CN113281592B - Electronic element performance testing device and testing method - Google Patents
Electronic element performance testing device and testing method Download PDFInfo
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- CN113281592B CN113281592B CN202110516018.7A CN202110516018A CN113281592B CN 113281592 B CN113281592 B CN 113281592B CN 202110516018 A CN202110516018 A CN 202110516018A CN 113281592 B CN113281592 B CN 113281592B
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- 238000012360 testing method Methods 0.000 title claims abstract description 116
- 230000007246 mechanism Effects 0.000 claims abstract description 70
- 230000017525 heat dissipation Effects 0.000 claims abstract description 47
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 34
- 239000007788 liquid Substances 0.000 claims abstract description 14
- 230000001105 regulatory effect Effects 0.000 claims description 10
- 238000009423 ventilation Methods 0.000 claims description 10
- 238000010521 absorption reaction Methods 0.000 claims description 9
- 230000005540 biological transmission Effects 0.000 claims description 3
- 239000004033 plastic Substances 0.000 claims description 2
- 230000033228 biological regulation Effects 0.000 abstract description 5
- 238000013461 design Methods 0.000 abstract description 3
- 230000001360 synchronised effect Effects 0.000 abstract description 3
- 230000006978 adaptation Effects 0.000 abstract description 2
- 239000006185 dispersion Substances 0.000 abstract description 2
- 230000000694 effects Effects 0.000 abstract description 2
- 238000001816 cooling Methods 0.000 description 8
- 230000005855 radiation Effects 0.000 description 7
- 230000008878 coupling Effects 0.000 description 6
- 238000010168 coupling process Methods 0.000 description 6
- 238000005859 coupling reaction Methods 0.000 description 6
- 238000001125 extrusion Methods 0.000 description 6
- 239000000498 cooling water Substances 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 5
- 238000012546 transfer Methods 0.000 description 4
- 238000009825 accumulation Methods 0.000 description 3
- 238000007664 blowing Methods 0.000 description 3
- 239000000110 cooling liquid Substances 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 238000010998 test method Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- 238000011056 performance test Methods 0.000 description 1
- 239000011435 rock Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- General Physics & Mathematics (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
The invention discloses an electronic element performance testing device and a testing method, which belong to the technical field of electronic element testing and comprise a testing base provided with a lead sleeve, wherein a plurality of connecting mechanisms are limited on two sides of the top of the testing base through adjustable clamping mechanisms, heat circulation is carried out on radiating water pumped by an inner cavity of each connecting mechanism through a radiating mechanism, the radiating mechanism is fixedly arranged on one side of the testing base, an adjustable bearing mechanism is fixedly connected on the rear side of the testing base, and each connecting mechanism comprises a wiring seat. According to the invention, through the designed clamping mechanism, the limit and the attaching heat dissipation of the side circuit boards are realized, and the stability and the synchronous heat dissipation effect of the inserting connection of a plurality of circuit boards are improved; through the radiating mechanism of design, realize the hydrologic cycle regulation and control to a plurality of connection holders and bottom cold liquid water cavity, satisfy the heat dispersion regulation under the subregion control, the adaptation is to the heat dissipation treatment of the electronic component of different calorific values, improves test accuracy.
Description
Technical Field
The invention belongs to the technical field of electronic element testing, and particularly relates to an electronic element performance testing device and an electronic element performance testing method.
Background
Electronic components are basic components in circuits, and for performance considerations of integrated circuits, performance testing of the electronic components is generally required to ensure that the electronic components are operating properly, and because the electronic components themselves are small in size, the electronic components need to be integrated on a circuit board for performance testing.
Chinese patent document CN108957034a discloses an electronic component testing system, which comprises a rack, a tray placing area, a testing area, a front area transfer device, and a testing area transfer device. The tray placing area is adjacently arranged on the frame. The testing area is adjacently arranged on the rack and comprises an electronic element testing device for testing the electronic elements in a tray. The front area transfer device can be arranged on the rack in a displacement manner in the tray placing area and the testing area and is used for taking and placing the tray in the tray placing area. The test area transfer device can be arranged on the rack in a displacement manner in the test area and is used for replacing the tray to be tested and the tray after the test.
