CN217257761U

CN217257761U - Lamp bead packaging mold monomer and mold module

Info

Publication number: CN217257761U
Application number: CN202123076044.7U
Authority: CN
Inventors: 曾少林
Original assignee: Shenzhen Deming New Microelectronics Co ltd
Current assignee: Shenzhen Deming New Microelectronics Co ltd
Priority date: 2021-12-07
Filing date: 2021-12-07
Publication date: 2022-08-23
Anticipated expiration: 2031-12-07

Abstract

The lamp bead packaging mold monomer comprises a lamp bead support monomer and a plurality of LED chips arranged on the surface of the lamp bead support monomer, wherein the lamp bead support monomer comprises a signal input end and a signal output end which are arranged on the same horizontal line, and a gap for cutting a signal line is arranged between the signal input end and the signal output end; the method comprises the following steps: an upper die and a lower die; the upper die is arranged above the lower die; the upper die is provided with an inwards concave cavity corresponding to the shape of the upper part of the lamp bead prefabricated part monomer; a stop block protruding downwards is arranged in the concave cavity corresponding to the gap; the surface of the upper die is provided with a glue injection hole; the lower die is provided with a positioning groove corresponding to the shape of the lower part of the lamp bead prefabricated part monomer. This application can make the encapsulation colloid form the depressed area between signal input part and signal output part, is convenient for excise the wire between signal input part and the signal output part fast.

Description

Lamp bead packaging mold monomer and mold module

Technical Field

The application relates to the technical field of LED packaging, in particular to a lamp bead packaging mold single body and a mold module.

Background

An LED (Light Emitting Diode) is a solid semiconductor device, which uses a solid semiconductor chip as a Light Emitting material, and generates recombination by carriers to release energy to cause photon emission, thereby directly converting electrical energy into optical energy. The LED has the advantages of high brightness, small volume, high efficiency, long service life and the like, and is widely applied to the fields of traffic indication, outdoor full-color display and the like.

The traditional point control LED lamp string comprises four wires, wherein two wires are power wires, and the other two wires are signal wires. However, since four electrical connection points (i.e., the positive connection end, the negative connection end, the signal input end and the signal output end) of the LED lamp bead support are respectively located at four corners, the lamp bead support needs to be rotated by a certain angle and then welded with a wire, which results in a large volume and high manufacturing cost of such point-controlled LED lamp strings. In order to reduce the cost, some point control LED lamp strings adopt three wires, two wires are power supply wires, the other wire is a signal wire, a control chip is integrated in the lamp beads, and the signal output end of one lamp bead is connected with the signal output end of the adjacent lamp bead through the signal wire. When the three-wire point control LED lamp string is produced, the lamp bead prefabricated part can be encapsulated by glue, then the encapsulated prefabricated part is welded on the conducting wire, and finally the signal wire between the signal input end and the signal output end is cut off. However, the existing packaging mold is single in shape, the solidified colloid is completely coated on the surface of the lamp bead prefabricated member, and the signal line between the signal input end and the signal output end is difficult to be cut off quickly and effectively.

SUMMERY OF THE UTILITY MODEL

In view of the above, the present application is provided to provide a lamp bead packaging mold unit and a mold module that overcome or at least partially solve the above problems, including:

a lamp bead packaging mold monomer is used for packaging a lamp bead prefabricated member monomer, the lamp bead prefabricated member monomer comprises a lamp bead support monomer and a plurality of LED chips arranged on the surface of the lamp bead support monomer, the lamp bead support monomer comprises a signal input end and a signal output end which are arranged on the same horizontal line, and a gap for cutting a signal line is formed between the signal input end and the signal output end; the method comprises the following steps: an upper die and a lower die; the upper die is arranged above the lower die; the upper die is provided with an inwards concave cavity with a preset shape; a stop block protruding downwards is arranged in the concave cavity corresponding to the gap; the surface of the upper die is provided with a glue injection hole; the lower die is provided with a positioning groove corresponding to the shape of the lower part of the lamp bead prefabricated part monomer.

Preferably, the stopper extends from the top surface of the concave cavity to the bottom surface of the lower mold.

Preferably, the glue injection hole is arranged at the top of the upper die.

Preferably, the concave cavity is a rectangular body.

Preferably, the concave cavity is a hemisphere.

Preferably, the concave cavity is a trapezoid.

Preferably, the upper mold and the lower mold are integrally formed through an injection molding process.

A lamp bead packaging mold module is used for packaging a lamp bead prefabricated part, and the lamp bead prefabricated part comprises a plurality of lamp bead prefabricated part monomers which are arranged in an array manner; the method comprises the following steps: the lamp bead packaging mold comprises a substrate and any one of the lamp bead packaging mold monomers; the surface of the substrate is provided with a plurality of mounting through holes which are arranged in an array; the lamp bead packaging mold monomer is arranged inside the mounting through hole.

