CN217193114U - System capable of processing group holes at one time - Google Patents

Abstract

The utility model discloses a system capable of processing group holes at one time. The system comprises: the laser processing unit is used for preprocessing a multi-layer splicing structure which is mainly formed by sequentially laminating a workpiece to be processed, an insulating layer and a cathode conducting layer to form a plurality of through holes penetrating through the workpiece in the thickness direction; the electrolytic machining unit comprises a machining cavity and an electrolyte supply mechanism, the machining cavity is used for accommodating the multilayer splicing structure, and the electrolyte supply mechanism is used for supplying electrolyte into the machining cavity; the driving unit is used for driving different areas of the surface of the multilayer splicing structure to be in contact reaction with the high-energy laser beam provided by the laser processing unit, and the driving unit, the laser processing unit and the processing chamber are arranged on the base. The embodiment of the utility model provides a system that can once carry out group's hole processing can compromise machining efficiency and processingquality in the high quality group's hole processing to satisfy the high-efficient precision finishing demand that does not have recast layer group's hole.

Description

System capable of processing group holes at one time

Technical Field

The utility model particularly relates to a system that can once carry out group's hole processing belongs to special type processing technology field.

Background

In the aerospace field, the application of the group hole structure is very wide. The aviation manufacturing industry aims at the processing of precise micro-group holes, in particular to the processing of film cooling holes on blades of an aircraft engine, and has extremely strict processing requirements, wherein the processing requirements comprise no defects such as recasting layers, microcracks and the like, and the thickness of a heat affected layer needs to be strictly controlled, and the traditional processing technology is difficult to meet.

Laser processing can realize output of high energy density in an energy focusing mode. At present, the power output of high-energy laser reaches the level of ten-thousand watts, and the laser is widely applied to cutting, welding and the like of difficult-to-process materials in the manufacturing fields of aerospace, nuclear industry and the like. The conventional short pulse laser can process large-thickness metal plates such as 20mm aluminum alloy and 50mm stainless steel, a 2 kW-level quasi-continuous laser can realize the punching rate of 500mm/min on the high-temperature alloy, and a 15 kW-level laser can complete the punching within 1s on a 20mm aluminum alloy plate

The processing of the inner through round hole is far higher than the maximum speed of 2-4mm/min which can be achieved by the electrolytic processing of the small hole. However, as a thermal processing technology, laser processing inevitably forms defects such as recast layers, microcracks and the like on the inner surface of the micropores, and influences the mechanical properties and the service life of parts.

The electrolytic machining utilizes the anode dissolution principle to realize the material erosion of the set area of the workpiece, has the advantages of no tool loss, no heat affected zone, no recasting layer and the like, and is widely applied to the machining of high-quality complex structures of metal materials. The tube electrode electrolytic machining is to use tubular metal as a tool cathode, utilize electrolyte to flow out from the inner hole of the metal tube at a high speed, erode and remove materials and timely bring out an electrolytic product from a machining area, and can realize the machining of an intervention type high-quality deep small hole. However, compared with laser processing, the electrolytic processing has the problems that the material removal rate is low, and the electrolytic processing of the tube electrode has difficulty in eliminating the residual at the center of a processing area.

The laser and electrolysis combined machining method combines the advantages of high removal rate of laser machining materials, good surface quality of electrolysis machining and no heat influence area, and can realize low heat damage high-efficiency precise machining. The laser and electrolysis combined machining method mainly comprises step-by-step combined machining and synchronous combined machining. The step-by-step composite processing utilizes laser to pre-process a penetrating microporous structure on a workpiece, then a tubular electrode is extended into a prefabricated hole, the processing of the microporous structure is completed through electrochemical reaction, and a recasting layer and micro cracks formed by laser processing are removed. The method improves the processing efficiency of a single high-quality small hole to a certain extent, but in the face of parts such as filter screens and the like which have the processing requirements of large-area curved surface group hole structures, the positioning is difficult by adopting a hole-by-hole processing mode, the processing efficiency is low, and the problem that the positioning of the cathode tube electrode is difficult exists in the electrolytic post-treatment process.

