CN217112615U

CN217112615U - Integrated circuit packaging test device

Info

Publication number: CN217112615U
Application number: CN202220593363.0U
Authority: CN
Inventors: 周文; 步新祥; 牛云峰
Original assignee: Shandong Kangmu Microelectronics Co ltd
Current assignee: Shandong Kangmu Microelectronics Co ltd
Priority date: 2022-03-17
Filing date: 2022-03-17
Publication date: 2022-08-02
Anticipated expiration: 2032-03-17

Abstract

The utility model provides an integrated circuit encapsulation testing arrangement mainly relates to integrated circuit production technical field. The utility model provides an integrated circuit encapsulation testing arrangement, includes the pedestal, the top surface of pedestal is seted up and is passed through the groove, the several recess is seted up respectively on the upper portion of passing through the groove both sides, the bottom surface of recess is fixed mounting conducting strip respectively, the lower part in the recess inner wall outside is respectively through the articulated clamp plate of connecting of torsional spring, the both sides of pedestal are equipped with the torsion mechanism that can drive corresponding clamp plate upset respectively. The beneficial effects of the utility model reside in that: the device can fix the pins of the integrated circuit through the mutual matching between the conducting strips and the pressing plate when in use, and has simple operation and convenient use.

Description

Integrated circuit packaging test device

Technical Field

The utility model relates to an integrated circuit production technical field specifically is an integrated circuit encapsulates testing arrangement.

Background

An integrated circuit is a microelectronic device or component. The transistor, resistor, capacitor and inductor elements and wiring required in a circuit are interconnected together by a certain process, and are manufactured on a small semiconductor wafer or a plurality of small semiconductor wafers or medium substrates, and then are packaged in a package to form the micro-structure with the required circuit function.

When the test tool used in the existing integrated circuit packaging test device is used, the connecting pins of the integrated circuit are required to be connected with the connecting pin sleeves on the test platform in a one-to-one correspondence manner, the connecting pins and the corresponding connecting pin sleeves are required to be fixed, the operation is complex, and the working efficiency is reduced; when the integrated circuit testing fixture is used, the integrated circuit is easy to shift when placed in the testing fixture, and when the integrated circuit is limited, the limiting part is directly connected with the integrated circuit, so that the integrated circuit is easy to crush or scratch, the problem of damage to the integrated circuit is caused, and the quality of a product is influenced.

SUMMERY OF THE UTILITY MODEL

For solving prior art's not enough, the utility model provides an integrated circuit encapsulates testing arrangement, this device can realize the fixed to the integrated circuit stitch, easy operation convenient to use through mutually supporting between conducting strip and the clamp plate when using.

The utility model discloses a realize above-mentioned purpose, realize through following technical scheme:

the utility model provides an integrated circuit encapsulation testing arrangement, includes the pedestal, the top surface of pedestal is seted up and is passed through the groove, the several recess is seted up respectively on the upper portion of passing through the groove both sides, the bottom surface of recess is fixed mounting conducting strip respectively, the lower part in the recess inner wall outside is respectively through the articulated clamp plate of connecting of torsional spring, the both sides of pedestal are equipped with the torsion mechanism that can drive corresponding clamp plate upset respectively.

The torsion mechanism comprises an electric push rod, the two sides of the top surface of the base body are respectively fixedly provided with the electric push rod through connecting plates, the outer sides of the grooves are respectively provided with through holes, the push rods are respectively and movably arranged in the through holes, the outer ends of the push rods positioned at the same side are jointly and fixedly connected with the inner sides of the T-shaped plates, and the movable ends of the electric push rods are respectively and fixedly connected with the upper parts of the inner sides of the corresponding T-shaped plates.

The conducting strip is made of brass.

And a plurality of semiconductor refrigerating pieces are fixedly arranged in the through grooves.

And the bottom surfaces of the semiconductor refrigeration pieces are jointly and fixedly provided with the heat dissipation fan.

Contrast prior art, the beneficial effects of the utility model are that:

this device can be through the corresponding stitch of the extrusion fixed integrated circuit of clamp plate and conducting strip when using, does not need extra stop gear, easy operation convenient to use, and can cool down this device through semiconductor refrigeration piece, heat dissipation fan, prevent that the high temperature from influencing test effect when using.

Drawings

FIG. 1 is a schematic structural view of the present invention;

fig. 2 is a front view of the present invention;

FIG. 3 is an enlarged view of the view from the direction A of FIG. 1;

fig. 4 is a schematic sectional view of the seat body of the present invention;

fig. 5 is an enlarged view of part i of fig. 4.

Reference numerals shown in the drawings: 1. a base body; 2. a through groove; 3. a groove; 4. a conductive sheet; 5. pressing a plate; 6. an electric push rod; 7. a through hole; 8. a push rod; 9. a T-shaped plate; 10. a semiconductor refrigerating sheet; 11. a heat dissipation fan.

Detailed Description

The present invention will be further described with reference to the accompanying drawings and specific embodiments. It should be understood that these examples are for illustrative purposes only and are not intended to limit the scope of the present invention. Furthermore, it should be understood that various changes or modifications of the present invention may be made by those skilled in the art after reading the teachings of the present invention, and these equivalents also fall within the scope defined in the present application.

Example (b): integrated circuit packaging test device

As shown in fig. 1-5, an integrated circuit package testing apparatus has a specific structure including:

the novel seat comprises a seat body 1, a data interface is arranged at the back of the seat body 1, a through groove 2 is formed in the top surface of the seat body 1, a plurality of grooves 3 are formed in the upper portions of the two sides of the through groove 2 respectively, the top surfaces of the grooves 3 are communicated with the outside, conducting strips 4 are fixedly installed on the bottom surfaces of the grooves 3 respectively, the conducting strips 4 are electrically connected with the data interface, the lower portions of the outer sides of the inner walls of the grooves 3 are connected with a pressing plate 5 in a hinged mode through torsion springs respectively, and torsion mechanisms capable of driving the corresponding pressing plates 5 to turn over are arranged on the two sides of the seat body 1 respectively.