The above-mentioned background art still has following defects when in actual use: 1) The electronic element is easy to deviate from the wiring terminal when being inserted, so that the insertion and positioning of the circuit board are affected, and the multiple circuit boards are easy to collide with each other when being subjected to integrated test and feeding, so that the test precision is affected; 2) The electronic component is easy to generate more heat during operation, the circuit board of the integrated electronic component is easy to generate a large amount of heat during testing, the power consumption performance of the electronic component is affected, but the heat accumulation between different circuit boards is different, the temperature of the circuit boards is easy to influence each other due to the common heat dissipation of a single mode, the test result is deviated, and the use requirement cannot be well met.
In view of the above, the present invention provides an electronic device performance testing apparatus and a testing method thereof, which solve at least one of the problems in the prior art.
Disclosure of Invention
The invention aims at: in order to solve the problems that more heat is easy to generate when an electronic element works, a circuit board of an integrated electronic element is easy to generate a large amount of heat during testing, the power consumption performance of the electronic element is affected, but the heat accumulation between different circuit boards is different, the temperature of the circuit boards is easy to influence each other due to the common heat dissipation in a single mode, and the test result is deviated, the electronic element performance testing device and the test method are provided.
In order to achieve the above purpose, the present invention adopts the following technical scheme:
The utility model provides an electronic component capability test device, includes the test base that is equipped with the lead wire cover, test base top both sides all are spacing through adjustable fixture to have a plurality of coupling mechanism, and coupling mechanism inner chamber carries out the heat circulation through the cooling water liquid that the cooling mechanism pumped, and cooling mechanism sets firmly in test base one side, test base rear side fixedly connected with adjustable loading mechanism;
the connecting mechanism comprises a wire holder, wire holder one side is linked together with cooling mechanism one side through the pipeline, and wire holder inner chamber both sides are deflectable and are connected with splint, and wire holder top fixedly connected with elastic air bag that can sweep, and wire holder one side is laminated spacingly mutually with the stripper plate of fixture top one side, and stripper plate one side adjustable connection has the connecting rod, the connecting rod is set firmly in test base top through articulated seat, connecting rod one side fixedly connected with heating panel, and the heating panel is located coupling mechanism one side and corresponds the position.
As a further description of the above technical solution:
The wire holder both sides have all been seted up logical groove, and logical groove and splint sliding connection, and equal fixedly connected with second heat absorption pad between the splint opposite surfaces of both sides, wire holder one side both ends correspond the equal fixedly connected with of position hinge block with logical groove, and hinge through round pin axle and splint terminal one side between the hinge block of both sides.
As a further description of the above technical solution:
the top of the elastic air bag is communicated with a plurality of nozzles in a surrounding mode, the nozzles face upwards, the elastic air bag is attached to one side of the clamping plate, the elastic air bag is an elastic plastic air bag, and the bottom of the wire holder is communicated with the terminal of the test base element through the wiring terminal.
As a further description of the above technical solution:
The sliding groove is formed in one side of the connecting rod, the sliding block is connected in the sliding groove in a sliding mode, the sliding sleeve is embedded in the top of the sliding block, the sliding rod is connected in the sliding sleeve in a sliding mode, two ends of the sliding rod are fixedly connected with two sides of the inner cavity of the sliding groove respectively, one side of the sliding sleeve is fixedly connected with one side of the extruding plate, an elastic piece is sleeved on the outer side wall of the sliding rod, and the elastic piece is an elastic rubber piece gasket.
As a further description of the above technical solution:
And one side of the heat radiation plate is fixedly connected with a first heat absorption pad, two sides of the heat radiation plate are fixedly connected with communicating pipes, one side of the communicating pipe is communicated with one side of the heat radiation mechanism, and the other side of the communicating pipe is communicated with the heat radiation water cavity of the inner cavity of the test base.
As a further description of the above technical solution:
The bearing mechanism comprises a linear module, the linear module is fixedly connected to one side of the test base, the top of the linear module is in transmission connection with a bearing seat, an inner cavity of the bearing seat is slidably connected with two clamping plates, limiting clamping is conducted between the clamping plates on two sides, and one side of the top of the linear module is fixedly connected with a first fan.
As a further description of the above technical solution:
The two bearing seats are in the limiting sleeve through the limiting rod sliding connection, the limiting sleeve is fixedly connected to one side of the clamping plate, the tail end of the limiting rod is fixedly connected to one side of the clamping plate through the fixing plate, a threaded cap is embedded on one side of the limiting sleeve, a fixing bolt is connected to the threaded cap in a threaded manner, the fixing bolt is fixedly extruded with a friction surface on one side of the limiting rod, a plurality of clamping grooves are formed in an inner cavity of the clamping plate, a plurality of ventilation holes are formed in two sides of the inner cavity of the clamping grooves, the ventilation holes are uniformly arranged, and the cross section of the ventilation holes is arc-shaped.