The utility model discloses the laser that the people provided and coaxial synchronous combined machining technique of electrolysis (ZL201711136789.3, ZL201711136281.3), can realize that the intervention of deep aperture is high-efficient, high quality processing, from having solved in principle that the technology switches over and leads to the problem that positioning accuracy is difficult to control among the distributed combined machining, but in the face of crowd's hole overall structure's processing demand, still can't solve the problem that the adoption pursues hole processing mode inefficiency.

SUMMERY OF THE UTILITY MODEL

The main object of the present invention is to provide a system for processing group holes at a time, which overcomes the disadvantages of the prior art.

In order to realize the purpose of the utility model, the utility model adopts the technical scheme that includes:

the embodiment of the utility model provides a system that can once carry out group's hole processing is used for realizing no recast layer group's hole laser and electrolysis normal position combination processing method, the system that can once carry out group's hole processing includes:

the laser processing unit is at least used for providing a high-energy laser beam and preprocessing the high-energy laser beam in a preset area of a multi-layer splicing structure mainly formed by sequentially laminating a workpiece to be processed, an insulating layer and a cathode conducting layer along the thickness direction to form a plurality of through holes penetrating through the workpiece along the thickness direction;

the electrolytic processing unit comprises a processing chamber and an electrolyte supply mechanism, wherein the processing chamber is at least used for accommodating the multilayer splicing structure, and the electrolyte supply mechanism is connected with the processing chamber and is at least used for supplying electrolyte into the processing chamber;

the driving unit is at least used for driving the processing chamber and/or the laser processing unit to move along a preset track so as to enable different areas of the surface of the multilayer splicing structure to be in contact reaction with the high-energy laser beam provided by the laser processing unit;

wherein, drive unit, laser processing unit and processing cavity set up on the base.

Compared with the prior art, the embodiment of the utility model provides a system that can once carry out crowd's hole processing can compromise machining efficiency and processingquality in the high quality crowd's hole (being a plurality of through-holes) processing, solves current laser and electrolytic machining method and adopts to pursue the hole processing and lead to whole machining efficiency low, the accurate centering of distribution combination processing electrode to fix a position the high grade problem to satisfy the high-efficient precision finishing demand that does not have recast layer crowd's hole.

Drawings

Fig. 1 is a schematic structural diagram of a system for group hole machining at a time according to an exemplary embodiment of the present invention;

fig. 2 is a schematic diagram of a portion of a system for group hole machining in one step according to an exemplary embodiment of the present invention;

FIG. 3 is a schematic flow chart of a laser and electrolysis in-situ combination method for processing a non-recast hole group according to an exemplary embodiment of the present invention;

fig. 4 is a schematic diagram of the electrochemical machining process for the multi-layered structure according to an exemplary embodiment of the present invention.

Detailed Description

In view of the deficiencies in the prior art, the inventor of the present invention has made extensive studies and practices to provide the technical solution of the present invention. The technical solution, its implementation and principles, etc. will be further explained as follows.

The embodiment of the utility model provides a system that can once carry out group's hole processing, under the prerequisite of guaranteeing that deep hole is high-efficient, high-quality processing, solve the technical problem that group's hole machining efficiency improves, further optimize current laser and electrolysis combined machining mode, realized the synchronous processing of large tracts of land group's hole structure, improved laser and electrolysis combined machining's machining efficiency.

The embodiment of the utility model provides a system that can once carry out crowd's hole processing can compromise machining efficiency and processingquality in the high quality crowd's hole (being a plurality of through-holes) processing, solves current laser and electrolysis combined machining method and adopts to pursue the hole processing and lead to whole machining efficiency low, the accurate centering of distribution combination processing electrode to fix a position the high grade problem of the degree of difficulty to satisfy the high-efficient precision finishing demand that does not have the crowd's hole of recast layer.

