CN2717025Y - Power LED - Google Patents
Power LED Download PDFInfo
- Publication number
- CN2717025Y CN2717025Y CNU2004200468314U CN200420046831U CN2717025Y CN 2717025 Y CN2717025 Y CN 2717025Y CN U2004200468314 U CNU2004200468314 U CN U2004200468314U CN 200420046831 U CN200420046831 U CN 200420046831U CN 2717025 Y CN2717025 Y CN 2717025Y
- Authority
- CN
- China
- Prior art keywords
- power led
- heat sink
- recessed cup
- tube core
- framework
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Fastening Of Light Sources Or Lamp Holders (AREA)
Abstract
The utility model discloses a power luminous diode which is packaged by a half covering structure and comprises an electrode leading leg, a heat sink, a frame, a diode core, a bonding wire and transparent gelatinoid packaging materials, wherein, a frame is molded by injection through plastics; in the injection process, a concave cup is formed in the position for placing the diode core; the inner section of the concave cup forms a back taper shape or a parabolic shape; the inner side face of the concave cup is plated with a reflection layer; after the diode core is put in the concave cup and the wire is connected, the transparent gelatinoid packaging materials are filled in the concave cup. The power luminous diode has the characteristics of good heat dispersion and high luminous efficiency, and is applied to different illumination application.
Description
Technical field
The utility model relates to a kind of light-emitting diode, specifically, relates to a kind of power led.
Background technology
Be to increase the LED core area or add the big light-emitting diodes input current for improving the method that light-emitting diode luminance and luminous flux adopted at present.Along with the increase of LED core and the increase of input current, the heat that LED core produced also constantly increases, if the heat that LED core produced can not in time be transmitted in the environment, the accumulation of heat will cause the rising of tube core PN junction temperature, and the rising of PN junction temperature will directly have influence on luminous flux, luminous intensity and the luminous efficiency of light-emitting diode.Therefore conventional stent formula and flat type LED can't increase input current or adopt the large chip tube core because its pin is little and do not have a special heat dissipation design.Along with the development of semiconductor lighting, conventional stent formula and flat type LED can not satisfy illuminating engineering and the constantly requirement of development of other special lighting.
Summary of the invention
The purpose of this utility model be to provide a kind of luminous intensity height, perfect heat-dissipating, simple in structure, use power led easily.
Assembling structure is partly sealed in power led employing of the present utility model, it comprises electrode pin, heat sink, framework, tube core, bonding line, transparent gluey encapsulating material, heat sink and first electrode pin is an integral structure, remaining electrode links to each other with tube core by bonding line and separates with heat sink, heat sinkly be arranged in the framework and have one side all to expose, in the framework central upper one recessed cup is arranged, plating one deck reflector, surface of recessed cup, transparent gluey encapsulating material is filled in the recessed cup, and tube core is placed on recessed cup bottom heat sink.Heat sink upper and lower surface is the plane, and each electrode pin is a sheet, and framework adopts injection mo(u)lding, and its profile is rectangle or square.
The effect that the utility model can reach is: adopt special heat sink design, increased area of dissipation; Adopt the encapsulation of half encapsulating structure, heat sink one side all exposes, and can fully contact with wiring board, has accelerated heat transfer rate, and the light that the reflector of the recessed cup of framework can be sent the tube core side reflects away, and has increased the luminous flux and the luminous intensity of light-emitting diode; The pellet electrode pin has increased the contact area with wiring board, can increase heat transfer area, accelerates heat radiation.In a word, the utility model can effectively improve power led radiating effect and luminous efficiency.
Description of drawings
The utility model is described in further detail below in conjunction with the drawings and specific embodiments:
Fig. 1 is the utility model first embodiment schematic diagram;
Fig. 2 is the utility model second embodiment schematic diagram;
Fig. 3 is the stereogram of the utility model first embodiment.
Specific embodiment
As shown in Figure 1, assembling structure is partly sealed in power led employing of the present utility model, it comprises electrode pin, heat sink 3, framework 1, tube core 4, bonding line 8, transparent gluey encapsulating material 9, heat sink 3 and first electrode pin 2 is an integral structure, remaining electrode is that second electrode pin 5 in the present embodiment links to each other by bonding line 8 and tube core 4 and separates with heat sink 3, and first electrode and second electrode pin are sheet; Heat sink 3 are arranged in the framework 1 and have one side all to expose, and its upper and lower surface is the plane; In framework 1 central upper one recessed cup 6 is arranged, plating one deck reflector, surface 7 of recessed cup 6, transparent gluey encapsulating material 9 is filled in the recessed cup 6, tube core 4 be placed in recessed cup 6 bottoms heat sink 3 on; Recessed cup 6 cross sections are inverted cone shape, also can adopt parabolic shape; Recessed cup 6 surfaces the reflector of plating 7 materials be magnesium or silver; Framework 1 profile is a square or rectangular.
The embodiment shown in Figure 2 and the main distinction of Fig. 1 are that the outer surface that is filled in the transparent gluey encapsulating material 9 in the recessed cup 6 is a sphere, and Fig. 1 is the plane.All the other are identical with Fig. 1 embodiment, and present embodiment is not carefully stated at this.