The torsion mechanism comprises an electric push rod 6, the electric push rod 6 is connected with a power circuit, the two sides of the top surface of the base body 1 are respectively fixedly provided with the electric push rod 6 through a connecting plate, the outer sides of the grooves 3 are respectively provided with a through hole 7, the through hole 7 is internally provided with a push rod 8 which is movably arranged respectively, the push rods 8 are positioned at the same side, the outer ends of the push rods 8 are fixedly connected with the inner side of the T-shaped plate 9 together, the inner ends of the push rods 8 can be respectively in contact fit with the outer sides of the corresponding pressing plates 5, and the movable ends of the electric push rods 6 are respectively fixedly connected with the inner upper parts of the corresponding T-shaped plates 9. This device is when using, can drive the T template 9 of being connected with it and remove through the extension or the shrink of 6 movable rods of electric push rod, when T template 9 all moves towards pedestal 1 inside, T template 9 drives the push rod 8 of being connected with it and moves towards corresponding clamp plate 5, can promote corresponding clamp plate 45 after the inner of push rod 8 contacts with corresponding clamp plate 5 and turn over towards penetrating groove 2, when the user puts integrated circuit's stitch into corresponding recess 3, can form the centre gripping to integrated circuit's stitch under the extrusion of clamp plate 5 and corresponding conducting strip 4 and fix, make integrated circuit's stitch can contact with corresponding conducting strip 4, and realize fixing integrated circuit, prevent that integrated circuit from taking place the displacement in the testing process, easy operation convenient to use.

The conducting strip 4 is made of brass. Brass electric conductive property is high, can guarantee the electric connection effect of this device and integrated circuit stitch, and the brass price is lower can reduce the manufacturing cost of this device.

A plurality of semiconductor refrigeration pieces 10 are fixedly arranged in the transparent groove 2, and the semiconductor refrigeration pieces 10 are connected with a power circuit. When the cooling device is used, the power supply of the semiconductor refrigerating sheet 10 is switched on, and the semiconductor refrigerating sheet 10 can reduce the ambient temperature in the transparent groove 2 when working, so that the integrated circuit is cooled in the testing process, and the testing effect is prevented from being influenced by overhigh temperature of the integrated circuit

The bottom surface of the semiconductor refrigeration piece 10 is fixedly provided with a heat dissipation fan 11, and the heat dissipation fan 11 is connected with a power circuit. The heat dissipation fan 11 is powered on to work, so that the air flow can be increased, and the heat dissipation effect of the device is further improved.

When in use, the pins of the integrated circuit are respectively placed in the corresponding grooves 3, so that the pins of the integrated circuit are respectively in contact fit with the corresponding conductive sheets 4, the grooves 3 can limit the positions of the pins of the integrated circuit to avoid the integrated circuit from shifting in the detection process, after the placement is finished, the corresponding pressing plates 5 are respectively overturned towards the through grooves 2 through the torsion mechanisms, so that the inner sides of the pressing plates 5 are in contact with the tops of the corresponding pins of the integrated circuit, the pins of the integrated circuit can be clamped through the mutual fit between the pressing plates 5 and the conductive sheets 4, the further fixation of the integrated circuit is realized, the pins of the integrated circuit are clamped through the mutual fit between the pressing plates 5 and the corresponding conductive sheets 4, the connection between the conductive sheets 4 and the pins of the integrated circuit can be ensured, the poor contact between the conductive sheets 4 and the pins of the integrated circuit in the test process is avoided, and the test effect of the device is ensured, the device is simple to operate, convenient to use can realize a good fixing effect on the integrated circuit, and the integrated circuit is prevented from displacing in the test process.

Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art will understand that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications and substitutions do not depart from the spirit and scope of the present invention in its corresponding aspects.

Claims

1. The utility model provides an integrated circuit package testing arrangement, includes pedestal (1), its characterized in that: the top surface of pedestal (1) is seted up and is passed through groove (2), several recess (3) are seted up respectively on the upper portion of passing through groove (2) both sides, the bottom surface of recess (3) is fixed mounting conducting strip (4) respectively, the lower part in the recess (3) inner wall outside is respectively through torsional spring articulated connection clamp plate (5), the both sides of pedestal (1) are equipped with the torsion mechanism that can drive corresponding clamp plate (5) upset respectively.

2. The integrated circuit package testing device of claim 1, wherein: torsion mechanism includes electric push rod (6), the both sides of pedestal (1) top surface are respectively through connecting plate fixed mounting electric push rod (6), through-hole (7) are seted up respectively in the outside of recess (3), movable mounting push rod (8) respectively in through-hole (7), be located the homonymy the inboard of the common fixed connection T template (9) of outer end of push rod (8), the expansion end of electric push rod (6) respectively with the inboard upper portion fixed connection of corresponding T template (9).

3. The integrated circuit package testing device of claim 1, wherein: the conducting strip (4) is made of brass.

4. The integrated circuit package testing device of claim 1, wherein: a plurality of semiconductor refrigerating pieces (10) are fixedly arranged in the transparent groove (2).

5. The integrated circuit package testing device of claim 4, wherein: and the heat dissipation fans (11) are fixedly arranged on the bottom surfaces of the semiconductor refrigeration sheets (10) together.