The embodiment of the utility model provides a no recast layer crowd's hole laser and electrolysis normal position combination processing method, include:

providing a multi-layer splicing structure which is formed by sequentially laminating a workpiece to be processed, an insulating layer and a cathode conducting layer along the thickness direction;

firstly, preprocessing a preset area on the surface of the workpiece to be processed by using a high-energy laser beam to form a plurality of through holes penetrating through the multilayer splicing structure along the thickness direction;

and then the workpiece to be processed and the cathode conducting layer are respectively and electrically connected with the anode and the cathode of a power supply, so that the plurality of through holes in the multilayer splicing structure are immersed in the electrolyte, and the electrolyte, the workpiece to be processed and the cathode conducting layer form a conducting path and carry out electrochemical corrosion removal reaction, thereby removing the recast layer on the inner wall of the through hole by reaction.

In some more specific embodiments, the method for processing the non-recast layer group hole by combining laser and electrolysis in situ comprises the following steps: and focusing the high-energy laser beam to a predetermined area on the surface of the multi-layer splicing structure by using a focusing lens, and vertically transmitting the high-energy laser beam along the thickness direction of the multi-layer splicing structure, thereby forming the through hole.

In some more specific embodiments, a plurality of the through holes are formed by multiple processing with one or more high-energy laser beams, or a plurality of the through holes are formed by processing with one high-energy laser beams, wherein the recast layer is formed by reacting the multi-layer mosaic structure under the action of the high-energy laser beams.

In some more specific embodiments, the high energy laser beam has an energy density of 10 ⁸ -10 ¹⁰ J/cm ² 。

In some more specific embodiments, the laser and electrolysis in-situ combined machining method for the no-recast layer group holes further comprises: and keeping the electrolyte in a flowing state between the inside and the outside of the through hole under the condition of keeping the electrolyte connected with the workpiece to be processed and the cathode conducting layer.

In some more specific embodiments, the flow velocity of the electrolyte and the through-hole is not less than 10 m/s.

In some more specific embodiments, the workpiece to be machined comprises a conductive metal workpiece or an alloy workpiece.

In some more specific embodiments, the surface of the workpiece to be machined is formed with a thermal barrier coating.

In some more specific embodiments, the workpiece to be processed is not in direct contact with the cathode conductive layer.

In some more specific embodiments, the workpiece to be processed, the insulating layer, and the cathode conductive layer are closely bonded in the thickness direction.

The embodiment of the utility model provides a system that can once carry out group's hole processing is used for realizing no recasting layer group's hole laser and electrolysis normal position combination processing method, the system that can once carry out group's hole processing includes:

the laser processing unit is at least used for providing a high-energy laser beam and preprocessing the high-energy laser beam to form a plurality of through holes penetrating through a workpiece along the thickness direction in a preset area of a multi-layer splicing structure mainly formed by sequentially laminating the workpiece to be processed, an insulating layer and a cathode conducting layer along the thickness direction;

the electrolytic processing unit comprises a processing chamber and an electrolyte supply mechanism, wherein the processing chamber is at least used for accommodating the multilayer splicing structure, and the electrolyte supply mechanism is connected with the processing chamber and is at least used for supplying electrolyte into the processing chamber;

the driving unit is at least used for driving the processing chamber and/or the laser processing unit to move along a preset track so as to enable different areas of the surface of the multilayer splicing structure to be in contact reaction with a high-energy laser beam provided by the laser processing unit, wherein the driving unit, the laser processing unit and the processing chamber are arranged on the base.

In some more specific embodiments, the laser processing unit includes a laser, a laser beam transmission optical path, and a laser processing head, the laser being coupled to the laser processing head via the laser beam transmission optical path, the laser processing head being oriented toward the processing chamber.

In some specific embodiments, a workpiece holder is further disposed in the processing chamber, and the workpiece holder is at least used for fixing the multilayer splicing structure.

In some more specific embodiments, the work holder further divides the processing chamber into a first chamber and a second chamber in communication with each other, the multi-layered mosaic being capable of being simultaneously disposed in the first chamber and the second chamber when the multi-layered mosaic is secured with the work holder.

In some more specific embodiments, the first chamber and the second chamber are sequentially disposed along a depth direction of the process chamber.

In some specific embodiments, the electrolyte supply mechanism includes a liquid storage container, and the liquid storage container is connected to the processing chamber through a liquid inlet pipeline and a liquid outlet pipeline, so as to form a circulation loop between the liquid storage container and the processing chamber, wherein the circulation loop can be used for circulating the electrolyte.