As a further description of the above technical solution:
The heat dissipation mechanism comprises a heat dissipation water tank, a second fan is fixedly connected to one side of the heat dissipation water tank, heat dissipation water liquid is filled in an inner cavity of the heat dissipation water tank, a connecting main pipe is communicated with the inner cavity of the heat dissipation water tank through a water pump, a plurality of flow regulating valves are arranged at the top of the connecting main pipe, a plurality of connecting bent pipes are communicated with the bottom of the regulating valves, the connecting bent pipes are communicated with an inner cavity of a test base, and the other side of the test base is communicated with the connecting mechanism through the connecting bent pipes.
The testing method of the electronic element performance testing device is characterized by comprising the following steps:
s1, placing a component to be tested between clamping plates at two sides, and pushing the clamping plates to slide, wherein the clamping plates at the two sides can be moved to attach the electronic component;
S2, the linear module works to drive the electronic element placed at the top to move to one side of the test base, the electronic element is inserted into the wire holder at the corresponding position, and the terminal at the bottom of the wire holder and the test part are subjected to power connection test;
S3, driving one side extrusion plate to be meshed with the electronic element circuit board through rotating the connecting rods at two sides, meanwhile, enabling the bottom cooling plate to conduct heat dissipation on the circuit board, driving heat dissipation water liquid to conduct circulation heat dissipation on the connecting main pipe, the connecting bent pipe and the communicating pipe through the work of the rear side heat dissipation mechanism, and after testing, drawing out the electronic element from the wiring seat, and completing testing.
In summary, due to the adoption of the technical scheme, compared with the prior art, the invention has the following beneficial effects and advantages:
1. According to the invention, the flexible guiding limit of the circuit board can be realized through the designed connecting mechanism, and the portability and safety of inserting, mounting and positioning are improved; through the designed bearing mechanism, the feeding and discharging laminating limiting fixing capability of the test circuit board is guaranteed, mutual limiting fixing among electronic elements in the test procedure is improved, and falling off or damage of the electronic elements caused by mutual collision of the circuit boards in the feeding procedure is avoided; limiting, attaching and radiating of the side circuit boards are realized through the designed clamping mechanism, and the stability and synchronous radiating effect of the inserting connection of the circuit boards are improved; through the radiating mechanism of design, realize the hydrologic cycle regulation and control to a plurality of connection holders and bottom cold liquid water cavity, satisfy the heat dispersion regulation under the subregion control, the adaptation is to the heat dissipation treatment of the electronic component of different calorific values, improves test accuracy.
2. Through the coupling mechanism of design, after inserting the test element into the connection terminal, the circuit board can realize flexible spacing through the contact with both sides elasticity gasbag, the test element can realize that elasticity is spacing fixed through the splint of both sides L shape simultaneously, electronic component takes place the skew when avoiding the test and rocks, realize synchronous detection to a plurality of electronic components through a plurality of coupling mechanism simultaneously, and can realize blowing to inserting electronic component through self elasticity to the nozzle bulge when elasticity gasbag is extruded and sweep, guarantee the blowing dust removal after electronic component and the circuit board are inserted, avoid the dust to pile up and influence electronic component heat dissipation treatment efficiency.
3. According to the invention, through the designed bearing mechanism, the circuit board to be tested can be placed in the clamping plates at the corresponding positions, the clamping plates at the two sides can realize limiting and fixing of the circuit board through the internal clamping grooves, after the fixing bolts are screwed and separated from the limiting rods, the limiting sleeves can be pulled to slide outside the limiting rods and drive the clamping plates to move to adapt to the relative distance between the circuit boards, and the second fan at the rear side is used for blowing, so that the tested circuit board can be blown and cooled, and the movement of the top bearing seat and the clamping plates can be realized through the linear module, so that the conveying and fixing of the circuit board to be tested and tested can be realized.
