welding.

Background

The PCB board, also known as printed circuit board is the provider of electronic components electrical connection, like the multilayer PCB board that patent application number is CN202022367507.4 provided, including silica gel heat-conducting plate, first PCB board, second PCB board and third PCB board, the both sides of second PCB board are equipped with first PCB board and third PCB board, scribble the insulating cement between first PCB board, second PCB board and the third PCB board, be equipped with the silica gel heat-conducting plate in the insulating cement, four corners of silica gel heat-conducting plate run through and have seted up the fixed orifices, the outside of fixed orifices is seted up flutedly, silica gel heat-conducting plate, first PCB board, second PCB board and third PCB board pass through rivet connection fixed. The utility model discloses possess and be favorable to the heat dissipation, and the firm advantage of adhesion between the PCB board.

However, according to the technical scheme, when two PCBs are required to be welded, the two PCBs are butted together and then welded without a fixing device, so that the two PCBs are loosened in the welding process, and the welding quality and efficiency are affected.

SUMMERY OF THE UTILITY MODEL

A primary object of the present invention is to provide a thermal-insulated PCB board convenient for welding, which can effectively solve the problems in the background art.

In order to achieve the above purpose, the utility model adopts the technical proposal that:

the utility model provides a thermal-insulated PCB board convenient to welding, includes the PCB edition of books body, be provided with spacing subassembly on the PCB edition of books body, the PCB edition of books body includes the phenolic aldehyde layer, the phenolic aldehyde layer thickness is three millimeters, phenolic aldehyde layer upper surface is provided with the glass fiber layer, the glass fiber layer thickness is two millimeters, the glass fiber layer upper surface is provided with the epoxy glass layer, the epoxy glass layer thickness is two millimeters.

Preferably, the upper surface of the epoxy glass layer is provided with a polyimide layer, and the thickness of the polyimide layer is two millimeters.

Preferably, the upper surface of the polyimide layer is provided with a polytetrafluoroethylene layer, and the thickness of the polytetrafluoroethylene layer is three millimeters.

Preferably, the limiting assembly comprises a first positioning block, a second positioning block and a fixed pressing plate, the first positioning block is fixedly mounted on one side of the PCB body, and the second positioning block is fixedly mounted on the other side of the PCB body.

Preferably, the first locating piece is provided with a plurality of limiting holes at equal intervals, the second locating piece is provided with a plurality of limiting columns at equal intervals on the lower surface, and the limiting columns are arranged in the limiting holes.

Preferably, the fixed pressing plate is rotatably mounted on the upper surface of the PCB body through a rotating shaft.

Preferably, a plurality of radiating fins are fixedly mounted at both ends of the PCB body.

Compared with the prior art, the utility model discloses following beneficial effect has:

(1) when two PCB board bodies need to be welded, at first set up the second locating piece in first locating piece upper end, thereby can set up spacing post at spacing downthehole portion this moment, thereby can prevent that the second locating piece from setting up the condition of back-and-forth movement about appearing on first locating piece, rotate the stationary platen this moment again, thereby can press the stationary platen in second locating piece upper end, thereby can be in the same place first locating piece and second locating piece initial connection this moment, the not hard up condition can not appear, thereby can be convenient for the staff with two PCB board bodies weld, can prevent at the welded in-process, the not hard up condition influence welded efficiency and quality appear in the position of PCB board body.

(2) The high temperature resistance of PCB board body can be improved through setting up the phenolic aldehyde layer at first, can increase the thermal-insulated ability of PCB board body through setting up the glass fiber layer, can increase the heat-resisting of PCB board body, the moisture proof through setting up the epoxy glass layer, can increase the high temperature resistance of PCB board body through setting up the polyimide layer, can increase the corrosion resistance, the electrical insulation and the good ageing resistance endurance of PCB board body through setting up the polytetrafluoroethylene layer.

Drawings

Fig. 1 is a schematic view of an overall structure of a heat-insulating PCB board convenient for welding according to the present invention;

fig. 2 is a schematic side view of the heat-insulating PCB of the present invention for facilitating welding;

fig. 3 is the utility model relates to a PCB board body structure schematic diagram of thermal-insulated PCB board convenient to welding.

In the figure: 1. a PCB body; 101. a phenolic layer; 102. a glass fiber layer; 103. an epoxy glass layer; 104. a polyimide layer; 105. a polytetrafluoroethylene layer; 2. a limiting component; 201. a first positioning block; 202. a limiting hole; 203. fixing the pressing plate; 204. a rotating shaft; 205. a limiting column; 206. a second positioning block; 3. and (4) radiating fins.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely below with reference to the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Examples

As shown in fig. 1 to 3, a thermal-insulated PCB convenient to welding, includes PCB body 1, be provided with spacing subassembly 2 on the PCB body 1, the PCB body 1 includes phenolic aldehyde layer 101, phenolic aldehyde layer 101 thickness is three millimeters, phenolic aldehyde layer 101 upper surface is provided with glass fiber layer 102, glass fiber layer 102 thickness is two millimeters, glass fiber layer 102 upper surface is provided with epoxy glass layer 103, epoxy glass layer 103 thickness is two millimeters.

It should be noted that epoxy glass layer 103 upper surface is provided with polyimide layer 104, polyimide layer 104 thickness is two millimeters, polyimide layer 104 upper surface is provided with polytetrafluoroethylene layer 105, polytetrafluoroethylene layer 105 thickness is three millimeters, can improve the high temperature resistance of PCB board body 1 at first through setting up phenolic aldehyde layer 101, can increase PCB board body 1's thermal-insulated ability through setting up glass fiber layer 102, can increase PCB board body 1's heat-resisting, moisture-proof through setting up epoxy glass layer 103, can increase PCB board body 1's high temperature resistance through setting up polyimide layer 104, can increase PCB board body 1's corrosion resistance, electrical insulation and good ageing resistance through setting up polytetrafluoroethylene layer 105.