In some more specific embodiments, one of the inlet line and the outlet line is connected to the first chamber and the other is connected to the second chamber.

In some more specific embodiments, a side of the processing chamber, which is matched with the laser processing unit, is provided with an opening through which the high-energy laser beam can pass, and the opening can be opened and provided with a cover plate.

In some more specific embodiments, the drive unit comprises:

the first driving mechanism is in transmission connection with the processing chamber and is at least used for driving the processing chamber to move along a first direction in a plane of a preset area of the multilayer splicing structure;

the second driving mechanism is in transmission connection with the processing chamber and at least used for driving the processing chamber to move along a second direction in the plane of the preset area of the multilayer splicing structure;

and the third driving mechanism is in transmission connection with the laser processing head and is at least used for driving the laser processing head to move along a third direction perpendicular to the plane of the preset area of the multilayer splicing structure.

In some more specific embodiments, the driving unit further comprises: the fixed bolster, the fixed bolster is fixed to be set up on the base, first actuating mechanism and second actuating mechanism set up on the base, the third actuating mechanism sets up on the fixed bolster.

As will be described in detail below with reference to the accompanying drawings and specific embodiments, it is to be noted that the embodiments of the present invention are intended to explain and explain the structure of a system for group hole processing at a time and the related method, wherein the laser, the liquid storage container, the insulating layer, the cathode conductive layer, the processing container, the work holder, the electrolyte, the power source, etc. are all known to those skilled in the art and are commercially available.

Referring to fig. 1 and 2, an arrow 100 in the drawings indicates a flowing direction of an electrolyte, and a system capable of performing group hole machining at a time includes a laser machining unit, an electrochemical machining unit and a driving unit (also referred to as a motion control unit), where the laser machining unit includes a laser 3, a laser beam transmission optical path 6 and a laser machining head 9, the electrochemical machining unit includes a reaction container 4, a liquid storage container 10 and a power supply 12, the reaction container 4 has a machining chamber 40 for accommodating a multi-layer splicing structure 5 to be machined, and the driving unit includes a base 2, a fixing frame (e.g., a gantry) 7, a first driving mechanism/a second driving mechanism 13, and a third driving mechanism 8.

In this embodiment, the multi-layer splicing structure 5 is formed by sequentially stacking and tightly splicing a workpiece to be processed, an insulating layer and a cathode conducting layer in the thickness direction.

In the embodiment, the laser 3 is fixedly arranged on the base 2, the laser 3 is connected with a laser processing head 9 through the laser beam transmission optical path 6, the laser 3 can output high-energy short pulse laser beams which are transmitted to the laser processing head 9 through the laser beam transmission light path 6, the laser processing head 9 focuses the high-energy short pulse laser beams on the area to be processed on the surface of the multilayer splicing structure 5, the laser processing head 9 is fixed on a motion platform of the third driving mechanism 8, can realize linear movement along the Z-axis direction (namely the third direction) and rotation of a set angle, so that the laser processing head 9 corresponds to different positions of the area to be processed on the surface of the multi-layer spliced structure 5, and then satisfy the quick processing demand of the laser of the different processing angles of multilayer mosaic structure 5, can accomplish the regional prefabricated crowd's hole of waiting to process on multilayer mosaic structure 5 surface high-efficient processing in the short time.

In the present embodiment, the laser 3 may be a high-power short-pulse laser, and the specific model, the light emitting power, and the like thereof may be selected according to specific processing requirements.

In this embodiment, the liquid storage container 10 is connected to the reaction container 4 through a liquid inlet pipe 11 and a liquid outlet pipe 1 respectively and is communicated with the processing chamber 40, so that a circulation loop for circulating an electrolyte is formed between the liquid storage container 10 and the processing chamber 40.

In this embodiment, the inlet end and the outlet end of the liquid inlet pipe 11 are respectively connected to the liquid storage container 10 and the side inlet of the processing chamber 40, the electrolyte in the liquid storage container 10 is continuously fed into the closed processing chamber 40 through the liquid inlet pipe 11, a corrosion-resistant work fixture 41 is arranged in the processing chamber 40, the work fixture 41 is used for fixing the multi-layer splicing structure 5, the processing chamber 40 is divided into a first chamber 42 and a second chamber 43 which are vertically communicated in the depth direction by the work fixture 41, when the multi-layer splicing structure 5 is fixed on the work fixture 41, one part of the multi-layer splicing structure 5 is arranged in the first chamber 42, and the other part of the multi-layer splicing structure 5 is arranged in the second chamber 43.