4. According to the invention, after the circuit boards are inserted and connected, the connecting rod on one side can be deflected to rotate around the pin shaft and drive the top to be extruded to be attached to the top of the circuit board main body, the deflectable connecting rod is used for adapting the attachment of the circuit board and the external special-shaped surface of the circuit element, and meanwhile, the height of different circuit boards can be adapted through the extruding plate with the slidable top, so that the clamping limit of the test circuit board is ensured, the external test element is prevented from deviating and falling off, and the test stability is improved.
5. According to the invention, through the designed heat radiation mechanism, water liquid in the heat radiation water tank can be sent into the plurality of connecting bent pipes through the connecting main pipe, meanwhile, cooling water liquid is sent into the connecting bent pipes at corresponding positions through the flow regulating valve, heat is led out through circulating flow in the wire holder of the heat conducting material by the cooling water liquid, then, the water liquid of different wire holders can be circularly radiated through different flow regulating valves, the heat dissipation adjustment of different circuit boards is adapted, the heat dissipation capability of different heating value test circuit boards is adapted through partition heat dissipation adjustment, the heat dissipation efficiency is effectively improved, and the influence of heat accumulation on the test precision of electronic elements is avoided.
Drawings
Fig. 1 is a schematic diagram of a three-dimensional split structure of an electronic device performance testing apparatus according to the present invention;
fig. 2 is a schematic perspective view of an electronic device performance testing apparatus according to the present invention;
FIG. 3 is a schematic perspective view of a test base of an electronic device performance testing apparatus according to the present invention;
fig. 4 is a schematic perspective view of a bearing mechanism of an electronic device performance testing apparatus according to the present invention;
Fig. 5 is a schematic perspective view of a clamping plate of an electronic device performance testing apparatus according to the present invention;
fig. 6 is a schematic three-dimensional structure of a clamping mechanism of the device for testing performance of electronic components according to the present invention;
fig. 7 is a schematic three-dimensional structure of a heat dissipation plate of the electronic device performance test device according to the present invention.
Legend description:
1. A test base; 2. a clamping mechanism; 201. a hinge base; 202. a connecting rod; 203. an extrusion plate; 204. a heat dissipation plate; 205. a communicating pipe; 206. a first heat absorbing pad; 3. a carrying mechanism; 301. a linear module; 302. a bearing seat; 303. a clamping plate; 304. a vent hole; 305. a limit sleeve; 306. a limit rod; 307. a fixing bolt; 308. a fixing plate; 309. a first fan; 4. a connecting mechanism; 401. a wire holder; 402. a hinge block; 403. a through groove; 404. an elastic air bag; 405. a nozzle; 406. a clamping plate; 407. a second heat absorbing pad; 5. a heat dissipation mechanism; 501. a heat radiation water tank; 502. a second fan; 503. connecting a main pipe; 504. a flow regulating valve; 505. a connecting bent pipe; 6. and a lead sleeve.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Example 1:
Referring to fig. 1-7, the embodiment discloses an electronic component performance testing device, which comprises a testing base 1 provided with a lead sleeve 6, wherein a plurality of connecting mechanisms 4 are limited on two sides of the top of the testing base 1 through an adjustable clamping mechanism 2, heat circulation is carried out on radiating water pumped by an inner cavity of the connecting mechanisms 4 through a radiating mechanism 5, the radiating mechanism 5 is fixedly arranged on one side of the testing base 1, an adjustable bearing mechanism 3 is fixedly connected on the rear side of the testing base 1, the connecting mechanism 4 comprises a wire holder 401, one side of the wire holder 401 is communicated with one side of the radiating mechanism 5 through a pipeline, two sides of the inner cavity of the wire holder 401 are connected with clamping plates 406 in a deflectable way, an elastic air bag 404 capable of being purged is fixedly connected on the top of the wire holder 401, one side of the wire holder 401 is bonded and limited with a squeezing plate 203 on one side of the top of the clamping mechanism 2, one side of the squeezing plate 203 is connected with a connecting rod 202 in an adjustable way, the connecting rod 202 is fixedly arranged at the top of the test base 1 through the hinging seat 201, one side of the connecting rod 202 is fixedly connected with the heat dissipation plate 204, the heat dissipation plate 204 is positioned at a position corresponding to one side of the connecting mechanism 4, both sides of the wiring seat 401 are respectively provided with a through groove 403, the through grooves 403 are in sliding connection with clamping plates 406, the opposite surfaces of the clamping plates 406 at both sides are respectively fixedly connected with a second heat absorption pad 407, both ends of one side of the wiring seat 401 are respectively fixedly connected with a hinging block 402 corresponding to the through grooves 403, the hinging blocks 402 at both sides are hinged with one side of the tail end of the clamping plates 406 through pin shafts, the top of the elastic air bag 404 is circumferentially communicated with a plurality of nozzles 405, the nozzles 405 face upwards, the elastic air bag 404 is attached to one side of the clamping plates 406, the bottom of the wiring seat 401 is communicated with the element terminal of the test base 1 through wiring terminals, the connecting rod 202 has been seted up on one side, and the sliding connection has the slider in the spout, and the slider top inlays and has been equipped with the sliding sleeve, and sliding connection has the slide bar in the sliding sleeve, slide bar both ends correspond position fixed connection with spout inner chamber both sides respectively, sliding sleeve one side and stripper plate 203 one side fixed connection, slide bar lateral wall cover is equipped with the elastic component, and the elastic component is the elastic rubber spare packing ring, heating panel 204 one side fixedly connected with first heat absorption pad 206, and heating panel 204 both sides fixedly connected with communicating pipe 205, and one side communicating pipe 205 is linked together with one side cooling mechanism 5, and the opposite side communicating pipe 205 is linked together with test base 1 inner chamber cooling water cavity.