Preferably, the surface of the substrate is further provided with a positioning hole.

Preferably, the substrate is made of metal.

The application has the following advantages:

in the embodiment of the application, the upper die and the lower die are used; the upper die is arranged above the lower die; the upper die is provided with an inwards concave cavity with a preset shape; a stop block protruding downwards is arranged in the concave cavity corresponding to the gap; the surface of the upper die is provided with a glue injection hole; the lower die is provided with a positioning groove corresponding to the shape of the lower part of the lamp bead prefabricated part, so that a recessed area is formed between the signal input end and the signal output end by the packaging colloid, and the signal input end and the wire between the signal output ends can be cut off conveniently and quickly.

Drawings

In order to more clearly illustrate the technical solutions of the present application, the drawings required to be used in the description of the present application will be briefly described below, and it is apparent that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art that other drawings may be obtained according to these drawings without creative efforts.

Fig. 1 is a schematic front structure view of a single lamp bead packaging mold provided in an embodiment of the present application;

fig. 2 is a schematic bottom structure view of a single lamp bead packaging mold provided in an embodiment of the present application;

fig. 3 is a schematic structural diagram of an encapsulant corresponding to a single bead encapsulant module according to an embodiment of the present disclosure;

fig. 4 is a schematic front structure view of a single lamp bead packaging mold provided in an embodiment of the present application;

fig. 5 is a schematic bottom structure view of a single lamp bead packaging mold provided in an embodiment of the present application.

The reference numbers in the drawings of the specification are as follows:

1. the lamp bead packaging mold monomer; 11. an upper die; 111. an inwardly concave cavity; 112. a stopper; 12. a lower die; 2. a substrate.

Detailed Description

In order to make the aforementioned objects, features and advantages of the present application more comprehensible, the present application is described in further detail with reference to the accompanying drawings and the detailed description. It should be apparent that the embodiments described are some, but not all embodiments of the present application. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

It should be noted that, in any embodiment of this application, lamp pearl packaging mold monomer 1 for encapsulate lamp pearl prefab monomer, lamp pearl prefab monomer includes lamp pearl support monomer and sets up a plurality of LED chips on lamp pearl support monomer surface, lamp pearl support monomer is including setting up signal input part and the signal output part on same water flat line, signal input part with be equipped with the clearance that is used for tailorring the signal line between the signal output part. The lamp bead packaging mold module is used for packaging the lamp bead prefabricated part, and the lamp bead prefabricated part comprises a plurality of lamp bead prefabricated part monomers arranged in an array manner.

Referring to fig. 1-3, a lamp bead packaging mold unit 1 provided in an embodiment of the present application is shown, including: an upper mold 11 and a lower mold 12; the upper mold 11 is disposed above the lower mold 12; the upper die 11 is provided with a concave cavity 111 with a preset shape; a stop block 112 protruding downwards is arranged in the concave cavity 111 corresponding to the gap; the surface of the upper die 11 is provided with a glue injection hole; the lower die 12 is provided with a positioning groove corresponding to the shape of the lower part of the lamp bead prefabricated part.

In the embodiment of the present application, the upper mold 11 and the lower mold 12; the upper mold 11 is disposed above the lower mold 12; the upper die 11 is provided with a concave cavity 111 with a preset shape; a stop block 112 protruding downwards is arranged in the concave cavity 111 corresponding to the gap; the surface of the upper die 11 is provided with a glue injection hole; the lower die 12 is provided with a positioning groove corresponding to the shape of the lower part of the prefabricated lamp bead body, so that a recessed area is formed between the signal input end and the signal output end by the aid of the packaging colloid, and the signal input end and the lead between the signal output ends can be cut off conveniently and quickly.

Next, a bead packaging mold unit 1 in the present exemplary embodiment will be further described.

In this embodiment, the stopper 112 extends from the top surface of the concave cavity 111 to the bottom surface of the lower mold 12. Through with dog 112 extends to the bottom surface of bed die 12 makes the packaging colloid is in signal input part with form between the signal output part and run through to the depressed area of lamp pearl support monomer bottom, be convenient for fast right signal input part with wire between the signal output part is amputated.

In this embodiment, the glue injection hole is disposed at the top of the upper mold 11. Specifically, the surface of the upper die 11 is also provided with an exhaust hole; the glue injection hole is used for injecting glue into the concave cavity 111, the exhaust hole is used for exhausting gas in the glue injection process, and the concave cavity 111 can be completely filled with packaging glue after glue injection is completed.

In this embodiment, the concave cavity 111 is a rectangular body.

In this embodiment, the concave cavity 111 is a hemisphere.