In this embodiment, the liquid inlet pipe 11 may be communicated with the first chamber 42 located relatively above, and the liquid outlet pipe 1 is communicated with the second chamber 43 located relatively below, so that the electrolyte entering into the processing chamber 40 can self-circulate under the action of gravity, and of course, in order to enable the electrolyte to form a circulating loop among the liquid storage container 10, the first chamber 42 and the third chamber 43, a pump may be provided on the loop to provide power for driving the electrolyte to flow.

In the present embodiment, when the multilayer mosaic structure 5 is laser processed by the laser processing unit, the opening of the processing chamber 40 towards the laser processing head 9 is in an open state, i.e. the processing chamber 40 is not closed; when the laser processing unit is used for carrying out laser processing on the substitute processing area on the surface of the multi-layer splicing structure 5 and forming a plurality of through holes penetrating through the multi-layer splicing structure 5 along the thickness direction, namely, after the process of processing prefabricated group holes (a group hole is a plurality of through holes, the same applies below) by laser processing is finished, the cover plate of the processing chamber 40, which is opened towards the laser processing head 9, is closed, so that the processing chamber 40 is closed, and then the electrolytic processing of the prefabricated group holes is carried out.

In this embodiment, the positive electrode and the negative electrode of the power supply 12 are respectively connected to the workpiece to be processed and the cathode conductive layer of the multi-layer mosaic structure 5, so that the workpiece to be processed and the cathode conductive layer can form a conductive path with the electrolyte in the plurality of through holes 50, and the power supply 12 is turned on to complete the electrochemical etching of the defects such as the recast layer in the laser processing prefabricated group hole.

In this embodiment, the processing chamber 40 is in transmission connection with the first/second driving mechanism 13, and the first/second driving mechanism 13 can drive the processing chamber 40 to move or rotate in the first direction and the second direction along the plane of the base.

In this embodiment, the liquid storage container 10, the reaction vessel 4, the workpiece fixture 41, the liquid inlet pipeline 11, the liquid outlet pipeline 1, etc. are corrosion-resistant devices or components, the processing chamber 40 is closable so as to close the processing chamber 40 during electrolytic processing, thereby preventing the processing environment from being polluted by the sputtering of the electrolyte, the workpiece fixture inside the processing chamber 40 divides the processing chamber 40 into an upper part and a lower part, so that the electrolyte is filled in the through holes 50 in the multi-layer splicing structure 5, and continuously flows and updates in the internal region of the through holes 50 at a certain flow rate under the action of pressure.

In this embodiment, the power source 12 may be a dc pulse power source, the power source is commercially available, and the voltage and the current of the power source may be different types of power sources according to the requirement.

In this embodiment, the base 2 may be horizontally disposed, the fixing frame 7 may be vertically disposed with the base 2, the laser 3 and the first/second driving mechanism 13 are fixed on the base 2, in this embodiment, the first/second driving mechanism 13 may be an XY plane motion module, or referred to as a horizontal plane driving module, the first and second driving mechanisms may be linear driving mechanisms or rotary driving mechanisms, or one of the first and second driving mechanisms may be a linear driving mechanism and the other is a rotary driving mechanism, and the first and second driving mechanisms are engaged with each other through a spline coupler to realize the rotation and linear motion of the processing chamber 40 in the plane of the base, and the first driving mechanism, The structure and manner of the driving connection of the second driving mechanism to the processing chamber 40 can be known to those skilled in the art, and are not specifically limited and described herein.

In this embodiment, the third driving mechanism 8 is fixed on the fixing frame 7, and the laser processing head 9 is in transmission connection with the third driving mechanism 8, so that the linear motion of the laser processing head 9 along the Z-axis direction and the rotation or swing of a set angle can be realized.