Make the utility model power led before, by each power led electrode pin, heat sinkly form power led support, form the support bar by a plurality of support parallel arranged, fabrication and processing is based on the support bar.The power led making of the utility model may further comprise the steps:
(1) injection mo(u)lding: framework is sealed in power led support injection moulding;
(2) plating reflector: at the side of the recessed cup of framework plating magnesium or argentum reflecting layer;
(3) welding tube core: tube core is bonding or be welded on the heat sink metal covering;
(4) gold thread bonding: tube core is connected to the respective electrode pin with gold thread;
(5) some glue: insert in the recessed cup with the gluey encapsulating material of deployed elasticity printing opacity;
(6) solidify: the power led curing oven of putting into that will put glue solidifies, and makes the gluey encapsulation material solidifies moulding of elasticity printing opacity;
(7) floating screed: cut from its support bar with power led;
(8) test: the optics of detection power light-emitting diode and electrical parameter and according to the detection case stepping;
(9) packing: power led being packaged into behind the stepping adorned or slivering;
(10) warehouse-in.
The main distinction of second embodiment and first embodiment is that the exiting surface of second embodiment is a sphere.In fact, power led a lot of other embodiment that also have of the present utility model, for example, but power led seamed edge chamfer or rounding; Power led can have plural electrode, and each utmost point pin number also can be different, and the shape of electrode and pin also can be different, and each electrode pin can be identical with first utmost point thickness near the thickness of die site; Can encapsulate more than one tube core in recessed cup, can connect between each tube core also can be in parallel.
Claims (6)
1, a kind of power led, comprise electrode pin, heat sink, framework, tube core, bonding line, transparent gluey encapsulating material, it is characterized in that it adopts and partly seals assembling structure, heat sink and first electrode pin is an integral structure, remaining electrode links to each other with tube core by bonding line and separates with heat sink, heat sink being arranged in the framework has a recessed cup in the framework central upper, plating one deck reflector, surface of recessed cup, transparent gluey encapsulating material is arranged on the recessed cup, and tube core is placed on recessed cup bottom heat sink.
2, according to claim 1 power led, it is characterized in that recessed cup cross section is inverted cone shape or parabolic shape.
3, according to claim 2 power led, it is characterized in that the recessed cup surface reflector material that plates is magnesium or silver.
4, according to claim 1 power led, it is characterized in that heat sink upper and lower surface is the plane.
5, according to claim 1 power led, it is characterized in that each electrode pin is a sheet.
6, according to claim 1 power led, it is characterized in that outling of truss is a square or rectangular.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2004200468314U CN2717025Y (en) | 2004-06-11 | 2004-06-11 | Power LED |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2004200468314U CN2717025Y (en) | 2004-06-11 | 2004-06-11 | Power LED |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2717025Y true CN2717025Y (en) | 2005-08-10 |
Family
ID=34872286
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2004200468314U Expired - Lifetime CN2717025Y (en) | 2004-06-11 | 2004-06-11 | Power LED |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2717025Y (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2009012624A1 (en) * | 2007-07-23 | 2009-01-29 | Foshan Nationstar Optoelectronics Limited Liability Company | A white light device and the manufacturing method thereof |
| CN102257646A (en) * | 2008-12-19 | 2011-11-23 | 三星Led株式会社 | Lighting device package, backlight unit, display device and lighting device |
| CN109973838A (en) * | 2019-04-04 | 2019-07-05 | 固安翌光科技有限公司 | A kind of LED atmosphere lamp |
-
2004
- 2004-06-11 CN CNU2004200468314U patent/CN2717025Y/en not_active Expired - Lifetime
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2009012624A1 (en) * | 2007-07-23 | 2009-01-29 | Foshan Nationstar Optoelectronics Limited Liability Company | A white light device and the manufacturing method thereof |
| CN102257646A (en) * | 2008-12-19 | 2011-11-23 | 三星Led株式会社 | Lighting device package, backlight unit, display device and lighting device |
| US8541800B2 (en) | 2008-12-19 | 2013-09-24 | Samsung Electronics Co., Ltd. | Light emitting device package, backlight unit, display device and lighting device |
| CN109973838A (en) * | 2019-04-04 | 2019-07-05 | 固安翌光科技有限公司 | A kind of LED atmosphere lamp |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee |
Owner name: FUSHAN CITY GUOXING PHOTOELECTRIC CO., LTD. Free format text: FORMER NAME OR ADDRESS: FUSHAN CITY GUOXING PHOTOELECTRICITY TECHNOLOGY CO.,LTD. |
|
| CP03 | Change of name, title or address |
Address after: 528000, No. 18, Huabao South Road, Chancheng District, Guangdong, Foshan Patentee after: Foshan Guoxing Photoelectric Co., Ltd. Address before: 528000, No. 24 Jiangbei Road, Chancheng District, Guangdong, Foshan Patentee before: Foshan Nationstar Optoelectronics Co., Ltd. |
|
| C17 | Cessation of patent right | ||
| CX01 | Expiry of patent term |
Expiration termination date: 20140611 Granted publication date: 20050810 |