It should be noted that the limiting component 2 includes a first positioning block 201, a second positioning block 206, and a fixed pressing plate 203, the first positioning block 201 is fixedly installed on one side of the PCB body 1, the second positioning block 206 is fixedly installed on the other side of the PCB body 1, a plurality of limiting holes 202 are equidistantly arranged on the first positioning block 201, a plurality of limiting posts 205 are equidistantly arranged on the lower surface of the second positioning block 206, the limiting posts 205 are arranged inside the limiting holes 202, the fixed pressing plate 203 is rotatably installed on the upper surface of the PCB body 1 through a rotating shaft 204, when two PCB bodies 1 need to be welded, the second positioning block 206 is firstly arranged at the upper end of the first positioning block 201, at this time, the limiting posts 205 can be arranged inside the limiting holes 202, so as to prevent the second positioning block 206 from moving left and right and back and forth after being arranged on the first positioning block 201, rotate fixed pressing plate 203 this moment again to can press fixed pressing plate 203 in second locating piece 206 upper end, thereby can be in the same place first locating piece 201 and the preliminary connection of second locating piece 206 this moment, the not hard up condition can not appear, thereby can be convenient for the staff with first locating piece 201 and the welding of second locating piece 206, can prevent at the welded in-process, the not hard up condition influence welded efficiency and quality appear in PCB board body 1's position.

It should be noted that, a plurality of radiating fins 3 are fixedly mounted at both ends of the PCB body 1, and the radiating efficiency of the PCB body 1 can be increased by arranging the radiating fins 3.

This thermal-insulated PCB board's convenient to welding theory of operation:

when the PCB is used, firstly, the high-temperature resistance of the PCB body 1 can be improved by arranging the phenolic aldehyde layer 101, the heat insulation capability of the PCB body 1 can be improved by arranging the glass fiber layer 102, the heat resistance and the moisture resistance of the PCB body 1 can be improved by arranging the epoxy glass layer 103, the high-temperature resistance of the PCB body 1 can be improved by arranging the polyimide layer 104, the corrosion resistance, the electric insulation and the good ageing resistance of the PCB body 1 can be improved by arranging the polytetrafluoroethylene layer 105, when two PCB bodies 1 need to be welded, the second positioning block 206 is firstly arranged at the upper end of the first positioning block 201, at the moment, the limiting column 205 can be arranged in the limiting hole 202, the situation that the second positioning block 206 moves left and right and back and forth after being arranged on the first positioning block 201 can be prevented, at the moment, the fixing pressing plate 203 is rotated, thereby can press fixed pressing plate 203 in second locating piece 206 upper end, thereby can be in the same place first locating piece 201 and the initial connection of second locating piece 206 this moment, the not hard up condition can not appear, thereby can be convenient for the staff welds two PCB board bodies, can prevent at the welded in-process, the not hard up condition influence welded efficiency and quality appear in PCB board body 1's position, can increase PCB board body 1's radiating efficiency through setting up radiating fin 3.

The basic principles and the main features of the invention and the advantages of the invention have been shown and described above. It should be understood by those skilled in the art that the present invention is not limited to the above embodiments, and the above embodiments and descriptions are only illustrative of the principles of the present invention, and that various changes and modifications may be made without departing from the spirit and scope of the present invention, and all such changes and modifications fall within the scope of the present invention as claimed. The scope of the invention is defined by the appended claims and equivalents thereof.

Claims

1. The utility model provides a thermal-insulated PCB board convenient to welding, includes PCB board body (1), its characterized in that: be provided with spacing subassembly (2) on PCB board body (1), PCB board body (1) includes phenolic aldehyde layer (101), phenolic aldehyde layer (101) thickness is three millimeters, phenolic aldehyde layer (101) upper surface is provided with glass fiber layer (102), glass fiber layer (102) thickness is two millimeters, glass fiber layer (102) upper surface is provided with epoxy glass layer (103), epoxy glass layer (103) thickness is two millimeters.

2. An insulated PCB for facilitating soldering according to claim 1, wherein: the upper surface of the epoxy glass layer (103) is provided with a polyimide layer (104), and the thickness of the polyimide layer (104) is two millimeters.

3. An insulated PCB for facilitating soldering according to claim 2, wherein: the polyimide layer (104) upper surface is provided with polytetrafluoroethylene layer (105), polytetrafluoroethylene layer (105) thickness is three millimeters.

4. An insulated PCB for facilitating soldering according to claim 1, wherein: the limiting assembly (2) comprises a first positioning block (201), a second positioning block (206) and a fixed pressing plate (203), the first positioning block (201) is fixedly installed on one side of the PCB body (1), and the second positioning block (206) is fixedly installed on the other side of the PCB body (1).

5. An insulated PCB for facilitating soldering according to claim 4, wherein: a plurality of limiting holes (202) are equidistantly formed in the first positioning block (201), a plurality of limiting columns (205) are equidistantly formed in the lower surface of the second positioning block (206), and the limiting columns (205) are arranged in the limiting holes (202).

6. An insulated PCB for facilitating soldering according to claim 4, wherein: the fixed pressing plate (203) is rotatably arranged on the upper surface of the PCB body (1) through a rotating shaft (204).

7. An insulated PCB for facilitating soldering according to claim 1, wherein: a plurality of radiating fins (3) are fixedly mounted at two ends of the PCB body (1).