In this embodiment, the base 2 may be a marble platform, or may be made of other suitable materials, and for convenience of processing, the working platform of the base 2 is horizontally disposed so as to perform a subsequent electrochemical etching reaction after laser processing.

It should be noted that, the first driving mechanism/the second driving mechanism 13 and the third driving mechanism 8 adopted in the embodiment of the present invention may be driving motors or driving cylinders, and other driving modules or components capable of implementing corresponding driving functions, and the like, and all of them may adopt driving components known to those skilled in the art, and all of them may be commercially available, and the specific structure thereof is not limited herein.

In this embodiment, the system capable of performing group hole machining at a time in the embodiments of the present invention may further include a controller, the controller is connected to the laser 3, the power supply 12, the first driving mechanism/the second driving mechanism 13, and the third driving mechanism 8, and is configured to control an operating state of each functional component, it should be noted that the controller may be a combinational logic controller or a micro-program controller, the controller may be obtained through market purchase, and a numerical control program and the like adopted by the controller may also be obtained through market purchase.

Referring to fig. 3 and 4, a method for performing laser and electrolytic in-situ combined machining of group holes without recast layer by using the system capable of performing group hole machining at one time provided in fig. 1 and 2 specifically includes the following steps:

1) the workpiece 51 to be processed, the insulating layer 52 and the cathode conducting layer 53 are sequentially and tightly spliced along the thickness direction, so that no sliding and separation between spliced surfaces are ensured, and a multi-layer spliced structure 5 is formed, wherein the multi-layer spliced structure 5 is a multi-layer laminated structure, and the workpiece 51 to be processed and the cathode conducting layer 53 are electrically isolated from each other through the insulating layer 52 in the middle;

it should be noted that the workpiece 51 to be processed includes, but is not limited to, a conductive metal material, an alloy material, a workpiece with a thermal barrier coating, and the like, and the thickness and the material of the insulating layer and the cathode conductive layer are determined according to the thickness and the size of the workpiece 51 to be processed and the electrochemical reaction characteristics, which are not specifically required herein;

2) placing the multilayer laminated structure 5 in the processing chamber 40 along the thickness direction thereof, fixing the multilayer laminated structure by a workpiece clamp 41, and enabling the opening at the top of the processing chamber 40 to be in an open state; processing the multilayer splicing structure 5 by adopting a step-by-step combined processing method so as to finish the processing of group holes in the to-be-processed area on the surface of the multilayer splicing structure 5:

2.1) firstly, the high-energy laser beam provided by the laser 3 is utilized to complete the group hole preprocessing in the area to be processed on the surface of the multilayer splicing structure 5, and the method specifically comprises the following steps:

enabling a laser processing head 9 to face a to-be-processed area on the surface of the multilayer laminated structure 5, opening a laser 3, enabling a high-energy short pulse laser beam emitted by the laser 3 to be transmitted into the laser processing head 9 through a laser beam transmission light path 6, enabling the high-energy short pulse laser beam to be focused on the to-be-processed area on the surface of the multilayer laminated structure 5 through a focusing lens and to be vertically transmitted downwards along the thickness direction of the multilayer laminated structure 5, and enabling the high-energy laser beam to react with a cathode conducting layer 53, an insulating layer 52 and a to-be-processed workpiece in sequence until a through hole 50 penetrating through the multilayer spliced structure 5 is formed, namely completing the preprocessing of the through hole; switching the high-energy short pulse laser beam to the next position of the area to be processed on the surface of the multilayer structure 5, completing the through hole of the next through hole, repeating for multiple times until preprocessing of all the through holes is completed and the laser is turned off;

it should be noted that, when the high-energy short pulse laser beam is used to perform laser processing on different positions of the to-be-processed area on the surface of the multilayer laminated structure 5, the laser processing head 9 can be driven by the third driving mechanism 8 to perform linear motion along the Z-axis direction (which can be perpendicular to the to-be-processed area on the surface of the multilayer laminated structure 5) or rotate or swing at a set angle, so as to meet the processing requirements of different processing angles, and thus, the high-efficiency processing of the prefabricated group holes on the multilayer spliced structure can be completed in a short time; and the multi-layer splicing structure 5 can be driven to do linear motion or rotation in the horizontal direction by the first driving mechanism/the second driving mechanism 13, so that different positions of the area to be processed on the surface of the multi-layer laminating structure 5 correspond to the laser processing head 9, and the preprocessing of a plurality of through holes 50 in the area to be processed on the surface of the multi-layer laminating structure 5 is realized;

when the through-hole 50 is formed by processing the multilayer laminated structure 5 with a high-energy short-pulse laser beam, a recast layer is formed on the inner wall of the through-hole 50;

