CN216391952U

CN216391952U - Solid-state relay

Info

Publication number: CN216391952U
Application number: CN202123273880.4U
Authority: CN
Inventors: 林小军; 陈仁宗; 刘春青; 车佳宇; 陈泽龙; 高韩星; 洪佳崎; 熊伟庆; 李伟
Original assignee: Chint Automotive Technology Co
Current assignee: Chint Automotive Technology Co
Priority date: 2021-12-23
Filing date: 2021-12-23
Publication date: 2022-04-26
Anticipated expiration: 2031-12-23

Abstract

The utility model relates to a solid-state relay, which comprises a shell, wherein a circuit board, an MOS (metal oxide semiconductor) tube, a heat dissipation block and a heat conduction column are arranged in the shell, the MOS tube is arranged on the front side of the circuit board, the heat dissipation block and the heat conduction column are arranged on the back side of the circuit board, and the end part of the heat conduction column is inserted in the heat dissipation block. By adopting the technical scheme, the utility model provides the solid-state relay, the heat-conducting gasket is welded on the reverse side of the circuit board by reflow soldering, the MOS tube is welded on the circuit board by the reflow soldering, the heat generated by the MOS tube is transferred to the heat-conducting gasket and then transferred to the heat-conducting column for heat dissipation, and therefore, the MOS tube can be effectively prevented from being damaged.

Description

Solid-state relay

Technical Field

The utility model relates to the technical field of automobile switches, in particular to a solid-state relay.

Background

The electronic relay switch is used for controlling an electronic relay of a preheater of an automobile engine, the electronic relay switch is directly connected with the preheater, and the working current is up to 200A. The MOS tube (mode tube) is used as a core device of the electronic relay, has the problem of large heat productivity under high power, and is of great importance for ensuring the heat dissipation effect of the MOS tube in normal work. Traditional electronic relay switch has increased heat radiation structure in order to solve the heat dissipation problem, among the prior art, is to pass through the electric induction heating technology with the MOS pipe and is connected with the heat conduction post, can lead to damaging the MOS pipe because the unable fine control of temperature is adding man-hour like this to when MOS intraduct damages, the later stage is unable discernment when detecting, leads to causing the damage of car when using on the car.

Disclosure of Invention

The purpose of the utility model is as follows: in order to overcome the defects of the prior art, the utility model provides the solid-state relay, the heat-conducting gasket is welded on the reverse side of the circuit board by reflow soldering, the MOS tube is welded on the circuit board by the reflow soldering, the heat generated by the MOS tube is transferred to the heat-conducting gasket and then transferred to the heat-conducting column for heat dissipation, and therefore, the MOS tube can be effectively prevented from being damaged.

The technical scheme of the utility model is as follows: the utility model provides a solid-state relay, includes the casing, be equipped with circuit board, MOS pipe, radiating block, heat conduction post in the casing, the MOS pipe sets up at the circuit board openly, and radiating block and heat conduction post setting are at the circuit board reverse side, heat conduction post tip is inserted and is established in the radiating block, its characterized in that, be equipped with the locating hole on the circuit board, it has the heat conduction gasket to weld through the reflow soldering in the locating hole, the heat conduction gasket contacts with the MOS pipe, the MOS pipe passes through reflow soldering on the circuit board, the heat conduction post pass through reflow soldering on the heat conduction gasket.

Adopt above-mentioned technical scheme, adopt reflow soldering's welding mode respectively with MOS pipe, heat conduction gasket welded to the just, the reverse side of circuit board, then with the heat conduction post through reflow soldering's mode welding to the heat conduction gasket, adopt reflow soldering's welding mode, processing is convenient, effectively prevents the damage of MOS pipe, the radiating mode is that the produced heat of MOS pipe is given the heat conduction gasket earlier for, then transmits for the heat conduction post again, dispels the heat, the radiating effect is good like this.

The utility model further comprises the following steps: the thickness of the heat conducting gasket is equal to the thickness of the circuit board.

By adopting the further arrangement, after the heat conduction gasket is arranged in the positioning hole, the structure is smooth, and the subsequent installation of other components is convenient.

The utility model further provides that: the heat conduction gasket is made of red copper.

By adopting the above further arrangement, the heat conducting gasket made of red copper material has good heat conducting effect and fast heat dissipation.

Still further arrangements of the utility model are: the heat conduction column is made of red copper.

By adopting the above further arrangement, the heat conduction effect is good, and the heat dissipation is fast.

Still further arrangements of the utility model are: the radiating block is made of an insulating silica gel material and is fixedly arranged on the circuit board through screws.

By adopting the above further arrangement, the radiating block is only heat-conducting and non-conducting, and is fixed on the circuit board through the screw, so that the structure is more stable.

Still further arrangements of the utility model are: the heat dissipation block is made of hard steel paperboard materials and is fixedly arranged on the circuit board through screws.

Drawings

FIG. 1 is a schematic overall structure diagram of an embodiment of the present invention;

FIG. 2 is a schematic diagram of the internal structure of an embodiment of the present invention;

FIG. 3 is a schematic view of a welded heat-conducting post according to an embodiment of the present invention;

FIG. 4 is a schematic diagram of the front side of the circuit board according to the embodiment of the utility model;

FIG. 5 is a top view of an embodiment of the present invention;

FIG. 6 is a cross-sectional view taken along line A-A of FIG. 5;

FIG. 7 is an enlarged view of portion A of FIG. 6;

fig. 8 is a schematic diagram of the reverse side of a circuit board according to an embodiment of the utility model.

