CN213124294U

CN213124294U - Novel high-power electronic relay switch

Info

Publication number: CN213124294U
Application number: CN202022075062.2U
Authority: CN
Inventors: 龚敏; 马运凡; 史国辉
Original assignee: Wuhan Tianyun Auto Electric System Co ltd
Current assignee: Wuhan Tianyun Auto Electric System Co ltd
Priority date: 2020-09-21
Filing date: 2020-09-21
Publication date: 2021-05-04
Anticipated expiration: 2030-09-21

Abstract

The embodiment of the utility model discloses novel high-power electronic relay switch, including the shell, be equipped with contact pin, terminal, fin in it, the cover is equipped with the sealing washer on the terminal, and the riveting has the heat dissipation post on the fin, and on the circuit board passed through the fix with screw and was fixed in the fin, the welding had the MOS pipe on the circuit board, and MOS pipe and fin welding, on the terminal was fixed in the circuit board, contact pin and circuit board welded connection, the opening of shell passed through the casting glue and is sealed. This novel high-power electronic relay switch to heat radiation structure, circuit board configuration optimization, has reached the effect that alleviates product weight, improves product quality, reduction product cost.

Description

Novel high-power electronic relay switch

Technical Field

The utility model relates to an automobile electrical apparatus makes the trade, especially relates to a novel high-power electronic relay switch.

Background

The electronic relay switch is used for controlling an electronic relay of a preheater of an automobile engine, the electronic relay switch is directly connected with the preheater, and the working current is up to 200A. The MOS tube (mode tube) is used as a core device of the electronic relay, has the problem of large heat productivity under high power, and is of great importance for ensuring the heat dissipation effect of the MOS tube in normal work. The traditional electronic relay switch lacks a necessary heat dissipation structure, and the product weight is large and the quality is not high.

SUMMERY OF THE UTILITY MODEL

The embodiment of the utility model provides a technical problem that will solve lies in, lacks necessary heat radiation structure to traditional electronic relay switch to product weight is big, and the not high problem of quality provides a novel high-power electronic relay switch.

In order to solve the technical problem, the embodiment of the utility model provides a novel high-power electronic relay switch is provided, this novel high-power electronic relay switch includes: the casing is equipped with contact pin, terminal, fin in it, and the cover is equipped with the sealing washer on the terminal, and the riveting has the heat dissipation post on the fin, and on the circuit board passed through the fix with screw in the fin, the welding had the MOS pipe on the circuit board, MOS pipe and fin welding, on the terminal is fixed in the circuit board, contact pin and circuit board welded connection, the opening of casing passes through the casting glue and seals.

Wherein, be provided with insulating pad between circuit board and the fin, insulating pad pastes and locates on the fin.

Wherein, three shaft sleeves are respectively arranged on the outer edge of the shell.

Wherein, the fin is aluminum plate, and the heat dissipation post is the copper post, and the surface of heat dissipation post is provided with the silvered film.

Wherein, be provided with the contact pin welding hole of dislocation on the circuit board.

Wherein, the circuit board is provided with a counter bore, and the screw is buried under the plane of the circuit board through the counter bore.

Wherein, the both ends of heat dissipation post all set up into the guide angle structure.

Implement the embodiment of the utility model provides a, following beneficial effect has: this novel high-power electronic relay switch to heat radiation structure, circuit board configuration optimization, has reached the effect that alleviates product weight, improves product quality, reduction product cost.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.

Fig. 1 is a schematic structural diagram of a novel high-power electronic relay switch provided by the present invention;

FIG. 2 is a schematic structural diagram of the circuit board of FIG. 1;

FIG. 3 is a schematic structural diagram of the heat sink of FIG. 1;

FIG. 4 is a schematic view of the heat-dissipating stud of FIG. 1.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-4, fig. 1 is a schematic structural diagram of a novel high-power electronic relay switch provided by the present invention; FIG. 2 is a schematic structural diagram of the circuit board of FIG. 1; FIG. 3 is a schematic structural diagram of the heat sink of FIG. 1; FIG. 4 is a schematic view of the heat-dissipating stud of FIG. 1. This novel high-power electronic relay switch includes: the device comprises a shell 1, a contact pin 2, a binding post 3, a radiating fin 4, a sealing ring 5, a radiating column 6, a circuit board 7, a screw 8, an MOS (metal oxide semiconductor) tube 9, a pouring sealant 10, an insulating pad 11, a shaft sleeve 12, a contact pin welding hole 13 and a counter bore 14.