2.2) respectively connecting a workpiece 51 to be processed and a cathode conducting layer 53 in the multilayer laminated structure 5 with the positive electrode and the negative electrode of a power supply 12, injecting an electrolyte into a processing chamber 40 fixed with the multilayer laminated structure 5, and enabling the electrode liquid to immerse a plurality of through holes 50 in the multilayer laminated structure 5, so that the electrolyte, the workpiece 51 to be processed and the cathode conducting layer 53 form a conducting path, and carrying out electrochemical material etching reaction after the power supply is switched on to remove a recasting layer generated by laser preprocessing; the method specifically comprises the following steps:

sealing the processing cavity 40, injecting electrolyte with certain pressure into the processing cavity 40 through the liquid storage container 10 until the processing cavity is filled with the plurality of through holes 50 in the multilayer laminated structure 5, forming a conductive path by the workpiece 51 to be processed, the electrolyte and the cathode conductive layer 53, opening the switch of the direct current pulse power supply 12, oxidizing and dissolving the material of the workpiece 51 to be processed according to the electrochemical reaction principle, completely removing defects such as recast layers and the like generated by laser processing in the plurality of through holes 50 in the multilayer laminated structure 5, and closing the direct current pulse power supply switch after the target size precision requirement is met;

it should be noted that, the electrolyte enters from the first chamber 42 located relatively above and flows out from the second chamber 43 located relatively below, the electrolyte maintains a flowing state in the through hole 50, and the flowing speed of the electrolyte and the flowing speed in the through hole are not less than 10m/s, the electrolyte circulates to take away the processed product in time through the liquid outlet pipeline 1, and after the defects such as recast layers on the surfaces of the multiple through holes are completely removed, one-time hole group laser and electrolysis in-situ combined processing without the recast layers is completed; wherein, the electrolyte may be known to those skilled in the art, and may be commercially available, and the specific components and concentrations thereof are not limited herein;

3) after the processing is finished, the multilayer splicing structure 5 is disassembled, and the insulating layer and the cathode conducting layer are removed.

In the embodiment, after the laser prefabricated through holes are machined, the inner walls of all the laser prefabricated through holes can be subjected to synchronous electrolytic machining in situ without secondary positioning, so that a hole-by-hole positioning machining mode is avoided.

The embodiment of the utility model provides a can once carry out system and processing method of crowd's hole processing, will wait to process work piece, insulating layer and negative pole conducting layer once combination, adopt high energy short pulse laser beam to accomplish the preprocessing of crowd's hole structure fast in the waiting to process region of the corresponding work piece surface of waiting to process on the multilayer mosaic structure at first, guaranteed machining efficiency; and then, under the electrolyte circulation environment, synchronously carrying out electrochemical corrosion removal reaction on the inner walls of all the prefabricated through holes processed by the laser, removing defects such as recast layers, microcracks and the like generated on the inner walls of the through holes by the laser processing, and ensuring the processing quality of the group holes.

Compared with the existing laser and electrolysis synchronous processing mode, the group hole laser and electrolysis in-situ combined processing method without the recast layer provided by the embodiment of the utility model adopts high-energy short pulse laser for removing the material for group hole processing, thereby ensuring the processing efficiency; compared with the prior art, the embodiment of the utility model provides a no recast layer crowd's hole laser and electrolysis normal position combination processing method need not secondary clamping and location in the whole course of working, and the normal position is got rid of the defect of prefabricated crowd's hole inner wall, has solved cathode tube electrode location difficulty, has pursued the problem that hole electrochemistry aftertreatment efficiency is low, directly carries out whole electrolytic machining to crowd's hole structure, has reduced technology complexity, has promoted the uniformity of machining precision and crowd's spot facing work, has guaranteed machining efficiency.