The clamp plate 406 deflected through the hinging block 402 and the pin shaft improves the positioning suitability when inserting the circuit board, and the clamp plate 406 can avoid breaking separation and rotation at the wiring seat 401 side step through groove 403, and the L-shaped clamp plate 406 can guarantee the spacing positioning of inserting the circuit board, and the second heat absorption pad 407 in the clamp plate 406 inner cavity can absorb heat when guaranteeing the laminating of the circuit board, and the squeeze plate 203 is more stable through the sliding of the rear side sliding block in the sliding groove, and the sliding block moves and can drive the sliding sleeve to move outside the sliding rod, avoid the extrusion to deviate, simultaneously can squeeze the top elastic piece when the sliding sleeve moves, and then can guarantee the pulling limit of the top squeeze plate 203 through the self pulling force of the elastic piece, the test base 1 can realize the electrical test of the inserted circuit board through the internal circuit, and a plurality of cold liquid cavities corresponding to the wiring seat 401 are formed at the rear side of the test base 1, guarantee the heat dissipation of the circuit board through the bottom wiring terminal realization detachable assembly, and improve the durability, and the side 204 can realize the heat absorption of the heat exchange board through the first pad 206 when contacting the circuit board, and the heat absorption liquid can be guaranteed to the heat dissipation plate 204, and the heat dissipation volume of the test base can be guaranteed to the heat dissipation board is high through the heat dissipation plate 1, and the test base is required to be satisfied.
Further, the carrying mechanism 3 includes a linear module 301, and the linear module 301 is fixedly connected to one side of the test base 1, the top of the linear module 301 is in transmission connection with a carrying seat 302, an inner cavity of the carrying seat 302 is slidably connected with two clamping plates 303, a first fan 309 is fixedly connected to one side of the top of the linear module 301, two carrying seats 302 are slidably connected in a limiting sleeve 305 through a limiting rod 306, the limiting sleeve 305 is fixedly connected to one side of the clamping plate 303, the tail end of the limiting rod 306 is fixedly connected to one side of the clamping plate 303 through a fixing plate 308, a threaded cap is embedded on one side of the limiting sleeve 305, a fixing bolt 307 is connected with one side of the threaded cap in a threaded manner, the fixing bolt 307 is fixedly extruded with a friction surface on one side of the limiting rod 306, a plurality of clamping grooves are formed in the inner cavity of the clamping plate 303, a plurality of ventilation holes 304 are formed in two sides of the inner cavity of the clamping grooves, the ventilation holes 304 are uniformly arranged, and the cross section of the ventilation holes is arc.
Further, as shown in fig. 3-5, the clamping plate 303 can ensure the requirement of limiting bearing through the U-shaped bearing grooves on two sides, the rectangular limiting rod 306 and the limiting sleeve 305 can ensure the moving stability of the bearing seat 302 on two sides, the U-shaped bearing seat 302 can ensure the moving stability of the clamping plate 303, the clamping plate 303 is prevented from swinging and shifting, and the fixing bolt 307 can ensure the spacing adjustment and limiting of the clamping plate 303 on two sides through extrusion lamination on one side of the limiting rod 306.