Detailed Description

The technical solutions in the embodiments will be described clearly and completely with reference to the accompanying drawings, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

It should be noted that all the directional indications (such as up, down, front, and back … …) in the description of the present invention are only used to explain the relative position relationship between the components, the movement, etc. in a specific posture (as shown in the drawings), and if the specific posture is changed, the directional indication is changed accordingly.

In addition, the descriptions related to "first", "second", etc. in the present invention are only for descriptive purposes and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. In the description of the present invention, "a number" means at least two, e.g., two, three, etc., unless specifically limited otherwise.

In addition, the technical solutions in the embodiments of the present invention may be combined with each other, but it is necessary that a person skilled in the art can realize the technical solutions, and when the technical solutions are contradictory or cannot be realized, such a combination of the technical solutions should be considered to be absent and not within the protection scope of the present invention.

As shown in fig. 1-8, a solid-state relay includes a housing 1, a circuit board 2, a MOS tube 3, a heat sink 4, and a heat conducting post 5 are disposed in the housing 1, the MOS tube 3 is disposed on the front side of the circuit board 2, the heat sink 4 and the heat conducting post 5 are disposed on the back side of the circuit board 2, the circuit board 2 is further provided with a pin 7 and a connection bolt 8, and the structures of the pin and the connection bolt are the same as those of the prior art, so that the detailed description is omitted herein, the end of the heat conducting post 5 is inserted into the heat sink 4, the circuit board 2 is provided with a positioning hole 21, a heat conducting pad 6 is welded in the positioning hole 21 by reflow soldering, the heat conducting pad 6 contacts with the MOS tube 3, the MOS tube 3 is soldered on the back side of the circuit board 2 by reflow soldering, the heat conducting post 5 is soldered on the heat conducting pad 6 by reflow soldering, the heat sink 4 is disposed on the circuit board 2, and the heat dissipation block 4 is provided with a jack 41 corresponding to the position of the heat conduction post 5, the heat conduction post 5 is inserted in the jack 41, the heat conducting gasket 6 and the heat conducting column 5 are both red copper heat conducting gaskets, the heat conducting effect is good, the heat dissipation is fast, the MOS tube 3 and the heat conducting gasket 6 are respectively welded on the front surface and the back surface of the circuit board 2 by adopting a reflow soldering mode, then the heat conducting column 5 is welded on the heat conducting gasket 6 by a reflow soldering mode, the reflow soldering mode is adopted, the processing is convenient, the MOS tube 3 is effectively prevented from being damaged, the problems in the prior art are solved, the MOS tube is connected with the heat-conducting column by adopting an inductive heating process, the MOS tube is damaged because the temperature cannot be well controlled during processing, the heat dissipation mode is that the heat generated by the MOS tube 3 is firstly transferred to the heat-conducting gasket 6, then, the heat is transmitted to the heat conducting column 5 for heat dissipation, so that the heat dissipation effect is good, and the opening in the shell 1 is sealed through the sealant 11.

Specifically, the thickness of the heat conducting gasket 6 is equal to the thickness of the circuit board 2, and after the heat conducting gasket 6 is installed in the positioning hole 21, the structure is flat, and subsequent installation of other components is facilitated.

In this embodiment, the heat dissipation block 4 adopts insulating silica gel material to make, the heat dissipation block 4 pass through the fix with screw setting on circuit board 2, of course, the heat dissipation block 4 adopts hard steel cardboard material to make, or other insulating material makes, and is not only restricted to these two kinds for the heat dissipation block only conducts heat, and is not electrically conductive, fixes the heat dissipation block 4 on circuit board 2 through the screw, and the structure is more stable.

The solid-state relay of the utility model has the following heat dissipation principle: the MOS tube is welded on the front surface of the circuit board through reflow soldering, the heat-conducting gasket is arranged in the circuit board, then the heat-conducting gasket passes through a steel mesh and is brushed with tin paste, the heat-conducting gasket is fixed with the fixing plate through reflow soldering and is in contact with the MOS tube, then the heat-conducting column is welded on the heat-conducting gasket, and therefore heat generated by the MOS tube is transferred to the heat-conducting gasket and then is transferred to the heat-conducting column for heat dissipation.

Claims

1. The utility model provides a solid-state relay, includes the casing, be equipped with circuit board, MOS pipe, radiating block, heat conduction post in the casing, the MOS pipe sets up at the circuit board openly, and radiating block and heat conduction post setting are at the circuit board reverse side, heat conduction post tip is inserted and is established in the radiating block, its characterized in that, be equipped with the locating hole on the circuit board, it has the heat conduction gasket to weld through the reflow soldering in the locating hole, the heat conduction gasket contacts with the MOS pipe, the MOS pipe passes through reflow soldering on the circuit board, the heat conduction post pass through reflow soldering on the heat conduction gasket.

2. The solid state relay according to claim 1, wherein the thickness of the thermal pad is equal to the thickness of the circuit board.

3. The solid-state relay according to claim 1 or 2, wherein the heat conductive pad is a red copper heat conductive pad.

4. The solid-state relay according to claim 3, wherein the heat-conducting pillar is a red copper heat-conducting pillar.

5. The solid-state relay according to claim 4, wherein the heat dissipation block is made of an insulating silica gel material, and the heat dissipation block is fixed on the circuit board by screws.

6. The solid state relay according to claim 4, wherein the heat slug is made of a hard vulcanized paper material, and the heat slug is fixed to the circuit board by screws.