Compared with the intervention processing of a tubular electrode in a prefabricated hole, the flow space of electrolyte in the prefabricated group hole is larger, which is beneficial to better discharge of electrolysis products and reaction heat; a certain processing gap is always kept between the workpiece to be processed and the cathode conductive layer, so that the short circuit problem in the electrolytic processing process is avoided, and the processing stability is improved.

It should be understood that the above-mentioned embodiments are merely illustrative of the technical concepts and features of the present invention, and the purpose thereof is to enable those skilled in the art to understand the contents of the present invention and to implement the present invention, and therefore, the protection scope of the present invention should not be limited thereby. All equivalent changes and modifications made according to the spirit of the present invention should be covered by the protection scope of the present invention.

Claims (10)

1. A system for group hole machining at a time, comprising:

the laser processing unit is at least used for providing a high-energy laser beam and preprocessing the high-energy laser beam to form a plurality of through holes penetrating through a workpiece along the thickness direction in a preset area of a multi-layer splicing structure mainly formed by sequentially laminating the workpiece to be processed, an insulating layer and a cathode conducting layer along the thickness direction;

the electrolytic machining unit comprises a machining cavity and an electrolyte supply mechanism, wherein the machining cavity is at least used for accommodating the multilayer splicing structure, and the electrolyte supply mechanism is connected with the machining cavity and is at least used for supplying electrolyte into the machining cavity;

a driving unit at least used for driving the processing chamber and/or the laser processing unit to move along a preset track so as to enable different areas of the surface of the multilayer splicing structure to be in contact reaction with the high-energy laser beam provided by the laser processing unit,

wherein, drive unit, laser processing unit and processing cavity set up on the base.

2. The system for group hole machining according to claim 1, wherein: the laser beam processing unit includes laser instrument, laser beam transmission light path and laser beam machining head, the laser instrument warp the laser beam transmission light path is connected with the laser beam machining head, the laser beam machining head orientation the processing cavity.

3. The system for group hole machining according to claim 2, wherein: still be provided with work piece holder in the processing cavity, work piece holder is used for at least fixing multilayer mosaic structure.

4. The system for group hole machining according to claim 3, wherein: the work holder also divides the processing chamber into a first chamber and a second chamber communicating with each other, and the multi-layered mosaic structure can be simultaneously disposed in the first chamber and the second chamber when the multi-layered mosaic structure is fixed by the work holder.

5. The system for group hole machining according to claim 4, wherein: the first chamber and the second chamber are sequentially arranged along the depth direction of the processing chamber.

6. The system for group hole machining according to claim 1, wherein: electrolyte supply mechanism includes the stock solution container, the stock solution container respectively through inlet line, drain pipe and processing cavity connects to form the circulation return circuit that can supply the electrolyte circulation to flow between stock solution container and the processing cavity.

7. The system for group hole machining according to claim 6, wherein: one of the liquid inlet pipeline and the liquid outlet pipeline is connected with the first cavity, and the other one of the liquid inlet pipeline and the liquid outlet pipeline is connected with the second cavity.

8. The system for group hole machining according to claim 2, wherein: and one side of the processing chamber, which is matched with the laser processing unit, is provided with an opening through which a high-energy laser beam can pass, and the opening can be opened and provided with a cover plate.

9. The system for group hole machining according to claim 2, wherein the driving unit comprises:

the first driving mechanism is in transmission connection with the processing chamber and is at least used for driving the processing chamber to move along a first direction in a plane of a preset area of the multilayer splicing structure;

the second driving mechanism is in transmission connection with the processing chamber and at least used for driving the processing chamber to move along a second direction in the plane of the preset area of the multilayer splicing structure;

and the third driving mechanism is in transmission connection with the laser processing head and is at least used for driving the laser processing head to move along a third direction perpendicular to the plane of the preset area of the multilayer splicing structure.

10. The system for group hole machining at a time according to claim 9, wherein the driving unit further comprises: the fixed bolster, the fixed bolster is fixed to be set up on the base, first actuating mechanism and second actuating mechanism set up on the base, the third actuating mechanism sets up on the fixed bolster.

Images