In this embodiment, the concave cavity 111 is a trapezoid.

It should be noted that the concave cavity 111 may also be a combination of a rectangular body and a trapezoid body or a hemisphere body, or any other shape, which is not limited in this application.

In this embodiment, the upper mold 11 and the lower mold 12 are integrally formed by an injection molding process. The upper mold 11 and the lower mold 12 are stably connected to form a surrounding structure with a downward opening. When the lamp bead packaging mold monomer 1 is installed, the lamp bead packaging mold monomer 1 is placed above the lamp bead prefabricated part monomer, so that the lower mold 12 is connected with the lower part of the lamp bead support in a clamping mode.

Referring to fig. 4-5, a lamp bead packaging mold module provided by an embodiment of the present application is shown, including: the lamp bead packaging mold comprises a substrate 2 and a lamp bead packaging mold monomer 1; the surface of the substrate 2 is provided with a plurality of mounting through holes which are arranged in an array; the lamp bead packaging mold single body 1 is arranged inside the mounting through hole. Specifically, the lower die 12 is attached inside the mounting through-hole; the arrangement form of the installation through holes corresponds to the arrangement form of the single lamp bead prefabricated member, for example, when the single lamp bead prefabricated member is arranged in a form of 10 rows by 20 columns, the installation through holes are arranged in a form of 10 rows by 20 columns.

In this embodiment, the surface of the substrate 2 is further provided with a positioning hole. The positioning hole is used for connecting and fixing the substrate 2 and a workbench below the dispensing equipment.

In this embodiment, the substrate 2 is made of metal. The substrate 2 can be made of a metal sheet, so that the substrate is convenient to clean; the lamp bead packaging mold body 1 is made of transparent materials, so that the dispensing progress can be observed conveniently.

While preferred embodiments of the present application have been described, additional variations and modifications of these embodiments may occur to those skilled in the art once they learn of the basic inventive concepts. Therefore, it is intended that the appended claims be interpreted as including the preferred embodiment and all such alterations and modifications as fall within the true scope of the embodiments of the application.

Finally, it should also be noted that, in this document, relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or terminal that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or terminal. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other like elements in a process, method, article, or terminal that comprises the element.

The lamp bead packaging mold monomer and the mold module provided by the application are introduced in detail, specific examples are applied in the description to explain the principle and the implementation mode of the application, and the description of the embodiments is only used for helping to understand the method and the core idea of the application; meanwhile, for a person skilled in the art, according to the idea of the present application, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present application.

Claims

1. A lamp bead packaging mold monomer is used for packaging a lamp bead prefabricated member monomer, the lamp bead prefabricated member monomer comprises a lamp bead support monomer and a plurality of LED chips arranged on the surface of the lamp bead support monomer, the lamp bead support monomer comprises a signal input end and a signal output end which are arranged on the same horizontal line, and a gap for cutting a signal line is formed between the signal input end and the signal output end; it is characterized by comprising: an upper die and a lower die; the upper die is arranged above the lower die; the upper die is provided with an inwards concave cavity with a preset shape; a stop block protruding downwards is arranged in the concave cavity corresponding to the gap; the surface of the upper die is provided with a glue injection hole; the lower die is provided with a positioning groove corresponding to the shape of the lower part of the lamp bead prefabricated part monomer.

2. A lamp bead packaging mold monomer according to claim 1, wherein the stopper extends from the top surface of the recessed cavity to the bottom surface of the lower mold.

3. A lamp bead packaging mold monomer according to claim 1, wherein the glue injection hole is provided at the top of the upper mold.

4. A lamp bead packaging mold unit according to claim 1, wherein the concave cavity is a rectangular body.

5. A lamp bead packaging mold monomer according to claim 1, wherein the concave cavity is a hemisphere.

6. A lamp bead packaging mold unit as claimed in claim 1, wherein the concave cavity is a trapezoid.

7. A lamp bead packaging mold monomer according to claim 1, wherein the upper mold and the lower mold are integrally formed by an injection molding process.

8. A lamp bead packaging mold module is used for packaging a lamp bead prefabricated part, the lamp bead prefabricated part comprises a plurality of lamp bead prefabricated part monomers which are arranged in an array, and the lamp bead prefabricated part monomers are the lamp bead prefabricated part monomers according to any one of claims 1-7; it is characterized by comprising: a substrate and the lamp bead packaging mold monomer of any one of claims 1-7; the surface of the substrate is provided with a plurality of mounting through holes which are arranged in an array; the lamp bead packaging mold monomer is arranged inside the mounting through hole.

9. The lamp bead packaging mold module of claim 8, wherein the substrate surface is further provided with positioning holes.

10. The lamp bead packaging mold module of claim 8, wherein the substrate is made of metal.