Further, the heat dissipation mechanism 5 includes the heat dissipation water tank 501, heat dissipation water tank 501 one side fixedly connected with second fan 502, heat dissipation water tank 501 inner chamber is filled with the heat dissipation water liquid, heat dissipation water tank 501 inner chamber has connecting manifold 503 through the water pump intercommunication, connecting manifold 503 top is equipped with a plurality of regulating valves 504, the regulating valve bottom intercommunication has a plurality of connecting bend 505, connecting bend 505 is linked together with test base 1 inner chamber, test base 1 opposite side is linked together with coupling mechanism 4 through connecting bend 505.
Further, as shown in fig. 1-3, a ventilation slot for keeping air circulation is provided on one side of the heat dissipating water tank 501, so that the second fan 502 on the rear side can discharge the cooling liquid for heat absorption during operation and rotation, and meanwhile, the flow regulating valve 504 on the top can realize the liquid distribution and circulation of the communicating pipe 205 on the rear side of the wire holder 401 through the three-way pipeline, meanwhile, the shortage of water pressure of the circulating water is avoided, the flow regulation of the cooling liquid of the wire holders 401 is improved, and the adjustment of heat dissipating capacity of different areas is adapted, thereby meeting the test requirement.
Example 2:
the embodiment discloses a testing method of an electronic element performance testing device, which specifically comprises the following steps:
s1, placing a component to be tested between two clamping plates 303, and pushing the clamping plates 303 to slide, wherein the clamping plates 303 at the two sides can be moved to attach the electronic component;
s2, the linear module 301 works to drive the electronic element placed at the top to move to one side of the test base 1, the electronic element is inserted into the wire holder 401 at the corresponding position, and the terminal at the bottom of the wire holder 401 and the test part are subjected to power connection test;
S3, the two-side connecting rods 202 are rotated to drive the one-side extrusion plate 203 to be meshed with the electronic element circuit board, the extrusion plate 203 slides in the sliding grooves through the rear side sliding blocks more stably, the sliding blocks can drive the sliding sleeves to move outside the sliding rods, meanwhile, the bottom cooling plates 204 are used for cooling the circuit board, meanwhile, the rear side cooling mechanism 5 works to drive cooling water to circularly cool the connecting manifold 503, the connecting bent pipe 505 and the communicating pipe 205, after the test is completed, the electronic element is pulled out of the wiring seat 401, and the test is completed.
The foregoing is only a preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art, who is within the scope of the present invention, should make equivalent substitutions or modifications according to the technical scheme of the present invention and the inventive concept thereof, and should be covered by the scope of the present invention.
Claims (3)
1. The device for testing the performance of the electronic element is characterized by comprising a test base (1), a clamping mechanism (2), a bearing mechanism (3), a connecting mechanism (4) and a heat dissipation mechanism (5); the testing base (1) is provided with a lead sleeve (6), two sides of the top of the testing base (1) are limited by a plurality of connecting mechanisms (4) through adjustable clamping mechanisms (2), the inner cavity of each connecting mechanism (4) is subjected to heat circulation through radiating water pumped by the corresponding radiating mechanism (5), the corresponding radiating mechanism (5) is fixedly arranged on one side of the testing base (1), and the rear side of the testing base (1) is fixedly connected with an adjustable bearing mechanism (3);
The connecting mechanism (4) comprises a wire holder (401), one side of the wire holder (401) is communicated with one side of the heat dissipation mechanism (5) through a pipeline, clamping plates (406) are connected to two sides of an inner cavity of the wire holder (401) in a deflectable mode, an elastic air bag (404) capable of being purged is fixedly connected to the top of the wire holder (401), one side of the wire holder (401) is in fit limit with a pressing plate (203) on one side of the top of the clamping mechanism (2), a connecting rod (202) is connected to one side of the pressing plate (203) in an adjustable mode, the connecting rod (202) is fixedly arranged on the top of the test base (1) through a hinging seat (201), a heat dissipation plate (204) is fixedly connected to one side of the connecting rod (202), the heat dissipation plate (204) is located at a position corresponding to one side of the connecting mechanism (4), through grooves (403) are formed in two sides of the wire holder (401), second heat absorption pads (407) are fixedly connected between two opposite sides of the clamping plates (406), hinging blocks (402) are fixedly connected to the corresponding positions of the two sides of the through grooves (403), and one side of the hinging blocks (402) are hinged to one sides of the two sides of the hinging blocks (402).