The shell 1 is internally provided with a contact pin 2, a binding post 3 and a heat sink 4. The sealing ring 5 is sleeved on the wiring terminal 3, the heat dissipation column 6 is riveted on the heat dissipation sheet 4, the heat dissipation sheet 4 is an aluminum plate, the heat dissipation column 6 is a copper column, a silver coating is arranged on the surface of the heat dissipation column 6, and the two ends of the heat dissipation column 6 are both provided with guide angle structures. The circuit board 7 is fixed on the radiating fin 4 through a screw 8, a countersunk hole 14 is formed in the circuit board 7, and the screw 8 is buried under the plane of the circuit board 7 through the countersunk hole 14. An insulating pad 11 is arranged between the circuit board 7 and the heat sink 4, and the insulating pad 11 is attached to the heat sink 4. The circuit board 7 is welded with the MOS tube 9, the MOS tube 9 is welded with the radiating fin 4, and the wiring terminal 3 is fixed on the circuit board 7. The circuit board 7 is provided with staggered pin welding holes 13, and the pins 2 are connected with the circuit board 7 in a welding mode through the pin welding holes 13. The opening of the shell 1 is sealed by pouring sealant 10, and three shaft sleeves 12 are respectively installed on the outer edge of the shell 1.

The heat dissipation principle of the novel high-power electronic relay switch is as follows: the heat dissipation column and the heat dissipation sheet are matched through riveting and pressing, then the heat dissipation sheet and the circuit board are fixed through screws, and the heat dissipation column penetrates through solder paste brushed on the surface of the circuit board and is welded and fixed with the MOS tube together with other components through reflow soldering.

According to the novel high-power electronic relay switch, the heat dissipation component is directly contacted with the heating source, so that heat is quickly conducted to ensure that the device works normally; the novel high-power electronic relay switch surface mounted device is subjected to reflow soldering together, so that the independent soldering process is reduced, and the efficiency, the reliability and the product consistency of equipment soldering are improved; the circuit board adopts surface gold plating, and the punching hole position is covered with the gold plating layer to increase the radiating surface. The heat radiation structure adopts the form of a heat radiation fin and a heat radiation column: the lower surface of the step surface of the radiating fin is designed to be used for placing an insulating pad to avoid the short circuit problem, and the high surface is contacted with the gold layer of the circuit board to increase the radiating contact area and improve the quick radiating capability; in order to enable the radiator to be in direct contact with the MOS tube in a mode of best heat transfer of the MOS tube, the MOS tube is required to be welded on a circuit board as a key power device, and the heat dissipation structure and the MOS tube are welded into an optimal scheme in order to achieve the final function and combine the MOS tube structure. The traditional heat dissipation structure is copper or aluminum, and the copper structure heat dissipater can realize functions but is heavy and high in price; the aluminum structure radiator has the problem that the aluminum structure radiator cannot be welded with the MOS; in order to meet the requirements of product quality, low cost and light weight, an aluminum plate and copper column structure is adopted; the silver plating on the surface of the heat dissipation column increases the welding reliability, reduces the welding difficulty of the process, increases the surface lubricity due to the silver plating on the surface, and reduces the riveting difficulty with the heat dissipation sheet.

Details not described in this specification are within the skill of the art that are well known to those skilled in the art. The above description is only a preferred embodiment of the present invention, and should not be taken as limiting the invention, and any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. The utility model provides a novel high-power electronic relay switch which characterized in that, novel high-power electronic relay switch includes: the shell, contact pin, terminal, fin are equipped with in it, the cover is equipped with the sealing washer on the terminal, the riveting has the heat dissipation post on the fin, and the circuit board passes through the fix with screw in on the fin, the welding has the MOS pipe on the circuit board, the MOS pipe with the fin welding, the terminal is fixed in on the circuit board, the contact pin with circuit board welded connection, the opening of shell is sealed through the casting glue.

2. The novel high-power electronic relay switch according to claim 1, wherein an insulating pad is arranged between the circuit board and the heat sink, and the insulating pad is attached to the heat sink.

3. A novel high power electronic relay switch according to claim 1, wherein three bushings are mounted on the outer edges of said housing, respectively.

4. The novel high-power electronic relay switch according to claim 1, wherein the heat sink is an aluminum plate, the heat sink pillar is a copper pillar, and the surface of the heat sink pillar is provided with a silver coating.

5. The novel high-power electronic relay switch according to claim 1, wherein the circuit board is provided with staggered pin welding holes.

6. The novel high-power electronic relay switch according to claim 1, wherein a countersunk hole is formed in the circuit board, and the screw is embedded under the plane of the circuit board through the countersunk hole.

7. The novel high-power electronic relay switch according to claim 1, wherein both ends of the heat dissipation column are arranged in a guide angle structure.