The top of the elastic air bag (404) is communicated with a plurality of nozzles (405) in a surrounding mode, the nozzles (405) face upwards, the elastic air bag (404) is attached to one side of the clamping plate (406), the elastic air bag (404) is an elastic plastic air bag, and the bottom of the wiring seat (401) is communicated with the element terminal of the test base (1) through a wiring terminal;
The bearing mechanism (3) comprises a linear module (301), the linear module (301) is fixedly connected to one side of the test base (1), a bearing seat (302) is connected to the top of the linear module (301) in a transmission mode, two clamping plates (303) are connected to the inner cavity of the bearing seat (302) in a sliding mode, the clamping plates (303) on the two sides are in limiting clamping connection, and a first fan (309) is fixedly connected to one side of the top of the linear module (301);
The two bearing seats (302) are slidably connected in the limiting sleeve (305) through the limiting rod (306), the limiting sleeve (305) is fixedly connected to the clamping plate (303) on one side, the tail end of the limiting rod (306) is fixedly connected to one side of the clamping plate (303) through the fixing plate (308), a threaded cap is embedded on one side of the limiting sleeve (305), a fixing bolt (307) is connected with the threaded cap in an internal thread manner, the fixing bolt (307) is fixedly extruded with a friction surface on one side of the limiting rod (306), a plurality of clamping grooves are formed in the inner cavity of the clamping plate (303), a plurality of ventilation holes (304) are formed in two sides of the inner cavity of the clamping grooves, the ventilation holes (304) are uniformly arranged, and the cross section of ventilation is arc;
The heat dissipation mechanism (5) comprises a heat dissipation water tank (501), a second fan (502) is fixedly connected to one side of the heat dissipation water tank (501), heat dissipation water liquid is filled in an inner cavity of the heat dissipation water tank (501), a connecting main pipe (503) is communicated with the inner cavity of the heat dissipation water tank (501) through a water pump, a plurality of flow regulating valves (504) are arranged at the top of the connecting main pipe (503), a plurality of connecting bent pipes (505) are communicated with the bottom of the flow regulating valves, the connecting bent pipes (505) are communicated with the inner cavity of the test base (1), and the other side of the test base (1) is communicated with the connecting mechanism (4) through the connecting bent pipes (505);
The sliding groove is formed in one side of the connecting rod (202), the sliding block is connected in the sliding groove in a sliding mode, the sliding sleeve is embedded in the top of the sliding block, the sliding rod is connected in the sliding sleeve in a sliding mode, two ends of the sliding rod are fixedly connected with two sides of the inner cavity of the sliding groove respectively, one side of the sliding sleeve is fixedly connected with one side of the extruding plate (203), an elastic piece is sleeved on the outer side wall of the sliding rod, and the elastic piece is an elastic rubber piece gasket.
2. The device for testing the performance of the electronic component according to claim 1, wherein a first heat absorbing pad (206) is fixedly connected to one side of the heat dissipating plate (204), communicating pipes (205) are fixedly connected to two sides of the heat dissipating plate (204), one side of the communicating pipes (205) is communicated with the one side heat dissipating mechanism (5), and the other side of the communicating pipes (205) is communicated with the heat dissipating water cavity of the inner cavity of the test base (1).
3. The testing method of an electronic device performance testing apparatus according to any one of claims 1-2, comprising the steps of:
S1, placing a component to be tested between two clamping plates (303), and attaching an electronic component by pushing the clamping plates (303) to slide and moving the clamping plates (303);
S2, the linear module (301) works to drive the electronic element placed at the top to move to one side of the test base (1), the electronic element is inserted into the wiring seat (401) at the corresponding position, and the terminal at the bottom of the wiring seat (401) and the test part are subjected to power connection test;
S3, the connecting rods (202) on two sides are rotated to drive the extruding plate (203) on one side to be meshed and fixed with the circuit board of the electronic element, meanwhile, the bottom radiating plate (204) radiates heat to the circuit board, meanwhile, the rear radiating mechanism (5) works to drive radiating water to circularly radiate heat in the connecting header pipe (503), the connecting bent pipe (505) and the communicating pipe (205), after the test is completed, the electronic element is pulled out from the wiring seat (401), and the test is completed.
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| CN116413526A (en) * | 2022-01-05 | 2023-07-11 | 华为技术有限公司 | Heat dissipation device, test system and test method for single event effect test |
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